KR100274992B1 - Flip chip and mounting method thereof - Google Patents

Flip chip and mounting method thereof Download PDF

Info

Publication number
KR100274992B1
KR100274992B1 KR1019970074511A KR19970074511A KR100274992B1 KR 100274992 B1 KR100274992 B1 KR 100274992B1 KR 1019970074511 A KR1019970074511 A KR 1019970074511A KR 19970074511 A KR19970074511 A KR 19970074511A KR 100274992 B1 KR100274992 B1 KR 100274992B1
Authority
KR
South Korea
Prior art keywords
flip chip
circuit board
electrode
protrusions
chip
Prior art date
Application number
KR1019970074511A
Other languages
Korean (ko)
Other versions
KR19990054650A (en
Inventor
안형기
Original Assignee
윤종용
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윤종용, 삼성전자주식회사 filed Critical 윤종용
Priority to KR1019970074511A priority Critical patent/KR100274992B1/en
Publication of KR19990054650A publication Critical patent/KR19990054650A/en
Application granted granted Critical
Publication of KR100274992B1 publication Critical patent/KR100274992B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip

Abstract

PURPOSE: A flip chip and a mounting method thereof are provided to enable a resin to be filled uniformly in a flip chip mounting structure by attaching filling guide ribs protruding from a bottom surface of a flip chip that is to be mounted on a circuit board so that a resin can be filled between the flip chip and the circuit board and a filling rate varying from place to place can be controlled to be uniform by a capillary phenomenon. CONSTITUTION: A flip chip(20) comprises a chip body, and a plurality of electrodes(24) protruding from a bottom surface of the chip body which are to be attached to board electrodes(32) formed on a circuit board(30). The flip chip is mounted on the circuit board with a predetermined space therebetween. The flip chip includes at least a filling guide rib(26) protruding from a region on the bottom surface of the chip body where the electrodes(24) are not formed.

Description

플립칩과 그 실장방법Flip chip and its mounting method

본 발명은 칩본체와, 칩본체의 하부면에 회로기판상의 기판전극에 부착되는 다수의 전극돌기를 가지고 회로기판상에 소정의 이격공간을 두고 실장되는 플립칩과 그 플립칩의 실장방법에 관한 것이다.The present invention relates to a chip and a flip chip mounted with a predetermined spaced space on a circuit board having a plurality of electrode protrusions attached to a substrate electrode on a circuit board on a lower surface of the chip body and a method of mounting the flip chip. will be.

일반적으로, 플립칩의 실장공정에서 실장재료로서 솔더(solder)나 전도성 접착물을 사용할 경우에는 플립칩의 실장 신뢰도를 향상시키기 위해 비전도성 수지(underfill resin)를 충진하게 된다.In general, when solder or a conductive adhesive is used as a mounting material in the flip chip mounting process, an underfill resin is filled to improve the reliability of mounting the flip chip.

종래에 수지를 충진하는 방법으로는 플립칩 실장체를 경사지게 설치하거나 로터리펌프에 연결된 밀폐용기를 사용하였다. 이중, 밀폐용기를 사용한 경우를 도1내지 도4에 의거하여 설명하기로 한다.Conventionally, as a method of filling a resin, a flip chip mounting body is installed obliquely or a sealed container connected to a rotary pump is used. Of these, the case of using a sealed container will be described based on Figures 1 to 4.

