KR100263317B1 - Apparatus and method for removing by-product in a plating solution - Google Patents

Apparatus and method for removing by-product in a plating solution Download PDF

Info

Publication number
KR100263317B1
KR100263317B1 KR1019970049750A KR19970049750A KR100263317B1 KR 100263317 B1 KR100263317 B1 KR 100263317B1 KR 1019970049750 A KR1019970049750 A KR 1019970049750A KR 19970049750 A KR19970049750 A KR 19970049750A KR 100263317 B1 KR100263317 B1 KR 100263317B1
Authority
KR
South Korea
Prior art keywords
ultraviolet light
plating liquid
light source
reaction
plating
Prior art date
Application number
KR1019970049750A
Other languages
Korean (ko)
Other versions
KR19990027313A (en
Inventor
김주봉
민병철
Original Assignee
이중구
삼성테크윈주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이중구, 삼성테크윈주식회사 filed Critical 이중구
Priority to KR1019970049750A priority Critical patent/KR100263317B1/en
Publication of KR19990027313A publication Critical patent/KR19990027313A/en
Application granted granted Critical
Publication of KR100263317B1 publication Critical patent/KR100263317B1/en

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes

Abstract

PURPOSE: An equipment for removing reaction byproduct of plating solution is provided, which can be used semi-permanently as long as the life time of an ultraviolet light source. The treatment rate of the equipment is greatly improved compared with the conventional activated carbon process. CONSTITUTION: The system comprises the followings: (i) a removal equipment (20) of reaction byproduct that consists of a tank (14), an ultraviolet light source (21) and a cooler (28); (ii) a tank (14) for holding a plating solution (15) in which reaction byproduct is contained; (iii) an ultraviolet light source (21) that is protected by a transparent protecting cell (29), is connected to a direct current source (24) and is submerged in the plating solution (15) in the tank (14) for irradiating ultraviolet light of 240-250nm to remove reaction byproduct; and (iii) a cooler (28) that is installed on an inflow and outflow line (26) of coolant for cooling the ultraviolet light source (21).

Description

도금액 반응부산물 제거장치 및 방법{Apparatus and method for removing by-product in a plating solution}Apparatus and method for removing by-product in a plating solution}

본 발명은 도금액의 반응부산물 제거에 관한 것으로서, 보다 상세하게는 자외선을 이용하여 도금액의 반응부산물을 제거하는 장치와 그 방법에 관한 것이다.The present invention relates to the removal of the reaction by-product of the plating liquid, and more particularly, to an apparatus and a method for removing the reaction by-product of the plating liquid using ultraviolet light.

도 1에는 종래의 도금액 반응부산물 제거장치의 구성이 도시되어 있다.1 shows a configuration of a conventional plating liquid reaction byproduct removing apparatus.

도면을 참조하면, 종래의 도금액 반응부산물 제거장치(10)는 활성탄을 사용하는 흡착식 여과방법을 사용하며 도금액(15)을 담는 탱크(14), 상기 탱크(14)에 연결된 유출입 배관(16), 상기 유출입 배관(16)에 연결된 필터하우징(12), 상기 필터하우징(12)의 내부에 설치되어 유입된 도금액(15)을 여과 및 정화하는 활성탄 필터카트리지(11), 상기 유출입 배관(16)을 따라 상기 도금액(15)을 순환시키는 이송펌프(13)를 구비한다.Referring to the drawings, the conventional plating liquid reaction by-product removal device 10 is a tank 14 containing the plating liquid 15, using an adsorption-type filtration method using activated carbon, the outflow pipe 16 connected to the tank 14, The filter housing 12 connected to the outflow pipe 16, the activated carbon filter cartridge 11 installed in the filter housing 12 to filter and purify the plating solution 15 introduced therein, and the outflow pipe 16. Accordingly, a transfer pump 13 for circulating the plating solution 15 is provided.

