KR100269834B1 - 용제 잔류물의 제거를 포함하는 납땜 방법 - Google Patents

용제 잔류물의 제거를 포함하는 납땜 방법 Download PDF

Info

Publication number
KR100269834B1
KR100269834B1 KR1019920019716A KR920019716A KR100269834B1 KR 100269834 B1 KR100269834 B1 KR 100269834B1 KR 1019920019716 A KR1019920019716 A KR 1019920019716A KR 920019716 A KR920019716 A KR 920019716A KR 100269834 B1 KR100269834 B1 KR 100269834B1
Authority
KR
South Korea
Prior art keywords
solvent
substrate
temperature
devices
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1019920019716A
Other languages
English (en)
Korean (ko)
Other versions
KR930009693A (ko
Inventor
이논디가니
딘폴코시브스
Original Assignee
죤 제이.키세인
아메리칸 텔리폰 앤드 텔레그라프 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 죤 제이.키세인, 아메리칸 텔리폰 앤드 텔레그라프 캄파니 filed Critical 죤 제이.키세인
Publication of KR930009693A publication Critical patent/KR930009693A/ko
Application granted granted Critical
Publication of KR100269834B1 publication Critical patent/KR100269834B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Soldering of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Application thereof; Other processes of activating the contact surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
KR1019920019716A 1991-11-04 1992-10-26 용제 잔류물의 제거를 포함하는 납땜 방법 Expired - Lifetime KR100269834B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US787,290 1991-11-04
US07/787,290 US5125560A (en) 1991-11-04 1991-11-04 Method of soldering including removal of flux residue

Publications (2)

Publication Number Publication Date
KR930009693A KR930009693A (ko) 1993-06-21
KR100269834B1 true KR100269834B1 (ko) 2000-10-16

Family

ID=25141008

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019920019716A Expired - Lifetime KR100269834B1 (ko) 1991-11-04 1992-10-26 용제 잔류물의 제거를 포함하는 납땜 방법

Country Status (5)

Country Link
US (1) US5125560A (https=)
EP (1) EP0541282B1 (https=)
JP (1) JPH05218113A (https=)
KR (1) KR100269834B1 (https=)
DE (1) DE69216768T2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100807038B1 (ko) 2002-12-06 2008-02-25 가부시키가이샤 다무라 세이사쿠쇼 솔더 범프 형성 방법 및 장치

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3390245B2 (ja) * 1993-06-01 2003-03-24 富士通株式会社 洗浄液及び洗浄方法
JP3194553B2 (ja) * 1993-08-13 2001-07-30 富士通株式会社 半導体装置の製造方法
DE4432774C2 (de) * 1994-09-15 2000-04-06 Fraunhofer Ges Forschung Verfahren zur Herstellung meniskusförmiger Lotbumps
US5919317A (en) * 1994-12-07 1999-07-06 Nippondenso Co., Ltd. Soldering flux, soldering paste and soldering method using the same
JP3104606B2 (ja) 1995-03-24 2000-10-30 株式会社デンソー 基板と被接続材との接続方法及びその接続構造及びその接続用補助材料
US5728035A (en) * 1996-05-03 1998-03-17 Guthy-Renker Corp. Anchor plate for abdominal exercise device
US5992729A (en) * 1996-10-02 1999-11-30 Mcnc Tacking processes and systems for soldering
US5988485A (en) * 1998-03-17 1999-11-23 Advanced Micro Devices, Inc. Flux cleaning for flip chip technology using environmentally friendly solvents
JP3785435B2 (ja) 1998-08-27 2006-06-14 株式会社デンソー はんだペーストおよび表面実装型電子装置
US6279090B1 (en) 1998-09-03 2001-08-21 Micron Technology, Inc. Method and apparatus for resynchronizing a plurality of clock signals used in latching respective digital signals applied to a packetized memory device
JP3649087B2 (ja) 1999-07-28 2005-05-18 株式会社デンソー 熱可塑性樹脂材料の接着方法および接着構造体
JP3520854B2 (ja) 2001-01-30 2004-04-19 住友電気工業株式会社 レジスタコネクタ及びその製造方法
US6712260B1 (en) 2002-04-18 2004-03-30 Taiwan Semiconductor Manufacturing Company Bump reflow method by inert gas plasma
KR100499134B1 (ko) * 2002-10-28 2005-07-04 삼성전자주식회사 압축 접합 방법
US20070102481A1 (en) * 2003-06-09 2007-05-10 Rikiya Kato Solder paste
US9059241B2 (en) * 2013-01-29 2015-06-16 International Business Machines Corporation 3D assembly for interposer bow
WO2016022755A2 (en) 2014-08-06 2016-02-11 Greene Lyon Group, Inc. Rotational removal of electronic chips and other components from printed wire boards using liquid heat media