도1에 도시된 바와 같이, 플립칩(100)은 그 하측의 전극(102)으로부터 도전가능하게 연장된 전극돌기(104)가 형성되어 있다. 이러한 플립칩(100)의 하부에는 회로기판(200)이 배치되어 있다. 회로기판(200)은 그 상부면에 기판전극(202)이 형성되어 있다. 따라서, 이러한 기판전극(202) 상면에 플립칩의 전극돌기(104)가 접합됨으로써 플립칩실장체(300)를 구성하게 되는 것이다. 그러나, 이러한 플립칩실장체(300)는 회로기판(200)에 대해 전극돌기(104)에 의해 지지됨으로써, 열적 충격이 가해지면 전극돌기(104) 부위에 응력이 집중되게 되므로 파손의 우려가 있게 된다. 따라서, 이와 같은 종류의 플립칩실장체에 있어서는 필히 비전도성 수지에 의해 충진되어, 전극돌기 부위에 응력이 집중되지 않도록 하여야 하는 것이다. 이를 위해, 먼저 도2에서 보는 바와 같이 수지분배기(400)를 이용하여 플립칩실장체(300)에 비전도성 수지(402)를 분사(DISPENSING)한다. 비전도성 수지를 분사할 때는, 도3에 도시된 바와 같이, 회로기판(200) 하측에 일정 열을 발생하는 핫플레이트(600)를 배치하고, 이러한 핫플레이트(600)에 의해 지지된 플립칩실장체(300)를 밀폐용기(502)로써 밀폐한다. 또한, 밀폐용기(502)는 수지가 분사되는 쪽과 대향하는 쪽에 용기내에 부압을 가하기 위한 로터리펌프(500)가 연통되어 있다. 따라서, 로터리펌프(500)를 작동시키면, 이와 연결된 밀폐용기(502)내의 공기가 강제 배출됨으로써 용기내에 부압이 가해지게 된다. 이렇게 하면, 회로기판상(200)에 분사된 수지(402)가 부압작용에 의해 강제 충진되게 된다. 물론, 이러한 작업동안에 핫플레이트(600)는 계속 작동되어 수지의 경화를 방지하게 된다. 이렇게 함으로써, 도4 및 도5에 도시된 바와 같이, 플립칩실장체(300)내에 수지가 균일하게 충진될 수 있는 것이다.As shown in FIG. 1, the flip chip 100 is formed with an electrode protrusion 104 extending from the lower electrode 102 so as to be conductive. The circuit board 200 is disposed below the flip chip 100. In the circuit board 200, a substrate electrode 202 is formed on an upper surface thereof. Accordingly, the flip chip mounting body 300 is formed by bonding the electrode protrusion 104 of the flip chip to the upper surface of the substrate electrode 202. However, since the flip chip mounting body 300 is supported by the electrode protrusion 104 with respect to the circuit board 200, stress is concentrated on the electrode protrusion 104 when thermal shock is applied, so that the flip chip mounting body 300 may be damaged. do. Therefore, in this kind of flip chip mounting body, the non-conductive resin must be filled so that the stress does not concentrate on the electrode protrusion. To this end, as shown in FIG. 2, the non-conductive resin 402 is sprayed onto the flip chip assembly 300 using the resin distributor 400. When spraying the non-conductive resin, as illustrated in FIG. 3, a hot plate 600 generating a predetermined heat is disposed below the circuit board 200, and flip chip mounting supported by the hot plate 600 is provided. The sieve 300 is sealed with the sealed container 502. In the sealed container 502, a rotary pump 500 for applying a negative pressure in the container is connected to a side opposite to the side on which the resin is injected. Therefore, when the rotary pump 500 is operated, negative pressure is applied to the container by forcibly discharging the air in the sealed container 502 connected thereto. In this case, the resin 402 injected onto the circuit board 200 is forcedly filled by the negative pressure action. Of course, during this operation the hotplate 600 will continue to operate to prevent curing of the resin. By doing so, as shown in FIGS. 4 and 5, the resin can be uniformly filled in the flip chip assembly 300.