상기와 같은 구조를 가진 종래의 도금액 반응부산물 제거장치(10)에 있어서 상기 탱크(14)에서 이송펌프(13)에 의해 유출된 도금액(15)은 배관(16)을 통하여 상기 필터하우징(12) 내의 필터카트리지(11)로 유입된다. 유입된 도금액(15)은 상기 필터카트리지(11)에 의해 여과되어 도금액(15)내의 반응부산물의 농도가 낮아지게 된다. 즉 상기 필터카트리지(11)내에 충진된 활성탄(미도시)을 통과하면서 반응부산물이 흡착되어 정화된 도금액(15)은 배관(16)을 통하여 다시 탱크(14) 내로 유입된다. 상기 종래의 도금액 반응부산물 제거장치(10)는 활성탄에 의해 도금액(15)을 여과시키므로, 일정시간 사용 후에 상기 활성탄을 포함한 필터카트리지(11)를 교환하여야 한다. 특히 도금액(15)의 반응부산물 농도가 높을 때에는 상기 필터카트리지(11)를 자주 교환하여야 하므로 작업이 번거롭고 필터카트리지(11)의 교환비용이 발생한다. 또한, 이러한 필터링 방식은 대량의 도금액(15)을 처리하는데 많은 시간이 소요되는 단점이 있다.In the conventional plating solution reaction byproduct removing apparatus 10 having the structure as described above, the plating solution 15 leaked by the transfer pump 13 from the tank 14 is connected to the filter housing 12 through a pipe 16. It flows into the filter cartridge 11 inside. The introduced plating solution 15 is filtered by the filter cartridge 11 so that the concentration of the reaction byproduct in the plating solution 15 is lowered. That is, while passing through activated carbon (not shown) filled in the filter cartridge 11, the reaction by-products are adsorbed and purified, and the plating solution 15 is introduced into the tank 14 through the pipe 16 again. The conventional plating liquid reaction byproduct removing apparatus 10 filters the plating liquid 15 by activated carbon, so that the filter cartridge 11 including the activated carbon needs to be replaced after a predetermined time of use. In particular, when the reaction by-product concentration of the plating solution 15 is high, the filter cartridge 11 needs to be replaced frequently, which is cumbersome and incurs a replacement cost of the filter cartridge 11. In addition, this filtering method has a disadvantage in that it takes a long time to process a large amount of the plating liquid (15).

본 발명은 상기와 같은 문제점을 해결하기 위하여 인출된 것으로서, 자외선을 발하는 광원을 이용하여, 도금후 도금액 내의 반응부산물을 제거하는 도금액 반응부산물 제거장치 및 방법을 제공하는데 그 목적이 있다.The present invention has been made in order to solve the above problems, and an object of the present invention is to provide a plating solution reaction by-products removal method and method for removing the reaction by-products in the plating liquid after plating using a light source that emits ultraviolet rays.

도 1은 종래의 도금액 반응부산물 제거장치의 구성을 도시한 도면.1 is a view showing the configuration of a conventional plating liquid reaction by-product removal device.

도 2는 본 발명에 따른 도금액 반응부산물 제거장치의 구성을 도시한 도면.2 is a view showing the configuration of a plating liquid reaction by-products removing device according to the present invention.

도 3은 본 발명에 따라 자외선 조사시 자외선의 파장과 니켈도금용액의 자외선 흡수율과의 상관관계를 나타낸 그래프.Figure 3 is a graph showing the correlation between the wavelength of ultraviolet light and the ultraviolet absorption of the nickel plating solution during ultraviolet irradiation in accordance with the present invention.

