KR100259599B1 - Cooling apparatus using boiling and condensing refrigerant - Google Patents

Abstract

According to the present invention, a fluid separation plate for separating high temperature fluid from a low temperature fluid, a refrigerant tank disposed on the high temperature fluid side from the fluid separation plate, a refrigerant enclosed in the refrigerant tank, and a pair of communication in which one end is sealedly communicated with the refrigerant tank A cooling apparatus using a boiling and condensation refrigerant comprising a pipe, a condensing portion communicating with the other end of the communicating pipe and disposed on the low temperature fluid side from the fluid separation plate, and a heat insulating material of a high temperature side heat insulating material coated on the outer circumference of the high temperature side communicating pipe. In this way, it becomes possible to suppress the heat conduction from the high temperature part (hot air) to the high temperature side communication pipe. As a result, it is possible to prevent the falling refrigerant condensed and liquefied in the radiator from receiving heat from the high temperature portion through the high temperature side communication pipe and receiving a lift force in the high temperature side communication pipe.

Description

COOLING APPARATUS USING BOILING AND CONDENSING REFRIGERANT}

The present invention is directed to a cooling apparatus using a boiling and condensing refrigerant, such as a cooling apparatus having a thermomosyphon type heat exchanger, wherein the refrigerant is boiled by the heat of the hot medium and then condensed to dissipate the heat of the high temperature refrigerant. It is about.

Conventionally, electronic components and heat generating elements are often embedded in a sealed housing. In this case, since external air cannot be directly sent into the housing to ventilate the interior of the housing, a method of performing heat exchange between the air inside the housing and the air outside the housing has been used as a method for cooling the heating element. . As a method for obtaining a large amount of heat transfer with a small number of parts, a method using a heat pipe (refrigerant sealed) arranged to pass through a housing is known, as disclosed in Japanese Patent Application Laid-Open No. 2-3320. .

In the heat pipe disclosed in Japanese Patent Application Laid-Open No. 2-332, the internal refrigerant is boiled by hot air in the housing, and the refrigerant is condensed by a heat dissipation unit disposed outside the housing to radiate heat. The coolant is sent back to the heat absorbing part disposed in the housing.

However, in the case of the heat pipe disclosed in Japanese Patent Application Laid-Open No. 2-332, the boiled evaporative refrigerant rises, and the condensed condensed refrigerant descends in the same pipe. Accordingly, the flow directions of the refrigerants face each other, which may cause a problem that the entire refrigerant does not circulate efficiently.

In view of the foregoing, as disclosed in Japanese Patent Application Laid-Open No. 62-162847, a cooling apparatus using a boiling and condensation refrigerant capable of efficiently dissipating heat by a refrigerant circulating heat is disclosed. According to the cooling device disclosed in Japanese Patent Application Laid-Open No. 62-163847, the heat generating element is fixed to the refrigerant tank, the heat generated by the heat generating element is absorbed by the refrigerant sealed in the refrigerant tank, and is boiled and evaporated by endotherm. The refrigerant is condensed and liquefied by a radiator disposed in the refrigerant tank, and the condensed liquefied refrigerant is returned to the refrigerant tank through a refrigerant return pipe inserted into the refrigerant tank.

However, in the case of the cooling apparatus disclosed in Japanese Example 62-163847, since the refrigerant return pipe for returning the refrigerant condensed by the radiator to the refrigerant tank is inserted into the refrigerant tank, before the refrigerant returns to the refrigerant tank. The refrigerant may be heated in the return pipe, and buoyancy upwards acts on the refrigerant, so that the refrigerant cannot be efficiently returned to the refrigerant tank. Therefore, a problem may occur in which the refrigerant circulates slowly and the heat dissipation performance is lowered.

In addition, when the passage for communicating between the refrigerant tank and the radiator is cooled, when the refrigerant boiled and evaporated from the refrigerant tank is elevated to the upper radiator, the boiled and evaporated refrigerant is condensed in the passage before moving to the radiator. To fall. Therefore, a problem is caused that the refrigerant circulates slowly and the heat dissipation performance is lowered.

In addition, due to the deterioration of the heat dissipation characteristics, the size of the cooling device is increased.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and a first object of the present invention is to reduce the size of the cooling device by using a new structure.

A second object of the present invention is to provide a cooling apparatus that can prevent the circulation of the refrigerant from being disturbed.

A third object of the present invention is to have a low temperature side communication pipe for returning the refrigerant condensed by the radiator to the refrigerant tank, which can prevent the generation of lift force of the condensation refrigerant in the low temperature side communication pipe when the low temperature side communication pipe is heated. It is to provide a cooling device.

In addition, a fourth object of the present invention has a high temperature side communication pipe for sending the refrigerant boiled by the refrigerant tank to the radiator, and the evaporated refrigerant is condensed in the high temperature side communication pipe when the high temperature side communication pipe is cooled. It is to provide a cooling device that can be prevented.

1 is a side view of a casing cooling device used in a cooling device using boiling and condensation refrigerant according to a first embodiment of the present invention.

FIG. 2 is a schematic explanatory view of the cooling device shown in FIG. 1; FIG.

3 is a perspective view showing a cooling apparatus according to the first embodiment;

4 is a front view of the cooling device shown in FIG.

FIG. 5 is a schematic explanatory view of the cooling device shown in FIG. 4; FIG.

FIG. 6 is a cross-sectional view taken along line VI-VI of FIG. 3;

7 is a sectional view showing a modification of the cooling device shown in FIG.

8 is a side view of a cooler using the cooling device according to the second embodiment.

9 is a front view of the cooler according to the second embodiment shown in FIG.

10 is a perspective view showing a cooling apparatus according to the second embodiment.

FIG. 11 is an enlarged view of an endothermic pipe of the cooling device shown in FIG. 10; FIG.

12 is a cross-sectional view taken along the line II-II of FIG. 10;

FIG. 13 is a sectional view showing a modification of the cooling device shown in FIG.

Fig. 14 is a side view showing the entire cooling system according to the third embodiment.

15 is a vertical sectional view of a refrigerant tank.

FIG. 16 is a cross sectional view of a refrigerant tank taken along a line VI-VI of FIG. 15; FIG.

FIG. 17 is a cross-sectional view of the radiator taken along the line VII-VII of FIG. 14; FIG.

18 is a partial sectional view of a refrigerant tank showing a heat transfer reducing structure according to the fourth embodiment;

19 is a partial sectional view of a refrigerant tank showing a heat transfer reducing structure according to the fifth embodiment;

20 is a partial sectional view of a refrigerant tank showing a heat transfer reducing structure according to the sixth embodiment;

21 is a partial sectional view of a refrigerant tank showing a heat transfer reducing structure according to the seventh embodiment;

22 is a vertical sectional view of a refrigerant tank according to the eighth embodiment;

23 is a vertical sectional view of a refrigerant tank according to the ninth embodiment;

24 is a vertical sectional view of a modification of the refrigerant tank according to the ninth embodiment;

25 is a vertical sectional view of another modification of the refrigerant tank according to the ninth embodiment;

Fig. 26A is a sectional view schematically showing the structure of a heat exchanger used in the cooling apparatus according to the tenth embodiment, and Fig. 26B is a schematic diagram showing a schematic structure of the heat exchanger.

27 is a schematic diagram showing an overall structure of an electronic device according to a tenth embodiment.

28 is a front view showing the structure of a cooling unit according to the tenth embodiment;

29 is a perspective view showing a fluid separation plate dividing the cooling unit into two parts according to the tenth embodiment;

30 is a perspective view showing a modification of the fluid separation plate for dividing the cooling unit into two parts according to the tenth embodiment;

Fig. 31A is a schematic diagram showing the temperature distribution in the flow direction of air and refrigerant according to the prior art, and Fig. 31B is a schematic diagram showing the temperature distribution in the flow direction of air and refrigerant according to the tenth embodiment of the present invention. In diagram.

32 is a cross-sectional view showing a specific structure of a cooling device according to an eleventh embodiment of the present invention.

33 is a front view showing the structure of the cooling apparatus according to the eleventh embodiment.

34 is a rear view showing the structure of the cooling device according to the eleventh embodiment.

35 is a front view showing the structure of the cooling apparatus according to the eleventh embodiment.

36 is a sectional view showing a schematic structure of a cooling apparatus according to an eleventh embodiment.

37 is a front view showing the structure of the cooling apparatus according to the twelfth embodiment;

38 is a perspective view showing a sealing structure in a heat exchanger according to a twelfth embodiment;

39 is a sectional view showing a sealing structure in a heat exchanger according to a twelfth embodiment;

40 is a sectional view showing a specific structure of a cooling system according to a thirteenth embodiment;

Fig. 41 is a front view showing the main structure of the fluid separation plate used in the heat exchanger according to the thirteenth embodiment.

42 is a sectional view showing a structure of a cooling system according to a fourteenth embodiment;

43 is a front view showing the main structure of the fluid separation plate used in the heat exchanger according to the fourteenth embodiment;

44 is a sectional view showing the structure of the cooling apparatus of the fifteenth embodiment;

45 is a front view showing the main structure of the fluid separation plate used in the heat exchanger according to the fifteenth embodiment;

46 is a schematic diagram showing an overall structure of an electronic device according to a sixteenth embodiment.

Fig. 47 is a sectional view showing a detailed structure of a cooling device.

48 is a front view showing the detailed structure of a cooling device.

49 is a rear view showing the detailed structure of a cooling device.

50 is a front view showing a detailed structure of a cooling unit.

Fig. 51 is a sectional view showing a detailed structure of a cooling unit.

Fig. 52 is a front view showing the detailed structure of the electric heater mounting apparatus.

Fig. 53 is a side view showing the detailed structure of the electric heater mounting apparatus.

Fig. 54A is a front view showing the detailed structure of an electric heater, and Fig. 54B is a side view thereof.

Fig. 55A is a front view showing the detailed structure of the bracket and the guide shaft, and Fig. 55B is a side view thereof.

56 is a schematic diagram showing the entire structure of an electronic equipment according to a seventeenth embodiment;

Fig. 57A is a sectional view showing a schematic structure of a heat exchanger of a cooling device according to a seventeenth embodiment, and Fig. 57B is a schematic diagram showing a schematic structure of a heat exchanger of a cooling device.

58 is a front view showing the detailed structure of a cooler according to the seventeenth embodiment;

Fig. 59 is a perspective view showing a fluid separation plate that divides the cooler into two parts according to the seventeenth embodiment.

60 is a perspective view showing a modification of the fluid separation plate that divides the cooler into two parts according to the seventeenth embodiment;

61A is a schematic diagram showing the temperature distribution in the flow direction of air and refrigerant according to the prior art, and FIG. 61B is a schematic diagram showing the temperature distribution in the flow direction of air and refrigerant according to the seventeenth embodiment of the present invention.

Fig. 62 is a sectional view showing the detailed structure of a cooling device according to the eighteenth embodiment of the present invention.

63 is a front view showing the detailed structure of a cooling apparatus according to the eighteenth embodiment;

64 is a rear view showing the detailed structure of a cooling system according to the eighteenth embodiment;

65 is a front view showing the detailed structure of a cooler according to the eighteenth embodiment;

66 is a sectional view showing a detailed structure of a cooler according to an eighteenth embodiment;

67 is a front view showing the detailed structure of a cooler according to the nineteenth embodiment;

68 is a schematic diagram showing an overall structure of an electronic device according to a twentieth embodiment;

69 is a sectional view showing the structure of a cooling device according to the twentieth embodiment;

70 is a sectional view showing an upper structure of a cooling device according to a twentieth embodiment;

71 is a sectional view showing a lower structure of a cooling device according to a twentieth embodiment;

72 is a front view showing the specific structure of the cooling device according to the twentieth embodiment;

73 is a rear view showing the structure of the cooling device according to the twentieth embodiment;

74 is a front view showing the structure of the cooling device according to the twentieth embodiment;

75 is a sectional views schematically showing the structure of a cooling apparatus according to a twentieth embodiment;

76 is an exploded view showing a structure for mounting a low temperature side centrifugal blower according to a twentieth embodiment;

77 is a sectional views schematically showing the structure of a low-temperature side centrifugal blower according to a twentieth embodiment;

78 is a sectional views schematically showing the structure of a low-temperature side centrifugal blower according to a twenty-first embodiment;

79 shows a side plate and a heat transfer accelerator plate of a drive motor according to the twenty-first embodiment;

80 is a sectional views schematically showing the structure of a low-temperature side centrifugal blower according to a twenty-second embodiment;

81 is a plan view showing a centrifugal fan support plate according to the twenty-second embodiment;

82 is a sectional views schematically showing the structure of a low temperature side centrifugal blower according to a twenty-third embodiment;

83 is a sectional views schematically showing the structure of a low-temperature side centrifugal blower according to a twenty-fourth embodiment;

84 is a mounting diagram showing the main structure of the low-temperature side centrifugal blower according to the twenty-fourth embodiment;

85 is a sectional view of a housing to which a cooling device according to the twenty fifth embodiment is mounted.

86 is a front view of a cooling apparatus according to the 25th embodiment;

87 is a side view of the cooling apparatus according to the 25th embodiment;

88 is a view of the cooling apparatus according to the 25th embodiment when viewed from below.

89 is a detailed view of the connecting portion of the cooling apparatus according to the 25th embodiment;

90 is a detailed view of a refrigerant inlet port in the cooling device according to the 25th embodiment;

91 is a detailed view of the connecting portion of the cooling apparatus according to the 26th embodiment.

92 is a front view of a modification of the cooling system according to the present invention.