하지만, 이러한 종래의 플립칩 실장방법을 사용할 경우에는, 수지가 모세관현상에 의해 균일하게 충진될 수 없게 된다. 다시 말해, 플립칩 실장체의 연부 일측에 수지를 분사하면, 플립칩의 전극돌기 부분에서는 모세관현상에 의해 수지의 유동이 빨라지게 되고, 전극돌기가 없는 영역에서는 수지의 유동속도가 상대적으로 감소하게 된다. 그러므로, 충진수지의 유동 하류영역에 까지 수지가 충분히 전달되지 못하게 되어 하류영역에 보이드(void)(도5에서의 700)가 형성됨으로써, 플립칩 실장체가 실사용 환경에서 사용할 경우에 그러한 보이드로부터 열적 응력에 의해 크랙이 발생하여 파손되는 문제점이 있었다.However, when using such a conventional flip chip mounting method, the resin cannot be uniformly filled by the capillary phenomenon. In other words, when the resin is injected to one edge of the flip chip assembly, the flow of the resin is accelerated by the capillary phenomenon in the electrode protrusion of the flip chip, and the flow rate of the resin is relatively decreased in the region where the electrode protrusion is not present. do. Therefore, the resin cannot be sufficiently transferred to the flow downstream region of the filling paper, and a void (700 in FIG. 5) is formed in the downstream region, so that the flip chip package is thermally released from such void when used in a practical use environment. There is a problem in that cracks are generated and broken by stress.

이에, 본 발명은 이러한 문제점을 해결하기 위해 안출된 것으로서, 그 목적은 플립칩 실장체에 수지가 균일하게 충진될 수 있는 플립칩과 그 실장방법을 제공함에 있다.Accordingly, the present invention has been made to solve this problem, an object of the present invention is to provide a flip chip and a mounting method that can be uniformly filled with a resin in the flip chip mounting body.

도1내지 도4는 종래의 수지충진방법을 설명하기 위한 개략도,1 to 4 is a schematic view for explaining a conventional resin filling method,

도5는 종래의 플립칩 실장체를 도시한 평면도,5 is a plan view showing a conventional flip chip mounting body;

도6은 본 발명에 따른 플립칩 실장체를 도시한 측면도,6 is a side view showing a flip chip mounting body according to the present invention;

도7은 본 발명에 따른 플립칩 실장체를 도시한 평면도.7 is a plan view showing a flip chip mounting body according to the present invention.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

10: 플립칩 실장체 20: 플립칩10: flip chip assembly 20: flip chip

22: 전극 24: 전극돌기22: electrode 24: electrode projection

26: 충진안내리브 30: 회로기판26: Filling guide rib 30: Circuit board

32: 기판전극 40: 접합물32 substrate electrode 40 junction

이러한 목적을 달성하기 위한 본 발명은 칩본체와, 칩본체의 하부면에 회로기판상의 기판전극에 부착되는 다수의 전극돌기를 가지고 회로기판상에 소정의 이격공간을 두고 실장되는 플립칩에 있어서, 칩본체의 하부면에 전극돌기가 없는 영역내에서 회로기판을 향해 소정 길이구간에 걸쳐 돌출 형성된 적어도 하나의 충진안내리브를 포함하는 것을 특징으로 하고 있다.In order to achieve the above object, the present invention provides a chip main body and a flip chip mounted on a circuit board with a predetermined spacing space having a plurality of electrode protrusions attached to a substrate electrode on a circuit board on a lower surface of the chip body. It characterized in that it comprises at least one filling guide rib protruding over a predetermined length portion toward the circuit board in the region where the electrode body is free from the bottom surface of the chip body.

또한, 칩본체 하부면에 회로기판상의 기판전극에 부착되는 다수의 전극돌기를 가지고, 회로기판상에 실장되는 플립칩의 실장방법에 있어서, 칩본체의 하부면에 전극돌기가 없는 영역내에서 회로기판을 향해 소정 길이구간에 적어도 하나의 충진안내리브를 형성하는 단계; 플립칩의 전극돌기와 기판전극을 상호 접착시키는 단계; 및 회로기판과 플립칩간에 충진안내리브의 길이방향을 따라 비전도성 수지가 유입되도록 하는 수지충진단계를 포함하는 것을 특징으로 하고 있다.Further, in a flip chip mounting method having a plurality of electrode protrusions attached to a substrate electrode on a circuit board on a lower surface of the chip body, and mounted on the circuit board, a circuit is provided in an area where no electrode protrusion is formed on the lower surface of the chip body. Forming at least one filling guide rib toward a substrate at a predetermined length; Bonding the electrode protrusion of the flip chip to the substrate electrode; And a resin filling step of allowing non-conductive resin to flow in the longitudinal direction of the filling guide rib between the circuit board and the flip chip.