〈도면의 주요부분에 대한 부호의 간단한 설명〉<Brief description of symbols for the main parts of the drawings>

11..필터카트리지 12..필터하우징11..Filter cartridge 12 .. Filter housing

13,23..이송펌프 15..도금액13,23 .. Transfer pump 15 .. Plating solution

16,26..유출입 배관 21..자외선광원16, 26. Outflow and outflow piping 21. Ultraviolet light source

29..투과성보호셀29. Permeable protective cell

상기와 같은 목적을 달성하기 위하여 본 발명의 도금액 반응부산물 제거장치는, 직류전원장치, 탱크, 상기 직류전원장치로부터 인가된 전류을 사용하며 상기 탱크에 조사 가능하게 설치된 자외선광원을 구비하는 것을 특징으로 한다.In order to achieve the above object, the plating liquid reaction byproduct removing apparatus of the present invention is characterized in that it comprises a direct current power source, a tank, an ultraviolet light source that is irradiated to the tank using a current applied from the direct current power source. .

또한 상기 자외선광원을 보호하기 위해 감싸며, 상기 자외선광원과 소정간격 이격되어 설치된 다중구조벽의 투과성보호셀을 더 포함하는 것이 바람직하다. 또한 상기 투과성보호셀은 석영관인 것을 더 포함하는 것이 바람직하다.In addition, it is preferable to further include a permeable protective cell of the multi-structured wall wrapped to protect the ultraviolet light source, spaced apart from the ultraviolet light source by a predetermined interval. In addition, the permeable protective cell preferably further comprises a quartz tube.

이하 첨부된 도면을 참조하면서 본 발명에 따른 도금액 반응부산물 제거장치 및 방법의 바람직한 실시 예를 상세히 설명한다.Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the plating liquid reaction byproduct removal apparatus and method according to the present invention.

본 발명의 일 실시 예에 따른 도금액 반응부산물 제거장치(20)가 도 2에 도시되어 있다. 여기에서 앞서 도시된 도면에서와 동일한 참조부호는 동일한 구성요소를 가리킨다.A plating liquid reaction byproduct removing apparatus 20 according to an embodiment of the present invention is shown in FIG. 2. Here, the same reference numerals as in the above-described drawings indicate the same components.

상기 도면을 참조하면, 본 발명의 도금액 반응부산물 제거장치(20)는 도금후 반응부산물이 함유된 도금액(15)이 저장되는 탱크(14), 상기 탱크(14)내의 도금액(15)에 잠기도록 설치되어 자외선을 방출하는 자외선광원(21), 상기 자외선광원(21)에 직류전원을 공급하는 직류 전원장치(24)로 구성된다.Referring to the drawings, the plating solution reaction by-product removal apparatus 20 of the present invention is to be immersed in the tank 14, the plating liquid 15 containing the reaction by-product after plating, the plating liquid 15 in the tank 14 It is composed of an ultraviolet light source 21 provided to emit ultraviolet light, and a DC power supply device 24 for supplying DC power to the ultraviolet light source 21.

상기 자외선광원(21)은 투과성보호셀(29)에 의해 감싸진다. 그런데, 상기 자외선광원(21)으로부터 자외선이 방출될 때 고온의 발열이 있으므로 이를 냉각하기 위한 냉각장치(28)가 구비된다. 상기 냉각장치(28)는 상기 투과성보호셀(29)로 냉매를 공급하도록 커플링(25)으로 연결된 유출입 배관(26) 및 상기 유출입 배관(26)에 연결된 냉각장치(28)를 포함한다. 상기 투과성보호셀(29)은 그 내벽과 외벽 사이에 상기 냉매가 통과하는 통로가 형성되어 있는 다중벽 구조를 이룬다.The ultraviolet light source 21 is wrapped by the transparent protective cell 29. However, since there is a high temperature heat generated when the ultraviolet light is emitted from the ultraviolet light source 21, a cooling device 28 for cooling it is provided. The cooling device 28 includes an inflow and outflow pipe 26 connected to the coupling 25 and a cooling device 28 connected to the outflow and inflow pipe 26 to supply the refrigerant to the permeable protective cell 29. The permeable protective cell 29 forms a multi-walled structure in which a passage through which the refrigerant passes is formed between the inner wall and the outer wall.