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3963529A (en) * 1970-12-07 1976-06-15 Matsushita Electric Industrial Co., Ltd. Soldering flux
SU810417A1 (ru) * 1979-04-17 1981-03-07 Предприятие П/Я Г-4444 Флюс
AU5919890A (en) * 1989-08-14 1991-02-14 Multicore Solders Limited Manufacture of printed circuit board assemblies

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100807038B1 (ko) 2002-12-06 2008-02-25 가부시키가이샤 다무라 세이사쿠쇼 솔더 범프 형성 방법 및 장치
US7350686B2 (en) 2002-12-06 2008-04-01 Tamura Corporation Method for supplying solder

Also Published As

Publication number Publication date
US5125560A (en) 1992-06-30
DE69216768D1 (de) 1997-02-27
EP0541282A3 (https=) 1994-02-23
EP0541282B1 (en) 1997-01-15
EP0541282A2 (en) 1993-05-12
DE69216768T2 (de) 1997-07-10
JPH05218113A (ja) 1993-08-27
KR930009693A (ko) 1993-06-21

Similar Documents

Publication Publication Date Title
KR100269834B1 (ko) 용제 잔류물의 제거를 포함하는 납땜 방법
US6265776B1 (en) Flip chip with integrated flux and underfill
US6228681B1 (en) Flip chip having integral mask and underfill providing two-stage bump formation
US6228678B1 (en) Flip chip with integrated mask and underfill
JP2589239B2 (ja) 熱硬化可能な接着剤およびこれを用いた電気的コンポーネント組立体
EP0539481B1 (en) Method of producing microchips
US5615827A (en) Flux composition and corresponding soldering method
JP3215008B2 (ja) 電子回路の製造方法
KR100644420B1 (ko) 환경 친화적인 용제를 이용하는 플립 칩 기술을 위한 플럭스 세정
KR100669061B1 (ko) 리플로 납땜 방법
KR100592121B1 (ko) 플립 칩 조립을 위한 무세정 플럭스
KR100322823B1 (ko) 전자회로장치의제조방법
JPH09186200A (ja) フリップチップ実装方法
US6722557B2 (en) Flux cleaning method and method of manufacturing semiconductor device
US6503874B2 (en) Cleaning method to remove flux residue in electronic assembly
JP2014146638A (ja) 半導体装置の製造方法
KR102713467B1 (ko) 웨이퍼 범핑용 플럭스 조성물
Oppermann et al. Reliability investigations of hard core solder bumps using mechanical palladium bumps and SnPb solder
WO2022158460A1 (ja) はんだ接合用樹脂組成物
JP2022147854A (ja) 仮固定組成物
Lo et al. Wetting characteristics of solder reflow on copper traces without solder mask
Nagarkar et al. Effect of Cleaning Process Parameters and Materials on Flux Residue for Flip Chip Assembly
Schweigart et al. True Water-Based Cleaning Innovations to Replace Solvent Based Defluxing Products
JPH10199938A (ja) 半導体製造方法および装置

Legal Events

Date Code Title Description
PA0109 Patent application

Patent event code: PA01091R01D

Comment text: Patent Application

Patent event date: 19921026

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 19970703

Comment text: Request for Examination of Application

Patent event code: PA02011R01I

Patent event date: 19921026

Comment text: Patent Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20000131

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20000519

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20000725

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20000726

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20030630

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20040702

Start annual number: 5

End annual number: 5

PR1001 Payment of annual fee

Payment date: 20050701

Start annual number: 6

End annual number: 6

PR1001 Payment of annual fee

Payment date: 20060628

Start annual number: 7

End annual number: 7

PR1001 Payment of annual fee

Payment date: 20070629

Start annual number: 8

End annual number: 8

PR1001 Payment of annual fee

Payment date: 20080625

Start annual number: 9

End annual number: 9

PR1001 Payment of annual fee

Payment date: 20090721

Start annual number: 10

End annual number: 10

PR1001 Payment of annual fee

Payment date: 20100721

Start annual number: 11

End annual number: 11

PR1001 Payment of annual fee

Payment date: 20110718

Start annual number: 12

End annual number: 12

FPAY Annual fee payment

Payment date: 20120628

Year of fee payment: 13

PR1001 Payment of annual fee

Payment date: 20120628

Start annual number: 13

End annual number: 13

EXPY Expiration of term
PC1801 Expiration of term

Termination date: 20130709

Termination category: Expiration of duration