게다가, 상기 전극돌기는 칩본체의 하부면에 상호 평행한 한쌍의 돌기열을 이루어 배열되어, 충진안내리브를 돌기열 사이에 돌기열과 평행하게 형성됨이 바람직하다.In addition, the electrode protrusions are arranged to form a pair of protrusions parallel to the lower surface of the chip body, it is preferable that the filling guide ribs are formed in parallel with the protrusions between the protrusions.

아울러, 상기 전극돌기가 칩본체의 하부면에 상호 평행한 한쌍의 돌기열을 이루어 배열되어, 충진안내리브를 돌기열 사이에 돌기열과 평행하게 형성함이 바람직하다.In addition, the electrode protrusions are arranged to form a pair of protrusions parallel to the lower surface of the chip body, it is preferable to form the filling guide rib in parallel with the protrusions between the protrusions.

더불어, 상기 충진안내리브를 복수개로 상호 평행하게 배열함이 바람직하다.In addition, it is preferable to arrange the plurality of filling guide ribs in parallel with each other.

이하, 첨부된 도면을 참조하여 본 발명의 구성 및 작용을 상세히 설명한다.Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation of the present invention.

플립칩 실장체(10)는 플립칩(20)과 회로기판(30)이 접합물(40)에 의해 접착되어 있다. 플립칩(20)은 그 하측면에 전극(22)이 형성되어 있고, 전극(22)에는 그로부터 도전가능하게 연장된 전극돌기(24)가 결합되어 있다. 전극돌기(24)는 상호 평행하게 돌기열을 이루면서 배열되어 있고, 이러한 전극돌기열 사이에 전극돌기가 없는 영역에는 회로기판(30)쪽으로 둘출한 충진안내리브(26)가 상호 평행하게 다수개 부착되어 있다. 충진안내리브(26)로는 PSR(photo solder resist)나 실크인쇄물이 사용된다. 또한, 이러한 플립칩(20)과 결합되는 회로기판(30)은 그 상부면에 기판전극(32)이 형성되어 있다. 따라서, 플립칩(20)이 회로기판(30)상에 배치되어 전극돌기(24)가 기판전극(32)과 접합물(40)로써 접착됨으로써 고정되어 있다. 접합물(40)은 전극돌기(24) 및 기판전극(32)을 접착하기 위한 것으로서, 전도성 접착제(conductive adhesive)나 솔더(soldre)가 사용된다.In the flip chip mounting body 10, the flip chip 20 and the circuit board 30 are bonded to each other by a bonding body 40. The flip chip 20 has an electrode 22 formed on a lower side thereof, and an electrode protrusion 24 extending from the electrode 22 so as to be electrically conductive therefrom. The electrode protrusions 24 are arranged in parallel to form a series of protrusions, and a plurality of filling guide ribs 26 protruded toward the circuit board 30 are attached in parallel to each other in an area where there are no electrode protrusions between the electrode protrusions. It is. As the filling guide ribs 26, photo solder resist (PSR) or silk printed matter is used. In addition, a substrate electrode 32 is formed on an upper surface of the circuit board 30 coupled to the flip chip 20. Accordingly, the flip chip 20 is disposed on the circuit board 30 so that the electrode protrusions 24 are fixed by bonding the substrate electrodes 32 to the bonding body 40. The bonding body 40 is for bonding the electrode protrusion 24 and the substrate electrode 32, and a conductive adhesive or a solder is used.

따라서, 이렇게 결합된 플립칩 실장체(10)에 수지를 분사(DISPENSING)하여 실장체내에 유입되게 하면, 수지가 충진안내리브(26)를 따라 일정하게 유동되게 된다.Accordingly, when the resin is injected into the assembled flip chip mounting body 10 so as to flow into the mounting body, the resin flows uniformly along the filling guide rib 26.