상기와 같이 구성된 본 발명에 따른 도금액 반응부산물 제거장치(20)는 다음과 같이 작동한다.Plating liquid reaction by-product removal device 20 according to the present invention configured as described above operates as follows.

먼저 직류전원장치(24)에서 인가된 직류 전류에 의하여 상기 자외선광원(21)에서 자외선이 발생된다. 상기 자외선이 조사됨에 따라 상기 자외선광원(21) 주위의 공기는 온도가 상승된다. 이러한 상승되는 열이 축적되어 발생되는 과열을 냉각하기 위하여 석영으로된 투과성보호셀(29)에 연결된 유출입 배관(26)을 통하여 상기 유출입 배관(26)에 연결된 냉각장치(28)로부터 냉각매체가 유입된다. 상기 냉각매체는 물이 바람직하다.First, ultraviolet rays are generated from the ultraviolet light source 21 by the DC current applied from the DC power supply device 24. As the ultraviolet light is irradiated, the air around the ultraviolet light source 21 increases in temperature. The cooling medium flows in from the cooling device 28 connected to the inflow and outflow pipe 26 through the outflow and outflow pipe 26 connected to the permeable protective cell 29 made of quartz to cool down the heat generated by the rising heat. do. The cooling medium is preferably water.

상기 자외선의 조사에 의하여, 상기 도금액 탱크(14)내의 인위적으로 첨가되거나 도금공정 진행 중 반응 부산물로 생성된 유기물 등이 함유된 도금액(15)에 함유된 반응 부산물은 분해되어 정화된다.By the irradiation of the ultraviolet rays, the reaction by-products contained in the plating liquid 15 containing the organic substances or the like that are artificially added in the plating liquid tank 14 or generated as reaction by-products during the plating process are decomposed and purified.

본 발명의 효과는 다음과 같은 실험 예에 의해 뒷받침된다.The effects of the present invention are supported by the following experimental examples.

〈실험 예〉Experimental Example

본 실험 예에서 사용된 도금액은 니켈 도금액이다. 즉, 이러한 니켈 도금액은 통상적으로 니켈염, pH완충제 등을 포함하고 있다. 상기 니켈염으로는 황산니켈, 염화니켈, 설파믹산 니켈(nickel sulfamate)〔Ni(H2NSO3)2〕등을 사용한다.The plating liquid used in this experimental example is a nickel plating liquid. That is, such a nickel plating solution usually contains a nickel salt, a pH buffer, etc. Nickel sulfate, nickel chloride, nickel sulfamate [Ni (H 2 NSO 3 ) 2 ], and the like are used as the nickel salt.

상기 니켈염으로서 설파믹산 니켈을 사용하는 경우, 설파믹산 니켈중의 일부는 중간체인 히드라진디술포네이트(hydrazine disulfonate)를 거쳐 아조디술포네이트(azodisulfonate)로 전환된다.When using sulfamic acid nickel as the nickel salt, a part of the sulfamic acid nickel is converted to azodisulfonate via an intermediate hydrazine disulfonate.

2H2NSO- 3 2---→［(SO3NHNHSO3)-2］+ 2H++ 2e- 2H 2 NSO - 3 2 --- → [(SO 3 NHNHSO 3) -2] + 2H + + 2e -

히드라진디술포네이트Hydrazine disulfonate

---→ (SO3N=NSO3)-2+ 4H++ 4e_ --- → (SO 3 N = NSO 3 ) -2 + 4H + + 4e _

아조디술포네이트Azodisulfonate

그런데, 상기 아조디술포네이트가 형성되면 니켈 도금층의 연성을 저하시키는 문제점이 있으므로 이에 본 발명은 상기 문제점을 해결하기 위하여 240nm 내지 250nm 사이 파장의 자외선(UV)을 이용하여 반응부산물인 상기 아조디술포네이트를 상술한 질소가스와 아황산가스 상태로 분해함으로써 제거하였다.However, when the azodisulfonate is formed, there is a problem of lowering the ductility of the nickel plating layer. Accordingly, the present invention provides the azodisulfo which is a reaction by-product using ultraviolet (UV) light having a wavelength between 240 nm and 250 nm. Nate was removed by decomposing in the above-described nitrogen gas and sulfurous acid gas state.