* Explanation of symbols for the main parts of the drawings

1, 14: Cooling device 2: Fluid separation plate

3, 3a: refrigerant tank 3b: radiator

6a: heat sink fin 6b: heat sink fin

7: heating element 8: refrigerant

9: sealed space 11, 12: heat transfer space

13, 14, 16, 17: vent 15: inner fan

18: external fan 19: heater

22: bulkhead 23: air passage

31a: endothermic pipe 31b: heat dissipation pipe

34a: low temperature side communication pipe 34b: high temperature side communication pipe

50: insulation 81: cooler

82: controller

According to one aspect of the present invention, the refrigerant sealed in the refrigerant tank absorbs the heat of the high temperature portion to boil and evaporate, and the boiled and evaporated refrigerant descends and flows into the radiator. In the radiator, heat of the evaporated refrigerant is radiated to the low temperature part to condense the refrigerant. The condensed and liquefied refrigerant is returned to the refrigerant tank through the communication pipe to absorb heat again. In the case of the present invention, the circulation of the refrigerant is prevented from being prevented so that the heat conduction between any one of the coolant tank, the radiator, the high temperature portion and the low temperature portion and the heat conduction to the communication pipe are suppressed by the heat conduction inhibiting means.

That is, when the heat conduction inhibiting means suppresses the heat conduction between the refrigerant tank and the communication pipe, the descending refrigerant condensed and liquefied by the radiator absorbs the high temperature heat from the refrigerant tank through the communication pipe and does not receive the upward force in the communication pipe. I can't. When the heat conduction inhibiting means suppresses heat conduction between the high temperature portion and the communication pipe, the descending refrigerant condensed and liquefied by the radiator absorbs heat from the high temperature portion through the communication pipe and thus cannot receive the lifting force in the communication pipe.

Further, when the heat conduction inhibiting means suppresses heat conduction between the radiator and the communication pipe, the rising refrigerant evaporated and evaporated in the refrigerant tank can be prevented from descending in the communication pipe by radiating heat to the low temperature radiator through the communication pipe. have. In addition, when the heat conduction inhibiting means suppresses heat conduction between the low temperature portion and the communication pipe, the rising refrigerant evaporated by boiling in the refrigerant tank can be prevented from descending in the communication pipe by radiating heat to the low temperature portion through the communication pipe. .

Therefore, since the heat dissipation is performed efficiently, the size of the cooling device can be reduced.

According to another aspect of the present invention, the refrigerant sealed in the refrigerant tank absorbs the heat of the high temperature fluid to be boiled and evaporated, and the boiled refrigerant is transferred to the radiator disposed away from the fluid separation plate. In the radiator, the heat of the refrigerant is radiated by the low temperature fluid so that the refrigerant condenses and liquefies. The refrigerant condensed and liquefied thus returns to the refrigerant tank through the communication pipe to absorb heat again. In this case, since the thermal conductivity between one of the refrigerant tank, the radiator, the high temperature portion and the low temperature portion and the communication pipe is suppressed by the heat conduction inhibiting means, it is possible to prevent the circulation of the refrigerant from being interrupted.

The heat conduction inhibiting means may be disposed between the refrigerant tank and the low temperature side communication pipe and made of the refrigerant tank side heat insulating material made of heat insulating material. In this case, heat conduction from the refrigerant tank to the low temperature side communication pipe can be suppressed. As a result, it is possible to prevent the falling refrigerant condensed and liquefied by the radiator to absorb heat from the high temperature refrigerant tank through the communication pipe and to receive the lifting force in the low temperature side communication pipe. Therefore, the circulation of the refrigerant can be prevented from being obstructed, so that the size of the cooling device can be reduced.

The heat conduction inhibiting means may be disposed between the radiator and the high temperature side communication pipe and made of a radiator side heat insulator made of a heat insulating material. In this case, it is possible to prevent the rising refrigerant evaporated and boiled in the refrigerant tank to radiate heat to the low temperature radiator through the communication pipe and to descend from the communication pipe. Therefore, the circulation of the refrigerant can be prevented from being obstructed and the size of the cooling device can be reduced.

The heat conduction inhibiting means may be made of a high temperature side heat insulating material which is covered around the outside of the low temperature side communication pipe and made of heat insulating material. In this case, heat conduction from the high temperature portion to the low temperature side communication pipe can be suppressed. As a result, the descending refrigerant condensed and liquefied in the radiator can be allowed to absorb heat from the high temperature portion through the low temperature side communication pipe and to absorb the upward force in the low temperature side communication pipe. Therefore, the circulation of the refrigerant can be prevented from being obstructed, so that the size of the cooling device can be reduced.

The heat conduction inhibiting means may be made of a low temperature side insulation that is covered around the outside of the high temperature side communication pipe and is made of a coated insulation. In this case, it is possible to prevent the rising refrigerant, which is boiled and evaporated in the refrigerant tank, dissipates heat to the low temperature portion through the high temperature side communication pipe and descends from the high temperature side communication pipe. Therefore, the circulation of the refrigerant can be prevented from being obstructed, so that the size of the cooling device can be reduced.

The insulation may also cover at least a portion of the outer perimeter of the low temperature side communication pipe or the high temperature side communication pipe. In this case, the circulation of the refrigerant can be prevented from being obstructed, so that the size of the cooling device can be made smaller than in the prior art.

In addition, the insulation may cover the outer circumference of the low temperature side communication pipe or the high temperature side communication pipe. In this case, it is possible to prevent the circulation of the refrigerant to be prevented, so that the size of the cooling device can be made smaller than in the prior art.

In addition, the heat insulating material can be made of foamed resin, so that heat insulation can be performed efficiently.

The heat conduction inhibiting means may include a hot side partition member for dividing the hot passage into a fluid separator so that the cold side communication pipe is separated from the region at a temperature lower than the temperature of the hot passage. As a result, the heat conduction from the high temperature passage to the low temperature side communication pipe can be suppressed. As a result, the descending refrigerant condensed and liquefied in the radiator can be prevented from absorbing heat from the high temperature passage through the low temperature side communication pipe and accepting the lifting force in the low temperature side communication pipe. In this case, the circulation of the refrigerant can be prevented from being obstructed, so that the size of the cooling device can be reduced.

In addition, the heat conduction inhibiting means may include a low temperature side partition member for dividing the low temperature passage into a fluid separation plate so that the high temperature side communication pipe is separated from the region of a temperature higher than the temperature of the low temperature passage. As a result, it is possible to prevent the rising refrigerant evaporated and boiled in the refrigerant tank to radiate heat to the low temperature passage through the high temperature side communication pipe and to descend from the high temperature side communication pipe. In this case, the circulation of the refrigerant can be prevented from being obstructed, so that the size of the cooling device can be reduced.

In addition, a plurality of boiling and cooling units are arranged such that the refrigerant tanks are arranged in parallel with each other and the radiators are arranged in parallel with each other. In addition, a high temperature side partition member for dividing the hot passage into the fluid separation plate and a low temperature side partition member for dividing the low temperature passage into the fluid separation plate may be provided, and the low temperature side communication pipe is provided in the high temperature side partition member and the low temperature side partition member. It is separated from the region of temperature lower than the temperature of the hot passage, and the hot side communication pipe is separated from the region of the temperature higher than the temperature of the cold passage. In this case, heat transfer from the high temperature passage to the low temperature side communication pipe and heat transfer from the high temperature side communication pipe to the low temperature passage can be suppressed, respectively.

As a result, it is possible to prevent the descending refrigerant condensed and liquefied in the radiator to absorb heat from the high temperature passage through the low temperature side communication pipe and to receive the lifting force in the low temperature side communication pipe, and to be evaporated and boiled in the refrigerant tank. It is possible to dissipate heat to the low temperature passage through the high temperature side communication pipe and to prevent falling from the high temperature side communication pipe. Therefore, the circulation of the refrigerant can be prevented from being obstructed, so that the size of the cooling device can be reduced.

The low temperature side communication pipe may be disposed substantially parallel to the heat absorbing side pipe so as to allow the heat absorbing side lower communication part to communicate with the heat radiating side lower communication part, and the high temperature side communication pipe may communicate the heat absorbing side upper communication part with the heat radiating side upper communication part. It may be arranged substantially parallel to the heat dissipation side pipe. Since the heat conduction inhibiting means can be provided in the low temperature side communication pipe or the high temperature side communication pipe, it is possible to suppress the heat conduction from the coolant tank to the low temperature side or to suppress the heat conduction from the high temperature side communication pipe to the radiator. As a result, it is possible to prevent the descending refrigerant condensed and liquefied in the radiator to absorb heat from the high temperature refrigerant tank through the communication pipe and to receive the lifting force in the low temperature side communication pipe. In addition, it is possible to prevent the rising refrigerant evaporated and boiled in the refrigerant tank to radiate heat to the low temperature radiator through the communication pipe and to descend from the communication pipe.

In this case, the circulation of the refrigerant can be prevented from being obstructed, so that the size of the cooling device can be reduced.

Other objects and advantages of the present invention will become more readily apparent from the following detailed description of preferred embodiments of the invention when taken in conjunction with the accompanying drawings.

(First embodiment)

Hereinafter, a first embodiment of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a side view showing that a cooling device 1 using boiling and condensation refrigerant is applied to a box-shaped cooling device, and FIG. 2 is a schematic illustration of FIG.

As shown in Figs. 1 and 2, the enclosed space 9 is a space formed by the casing 80 in this embodiment. The enclosed space 9 houses a heating element 7 (e.g., a transceiver for a communication facility and a power amplifier for operating the transceiver). The closed space 9 is provided with an opening portion communicating with the cooler 81 at the upper and lower portions thereof. In the cooler 81, an air vent 13 communicating with an upper portion of the sealed space 9 is formed in order to introduce the gas of the sealed space 9 on the high temperature side into the heat transfer space 11. In particular, the one side wall surface 9a forming the sealed space 9 and the partition wall 22 provided in the sealed space 9 form an air passage 23 extending vertically into the sealed space 9, and the air The upper end of the passage 23, as the vent 13, opens to the upper portion (above the fluid separation plate 2) in the sealed space 9.

In this case, the hot gas heated by the heat generating element 7 is introduced into the air passage 23 from the vent 13 and smoothly guided to the refrigerant tank 3a, and the temperature in the sealed space 9 is uniform. Can be maintained. That is, since the hot gas due to heat generated from the heat generating element 7 moves upward in the sealed space 9 by convection, in order to improve the cooling efficiency in the sealed space 9, Preferably, the vent 13 is provided at the top. In other words, when the vent 13 is positioned lower than the fluid separation plate 2, a relatively low temperature gas flows from the vent 13 into the air passage 23 in the sealed space 9 to the refrigerant tank 3a. It is induced and the cooling efficiency in the enclosed space 9 becomes insufficient.

In addition, by forming the air passage 23, the high-temperature fluid flows uniformly into the refrigerant tank 3a. When the air passage 23 is not provided, the flow in the most recent vicinity of the internal fan 15 is concentrated near the bottom of the refrigerant tank 3a, and the heat absorption efficiency is lowered. However, by forming the air passage 23, the hot air easily passes through the upper portion of the refrigerant tank 3a.

In addition, in this embodiment, since the whole cooling apparatus 1 is arrange | positioned so that it may incline in the side direction (left-right direction in FIG. 2), the refrigerant tank 3a and the radiator in the heat-transfer spaces 11 and 12 of the high temperature side. The gas passing through 3b flows smoothly from the air vents 13 and 16 on the suction side toward the air vents 14 and 17 on the outlet side. In this case, the change in the flow direction of the gas flowing through the refrigerant tank 3a and the radiator 3b can be slowed down so that the air flow loss can be reduced in a narrow space. As a result, the inner fan 15 in the enclosed space 9 can be downsized and the amount of heat generated by the inner fan 15 can be reduced, so that the amount of heat reduced by the heat generating element 7 is reduced. The amount of heat can be increased (i.e., when the inner fan 15 is enlarged to improve the cooling performance, the amount of heat generated by the inner fan 15 increases, as a result of which the heat generating element 7 Calories cannot be increased).

The controller 82 controls the rotational speed, operating time, operating mode and the like of the internal fan 15 based on the air temperature flowing into the vent 13 detected by the temperature sensor 84. When the enclosed space 9 is hot, the inner fan 15 and the outer fan 18 are operated to a lower temperature in the enclosed space 9, while the enclosed space 9 is cold (cold season). ), The internal fan 15 and the heater 19 fixed to the cooler wall 83 are operated to sufficiently control the temperature of the enclosed space 9.

FIG. 3 is a perspective view showing the cooling device 1, FIG. 4 is a front view of the cooling device shown in FIG. 3, FIG. 5 is a schematic view explaining FIG. 4, and FIG. 6 is taken along the line VI-VI of FIG. It is a cross section shown.

In this embodiment, as shown in Fig. 3, a cooling apparatus using a plurality of boiling and condensation refrigerants is stacked in the flow direction of the hot fluid and the cold fluid.

As shown in Fig. 5, the cooling device 1 includes a fluid separation plate 2 for separating a hot fluid (e.g., hot air) from a cold fluid (e.g., cold air); A refrigerant tank 3a composed of a plurality of endothermic pipes 31a disposed on the hot fluid side from the fluid separation plate 2; A refrigerant encapsulated into the endothermic pipe 31a to absorb heat from the high temperature fluid to boil and evaporate; One is in sealed communication with the refrigerant tank 3a, and the other is a pair of low temperature side communication pipes 34a extending through the fluid separation plate 2 to the low temperature fluid side; Communication pipe 34b; Low temperature side communication pipe 34a; A heat dissipator 3b, which is composed of a plurality of heat dissipation pipes 31b, which are sealedly communicated with the other high temperature side communication pipes 34b and disposed from the fluid separation plate 2 to the low temperature fluid side; A heat receiving fin 6a joined between the endothermic pipes 31a of the refrigerant tank 3a in a molten state (for example, a soldered state); Heat dissipation fins 6b joined in a molten state (for example, a solder state) between the heat dissipation pipes 31b of the heat dissipator 3b; And the refrigerant tank 3a and the low temperature side communication pipe as heat conduction suppression means for suppressing heat movement from the refrigerant tank 3a to the low temperature side communication pipe 34a and heat transfer from the radiator 3b to the communication pipe 34b. And a heat insulating material 50 (for example, urethane foam which is a foamed resin) sandwiched between the 34a and between the radiator 3b and the communication pipe 34b.