상술한 바와 같이, 본 발명에 따른 플립칩과 그 실장방법은 회로기판에 부착되는 플립칩 하부면에 회로기판쪽으로 돌출한 충진안내리브를 부착하여, 플립칩과 회로기판간에 수지가 충진되도록 함으로써, 모세관현상에 의해 부위별로 달라지는 충진속도를 일정하게 조정할 수 있게 되어 수지가 플립칩 실장체내에 균일하게 충진되는 효과가 있다.As described above, the flip chip and the mounting method according to the present invention is attached to the bottom surface of the flip chip attached to the circuit board by attaching a filling guide rib protruding toward the circuit board, so that the resin is filled between the flip chip and the circuit board, Capillary phenomena can be adjusted to vary the filling rate for each part uniformly has the effect that the resin is uniformly filled in the flip chip assembly.

Claims (7)

칩본체와, 칩본체의 하부면에 회로기판상의 기판전극에 부착되는 다수의 전극돌기를 가지고 회로기판상에 소정의 이격공간을 두고 실장되는 플립칩에 있어서,A flip chip mounted on a circuit board with a predetermined spacing space having a chip body and a plurality of electrode protrusions attached to a substrate electrode on a circuit board on a lower surface of the chip body. 상기 칩본체의 하부면에 상기 전극돌기가 없는 영역내에서 회로기판을 향해 소정 길이구간에 걸쳐 돌출 형성된 적어도 하나의 충진안내리브를 포함하는 것을 특징으로 하는 플립칩.And at least one filling guide rib protruding from the lower surface of the chip body over a predetermined length portion toward the circuit board in the region where the electrode protrusion is not present. 제 1항에 있어서,The method of claim 1, 상기 전극돌기는 상기 칩본체의 하부면에 상호 평행한 한쌍의 돌기열을 이루어 배열되어, 상기 충진안내리브를 상기 돌기열 사이에 상기 돌기열과 평행하게 형성되어 있는 것을 특징으로 하는 플립칩.The electrode protrusions are arranged in a pair of protrusions parallel to each other on the lower surface of the chip body, the filling guide ribs are formed in parallel with the protrusions between the protrusions. 제 2항에 있어서,The method of claim 2, 상기 충진안내리브는 복수개가 상호 평행하게 배열되어 있는 것을 특징으로 하는 플립칩.The filling guide rib is a plurality of flip chips, characterized in that arranged in parallel to each other. 제 2항에 있어서,The method of claim 2, 상기 충진안내리브는 상기 플립칩의 실장상태에서 상기 회로기판으로부터 소정의 틈새를 갖고 형성되어 있는 것을 특징으로 하는 플립칩.And the filling guide rib has a predetermined gap from the circuit board in the flip chip mounting state. 칩본체 하부면에 회로기판상의 기판전극에 부착되는 다수의 전극돌기를 가지고, 회로기판상에 실장되는 플립칩의 실장방법에 있어서,In the method of mounting a flip chip having a plurality of electrode projections attached to the substrate electrode on the circuit board on the lower surface of the chip body, mounted on the circuit board, 상기 칩본체의 하부면에 상기 전극돌기가 없는 영역내에서 회로기판을 향해 소정 길이구간에 적어도 하나의 충진안내리브를 형성하는 단계;Forming at least one filling guide rib on a bottom surface of the chip body toward a circuit board in a region without the electrode protrusion at a predetermined length; 상기 플립칩의 전극돌기와 상기 기판전극을 상호 접착시키는 단계; 및Bonding the electrode protrusion of the flip chip and the substrate electrode to each other; And 상기 회로기판과 플립칩간에 상기 충진안내리브의 길이방향을 따라 비전도성 수지가 유입되도록 하는 수지충진단계를 포함하는 플립칩의 실장방법.And a resin filling step of introducing a non-conductive resin in the longitudinal direction of the filling guide rib between the circuit board and the flip chip. 제 5항에 있어서,The method of claim 5, 상기 전극돌기가 상기 칩본체의 하부면에 상호 평행한 한쌍의 돌기열을 이루어 배열되어, 상기 충진안내리브를 상기 돌기열 사이에 상기 돌기열과 평행하게 형성하는 것을 특징으로 하는 플립칩의 실장방법.And the electrode protrusions are arranged in a pair of protrusion rows parallel to the lower surface of the chip body, so that the filling guide rib is formed in parallel with the protrusion rows between the protrusion rows. 제 5항에 있어서,The method of claim 5, 상기 충진안내리브를 복수개로 상호 평행하게 배열하는 것을 특징으로 하는 플립칩의 실장방법.And a plurality of filling guide ribs arranged in parallel to each other.
KR1019970074511A 1997-12-26 1997-12-26 Flip chip and mounting method thereof KR100274992B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019970074511A KR100274992B1 (en) 1997-12-26 1997-12-26 Flip chip and mounting method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019970074511A KR100274992B1 (en) 1997-12-26 1997-12-26 Flip chip and mounting method thereof