(SO3N=NSO3)-2→ UV(Ultra Violet Light)조사 → N2+ 2SO3 (SO 3 N = NSO 3 ) -2 → UV (Ultra Violet Light) irradiation → N 2 + 2SO 3

상기 아조디술포네이트는 조사된 자외선에 의하여 질소가스(N2)와 아황산가스(SO2)로 분해됨으로써 제거된다.The azodisulfonate is removed by decomposition into nitrogen gas (N 2 ) and sulfurous acid gas (SO 2 ) by the ultraviolet rays irradiated.

특히 상기 자외선의 파장은 약 245nm 가 바람직하다.In particular, the wavelength of the ultraviolet ray is preferably about 245 nm.

도 3은 본 발명의 특징인 자외선 조사시 자외선의 파장과 니켈 도금액의 자외선 흡수율과의 상관관계를 나타낸 그래프이며, 자외선 흡수율은 반응부산물의 함유량과 비례한다. 여기서 그래프곡선(Ⅰ)은 자외선을 조사후 반응부산물이 분해 제거된 경우이며, 그래프곡선(Ⅱ)은 자외선을 조사하기 전의 반응부산물이 함유된 상태의 경우이다.3 is a graph showing the correlation between the wavelength of ultraviolet light and the ultraviolet absorption of the nickel plating solution during ultraviolet irradiation, which is a characteristic of the present invention, and the ultraviolet absorption is proportional to the content of the reaction byproduct. Here, the graph curve (I) is a case where the reaction byproducts are decomposed and removed after irradiation with ultraviolet rays, and the graph curve (II) is a case where the reaction byproducts are contained before the irradiation with ultraviolet rays.

상기 그래프곡선(Ⅱ)에서 피크 부위인 "P" 가 그래프곡선(Ⅰ)에서 없어진 것은 반응부산물이 자외선에 의해 분해되었음을 나타낸다.The disappearance of the peak portion "P" in the graph curve (II) in the graph curve (II) indicates that the reaction by-products were decomposed by ultraviolet rays.

이상의 설명에서와 같이 본 발명에 따른 도금액 반응부산물 제거장치는 다음과 같은 효과를 얻을 수 있다.As described above, the plating liquid reaction byproduct removing apparatus according to the present invention may obtain the following effects.

첫째, 종래의 활성탄 처리법에서는 활성탄카트리지를 주기적으로 교체해야 하는 번거로움 및 비용부담이 있었으나 본 발명에서는 자외선 광원의 수명동안 반영구적으로 사용이 가능하다.First, in the conventional activated carbon treatment method, there is a hassle and cost burden to periodically replace the activated carbon cartridge, but the present invention can be used semi-permanently during the life of the ultraviolet light source.

둘째, 반응부산물의 처리속도가 종래의 활성탄 처리법에 비해 현저히 향상된다.Second, the treatment speed of the reaction byproduct is significantly improved compared to the conventional activated carbon treatment.

본 발명은 도면에 도시된 일 실시 예를 참고로 설명되었으나 이는 예시적인 것에 불과하며, 본 기술 분야의 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등한 타 실시 예가 가능하다는 점을 이해할 것이다. 따라서 본 발명의 진정한 기술적 보호 범위는 첨부된 등록청구범위의 기술적 사상에 의해 정해져야 할 것이다.Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (11)