In FIG. 5, the air flow directions of the low temperature fluid and the hot fluid are indicated in the transverse direction at the ground for convenience, but in reality, air flows in the stacking direction in FIG.

The fluid separation plate 2 constitutes, for example, one wall surface of a sealed space having a high temperature inside, and is formed of a metal material such as aluminum and integrated into the low temperature side communication pipe 34a and the high temperature side communication pipe 34b. Bonding (for example, soldering). A long insertion hole is formed in the fluid separation plate 2 through which the low temperature side communication pipe 34a and the high temperature side communication pipe 34b extend. In order to suppress the heat transfer, a resin such as rubber may be retained between the fluid separation plate 2 and each communication pipe. In addition, the fluid separation plate 2 is thermally insulated from the surrounding (at least one of a low temperature fluid or a high temperature fluid) by a heat insulating material formed of a foamed resin such as urethane foam.

The refrigerant tank 3a is provided with a plurality of endothermic pipes 31a disposed substantially in parallel, an endothermic side lower communication portion 41 disposed below the endothermic pipe 31a and communicating with these endothermic pipes 31a at a lower portion thereof. And an endothermic side upper communication section 42 disposed above the endothermic pipe 31a and communicating with these endothermic pipes 31a at the top thereof. The endothermic pipe 31a is made of a metal material (for example, aluminum or copper) that forms a flat tubular shape having a long rectangular (or elliptical) cross section and is excellent in heat transfer characteristics.

The radiator 3b is provided with a plurality of heat dissipation pipes 31b disposed substantially parallel to each other, a heat dissipation side lower communication portion 43 disposed under the heat dissipation pipe 31b and communicating with the heat dissipation pipe 31b at a lower portion thereof, and heat dissipation. It is arranged in the upper part of the pipe 31b, and includes the heat radiation side upper communication part 44 in communication with the heat radiation pipe 31b at the upper part. In addition, the heat dissipation pipe 31b is made of a metal material (for example, aluminum or copper) that forms a flat tube shape having a long rectangular (or elliptical) cross section and is excellent in heat transfer characteristics.

The high temperature side communication pipe 34b has the heat absorbing side upper communication part 42 and the radiator 3b of the refrigerant tank 3a so as to discharge the refrigerant 8 boiled and evaporated from the refrigerant tank 3a to the radiator 3b. It communicates with the heat dissipation side upper communication part 44 of FIG. The high temperature side communication pipe 34b is generally parallel with the heat dissipation pipe 31b and at regular intervals (preferably at a distance larger than the distance between the heat dissipation pipes 31b, more preferably the heat dissipation pipe 31b). At greater than twice the interval between them).

The low temperature side communication pipe 34a cools the radiator side lower communication part 43 and the coolant tank 3a of the radiator 3b so that the coolant 8 cooled by the radiator 3b is returned to the coolant tank 3a. Is in communication with the heat absorbing side lower communication portion (41). The low temperature side communication pipe 34a is arranged at predetermined intervals (preferably greater than the distance between the heat absorbing pipes 31a, more preferably, at least twice the distance between the heat absorbing pipes 31a). Are arranged substantially parallel to.

The refrigerant 8 is composed of HFC-134a (Chemical Formula: CH ₂ FCF ₃ ) and water, and in a range in which the pressure inside the tank is not too high (for example, 20 times or less of atmospheric pressure in the case of HFC-134a), That is, it is set to be condensed by the low temperature fluid and boiled by the high temperature fluid. In particular, a refrigerant that is boiled at 100 ° C is selected. Here, the refrigerant may be a refrigerant having a plurality of components or a mixture of a refrigerant mainly containing a single component. The coolant 8 is sealed up to an amount whose water level is slightly below the heat absorbing side upper communication portion 42 of the coolant tank 3a. Preferably, the amount of refrigerant may be determined such that its level does not reach the heat dissipation pipe 31b during operation. After the heat receiving fins 6a and the heat radiating fins 6b are soldered and joined to the heat absorbing pipe 31a and the heat radiating pipe 31b, the refrigerant 8 is sealed. The heat sink fins 6a are disposed between the heat absorbing pipes 31a, and the heat sink fins 6b are disposed between the heat sink pipes 31b. The heat receiving fins 6a and the heat radiating fins 6b are corrugated fins in which a metal plate such as aluminum (thickness: about 0.02 mm to 0.5 mm) having excellent heat transfer characteristics is alternately bent in a wave shape, and is a heat radiating pipe. It is soldered (that is, joined in a molten state) to the flat outer wall surface of 31b. The heat receiving fins 6a are provided to facilitate the transfer of the hot fluid side heat to the refrigerant 8 and to enhance the strength of the endothermic pipe 31a. The heat dissipation fins 6b are provided to facilitate the transfer of refrigerant heat to the low temperature fluid side and to enhance the strength of the heat dissipation pipe 31b.

As the heat conduction inhibiting means, for example, a heat insulating material 50 formed of a foamed resin, in particular a urethane foam, is provided between the refrigerant tank 3a and the low temperature side communication pipe 34a and the radiator 3b and the high temperature side communication pipe 34b. Is placed in between. The heat insulating material 50 suppresses heat movement from the coolant tank 3a to the low temperature side communicating portion 34a and heat transfer from the high temperature side communicating pipe 34b to the radiator 3b.

The heat insulating material 50 is disposed between the refrigerant tank 3a and the low temperature side communication pipe 34a and between the radiator 3b and the high temperature side communication pipe 34b, as well as the low temperature side communication pipe 34a and the high temperature side communication. The outer circumference of the pipe 34b is covered. The coating may be performed for the entire outer circumference of the low temperature side communication pipe 34a and the high temperature side communication pipe 34b or part (vertical part). As shown in FIG. 6, the heat insulating material 50 does not cover the entire outer circumference of the communication pipes 34a and 34b, and is located between the refrigerant tank 3a and the low temperature side communication pipe 34a and the radiator 3b and the high temperature side. It may be arranged between the communication pipes 34b.

In the case of the cooling device, the refrigerant tanks are arranged in parallel with each other, and the radiators are arranged in parallel with each other.

The operation of the present embodiment will be described below.

The refrigerant 8 enclosed into each endothermic pipe 31a of the refrigerant tank 3a receives the heat transferred from the high temperature fluid through the heat receiving fins 6a and boils and evaporates. The evaporated refrigerant is exposed to the low temperature fluid and condenses and liquefies on the inner wall surface of the heat radiating pipe 31b of the low temperature radiator 3b. The latent condensation heat is transferred to the low temperature fluid through the heat radiating fin 6b. The refrigerant 8 condensed and liquefied in the radiator 3b moves along the inner wall surface due to its own weight and falls to the heat absorbing side lower communication portion 41 of the refrigerant tank 3a. By repeating the condensation liquefaction and boiling of the refrigerant, the heat of the hot fluid can be efficiently transferred to the cold fluid without mixing the cold fluid and the hot fluid.

The effects of the present embodiment will be described below.

In this embodiment, as the heat conduction inhibiting means, a heat insulating material 50a is provided as the coolant tank side heat insulating material between the coolant tank 3a and the low temperature side communication pipe 34a. In this case, it is possible to prevent the condensation refrigerant which is condensed and moved, absorbs heat from the high temperature side refrigerant tank 3a through the low temperature side communication pipe 34a and receives a lift force from the low temperature side communication pipe 34a.

Therefore, it is possible to prevent the refrigerant circulation from being disturbed, and the cooling device can be miniaturized.

As heat conduction inhibiting means, a heat insulating material 50b is provided as a heat radiating side heat insulating material between the radiator and the high temperature side communication pipe 34b. In this case, it is possible to prevent the rising refrigerant boiled and evaporated from the refrigerant tank 3a by radiating heat to the low temperature radiator 3b through the communication pipe 34b to lower the communication pipe 34b.

As the heat conduction inhibiting means, a heat insulating material 50a coated on the outer circumference of the low temperature side communication pipe 34a is provided as the high temperature side heat insulating material. In this case, the heat conduction from the high temperature part (hot air which is a high temperature fluid) to the low temperature side communication pipe 34a can be suppressed. As a result, it is possible to prevent the descending refrigerant condensed and liquefied in the radiator 3b from absorbing heat from the high temperature portion through the low temperature side communication pipe 34a and receiving the upward force in the low temperature side communication pipe 34a. In this case, it is possible to prevent the refrigerant circulation from being disturbed, and the cooling device can be miniaturized.

As the heat conduction inhibiting means, a heat insulating material 50b coated on the outer circumference of the high temperature side communication pipe 34b is provided as the low temperature side side heat insulating material. In this case, the rising refrigerant boiled and evaporated in the refrigerant tank 3a radiates heat to the low temperature portion (low temperature air as low temperature fluid) through the high temperature side communication pipe 34b and descends from the high temperature side communication pipe 34b. It can prevent things. Therefore, the disturbance of the refrigerant circulation can be prevented and the cooling device can be miniaturized.

Since the heat insulators 50a and 50b cover at least a portion of the outer circumference of the low temperature side communication pipe 34a or the high temperature side communication pipe 34b, the disturbance of the refrigerant circulation can be easily prevented as compared with the prior art. In addition, since the heat insulators 50a and 50b cover the entire outer circumference of the low temperature side communication pipe 34a or the high temperature side communication pipe 34b, the circulation of the refrigerant can be further prevented, and the cooling device can be miniaturized. There is a number.

Since the heat insulating material is made of foamed resin, thermal insulation can be performed efficiently.

The coolant tank 3a is disposed under a plurality of endothermic pipes 31a disposed generally parallel to each other, and a plurality of endothermic side communication portions 41 for communicating with the plurality of endothermic pipes 31a to each other. And an endothermic side upper communication part 42 disposed above the plurality of endothermic pipes 31a to communicate the plurality of endothermic pipes 31a with each other. The communication pipe is disposed substantially parallel to the heat absorbing pipe 31a to communicate with the heat absorbing side lower communication part 41, thereby miniaturizing the cooling device.

Since the heat sink fins 6a and the heat sink fins 6b are joined to the refrigerant tank 3a and the heat sink 3b in a molten state, the heat resistance between the fins is such that the heat sink fins 6a and the heat sink fins 6b are the refrigerant tanks. Compared to the case where it is mechanically mounted on 3a) and the radiator 3b, it can be reduced. Therefore, the cooling device can be further miniaturized than when the heat receiving fins 6a and the heat radiating fins 6b are mechanically mounted on the coolant tank 3a and the radiator 3b.

In addition, since the high temperature fluid and the low temperature fluid flow in opposite directions and the cooling apparatus using a plurality of boiling and condensation refrigerants is stacked in the flow direction of the high temperature fluid and the low temperature fluid, heat of the high temperature fluid can be easily radiated toward the low temperature fluid.

Second Embodiment

Hereinafter, a second embodiment of the present invention will be described.

FIG. 8 is a side view showing that a cooler according to the present embodiment is applied to a box-shaped cooling device, FIG. 9 is a plan view seen from the outside of FIG. 8 (ie, seen from the left side on the ground), and FIG. 10 is a second embodiment. Fig. 11 is an enlarged view of the endothermic pipe shown in Fig. 10, and Fig. 12 is a sectional view taken along the line II-II of Fig. 10. Figs.

The cooler according to the present embodiment is mounted inside the sealed space 9 in the same manner as the first embodiment shown in Figs. In the enclosed space 9, for example, a transceiver for communication equipment and a power amplifier for operating the transceiver are arranged.

As shown in Figs. 8 and 9, the cooler is provided with openings 13 and 14 in communication with the enclosed space 9 in its upper and lower parts.

In the cooler, an air vent 13, which is an open portion in communication with the upper portion of the sealed space 9, is formed in order to send the gas in the sealed space 9 into the high temperature side heat transfer space 11. In particular, the one side wall surface 9a and the partition wall 22 form an air passage 23 extending vertically through the cooler, and an upper end of the air passage 23 is an air vent 13 as an upper portion in the sealed space 9. (Top of the fluid separation plate 2). At the outlet of the vent 13, the upper portion of the enclosed space 9 is provided so as to suppress the inflow of cold air from the lower portion of the enclosed space 9 and to ensure a high temperature air flow from the upper portion of the enclosed space 9 securely. An open inlet 221 is formed.

In this case, the hot gas heated by the heat generating element 7 is introduced into the air passage 23 from the vent 13 and smoothly guided into the refrigerant passage 3a, so that the temperature of the enclosed space 9 is It can be kept uniform. That is, since the gas, which has become hot due to the heat generated from the heat generating element 7, is moved upward in the sealed space 9 by convection in the sealed space 8, in order to improve the cooling efficiency, the vent 13 Is preferably provided in the upper part of the enclosed space (9). In other words, when the vent 13 is positioned lower than the fluid separation plate 2, a relatively low temperature gas in the closed space 9 flows from the vent 13 into the air toll 23 to the refrigerant tank 3a. It is induced, and the cooling efficiency in the closed space 9 is not enough.

In addition, since the entire cooling device 1 is disposed to be inclined in the horizontal direction (since direction in FIG. 8), the coolant 1 passes through the coolant tank 3a and the radiator 3b in the heat transfer spaces 11 and 12 on the high and low temperatures. The gas to flow smoothly from the suction side vents 13 and 16 toward the discharge side vents 14 and 17. In this case, the change in the flow direction of the gas flowing through the refrigerant tank 3a and the radiator 3b can be slowed down so that the air flow loss in the narrow space can be reduced. As a result, the inner fan 15 in the enclosed space can be miniaturized and the amount of heat generated by the inner fan 15 can be reduced, so that the amount of heat corresponding to the reduced amount of heat by the heating element 7 is reduced. Can be increased (i.e., when the internal fan 15 is enlarged to improve the cooling performance, the amount of heat generated by the internal fan 15 increases, and as a result, the amount of heat generated by the heat generating element 7 increases. Can not be).