Publications (2)

Publication Number Publication Date
KR19990054650A KR19990054650A (en) 1999-07-15
KR100274992B1 true KR100274992B1 (en) 2001-01-15

Family

ID=40749568

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970074511A KR100274992B1 (en) 1997-12-26 1997-12-26 Flip chip and mounting method thereof

Country Status (1)

Country Link
KR (1) KR100274992B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021074713A1 (en) * 2019-10-15 2021-04-22 International Business Machines Corporation Structure with controlled capillary coverage

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021074713A1 (en) * 2019-10-15 2021-04-22 International Business Machines Corporation Structure with controlled capillary coverage
US11152226B2 (en) 2019-10-15 2021-10-19 International Business Machines Corporation Structure with controlled capillary coverage
GB2604793A (en) * 2019-10-15 2022-09-14 Ibm Structure with controlled capillary coverage
GB2604793B (en) * 2019-10-15 2023-12-20 Ibm Structure with controlled capillary coverage

Also Published As

Publication number Publication date
KR19990054650A (en) 1999-07-15

Similar Documents

Publication Publication Date Title
KR100323644B1 (en) Semiconductor device
KR950035545A (en) Semiconductor device and semiconductor chip mounting method having semiconductor chip connected to circuit board via bump
KR940022755A (en) Semiconductor device and manufacturing method thereof and lead frame for semiconductor device
US6653743B2 (en) Electronic component mounted on a flat substrate and padded with a fluid filler
KR20010070011A (en) Semiconductor device
WO2000035052A1 (en) Clip connector, method of mounting clip connector, and clip connector/holder assembly
KR100274993B1 (en) Circuit board with guide ribs and mounting method thereof
KR100274992B1 (en) Flip chip and mounting method thereof
US4724473A (en) Micropackage for encapsulating an electronic component
US7152957B2 (en) Recording device board having a plurality of bumps for connecting an electrode pad and an electrode lead, liquid ejection head, and manufacturing method for the same
JPH10321666A (en) Resin sealing structure of flip chip mounting type semiconductor element
KR20000068591A (en) Method for making a glued joint between an electronic component and a supporting substrate
JPH11260973A (en) Mounting structure of semiconductor chip
JPH11345834A (en) Semiconductor element manufacture of semiconductor device using the same, and semiconductor device
US8822836B2 (en) Bonding sheet, electronic circuit device and its manufacturing method
KR100617274B1 (en) Substrate for mounting semiconductor chip
US6371594B1 (en) Ink jet recording head, an ink jet cartridge, and an ink jet recording apparatus
US20020182774A1 (en) Die-attach method and assemblies using film and epoxy bonds
US20010010393A1 (en) Semiconductor device and semiconductor device mounting method thereof
JP3575222B2 (en) Mounting structure and mounting method of chip-shaped component
JP3918098B2 (en) Circuit module manufacturing method
KR100352119B1 (en) Structure of ball grid array semiconductor package having heatsink and fabricating method thereof
JPH10125720A (en) Semiconductor integrated circuit device and manufacturing method thereof
JPH01270390A (en) Electronic component mounting method for printed circuit board
JPH1098077A (en) Production of semiconductor device

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20080708

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee