KR100279004B1 - 반도체 제조용 노광장치 - Google Patents
반도체 제조용 노광장치 Download PDFInfo
- Publication number
- KR100279004B1 KR100279004B1 KR1019990004241A KR19990004241A KR100279004B1 KR 100279004 B1 KR100279004 B1 KR 100279004B1 KR 1019990004241 A KR1019990004241 A KR 1019990004241A KR 19990004241 A KR19990004241 A KR 19990004241A KR 100279004 B1 KR100279004 B1 KR 100279004B1
- Authority
- KR
- South Korea
- Prior art keywords
- laser beam
- unit
- high frequency
- wafer
- exposure apparatus
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 claims abstract description 39
- 239000004065 semiconductor Substances 0.000 claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 claims abstract description 23
- 230000000903 blocking effect Effects 0.000 claims abstract description 7
- 230000010287 polarization Effects 0.000 claims description 8
- 239000012780 transparent material Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 239000013078 crystal Substances 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 17
- 230000000694 effects Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000001427 coherent effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70025—Production of exposure light, i.e. light sources by lasers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (7)
- 반도체 제조용 노광장치에 있어서,제 1 레이져 빔을 발생시키는 광원부와,상기 제 1 레이져 빔이 서로 다른 광 통과경로 및 광 통과시간을 갖도록 하여 가간섭성이 저하된 제 2 레이져 빔을 형성하는 광원가간섭 저하부와,상기 제 2 레이져 빔의 배율을 조절하여 제 3 레이져 빔을 형성하는 렌즈부와,상기 제 3 레이져 빔을 통해 웨이퍼에 전사될 패턴을 형성하는 레티클부와,상기 레티클부에서 형성된 패턴을 웨이퍼 상에 투영시키는 투영부를 포함하여 이루어지는 반도체 제조용 노광장치.
- 청구항 1 에 있어서, 상기 광가간섭 저하부는 양면이 불규칙적인 왜곡된 형태로 된 왜곡면으로 형성되고, 투명한 재질로 된 위상왜곡 원판과,상기 위상왜곡 원판을 고속으로 회전시키기 위한 회전부로 구성된 것이 특징인 반도체 제조용 노광장치.
- 청구항 1 에 있어서, 상기 광가간섭 저하부는 상단의 두께가 하단의 두께보다 상대적으로 더 두껍게 하고, 투명한 재질로 된 옵티컬 웨지 원판과,상기 옵티컬 웨지 원판을 고속으로 회전시키기 위한 회전부로 구성된 것이 특징인 반도체 제조용 노광장치.
- 반도체 제조용 노광장치에 있어서,제 1 레이져 빔을 발생시키는 광원부와,상기 제 1 레이져 빔을 반복적으로 차단 또는 투과시켜 가간섭성이 저하된 제 2 레이져 빔을 형성하는 고주파 광스위치부와,상기 제 2 레이져 빔의 배율을 조절하여 제 3 레이져 빔을 형성하는 렌즈부와,상기 제 3 레이져 빔을 통해 웨이퍼에 전사될 패턴을 형성하기 위한 레티클부와,상기 레티클부에서 형성된 패턴을 웨이퍼 상에 투영시키는 투영부를 포함하는 반도체 제조용 노광장치.
- 청구항 4 에 있어서,상기 고주파 광스위치부는 분극 발생이 가능한 비선형 매질부와,상기 비선형 매질부에 고주파 전압을 가함에 따라 분극을 발생시켜 레이져 빔이 차단 또는 투과가 되도록 하는 고주파 전압공급부로 이루어진 것이 특징인 반도체 노광장치.
- 청구항 5 에 있어서, 상기 비선형 매질부는계열의 크리스탈 매질로 형성된 것이 특징인 반도체 제조용 노광장치.
- 청구항 5 에 있어서, 상기 고주파 전압공급부는 상기 비선형 매질부에 가하는 고주 파 전압의 전압 변환이 용이하게 형성된 것이 특징인 반도체 제조용 노광장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990004241A KR100279004B1 (ko) | 1999-02-08 | 1999-02-08 | 반도체 제조용 노광장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990004241A KR100279004B1 (ko) | 1999-02-08 | 1999-02-08 | 반도체 제조용 노광장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20000055564A KR20000055564A (ko) | 2000-09-05 |
KR100279004B1 true KR100279004B1 (ko) | 2001-01-15 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019990004241A KR100279004B1 (ko) | 1999-02-08 | 1999-02-08 | 반도체 제조용 노광장치 |
Country Status (1)
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KR (1) | KR100279004B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6573975B2 (en) * | 2001-04-04 | 2003-06-03 | Pradeep K. Govil | DUV scanner linewidth control by mask error factor compensation |
-
1999
- 1999-02-08 KR KR1019990004241A patent/KR100279004B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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KR20000055564A (ko) | 2000-09-05 |
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