The internal fan 15, which is an internal circulation fan, is configured as an axial fan to suck air, whereby hot air (hot air as a high temperature fluid) introduced into the vent 13 through the inlet 221 is supplied to the refrigerant tank 3a. It flows in between the endothermic pipes 31a of (). The inner fan 15 is inclined so as to be parallel to the endothermic pipe 31a of the refrigerant tank 3a. In addition, the internal fan 15 may be inclined with respect to the endothermic pipe 31a of the refrigerant tank 3a.

The external fan 18, which is an external circulation fan, is configured as an axial fan to suck air, whereby low temperature air (low temperature air as low temperature fluid) introduced into the vent 16 through the inlet 221 radiates 3b. Flows in between the heat dissipation pipes 31b. The outer fan 18 is inclined with respect to the heat radiation pipe 31b of the heat sink 3b. On the discharge side of the external fan 18, a light guide plate 181 for guiding the air traveling direction from the external fan 18 is disposed upward. Air from the external fan 18 is discharged to the outside through the vent 17 opened to the upper surface of the cooler by the guiding plate 181.

A maintenance cover 9b for holding the radiator 3b is provided on the radiator 3b side of the cooler shown in FIG. Since the radiator 3b introduces external air, dust or foreign matter contained in the external air may be blocked between the heat dissipation pipes 31b, but they may be easily removed by the maintenance cover 9b. The maintenance cover 9b is fixed to the cooler during operation and opened during the cleaning operation.

10 is a perspective view showing the cooling device. In addition, in this embodiment, cooling autonomouss using a plurality of boiling and condensation refrigerants are stacked in the flow direction of the hot fluid and the cold fluid. Details of the chiller are similar to those shown in FIG. 4 except that no insulation 50 is provided, and is described in part with reference to FIG.

As shown in Figs. 4 and 10, the cooling device 1 includes a fluid separator 2 for separating hot fluid (e.g., hot air) from a cold fluid (e.g., cold air); A refrigerant tank 3a composed of a plurality of endothermic pipes 31a disposed on the hot fluid side from the fluid separation plate 2; A refrigerant 8 enclosed in the endothermic pipe 31a to receive heat from the hot fluid, boil it, and evaporate it; A pair of low temperature side communication pipes 34b, one of which communicates with the refrigerant tank 31a in a sealed manner, and the other thereof passes through the fluid separation plate 2 and extends to the low temperature fluid side; Communication pipe 34b; Low temperature side communication pipe 34a; A heat dissipator 3b, which is composed of a plurality of heat dissipation pipes 31b disposed in the low temperature fluid side from the fluid separation plate 2, in sealing communication with another hot side communication pipe 34b; A heat receiving fin 6a joined between the endothermic pipes 31a of the refrigerant tank 3a in a molten state (for example, a soldered state); A heat dissipation fin 6b joined between the heat dissipation pipes 31b of the heat dissipator 3b in a molten state (for example, a soldering state); And heat conduction inhibiting means, which is inserted between the refrigerant tank 3a and the low temperature side communication pipe 34a and between the radiator 3b and the communication pipe 34b to heat transfer from the refrigerant tank 3a to the low temperature side communication pipe 34a. And a heat insulating material 50 (for example, urethane foam which is a foaming resin) which suppresses heat movement from the radiator 3b to the communication pipe 34b.

The fluid separation plate 2 constitutes, for example, one wall surface of a high-temperature sealed space, and is made of a metal material such as aluminum to be integrally joined to the low temperature side communication pipe 34a and the high temperature side communication pipe 34b. For example, soldered). The fluid separation plate 2 is drilled with an elongated insertion hole extending from the low temperature side communication pipe 34a and the high temperature side communication pipe 34b.

The refrigerant tank 3a includes a plurality of endothermic pipes 31a disposed substantially parallel to each other, an endothermic side lower communication portion 41 disposed below the endothermic pipe 31a and communicating with these endothermic pipes 31a at the bottom thereof, and The heat absorbing side 31 includes an endothermic side upper communicating portion 42 disposed above the heat absorbing pipe 31a and communicating with these heat absorbing pipes 31a at the top. The endothermic pipe 31a forms a flat tube having an elliptical (or long rectangular) cross section, and is formed of a metal material (for example, aluminum or copper) having excellent heat transfer characteristics. 11 is a partial cross-sectional view showing the endothermic pipe 31a. In the figure, the heat sink pin 6a is omitted. As shown, the endothermic pipe 31a is a flat tubular member having an elliptical cross section and is formed integrally with the plurality of inner diaphragms 33 over the vertical direction (eye-shaped cross section). In this case, the breakdown voltage performance is improved, and the heat absorption efficiency is improved due to the expansion of the contact area with the refrigerant. The endothermic pipe 31a can be easily formed by extrusion processing.

The radiator 3b is provided with a plurality of heat dissipation pipes 31b arranged substantially parallel to each other, a heat dissipation side lower communication portion 43 disposed under the heat dissipation pipe 31b and communicating with the heat dissipation pipe 31b at the bottom, and a heat dissipation pipe. A heat dissipation side upper communication portion 44 disposed on the upper portion 31b and communicating with the heat dissipation pipe 31b at an upper portion thereof. In addition, the heat dissipation pipe 31b is formed of a metal material (for example, aluminum or copper) that has a flat tube shape having an elliptical (or long square) cross section and is excellent in heat transfer characteristics. Similarly, the heat dissipation pipe 31b has a flat tube shape having an elliptical cross-sectional shape similar to that of the heat absorbing pipe 31a shown in Fig. 11, and is integrally formed with the plurality of inner diaphragms 33 over the vertical direction (not shown). Not). This has the effect of improving the heat absorption efficiency and pressure resistance performance by expanding the contact area with the refrigerant. The heat radiating pipe 31b can be easily formed by extrusion molding process.

The high temperature side communication pipe 34b communicates with the heat absorbing side upper communication part 42 of the refrigerant tank 3a and the heat dissipation side upper communication part 44 of the radiator 3b to be boiled and evaporated in the refrigerant tank 3a. (8) is sent to the radiator 3b. The high temperature side communication pipe 34b is generally at a predetermined interval (preferably greater than the distance between the heat dissipation pipes 31b, more preferably at least two times the distance between the heat dissipation pipes 31b). Are arranged parallel to.

The low temperature side communication pipe 34a communicates with the heat radiating side lower communication part 43 of the radiator 3b and communicates with the heat absorbing side lower communication part 41 of the coolant tank 3a to condense and liquefy the refrigerant at the radiator 3b. (8) is returned to the refrigerant tank 3a. The low temperature side communication pipe 34a is generally parallel to the endothermic pipe 31a at predetermined intervals (preferably greater than the distance between the endothermic pipes 31a, more preferably at least twice the distance between the endothermic pipes). To be placed.

The coolant 8 is formed of HFC-134a (Chemical Formula: CH ₂ FCF ₃ ) or water, and in a range in which the internal pressure of the tank is not too high (for example, 20 times or less of atmospheric pressure in the case of HFC-134a), That is, it is set to be condensed by the low temperature fluid and boiled by the high temperature fluid. In particular, the refrigerant is selected to boil at 100 ° C. Here, the refrigerant may be a mixture having a plurality of components or a mixture mainly containing a single component. The coolant 8 is sealed up to an amount whose water level is located slightly below the heat absorbing side upper communication portion 42 of the coolant tank 3a. Preferably, the amount of refrigerant is set such that its level does not reach the heat dissipation pipe 31b during operation. The refrigerant 8 is sealed after the heat absorption fins 6a, the heat radiation fins 6b, and the heat radiation fins 6b are soldered and joined to the heat absorbing pipe 31a and the heat radiating pipe 31b.

The heat sink fins 6a are disposed between the heat absorbing pipes 31a, and the heat sink fins 6b are disposed between the heat sink pipes 31b. The heat receiving fins 6a and the heat radiating fins 6b are corrugated fins in which a metal plate (for example, an aluminum plate, having a thickness of 0.02 to 0.5 mm) having excellent heat transfer characteristics is alternately bent in a wave shape, and the heat dissipation pipe 31b is uneven It is soldered (ie bonded in molten state) to one outer wall surface. The heat receiving fins 6a are provided to facilitate the high temperature fluid side heat transfer to the refrigerant 8 and to improve the strength of the heat absorbing pipe 31a. The heat dissipation fins 6b are provided to facilitate heat transfer of the refrigerant to the low temperature fluid side and to improve the strength of the heat dissipation pipe 31b.

In this embodiment, a high temperature passage 35a through which hot air as a high temperature fluid flows is formed in the high temperature portion, and a low temperature passage 35b through which low temperature air as a low temperature fluid flows is formed in the low temperature portion.

In this embodiment, as the heat conduction inhibiting means, at least a plate member disposed between the refrigerant tank 3a and the low temperature side communication pipe 34a and between the radiator 3b and the high temperature side communication pipe 34b is disposed.

The high temperature side passage (high temperature passage) 35a is constituted by the high temperature side dividing member 50d and the fluid separation plate 2 formed of a plate-like member surrounding the outer circumferential portion of the refrigerant tank 3a. The coolant tank 3a is disposed in the high temperature passage 35a, and the low temperature side communication pipe 34a is isolated from the high temperature passage 35a so as to be located in the low temperature region. That is, as shown in Fig. 12, the low temperature communication pipe 34a is disposed outside the high temperature side dividing member 50d. The bracket is disposed on the entire surface of the low temperature side communication pipe 34a at an upstream portion where the hot air flows to prevent the hot air from flowing into the space in which the low temperature side communication pipe 34a is disposed.

In the same manner, the low temperature side passage (low temperature passage) 35b includes a low temperature side partition member 50c and a fluid separation plate 2 formed of a plate-like member surrounding the outer circumference of the radiator 3b. The radiator 3b is disposed in the cold passage 35b and is isolated from the cold passage 35b so that the hot side communication pipe 34b is located in the hot region. That is, the high temperature side communication pipe 34b is arrange | positioned outside the low temperature side division member 50c.

The flange fixes the cooling device and acts to maintain a predetermined distance between the refrigerant tank 3a and the low temperature side communication pipe 34a and between the radiator 3b and the high temperature side communication pipe 34b.

In this embodiment, as the heat conduction inhibiting means, a high temperature side partition member 50d for dividing the high temperature side passage 35a and a fluid separation plate 2 are provided between the low temperature side communication pipe 34a and the endothermic pipe 31a. The low temperature side communication pipe 34a is provided and separated by the high temperature side dividing member 50d so that its temperature is located in a region lower than the high temperature passage 35a. In this case, the heat conduction from the high temperature passage 5a to the low temperature side communication pipe 34a can be suppressed, so that the descending refrigerant condensed and liquefied in the radiator 3b is heated at a high temperature through the low temperature side communication pipe 34a. It is possible to prevent heat from being absorbed from the passage and receiving upward force in the low temperature side communication pipe 34a. In this case, obstruction of the refrigerant circulation is prevented, and the cooling device can be miniaturized. Further, as the heat conduction inhibiting means, a low temperature side partition member 50c and a rapeseed separating plate 2 for dividing the low temperature passage 35b are provided between the high temperature side communication pipe 34b and the heat dissipation pipe 31b. The side communication pipe 34b is separated by the low temperature side partition member 50c so that its temperature is located in a region higher in the low temperature passage 35b.

In this case, heat conduction from the high temperature side communication pipe 34b to the low temperature passage 35b can be suppressed. As a result, it is possible to prevent the rising refrigerant boiled and evaporated in the refrigerant tank 3a through the high temperature side communication pipe 34b to dissipate heat into the low temperature passage to descend from the high temperature side communication pipe 34b. In this way, obstruction of refrigerant circulation can be prevented, and the cooling device can be miniaturized.

Further, in the plural layers of cooling apparatus shown in Fig. 10, each of the low temperature side communication pipes 34a is separated from the high temperature passage, and each of the high temperature side communication pipes 34b is separated from the low temperature passage, and thus, the fluid flow Temperature efficiency can be improved.

The cooling apparatus according to the present embodiment is divided into a portion through which air can be blown (pin portion) and a portion through which air can't be blown (low temperature side communication pipe 34a, high temperature side communication pipe 34b). As in the present embodiment, when air is blown by a fan (not shown) to the plural layers of cooling devices, the air flows into and comes into contact with the fin portion and expands after passing through the fin portion. As a result, pressure loss can be caused. However, in this embodiment, the high temperature passage 35a is divided by the fluid separation plate 2 and the high temperature side dividing member 50d, and the low temperature passage 35b is divided into the fluid separation plate 2 and the low temperature side dividing member ( As divided by 50c), air flowing through the passages 35a and 35b flows linearly so that the pressure loss can be reduced. In this case, power consumption and air flow noise of the fan are reduced. In addition, since the cross section through which air is blown is limited as compared with the case where it is not divided, the flow amount at the fin portion can be increased.

The high temperature side communication pipe 34b is disposed substantially parallel to the heat dissipation pipe 31b at a predetermined interval (preferably an interval larger than the distance between the heat dissipation pipes 31b, more preferably about twice the distance). Therefore, it is possible to prevent the rising refrigerant evaporated by boiling in the refrigerant tank 3a to radiate heat to the low temperature radiator 3b through the high temperature side communication pipe 34b to prevent it from descending from the high temperature side communication pipe 34b. . The low temperature side communication pipe 34a communicates with the heat dissipation side lower communication portion 43 of the radiator 3b and the heat absorbing side lower communication portion 41 of the coolant tank 3a to be condensed and liquefied by the radiator 3b. Return 8) to the refrigerant tank 3a. Further, the low temperature side communication pipe 34a is generally parallel to the endothermic pipe 31a at predetermined intervals (preferably, an interval larger than the distance between the endothermic pipes 31a, more preferably about twice the interval). Since it is arranged so that the descending refrigerant condensed and cooled in the radiator 3b can absorb heat from the high temperature refrigerant tank 3a and receive the lifting force in the low temperature side communication pipe 34a.