금속염을 포함하는 도금액이 담기는 탱크; 및A tank containing a plating liquid containing a metal salt; And 상기 탱크의 도금액에 잠기도록 설치되며 자외선을 조사하는 광원을 포함하며, 도금공정에서 상기 금속염의 반응부산물로 생성된 유기물을 분해하는 것을 특징으로 하는 도금액 반응부산물 제거장치.Plating solution reaction by-products removal apparatus comprising a light source installed to be immersed in the plating liquid of the tank and decomposing the organic material produced by the reaction by-products of the metal salt in the plating process. 제 1 항에 있어서,The method of claim 1, 상기 자외선광원을 보호하기 위해 감싸는 투과성보호셀을 더 포함하는 도금액 반응부산물 제거장치.Plating liquid reaction by-products removal device further comprises a permeable protective cell wrapped to protect the ultraviolet light source. 제 2 항에 있어서,The method of claim 2, 상기 투과성보호셀은 석영으로 된 것을 특징으로 하는 도금액 반응부산물 제거장치.The permeation protection cell is a plating liquid reaction by-product removal apparatus, characterized in that the quartz. 제 2 항에 있어서,The method of claim 2, 상기 자외선 광원을 냉각시키는 냉각장치를 더 구비하는 것을 특징으로 하는 도금액 반응부산물 제거장치.Plating liquid reaction by-products removal device further comprises a cooling device for cooling the ultraviolet light source. 제 4 항에 있어서,The method of claim 4, wherein 상기 투과성보호셀은 그 외벽과 내벽사이에 통로가 형성되며,The permeable protective cell has a passage formed between the outer wall and the inner wall, 상기 냉각장치는 상기 통로로 냉매를 공급하는 유출입 배관 및The cooling device is an inflow and outflow pipe for supplying a refrigerant to the passage and 상기 유출입 배관과 연결된 냉각기를 포함하는 것을 특징으로 하는 도금액 반응부산물 제거장치.Plating liquid reaction by-products removal apparatus comprising a cooler connected to the outflow pipe. 제 1 항에 있어서,The method of claim 1, 상기 자외선광원에 의해 조사되는 자외선의 파장은 240nm 내지 250nm 의 범위인 것을 특징으로 하는 도금액 반응부산물 제거장치.Plating liquid reaction byproduct removal apparatus, characterized in that the wavelength of the ultraviolet light irradiated by the ultraviolet light source is in the range of 240nm to 250nm. 제 6 항에 있어서,The method of claim 6, 상기 자외선광원에 의해 조사되는 자외선의 파장은 약 245nm인 것을 특징으로 하는 도금액 반응부산물 제거장치.Plating liquid reaction by-products removal apparatus, characterized in that the wavelength of the ultraviolet light irradiated by the ultraviolet light source is about 245nm. 제 1 항 내지 제7항중 어느 하나의 항에 있어서,The method according to any one of claims 1 to 7, 상기 금속염은 니켈염인 것을 특징으로 하는 도금액 반응부산물 제거장치.Plating liquid reaction by-product removal apparatus, characterized in that the metal salt is a nickel salt. 도금액이 담긴 탱크와 상기 도금액에 잠기도록 설치된 자외선 광원을 구비하는 단계; 및Providing a tank containing a plating liquid and an ultraviolet light source installed to be immersed in the plating liquid; And 상기 자외선 광원에 의해 자외선을 조사시킴으로써 상기 도금액 내의 반응부산물을 제거하는 단계를 포함하는 도금액 반응부산물 제거방법.And removing the reaction by-products in the plating liquid by irradiating ultraviolet rays with the ultraviolet light source. 제8항에 있어서,The method of claim 8, 상기 니켈염의 니켈은 설파믹산 니켈인 것을 특징으로 하는 도금액 반응부산물 제거장치.The nickel salt of the nickel salt is a plating solution reaction by-product removal apparatus, characterized in that the sulfamic acid nickel. 제10항에 있어서,The method of claim 10, 상기 유기물은 아조디술포네이트인 것을 특징으로 하는 도금액 반응부산물 제거장치.Plating liquid reaction by-product removal apparatus, characterized in that the organic material is azo disulfonate.
KR1019970049750A 1997-09-29 1997-09-29 Apparatus and method for removing by-product in a plating solution KR100263317B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019970049750A KR100263317B1 (en) 1997-09-29 1997-09-29 Apparatus and method for removing by-product in a plating solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019970049750A KR100263317B1 (en) 1997-09-29 1997-09-29 Apparatus and method for removing by-product in a plating solution