In the case of the first and second embodiments described above, heat absorption efficiency is improved because heat can be received by the plurality of endothermic pipes 31a in the refrigerant tank 3a. The refrigerant boiled by the absorption heat and evaporated is collected in the heat absorbing side upper communicating portion 42, and the refrigerant is sent to the radiator 3b by the high temperature side communicating pipe 31b. Therefore, the number of tubes for communicating between the radiator 3b and the coolant tank 3a can be reduced, and the fluid separation plate 2 can be easily machined. Further, in the radiator 3b, heat is radiated by the plurality of radiating pipes 31b, so that the heat radiating efficiency is improved. The condensed liquefied refrigerant is collected in the heat dissipation side lower communication portion 43, and the refrigerant is sent to the refrigerant tank 3a by the low temperature side communication pipe 34a. Therefore, the number of tubes for communicating between the radiator 3b and the coolant tank 3a can be reduced, and the fluid separation plate 2 can be easily machined.

The high temperature side dividing member 50d does not need to be constituted by a plate member disposed between the flange and the low temperature side communication pipe 34a, as shown in Fig. 12, and as shown in Fig. 13, between the flanges. It may also consist of an insertion flange 50e held at. Similarly, the low temperature side dividing member 50c does not need to be constituted by a plate member disposed between the flange and the high temperature side communicating pipe 34b, but may also be composed of an insertion flange 50e held between the flanges. In this case, the air is blown more smoothly.

12 and 13, since the bracket is disposed upstream of the air blowing region, hot air does not collide with the low temperature side communication pipe 34a, and the low temperature side communication pipe 34a is prevented from being heated by the hot air. Can be. However, even in the direction opposite to the air flow direction shown in Fig. 12 (the bracket is disposed downstream), the air is stagnated in the area surrounded by the cabinet side plate, the bracket, and the hot side partition member 50d, Practically hot air does not collide with the low temperature side communication pipe 34a. In this case, the low temperature side communication pipe 34a can also be prevented from being heated by the hot air. Similarly, even in the direction opposite to the air flow direction shown in FIG. 13 (the bracket is disposed downstream), the air is stagnated in the area surrounded by the cabinet side plate, the bracket, and the insertion flange 50e, and is generally hot air. Does not collide with the low temperature side communication pipe 34a. In this case, the low temperature side communication pipe 34a can also be prevented from being heated by the hot air.

(Third Embodiment)

Hereinafter, a third embodiment of the present invention will be described.

14 is a side view showing the overall structure of a cooling apparatus using boiling and condensation refrigerant according to a third embodiment of the present invention.

The cooling device 1 is for cooling an IGBT module (heating element) constituting an inverter of an electric vehicle or a general power control device. The cooling device 1 includes a refrigerant tank 3 including a fluorocarbon type refrigerant, a radiator 4 for condensing and liquefying evaporated refrigerant boiled in the refrigerant tank 3, and a radiator 4. And a cooling fan 5 for blowing air into the furnace.

As shown in Fig. 14, the IGBT module 2 has a heat sink 2a for dissipating heat generated from a semiconductor element (not shown) integrated in the module. The IGBT module 2 is fixed to the refrigerant tank 3 by tightening a plurality of bolts 6, and the heat sink 2a is in intimate contact with the outer wall surface of the refrigerant tank 3. In this embodiment, six IGBT modules 2 are mounted on one outer wall surface of the refrigerant tank 3 (two in the transverse direction and three layers in the vertical).

The refrigerant tank 3 includes, for example, an extrusion member 7 formed by extrusion processing from an aluminum block material and a pair of end caps 8 and 9 for closing the lower end opening of the extrusion member 7. do.

The extrusion member 7 has a vertically long and flat shape with a thickness smaller than its width. As shown in FIGS. 15 and 16 (sectional views taken along the line X VI-X VI in FIG. 15), the vapor passage 10, the condensate passage 11, the adiabatic passage 12, and the non-operating passage 13 In the longitudinal direction (vertically in Fig. 15) through the interior of the extruded member 7, with support rods (support wall portions) 14, 15, 16, and 17 intact between adjacent passages. Is formed.

The vapor passages 10a and 10b are areas in which the evaporative refrigerant boiled and evaporated by heat from the IGBT module 2 rises in the refrigerant tank 3. Two steam passages are formed side by side corresponding to the mounting position of the IGBT module 2. The condensate passage 11 is a region in which the condensate cooled by the radiator 4 flows and is formed at one side in the lateral direction. The adiabatic passage 12 serves to reduce the amount of heat transferred from the steam passage 10 to the condensate passage 11 side and is formed between the steam passage 10 and the condensate passage 11. The non-operating passage 13 is for balancing with the liquid solution passage 11 while the extrusion member 7 is extruded, and is formed on the opposite side of the condensate passage 11 in the transverse direction of the refrigerant tank 3. Thus, the inoperative passage 13 is not used as the condensate passage 11.

Support wall portion 14 for distinguishing between two steam passages 10a and 10b, support wall portion 15 for distinguishing between one steam passage 10a and adiabatic passage 12, and another steam passage 10b. In each of the supporting wall portions 16 for distinguishing between the non-operating passage 13 and the bolt 6 for mounting the IGBT module 2, as shown in FIG. 18) is formed.

As shown in Fig. 15, the area (indicated by the broken line B) to which the radiator 4 is connected through the connecting plate member 19 and the outer wall of the extrusion member 7 (in this embodiment, the IGBT module 2) In the wall on which this is mounted, a steam refrigerant pump 20 and a condensate inlet 21 are formed. The outlet 20 is opened above the non-operation passage 13. Since the upper part of the support wall parts 14, 15, 16 is removed by machining, for example, milling, the outlet 20 is in communication with the vapor passage 10 and the heat insulation passage 12. Since the inlet 21 and the outlet 20 are slightly different in height, the lower end of the inlet 21 is lower than the lower end of the outlet 20.

The end caps 8, 9 cover both open ends of the extrusion member 7 and are integrally connected thereto by soldering. In this case, the upper end cap 8 is attached while closing the upper opening of the extrusion member 7, while the lower end cap 9 is connected between the lower end and the lower end cap of the extrusion member 7. 22 is attached to the bottom opening of the extrusion member 7 to provide communication between the vapor passage 10, the condensate passage 11, the adiabatic passage 12 and the non-operating passage 13.

The radiator 4 is a so-called drawn-cup type heat exchanger, and is formed by stacking a plurality of hollow heat-dissipating tubes 23 of the same shape as shown in FIG. 14 and through the connecting plate 19. It is attached to the refrigerant tank (3).

As shown in Fig. 17 (cross section taken along the line X Ⅶ-X 에서 의 in Fig. 14), each of the heat dissipation tubes 23 includes two press-formed plate members 24 having a generally rectangular planar shape. The outer peripheral edges of the press-formed sheet material 24 are joined together to form a hollow body. The two press-formed plate members 24 are formed in the same shape by pressing a metal material (for example, aluminum) having excellent thermal conductivity having communication openings formed at both ends of each molded plate member 24. The entire center portion of each heat dissipation tube 23 constitutes a flat refrigerant passage 26 into which the inner fin 27 obtained by corrugating a thin aluminum sheet is inserted. Both ends of the refrigerant passage 26 are provided with a communication portion 28 having a communication opening 25. The communicating portion 28 is provided with the communicating portion 28 of the other heat dissipation tube 23 via the communicating opening 25, thereby constituting the tank portion of the overall radiator 4.

As shown in Fig. 17, the heat dissipation tubes 23 are stacked so that each communicating portion 28 faces each other. The mutual communication of the heat dissipation tube 23 is ensured through the communication opening 25 formed in the communication part 28 with the heat dissipation fin 29 sandwiched between adjacent heat dissipation tubes 23 in a laminated state. However, assuming that the outer press-formed plate member 24 of the heat dissipation tube 23 located at the outermost side does not have the communication opening 25, problems such as deterioration of the performance of the heat dissipation tube may occur.

Alternatively, the press-formed plate material 24 having the communication opening 25 may be used, but in this case, the communication opening 25 is closed by sealing with an end plate or the like from the outside.

The connecting plate 19 is sealedly connected to the outer wall surface of the extrusion member 7 so as to cover both the inlet 21 and the outlet 20 formed in the extrusion member. One communication chamber 30 in communication with the inlet 20 and another communication chamber 31 in communication with the outlet 21 are formed between the outer wall surface of the extrusion member 7 and the connecting plate 19. Both communication chambers 30 and 31 are in communication with each other through the refrigerant passage 26 in which the internal fins 27 are disposed. The connecting plate 19 has the same communication opening as that formed in the press-formed plate 24, and communication between the communication chambers 30 and 31 and the heat dissipation tube 23 is provided through the communication opening. As shown in Fig. 14, the cooling fan 5 is an axial fan having a fan shroud 5a fixed by bolts (not shown) on the side of the heat sink 4, and the heat sink 4 Is placed on top.

The operation of this embodiment will be described.

In the vapor passage where the IGBT module 2 is attached to the outer wall surface, the refrigerant boils and evaporates while receiving heat from the IGBT module 2. The resulting bubbles rise in the vapor passage 10 and pass through the outlet 20 and flow mainly into one communication chamber 30. The bubble then flows from one communication chamber 30 into one tank portion (right communication portion 28 in FIG. 17) of the radiator 4 and into the refrigerant passage 26 formed in the heat dissipation tube 23. Is distributed. The evaporative refrigerant flowing through each refrigerant passage 26 is condensed on the surface of the inner fin 27 and the inner wall surface of the refrigerant passage, which receives the air blown from the cooling fan 5 and is kept at a low temperature, to radiate the latent heat of condensation. The resulting condensate droplets flow along the bottom of each refrigerant passage 26 and into the other tank portion (left communication portion in FIG. 17) of the radiator 4. In addition, the condensate droplets flow out of the other tank portion and into the other communication chamber 31, and mainly stay there. Thereafter, the condensate of the communication chamber 31 flows into the condensate passage 11 through the open inlet 21 at a position lower than the outlet 20, and then flows down through the condensate passage 11 and the end cap 9. Return back to the steam passage 10 through the communication passage 22 formed inside. On the other hand, the latent heat of condensation radiated during condensation of the evaporative refrigerant is transferred from the wall surface of the refrigerant passage 26 to the heat dissipation fin 29 and radiated into the blowing air passing between the adjacent heat dissipation tubes 23.

The effects of the present embodiment will be described below.

According to the cooling device 1 of the present embodiment, in the heat transfer path in which heat generated from the IGBT module 2 is transferred to the refrigerant in the condensate passage 11 through the extrusion member 7, one vapor passage 10a. And the heat insulation passage 12 formed between the condensate passage 11 acts as a heat resistance. In addition, most of the heat moving through the heat transfer path is absorbed by the refrigerant in the heat insulating passage 12 to contribute to the temperature rise of the refrigerant in the passage 12. As a result, the amount of heat transferred from the steam passage 10 side to the condensate passage 11 side through the heat transfer path mentioned above is reduced, whereby the refrigerant can be prevented from boiling off the condensate in the passage 11. . As a result, the coolant circulates smoothly between the coolant tank 3 and the radiator 4, and the deterioration of the heat radiation performance due to the boiling of the coolant in the condensate passage 11 can be prevented.

(Example 4)

A fourth embodiment of the present invention will be described.

18 is a partial sectional view showing a heat transfer reducing structure of the refrigerant tank 3. In this embodiment, as the heat transfer reducing structure of the refrigerant tank 3, the contraction portion 32a having a reduced cross-sectional area in the support wall portion 32 for dividing between the condensate passage 11 and one vapor passage 10a. Is provided. In this case, since the amount of heat transferred to the condensate passage 11 from the steam passage 10 side decreases, it is possible to prevent the refrigerant from boiling in the condensate passage 11.

(Example 5)

A fifth embodiment of the present invention will be described.

19 is a partial cross-sectional view showing the heat transfer reducing structure of the refrigerant tank (3).

In this embodiment, as the heat transfer reducing structure of the refrigerant tank 3, the air-cooling fins 32b are outside the support wall portion 32 with a constant distance between the condensate passage 11 and one vapor passage 10a. Is formed.

According to the present embodiment, part of the heat transferred through the support wall portion 32 is released to the atmosphere through the air-cooling fins 32b, so that the amount of heat transferred to the condensate passage 11 on the steam passage 10 side is reduced. do. Therefore, boiling of the refrigerant in the condensate passage 11 can be prevented.

(Example 6)

The sixth embodiment of this embodiment will be described.

20 is a partial cross-sectional view showing the heat transfer reducing structure of the refrigerant tank (3).

In this embodiment, the inner fin 12a protrudes inside the adiabatic passage 12. According to this embodiment, since the heat dissipation area in the heat insulating passage 12 is increased by the internal fins 12a, the heat dissipation performance is improved by boiling the refrigerant in the heat insulating passage 12 and the condensate passage on the steam passage 10 side. The amount of heat transferred to the (11) side is reduced, and therefore, boiling of the refrigerant in the condensate passage 11 can be prevented.

(Example 7)

A seventh embodiment of the present invention will be described.

FIG. 21 is a partial sectional view showing the heat transfer reducing structure of the refrigerant tank 3. As shown in FIG.

In the present embodiment, the heat insulating passage 12 has an inner wall surface 12b of concave-convex shape. According to this embodiment, since the boiling of the refrigerant in the heat insulating passage 12 is accelerated as compared with the case where the inner wall surface of the heat insulating passage 12 is flat, the amount of heat transferred from the steam passage 10 side to the condensate passage 11 side. This becomes smaller, and therefore, boiling of the refrigerant in the condensate passage 11 can be prevented.

(Example 8)

The eighth embodiment of this embodiment will be described.

22 is a vertical sectional view of the refrigerant tank 3.

In this embodiment, the upper portion of the heat insulation passage 12 is in communication with the condensate passage 11. Also, in this case, the heat insulation passage 12 acts as a heat resistance and a part of the heat transferred through the extrusion portion 7 is absorbed by the refrigerant in the passage 12, so that the condensate passage 11 on the steam passage 10 side. The amount of heat transferred to the) side is reduced to a degree sufficient to prevent boiling of the refrigerant in the condensate passage 11. In proportion to the increase in the internal pressure at the boiling portion due to the bubbles, a difference in the water level (the height of the oil level) occurs between the boiling portion and the condensate passage 11 during the operation of the cooling device, so that the level of the condensate passage 11 becomes high. . As a result of the communication between the condensate passage 11 and the adiabatic passage 12, since the water level in the passage 12 is higher than in the case of the communication with the boiling part, the heat dissipation area in the adiabatic passage 12 increases and the cooling effect is increased. It is improved and boiling of the refrigerant in the condensate passage 11 can be prevented.

(Example 9)

A ninth embodiment of the present invention will be described.

23 to 25 are vertical cross-sectional views of the refrigerant tank 3.

In the present embodiment, a plurality of heat insulating passages 12 (two in Figs. 23 to 25) are formed. FIG. 23 shows an example in which the upper portions of the two adiabatic passages 12 are in communication with the steam passage 10. As shown in FIG. 24 shows an example in which the upper part of one heat insulating passage 12a is in communication with the vapor passage 10, and shows an example in which the upper part of the other heat insulating passage 12b is in communication with the condensate passage 11. 25 shows an example in which the upper portions of the two adiabatic passages 12 are in communication with the condensate passage 11. In each of the above examples, since a plurality of adiabatic passages 12 are provided, the amount of heat transferred from the steam passage 10 side to the condensate passage 11 side becomes smaller and the boiling of refrigerant in the condensate 11 can be further prevented. Can be.

(Example 10)

26 to 31, a tenth embodiment of the present invention will be described.

FIG. 26A is a diagram showing a schematic structure of a cooling apparatus using boiling and condensation refrigerant. FIG. 26B is a diagram showing a heat exchanger including a cooling unit arranged in a plurality of layers, and FIG. 27 shows the overall structure of the electronic apparatus. Diagram.

For example, the electronic device 1 is a device installed in a wireless base station of a portable telephone such as a wireless telephone or an automobile telephone. The electronic device 1 includes a housing 13 accommodating the electronic parts 11 and 12 in a sealed state and a cooling device (cooler) built in the housing 13 for cooling the electronic parts 11 and 12. (14).

The electronic component 11 is a heating element (for example, a semiconductor switching element constituting a high frequency switching circuit built in a transceiver) that performs a predetermined operation and generates heat when a current is supplied. The electronic component 12 is a heating element (for example, a semiconductor amplifier element such as a power transistor embedded in a power amplifier) that also performs a predetermined operation and generates heat when a current is supplied thereto.

The housing 13 for sealing the inside from the outside defines an enclosed space 15 therein. In order to prevent the deterioration of the performance of the electronic parts 11 and 12 due to the deposition of foreign substances such as dust and moisture, the sealed space 15 is, for example, attached to the fluid separation plate used in the cooling device 14 to be described later. It is sealed completely from the outside by this.

By the fluid separation plate used in the cooling device 14 and the casing of the cooling device 14, the sealed space 15 contains the electronic component accommodating space 16 in which the electronic components 11 and 12 are accommodated, and inside the sealed body. The flow path area of the high temperature side heat transfer space 17 which acts as a passage is narrowed on the upstream side, while the flow path area of the space 17 on the downstream side becomes wider. The housing 13 also defines a low temperature side heat transfer space 18 which is a passage outside the sealed body.

The cooling device 14 includes a casing 20 integral with the housing 13; Two upper centrifugal blowers 21 for generating a flow of cold air (outer fluid, cold fluid); Two lower centrifugal blowers 22 generating a flow of cold air (inner fluid, hot fluid); An electric heater 23 for maintaining the air temperature in the closed space 15 at a level not lower than a lower limit temperature (eg, 0 ° C.); A controller 24 for controlling the supply of electricity for the electrostatics used in the chiller 14; And a heat exchanger 25 for maintaining the air temperature in the closed space 15 at a level not higher than the upper limit temperature (eg, 65 ° C.).

The casing 20 includes an outer wall plate 26 disposed on the outermost side of the electronic device 1 and a rear diaphragm 27 surrounding the high temperature side heat transfer space 17. The outer wall plate 26 and the rear plate 27 are fixed to the housing 13 by, for example, joining by spot welding or the like, or by using fastening means such as screws or bolts.

The two upper centrifugal blowers 21 have a centrifugal fan 31 for generating air gm in the low temperature side heat transfer space 18, an electric motor 32 for rotating the centrifugal fan 31, and a centrifugal fan 31. There is provided a scroll casing 33 which rotatably houses therein.

When the internal temperature of the enclosed space 15 is lower than the lower limit temperature, the performance of the electronic components (for example, semiconductor elements) 11 and 12 decreases, so that the electric heater 23 has an internal temperature of the enclosed space 15. Is for heating the air flowing through the high temperature side heat transfer space 17 so as not to be lower than the lower limit temperature (for example, 0 ° C). The electric heater 23 used in this embodiment has a calorific value of 1.2 kW, for example.

The controller 24 controls the electric devices such as the electric motor 32 of the two upper centrifugal blowers 21, the electric motor 35 of the two lower centrifugal blowers 22 and the electric heater 23. It is for controlling according to the internal temperature of the sealed space 15 detected by the temperature sensor 9 composed of a temperature sensitive element such as.

When the internal temperature of the enclosed space 15 is not lower than the lower limit temperature (for example, 0 ° C.), the controller 24 performs control so that the two upper centrifugal blowers 21 and the two lower centrifugal blowers 22 are controlled. The electric heater 24 is turned off. The electric heater 24 is turned off. On the other hand, when the internal temperature of the sealed space 15 is lower than the lower limit temperature (for example, 0 ° C.), the controller 24 performs control so that the electric motor 32 of the two upper centrifugal blowers 21 is turned-on. When turned off, the electric motor 35 of the two lower centrifugal blowers 22 is operated in Hi (high wind volume) or Lo (low wind volume) mode, and the electric heater 23 is turned on.

Next, a heat exchanger 25 provided with a cooling unit will be described in detail with reference to FIGS. 26 to 31. FIG. 28 is a diagram showing the structure of a cooling unit, and FIGS. 29 and 30 are diagrams each showing a fluid separation plate for dividing the cooling unit into two parts.

The heat exchanger 25 includes a fluid separation plate 2 and a cooling unit 3 mounted to the fluid separation plate 2 in a plurality (two) layers while extending through the separation plate 2. The fluid separation plate 2 seals the hot air, which is the internal air (inside air) circulating through the inside of the housing 13, and the cold air, which is the outside air (outside air) circulated from the outside of the housing 13, in a sealed state. Isolate.

The fluid separation plate 2 has a wall surface (part of) of the housing 13 including both wall surfaces of the sealed space 15 where the inside thereof becomes a high temperature and walls of the low temperature side heat transfer space 18 where the inside thereof becomes a low temperature. Configure. For example, the fluid separation plate 2 is made of a metal thin plate having excellent thermal conductivity such as aluminum. The fluid separation plate 2 is provided with a cooling unit 3 and a casing to provide a sealed compartment between an enclosed space 15 including the high temperature side heat transfer space 17 and an exterior including the low temperature side heat transfer space 18. 20) are welded together.

As shown in Fig. 29, the fluid separation plate 2 has a plurality of elongated, square or rectangular through-holes 38 (e.g., 1.7 mm wide, 16.0) for the passage of cooling tubes of each cooling unit to be described later. Length). The through holes 38 are formed at predetermined intervals. The fluid separation plate 2 may be a split plate, as shown in FIG.

The cooling unit 3 is mounted in multiple layers inclined at a predetermined angle in the casing 20. The cooling unit 3 includes a pair of communication pipes for communicating a plurality of cooling tubes 4 and cooling tubes 4 in which a fluorocarbon type or a freon type refrigerant is sealed. 5) and a multiple flow path type heat exchanger each including a plurality of heat transfer fins 6 attached to the outside of each cooling tube 4. On both sides of each cooling unit (3) acts to fix the cooling unit (3) to the fluid separation plate (2) and the casing (20) by fastening means, and also a plurality of cooling tubes (4) and a plurality of heat transfer fins ( 6) side plates 37 which act to reinforce are connected. The cooling unit 3 is arranged in multiple layers (for example, two layers) in the flow direction of both hot air and cold air.

The plurality of cooling tubes 4 have a long, square or rectangular cross-sectional shape, and are each formed in a shape with a flat using a metal material excellent in thermal conductivity such as aluminum or copper, for example. The cooling tube 4 is arranged to extend through the through hole 38 formed in the fluid separation plate 2. One side (the hot air side to the fluid separation plate 2) of each cooling unit 3 including the cooling tube 4 is configured as a liquid refrigerant tank (boiling portion) 7, while the other side ( In Fig. 28, the upper side, the low temperature air side with respect to the fluid separation plate 2, is configured as an evaporative refrigerant tank (condensation portion) 8. In this embodiment, the boiling part 7 and the condensation part 8 are 360 mm wide (horizontal size), 430 mm high, 16 mm thick.

The communicating pipe 5 is connected by the high temperature side tank 41 connected to the lower end of the some cooling pipe 4 (boiling part 7), and the low temperature side tank 42 connected to the upper end of the some cooling tube 4, and is connected. And thus provide communication between the cooling tubes 4. The hot and cold side tanks 41 and 42 are each composed of a core plate disposed on the side of the cooling tube 4 and a tank plate of generally inverted U-shape fixed to the core plate. One refrigerant filling opening (not shown) for sealing the refrigerant into the cooling unit 3 is formed in the high temperature side tank 41 or the low temperature side tank 42. The refrigerant is enclosed in each cooling conduit 4 of the cooling unit 3 to a height such that its water level is substantially flush with the fluid separation plate 2. The filling of the coolant is performed after the heat transfer fins 6 are soldered to the cooling tube 4. The hot side tank 41 may be omitted.

The heat transfer fins 6 are the heat receiving fins 6a inserted between the cooling tubes 4 adjacent to the high temperature side (boiling portion 7) of the cooling unit 3 and the low temperature side (condensation portion) of the cooling unit 3. And a heat dissipation fin 6b inserted between the cooling tubes 4 adjacent to (8)). For example, the heat transfer fin 6 is a corrugated fin (pin pitch of about 3.75 mm) formed in a wave form by alternately pressing and bending a thin plate having excellent thermal conductivity such as aluminum. The fins 6 are soldered to the flat outer wall surface of the cooling tube 4. Thus, the outer wall surfaces of the cooling tube 4 and the heat transfer fin 6 are welded together.

As shown in Figs. 26A, 26B and 27, in the heat exchanger 25, the cooling unit 3 is hot air (housing 13 circulating in the high temperature side heat transfer space 17 of the enclosed space 15). ) And a plurality of layers according to the flow direction of the hot air and the cold air in such a manner that the cold air circulating in the cold side space 18 (the unclean air in the housing 13) flows in opposite directions. Is placed.

In the heat exchanger 25 comprising a plurality of layers of cooling units 3, in the drawing of the lower part (boiling part 7) of the cooling tube 4 in the cooling unit 3 of the second layer the right side is It serves as an inlet, whereas in the picture of the lower part (boiling part 7) of the cooling tube 4 in the cooling unit 3 of the first layer, the inlet acts as the outlet of the hot air. In addition, in the drawing of the upper end (condensation part 8) of the cooling unit at the cooling unit 4 of the first layer, the negative side serves as an inlet for low temperature air, while the cooling tube in the cooling unit 3 of the second layer is In the figure of the upper part (condensation part 8) of (4), the right side serves as an outlet of cold air.

Hereinafter, referring to FIGS. 26A, 26B and 27, in the cooling apparatus equipped with the heat exchanger 25, the cooling unit 3 of this embodiment is arranged in a plurality of layers so that the hot air and the cold air flow back to each other. The operation of the device will be briefly described.

When the internal temperature of the enclosed space 15 in the housing 13 is not lower than the lower limit temperature (for example, 0 ° C.), the electric motor 32 and the two lower centrifugal blowers of the two upper centrifugal blowers 21 ( The electric power supply to the electric motor 35 of 22 is started, whereby the centrifugal fans 31 and 34 start to operate. As a result, the flow of hot air (clean internal air that does not contain any foreign matter such as dust or moisture; internal fluid) circulates in the enclosed space 15 of the housing 13. In addition, outside of the housing 13, a flow of low temperature air (external air included in foreign matter such as dust or moisture; external fluid) circulates in the low temperature side heat transfer space 18.

As shown in Fig. 26A, the refrigerant encapsulated in the cooling tube 4 of each cooling unit mounted in multiple layers through the fluid separation plate 2 of the housing 13 is discharged from the hot air through the heat receiving fins 6; The transferred heat is received and then boiled and evaporated. The evaporative refrigerant transfers the resulting latent heat to the low temperature air through the heat dissipation fins 6 on the inner wall surface of the condensation unit 8 located on the upper surface of each cooling unit 3 exposed to the low temperature air. While condensing.

Thus, the refrigerant condensed in the condensation section 8, shown in FIG. 26A, by its own weight, the boiling portion 7 located on the lower end surface of the cooling unit 3 along the inner wall surface of the cooling conduit 4. To fall. Accordingly, since the refrigerant sealed in the cooling tube 4 of the cooling unit 3 alternately repeats boiling and condensation, heat of the hot air is transferred to the low temperature air. In this case, heat generated in the electronic components 11 and 12 may be radiated in the cooling unit 3 arranged in a plurality of layers.

Therefore, the electronic parts 11 and 12 are hot air circulated in the high temperature side heat transfer space 17 of the sealed space 15 (clean air in the housing 13) and low temperature air circulated in the low temperature side heat transfer space 18. It can be cooled without mixing (unclean air outside the housing 13).

The effect of this embodiment is explained.

31A and 31B, the features of the heat exchanger in which the cooling unit 3 is arranged in plural layers in the direction in which the hot air and the cold air flow will be described.

31A and 32B are schematic diagrams showing temperature distributions in the air and refrigerant flow directions, respectively, when the cooling unit 3 of a single layer is used and the cooling unit 3 of a plurality of layers (two layers) is used. . In each diagram, the ordinate represents the temperature (the lower the position, the higher the temperature), while the abscissa represents the direction of the fluid (air) flow.