Publications (2)

Publication Number Publication Date
KR19990027313A KR19990027313A (en) 1999-04-15
KR100263317B1 true KR100263317B1 (en) 2000-08-01

Family

ID=19521904

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970049750A KR100263317B1 (en) 1997-09-29 1997-09-29 Apparatus and method for removing by-product in a plating solution

Country Status (1)

Country Link
KR (1) KR100263317B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100947380B1 (en) 2007-08-10 2010-03-15 기아자동차주식회사 Anolyte solution sterilization device for electrodeposition painting system of body painting line
WO2014110416A1 (en) * 2013-01-10 2014-07-17 Coventya Inc. Apparatus and method of maintaining trivalent chromium bath plating efficiency
US11047064B2 (en) 2013-01-10 2021-06-29 Coventya, Inc. Apparatus and method to maintaining trivalent chromium bath plating

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100947380B1 (en) 2007-08-10 2010-03-15 기아자동차주식회사 Anolyte solution sterilization device for electrodeposition painting system of body painting line
WO2014110416A1 (en) * 2013-01-10 2014-07-17 Coventya Inc. Apparatus and method of maintaining trivalent chromium bath plating efficiency
CN105264122A (en) * 2013-01-10 2016-01-20 科文特亚股份有限公司 Apparatus and method of maintaining trivalent chromium bath plating efficiency
US10167564B2 (en) 2013-01-10 2019-01-01 Coventya, Inc. Apparatus and methods of maintaining trivalent chromium bath plating efficiency
US11047064B2 (en) 2013-01-10 2021-06-29 Coventya, Inc. Apparatus and method to maintaining trivalent chromium bath plating

Also Published As

Publication number Publication date
KR19990027313A (en) 1999-04-15

Similar Documents

Publication Publication Date Title
US4780215A (en) Water purification device
US3924139A (en) Apparatus for photo-oxidation of water
KR100671311B1 (en) Photocatalyst Sterilizer
KR100263317B1 (en) Apparatus and method for removing by-product in a plating solution
JPH08229577A (en) Method for treating waste liquid from nonelectrolytic plating process
KR100414560B1 (en) method of sterilization and apparatus of sterilization make use of ultraviolet rays and ozone
JPS608759B2 (en) Method for removing organic compounds from radioactive waste liquid
DE3903549A1 (en) UV light for the degradation of pollutants, in particular of halogenated hydrocarbons
US7837952B2 (en) System and method for removal of hydrogen peroxide from a contaminated media
JPH0440292A (en) Process for simultaneous removal of organic substance and dissolved oxygen
JP2002079689A (en) Method of washing ink cartridge
JP7356029B2 (en) How to cool the UV lamp unit
JP4553326B1 (en) Method for decomposing and removing 1,4-dioxane contained in an aquatic medium at a low concentration
JP2005193216A (en) Contaminant removing apparatus
JP3537995B2 (en) Wastewater treatment method
JPH09155337A (en) Method and apparatus for decomposing and removing volatile organic compound
JP3645007B2 (en) Ultrapure water production equipment
JP2008173617A (en) Water treatment apparatus and water treating method
KR100411022B1 (en) Photocatalyst apparatus for purification of wastewater
JPS61185378A (en) Apparatus for purifying water
JP2003202396A (en) Method for treating chemical decontamination waste liquid
Saitoh et al. Simultaneous removal of DO and TOC in ultrapure water by using UV rays
JPH07260997A (en) Method and device for treating radioactive waste liquid containing organic matter
KR200212319Y1 (en) an apparatus for purificating water in an aquarium
JPH0647394A (en) Treatment of waste water containing organic dye

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20080428

Year of fee payment: 9

LAPS Lapse due to unpaid annual fee