In the case of a heat exchanger (prior art) using a single-layer cooling unit 3, as shown in Fig. 31A, hot air flows from the right side to the lower portion (boiling portion 7) of the cooling unit 3 in the figure. Enter With heat radiation to the upper portion of the cooling unit (condensation part 8), the temperature of the hot air is lowered, so that the radiated (cooled) air flows out to the left in the figure. On the other hand, as also shown in Fig. 31A, the low temperature air enters the upper portion (condensation part 8) of the cooling unit 3 from the left side to receive heat from the cooling unit, whereby the temperature of the air rises and the air warms up. Flows to the right side of the cooling unit (3) in the figure.

Assuming that the temperature difference between the inlet air and the outlet air in the condensation unit 8 of the cooling unit 3 is ΔT1, since the heat exchange medium for heat exchange with the refrigerant enclosed in the cooling unit 3 is air, The air is heated rapidly by the heat radiating fins 6 in the cooling unit and its temperature rises rapidly at the inlet, but this entails saturation, whereby the temperature difference ΔT1 (cooling performance) is not so sufficient.

On the other hand, as shown in Fig. 31B, in the heat exchanger 25 including the plurality of layers of the cooling unit 3 according to the tenth embodiment of the invention, the refrigerant and air enclosed in each cooling unit 3 Heat exchange between can be performed in at least two layers in the air flow direction. In this case, as supported by the broken line in the figure, the temperature difference between the refrigerant encapsulated in the cooling unit 3 of the first layer and the refrigerant encapsulated in the cooling unit 3 of the second layer (heat dissipation fin temperature difference, and the heat sink fin). Temperature difference). Therefore, as shown in Fig. 31B, the low temperature air reaches its saturation temperature as it passes through the condensation section 8 of the cooling unit 3 of the first layer, and then its temperature reaches the cooling unit of the second layer. Rise near the inlet of (3). At the same time, the hot air reaches its saturation temperature as it passes through the boiling portion 7 of the cooling unit 3 of the second layer, after which the temperature drops near the inlet of the cooling unit 3 of the first layer. .

Thus, as shown in Figs. 31A and 31B, the temperature difference DELTA T2 obtained in this embodiment (heat exchanger using multiple layers of cooling devices 3) is known in the prior art (single layer cooling unit 3). Heat exchanger to be used) may be larger than the temperature difference ΔT1 obtained. Therefore, it is possible to improve the hot air cooling performance by dissipating the heat of the hot air with the cold air. In this case, the cooling effect on the electronic components 11 and 12 can be improved, and as a result, the electronic components 11 and 12 can operate properly. Further, in this embodiment, when compared with the prior art having the same heat dissipation performance (cooling performance), the effective heat exchange area (effective heat dissipation area) of each cooling unit 3 can be reduced. As a result, the entire cooling device 14 equipped with the small heat exchanger 25 can be downsized.

In addition, since the cooling unit 25 used in the heat exchanger 25 is disposed in a plurality of layers so that the hot air and the cold air flow in opposite directions, the temperature of the refrigerant encapsulated in the cooling unit 3 of the first layer ( Effective temperature difference between the heat sink fin temperature and the heat sink fin temperature) and the temperature of the refrigerant encapsulated in the second cooling unit 3. Therefore, by using a refrigerant having a different temperature, it is possible to efficiently raise and lower the cold air and the hot air alternately. Therefore, the cooling performance of the whole cooling device 14 can be improved and downsized.

Although this embodiment has been described with reference to the case where two layers of cooling units 3 are used, a large temperature between each air inlet and outlet of each boiling section 7 and condensation section 8 in the heat exchanger 25 is shown. Three or more layers of cooling unit 3 may be used to achieve the difference. Its actions and effects are as described above and are not described herein.

(Eleventh embodiment)

32 to 36, an eleventh embodiment of the present invention will be described. 32 to 34 show a specific structure of a cooling device incorporated in an electronic device, FIG. 35 shows a specific structure of a cooling unit, and FIG. 36 shows a schematic structure of a heat exchanger including a cooling unit arranged in a plurality of layers. .

The cooling unit 3 constituting the heat exchanger 25 according to this embodiment is mounted in plural (three) layers inclined by a predetermined angle in the casing. The cooling unit 3 includes a high temperature side heat exchanger (internal air side heat exchanger) 3a and a plurality of cooling tubes 4b of which the plurality of cooling tubes 4a constitute the boiling portion 7. It is divided into a low temperature side heat exchanger. The hot and cold side heat exchangers 3a and 3b are interconnected via two first and second connecting tubes 9a and 9b for refrigerant circulation.

The casing 20 includes an outer wall plate 26 and a rear diaphragm 27, as in the tenth embodiment. At the center of the outer wall plate 26 is formed a rectangular low temperature side suction port 26a which sucks low temperature air (unclean external air containing foreign matter such as dust or moisture) into the low temperature side heat transfer space 18. do. On the upper side of the outer wall plate 26, two rectangular low temperature side outlets 26b for discharging low temperature air to the outside through the centrifugal blower 21 are formed.

On the upper side of the rear diaphragm 27, a rectangular high temperature side suction port 27a is formed which sucks hot air (clean air which does not contain foreign matter such as dust or moisture) into the high temperature side heat transfer space 17. On the lower side of the rear diaphragm 27, after cooling, the duct 27b for introducing hot air into the electronic component 11 through the lower centrifugal blower 22, and after cooling, the other lower centrifugal blower 22 A duct 27c for introducing hot air into the electronic component 12 through is connected to the lower side of the rear plate 27 by spot welding or other suitable means. Ducts 27b and 27c are respectively integrally connected to the scrubbing casings of the two centrifugal blowers 22.

The high temperature side heat exchanger 3a includes a plurality of cooling tubes 4a, a high temperature side upper tank 41a, a high temperature side lower tank 42a, an adjacent cooling tube 4a, and a heat receiving fin 6a inserted therebetween, And a multiple flow path type heat exchanger (inside heat exchanger) including a side plate. Since the high temperature side heat exchanger 3a is disposed in the high temperature side heat transfer space 17 sealed from the outside by the housing 13, the high temperature side heat exchanger 3a is exposed to external air containing foreign matter such as dust or moisture. There is no fear of becoming.

The low temperature side heat exchanger 3b includes a plurality of cooling tubes 4b, a low temperature side upper tank 41b, a low temperature side lower tank 42b, a heat dissipation fin 6b inserted between adjacent cooling tubes 4b, and a side plate. A multiple flow path type heat exchanger (external heat exchanger) including a 37b. The heat exchanger 3b is arranged to be located substantially on the same plane as the hot side heat exchanger 3a in the low temperature side heat transfer space 18 exposed to the outside air containing foreign matter such as dust or moisture. The low temperature side lower tank 42b may be inclined so that the lower side of the second connecting pipe 9b is positioned.

The first connecting pipe 9a is a metal pipe made of the same metal material as the cooling pipe 4 and having a circular cross section. The connecting pipe 9a communicates between the high temperature side upper tank 41a disposed at the upper end of the boiling part 7 and the low temperature side upper tank 41b disposed at the upper end of the condensation part 8. The connecting pipe 9a is a hot-low temperature guide means for introducing the evaporative refrigerant into the condensation section 8 in the boiling section 7.

The second connecting pipe 9b is a metal pipe made of the same metal material as the first connecting pipe and having a circular cross section. The connecting pipe 9b communicates between the low temperature side bottom tank 42b located at the bottom of the condensation part 8 and the high temperature side bottom tank 42a located at the bottom of the boiling part 7. The connecting pipe 9b is a low temperature and high temperature guide means for introducing the liquid refrigerant condensed in the condensation part 8 into the boiling part 7.

The effects of the present embodiment will be described below.

The cooling device 14 according to the present embodiment includes a boiling unit 7 and a condensation unit 8, which are annularly interconnected through the first and second connecting pipes 9a and 9b, respectively. The heat exchanger, which is arranged in multiple layers in this air flow direction, is equipped.

With the above structure, the refrigerant circulation flow is formed in each cooling unit 3, and collision between the evaporative refrigerant (boiling refrigerant) and the liquid refrigerant (condensate) can be prevented. As a result, the heat dissipation performance (cooling performance) of each cooling unit 3 can be significantly improved than in the tenth embodiment. By arranging the cooling units 3 in plural layers, the heat dissipation performance (cooling performance) of the heat exchanger 25 can be further improved as compared with the tenth embodiment.

(Twelfth embodiment)

A twelfth embodiment of the present invention will be described with reference to Figs.

37 shows a heat exchanger built in the cooling device, and FIGS. 38 and 39 show a sealing structure for the heat exchanger.

In this embodiment, the heat exchanger 25 comprises a cooling unit 3 arranged in plural (three) layers in the air flow direction. The cooling unit 3 comprises the boiling part 7 and the condensation part 8 described above in the eleventh embodiment, the boiling part and the condensing part having two connecting tubes 9a extending through the fluid separation plate 2. Through 9b). The fluid separation plate 2 has a square or elliptical through hole 38 formed at two positions through which the three connecting tubes 9a and the three connecting tubes 9b of the heat exchanger 25 respectively pass.

In each cooling unit 3 in this embodiment compared with the eleventh embodiment, the high temperature side heat exchanger 3a and the low temperature side heat exchanger 3b are mutually positioned on both sides (left and right side in the figure) on substantially the same plane. It is replaced. Further, in these alternately displaced portions (positions having changed positions), first and second connecting pipes 9a and 9b which annularly connect the hot and cold side heat exchange parts 3a and 3b to each other for circulation of the refrigerant are provided. Is placed.

In this embodiment, the milling structures for the six connectors 9a, 9b and the fluid separator 2 are interposed therebetween to seal between the fluid separator 2 and the six connectors 9a, 9b. Mounted split packing 51 and sealing materials 52, 53.

The split packing 51 is each comprised by the half split which formed with elastic materials, such as artificial rubber, for example. Each split packing 51 extends through a combination through hole 38 formed in the fluid separation plate 2 and is supported by an edge 39 of the through hole 38. Half of the split remains tightly overlapped with the three connectors 9a or 9b sealed. On the opposite side of the split half, a connector insert recess 43 is formed which receives three connectors 9a or 9b therein, while on the outer circumferential surface of each split half, a fluid separation plate 2 is provided. A fluid separator insertion slot 44 is formed to receive the edge 39 of the formed combination through hole 38.

Sealing material 52 is an elastic material such as silicone type rubber and seals the gap between split packing 51 combined with three connectors 9a or 9b. The sealing material 53 is the same elastic material as the sealing material 52 and seals the gap between the fluid separation plate and the three connecting pipes 9a or 9b.

Hereinafter, effects will be described in the present embodiment.

In this embodiment, the three connecting tubes 9a and 9b are sealed by the combined split packing 51. Due to the edge 39 of the through hole 38 of the fluid separation plate 2 fitted into the separation plate insertion slot 44 of the split packing 51, the fluid separation plate 2 and the three connecting tubes 9a. , 9b) is reliably sealed by sealing members 52 and 53 applied around the connecting pipe and around the split packing.

In the case of the heat exchanger 25 including three cooling units 3, the connecting pipes 9a and 9b are close to each other, so that the sealing operation is not easy. However, by adopting the sealing structure as in the twelfth embodiment, the working efficiency in the process for sealing between the connecting pipes 9a and 9b and the fluid separation plate 2 can be improved and a suitable sealing can be achieved.

In the present embodiment, in particular, the hot and cold side heat exchange parts 3a, 3b are mutually displaced on both sides of the same plane, and the first and second connection pipes for connecting both heat exchange parts 3a, 3b ( 9a, 9b) are disposed at these alternating positions. As a result, compared with the eleventh embodiment in which the first and second connecting pipes 9a, 9b are arranged to protrude from both sides (left and right in the figure) of each cooling unit 3, the tube protrusions are no longer needed. The transverse size of the cooling unit 3 may be shortened by an amount corresponding to the projecting space of the first connecting pipe 9a which is a dead space. Therefore, the whole cooling apparatus 14 equipped with the small cooling unit 3 becomes further downsized.

(Thirteenth Embodiment)

40 and 41, a thirteenth embodiment of the present invention will be described.

Fig. 40 shows the structure of the cooling device specially incorporated in the electronic device, and Fig. 41 shows the main structure of the fluid separation plate in the heat exchanger.

In the cooling device 14 of the present embodiment, the fluid separation plate 2 of the heat exchanger 25 equipped with a plurality of layers of cooling units 3 is connected to the acceleration accelerator for promoting heat exchange between hot air and cold air. 10). The heat transfer accelerator 10 is disposed at a separation position for separating between the cold air downstream of the heat exchanger 25 (rear airflow) and the hot air upstream of the heat exchanger. The heat transfer accelerator 10 includes a plurality of uneven parts formed by a plurality of rows vertically in the figure by pressing a flat metal plate. The concave-convex portions are shaped to alternately repeat the long ridges 61a and the long concave portions 61b in a direction perpendicular to the air flow direction.

The effects of the present embodiment will be described below.

In the case of this embodiment, since the heat transfer accelerator 10 including alternating recesses and projections is disposed at a separation position for separating between the cold air downstream side of the heat exchanger 25 and the hot air upstream side of the heat exchanger, the fluid separation plate (2) may be provided with a heat exchange function for hot air and cold air. Therefore, the fluid separation plate 2 can act to transfer the heat of the high temperature side air to the low temperature side air, thereby improving the thermal conductivity of the entire heat exchanger 25. In addition, since the cooling performance for hot air can be improved, the entire cooling device 14 equipped with the heat exchanger can be miniaturized.

(Example 14)

A fourteenth embodiment of the present invention will be described with reference to FIG. Fig. 42 shows the structure of a cooling device specially embedded in the electronic device, and Fig. 43 shows the main structure of the fluid separation plate in the heat exchanger.

In the cooling device 14 according to the present embodiment, the heat transfer accelerator 10 is provided at the same position as that of the thirteenth embodiment, that is, at the separation position of the fluid separation plate 2 of the heat exchanger 25. The heat exchange accelerator 10 includes a plurality of circular recesses 62 formed in a plurality of rows by press molding a flat metal plate. Further, in the fourteenth embodiment, as in the thirteenth embodiment, heat transfer between the hot air and the cold air is promoted. In this case, the heat dissipation performance (cooling performance) for the hot air can be improved, and it is possible to obtain the same action and effect as in the thirteenth embodiment.

(Example 15)

A fifteenth embodiment of the present invention will be described with reference to 44th and 45th.

Fig. 44 shows the structure of a cooling device specially embedded in the electronic device, and Fig. 45 shows the main structure of the fluid separation plate in the heat exchanger.

In the cooling apparatus according to this embodiment, the heat transfer accelerator 10 is provided at the same position as in the thirteenth embodiment, that is, at the separation position of the fluid separation plate 2 of the heat exchanger 25. In the heat transfer accelerator 10, an uneven metal plate 65a having alternately repeated recesses 63a and convex portions 64b is connected to the hot air side of the fluid separation plate 2 by spot welding or other suitable means. , The requesting metal plate 65b having alternately repeated recesses 63b and convex portions 64a is connected to the cold air side of the fluid separation plate 2 by spot welding, for example. Further, in the fifteenth embodiment, as in the thirteenth embodiment, heat transfer between the hot air and the cold air is promoted. In this case, the heat radiation performance for the hot air can be improved.

Hereinafter, modified examples of the tenth to fifteenth embodiments will be described. The cooling device 14 equipped with the heat exchanger according to each of the tenth to fifteenth embodiments is used when a heating element such as, for example, the electronic parts 11 and 12 needs to be accommodated in a sealed space. do. If the heating element needs to be contained within a confined space, the heating element is used under harsh conditions including oil, moisture, iron, corrosive gas, etc., or when an inert gas such as helium gas or argon gas is shorted out. Used when used to prevent sparking or oxidation at the point of contact, or when there is a need to prevent leakage of gases harmful to the human body (eg, hydrogen-based fluorides obtained by decomposition of fluorocarbons). do.

In the above embodiment, a corrugated fin-tube type multi-flow type heat exchanger was used as each cooling unit 3, the hot side heat exchanger 3a and the cold side heat exchanger 3b, but the same For the purpose, a thin fin-tube type heat exchanger, a plate-shaped fin-tube type heat exchanger, an S-curve type heat exchanger configured by bending flat tubes into corrugations, or by stacking two press-formed sheets A draw-cup type heat exchanger comprising a plurality of stacked cooling tubes each constructed may be used. As the heat sink fins 6a and the heat sink fins 6b, slit fins or louver fins may be used.

In the above embodiment, although hot air heated by heating elements such as the electronic components 11 and 12 has been used as the hot fluid (inner fluid) in the housing 13, for example, cooling water for cooling the heating element or Cooling oils (hydraulic and lubricating oils) may be used as the hot fluid. In the same way, not only gases such as cold air, but also liquids such as cold water or oil can be used as external fluid (external air) outside the housing 13. In this case, a pump can be used as the inner fluid circulation means and the low temperature fluid generating means.

As means for operating the pumps and centrifugal fans 31 and 43, not only the electric motors 32 and 35 as in the above embodiments, but also internal combustion engines, water wheels, windmills may be used.

(Example 16)

Hereinafter, with reference to the drawings, a sixteenth embodiment having a device for controlling the temperature in the closed body of the present invention embedded in the electronic device will be described. 46 shows the overall configuration of the electronic device.

The electronic device 1 is, for example, a wireless base station of a mobile wireless telephone such as a wireless telephone, an automobile telephone, etc., and has a housing 13 for hermetically receiving the electronic components 11 and 12 therein, and an electronic component 11. , 12) and a cooling device (cooler) 14 embedded in the housing 13 for cooling.

An electronic component is a heat generating element (for example, a semiconductor switching element constituting a high frequency switching circuit built in a transceiver) that performs a predetermined operation and generates heat when electricity is supplied. The electronic component 12 is a heating element (for example, a semiconductor amplifying element such as a power transistor built in a power amplifier) that performs a predetermined operation and generates heat when electricity is supplied.

The housing 13 is a closed body which seals the inside to be sealed from the outside and has a sealed space 15 formed therein. The enclosed space 15 is externally sealed to be completely sealed by a fluid separation plate of the cooling device 14 in order to prevent deterioration of electronic component performance due to deposition of foreign matter such as dust and moisture on the electronic components 11 and 12. It is isolated from.

The enclosed space 13 is an electronic component accommodating space 16 for accommodating the electronic components 11 and 12 therein by a fluid separation plate of the cooling apparatus 14 and a casing of the cooling apparatus 14, and an interior thereof. It is partitioned into the high temperature side heat transfer space 17 which is a passage. The flow path area of the high temperature side heat transfer space 17 is narrow on the upstream side to minimize the depth size (vertical size) of the chiller 14, while the flow path area of the space on the downstream side is wider. . In addition, the housing 13 is formed with a low temperature side heat transfer space 18 which is an outer passage sealed from the high temperature side heat transfer space 17 by a fluid separation plate.

46 to 49, the cooling device 14 will be described. 47 to 49 show a detailed configuration of the cooling device 14.

The cooling device 14 includes a casing 20 provided integrally with the housing 13 and a heat exchanger 21 for setting the air temperature in the sealed space 15 to a level no higher than an upper limit temperature (for example, 65 ° C.). ), Two lower-side centrifugal blowers 23 which generate an air flow of cold air (cold fluid), and maintain the air temperature in the enclosed space 15 not lower than the lower limit temperature (e.g., 0 ° C). Electrical device 24, controller 25 for controlling the supply of electricity for the electrical device of the cooling device 14 and the like.

The casing 20 includes an outer wall plate 26 disposed at the outermost side of the electronic device 1, a rear diaphragm 27 surrounding the high temperature side heat transfer space 17, and the like. These outer wall plates 26 and rear plates 27 are fixed to the housing 13 by, for example, spot welding or fastening means such as screws or bolts.

One rectangular low temperature side suction port 26a which sucks low temperature air (unclean external air containing foreign matter such as dust or water) from the outside into the low temperature side heat transfer space 18 toward the center of the outer wall plate 26. Is opened. Further, toward the upper side of the outer wall plate 26, the low temperature side discharge port 26b for discharging the low temperature air from the upper centrifugal blower 22 to the outside is opened.

Towards the upper side of the rear diaphragm 27, a rectangular high temperature that sucks hot air (clean air containing no foreign matter such as dust or water) from the electronic component accommodating space 16 into the high temperature side heat transfer space 17. The side suction opening 27a is opened. In addition, the upper portion of the rear diaphragm 27, the duct 27b for introducing the cooled hot air from the one lower centrifugal blower 23 to the electronic component 11 and the cooled hot air for the other lower centrifugal blower ( The duct 27c flowing into the electronic component 12 in 23 is joined by means such as spot welding. The duct 27b and the duct 27c are respectively integrally connected to the scroll casing 36 of the two lower centrifugal blowers 23.

46 to 51, the heat exchanger 21 will be described in detail. 50 shows a detailed structure of the cooling unit, and FIG. 51 shows a schematic structure of the cooling unit.

The heat exchanger 21 seals and separates the hot air, which is the internal air (inside air) circulating in the housing 13, with the low temperature air, which is the outside air (outside air), circulated outside the housing 13. 2) and a plurality of layers (three layers) of cooling units 3 embedded in the fluid separation plate 2 in a state extending through the fluid separation plate 2.

The fluid separation plate 2 includes one wall surface of the housing 13 constituting one wall surface of the sealed space 15 having a high temperature inside and one wall surface of the low temperature heat transfer space 18 having a low temperature inside. The fluid separation plate 2 is made of a metal having excellent thermal conductivity such as aluminum, and is sealed between the sealed space 15 including the high temperature side heat transfer space 17 and the outer side including the low temperature side heat transfer space 18. It is soldered integrally with the cooling unit 3 and the casing 20 so as to divide. In the fluid separation plate 2, a plurality of elongated rectangular or elliptical through-holes, through which the connection pipe of the cooling unit 3 extends (described later), are drilled at predetermined intervals. The fluid separation plate 2 is also a separation element (eg a split plate).

The cooling unit 3 is a low temperature side heat exchanger (external air side heat exchanger) having a plurality of layers (three layers) inside the casing 20 in a state inclined at a predetermined angle and filled with a fluorine type or a freon type refrigerant. It is divided into a side heat exchanger (internal air side heat exchanger), and the high temperature side heat exchanger and the low temperature side heat exchanger 3a, 3b are connected by first and second connecting pipes 9a, 9b through which the refrigerant circulates.

The high temperature side heat exchanger 3a includes a plurality of cooling tubes 4a, a high temperature side upper tank 28a, a high temperature side lower tank 29a, and a heat receiving fin 6a inserted between adjacent cooling tubes 4a. It is an internal heat exchanger which is a multi-flow type heat exchanger. On the opposite side of the high temperature side heat exchanger 3a, the fastening means acts to be fixed to the fluid separation plate 2 and the casing 20, and to reinforce the plurality of cooling tubes 4a and the plurality of heat receiving fins 6a. The acting side plate 30a is joined. Since the high temperature side heat exchanger 3a is disposed in the high temperature side heat transfer space 17 sealed from the outside by the housing 13, the high temperature side heat exchanger 3a is exposed to external air containing foreign matter such as dust or water. There is no possibility to be.

The plurality of cooling tubes 4a are metal materials having excellent thermal conductivity, such as aluminum or copper, and are made of flat tubes (e.g., 1.7 in width and 16.00 mm in length) having an elongated rectangular shape or an elliptical cross section. . The high temperature side heat exchanger 3a formed by these cooling tubes 4a is configured as a refrigerant tank (boiling part) 7 in which a refrigerant sealed therein receives heat from hot air, boils, and evaporates.

The hot side top tank 28a and hot side bottom tank 29a comprise a core plate provided in the cooling conduit 4a and a generally inverted U-shaped tank plate joined to the core plate. The hot side top tank 28a or the cold side bottom tank 29a is provided with only one refrigerant opening (not shown) for enclosing the refrigerant into the cooling unit 3. The coolant is sealed at a speed of each cooling tube 4 of the high temperature side heat exchanger 3a to a height corresponding to the upper position of the cooling tube 4a, that is, to the height of the boiling section 7. The coolant is sealed after the heat receiving fins 6a are soldered to the cooling tube 4a.

The heat receiving fins 6a are corrugated fins formed by bending a thin plate (for example, a plate thickness of about 0.02 to 0.05 mm) formed of a metal material having excellent thermal conductivity such as aluminum, and bent in a wave shape. It is soldered to the flat outer wall surface of the cooling tube 4a. That is, soldering is performed in a state in which the cooling tube 4a and the heat receiving fins 6a are molten.

The low temperature side heat exchanger 3b includes a plurality of cooling tubes 4b, a low temperature side bottom tank 29b, a heat dissipation fin 6b inserted between the adjacent cooling tubes 4b, and a side plate 30b. External heat exchanger, which is a flow path type heat exchanger. The low temperature side heat exchanger 3b is disposed in the same plane as the high temperature side heat exchanger 3a in the low temperature side heat transfer space 18 exposed to foreign matter such as dust or water. The plurality of cooling tubes 4b are formed to have the same shape as the cooling tubes 4a. The low temperature side heat exchanger 3b including these cooling sections 4b is configured as an evaporative refrigerant tank (condensation section) in which the evaporative refrigerant boiled in the boiling section 7 is condensed and liquefied by releasing heat into the low temperature air.

The cold side top tank 28b and cold side bottom tank 29b comprise a core plate similar to the hot side top tank 28a and the hot side bottom tank 29a and a generally inverted U-shaped tank plate.

The heat dissipation fin 6b is a corrugated tube formed in a shape similar to the heat sink fin 6a, and is soldered to the flat outer wall surface of the heat dissipation tube 4b. That is, soldering is performed in a state where the outer wall surface of the cooling tube 4b and the heat dissipation fins 6b are melted.

The first connecting tube 9a is a metal tube formed of the same metal material as the cooling tube 4b so as to have a circular cross section, and the hot side upper tank 28a and the condensation portion 8 provided at the upper end of the boiling portion 7. It is in communication with the cold side top tank 28b provided at the top of the. The connecting pipe 9a is a high temperature-low temperature guide means for introducing the evaporative refrigerant boiled and evaporated in the boiling portion 7 into the condensation portion 8.

The second connecting pipe 9b is a metal pipe formed of the same metal material as the first connecting pipe 9a to have a circular cross section, and the low temperature side lower tank 29b and the boiling part 7 provided at the lower end of the condensation part 8. Is in communication with the high temperature side bottom tank 29a provided at the lower end of the " The connecting pipe 9b is a low-temperature high-temperature guide means for introducing the evaporative refrigerant condensed in the condensation section 8 into the boiling section 7.

The two upper centrifugal blowers 22 are a centrifugal fan 31 which generates air flow in the low temperature side heat transfer space 18, an electric motor 32 for rotating the centrifugal fan 31, and a centrifugal fan. And a scroll casing 33 for rotatably accommodating the 31.

The two lower centrifugal blowers 23 are a centrifugal fan 34 which generates air flow in the hot side heat transfer space 17, an electric motor 35 for rotating the centrifugal fan 34, and a centrifugal fan. Scroll casings 36 for rotatably receiving 34, respectively.

46, 47, and 53 to 55, the electric heater device 24 will be described in detail. 52 and 53 show the detailed structure of the electric heater apparatus 24. As shown in FIG.

The electric heater device 24 includes a detachable electric heater 5 and a heater mounting device 6 for fixing the electric heater 5 through openings (not shown) provided on the side from one side of the casing 20. Include. The opening is opened and closed by a hatch 20a indicated by the dashed dashed line in FIG.

The electric heater 5 is arranged in the flow direction of hot air on the downstream side of the high temperature side heat exchanger 3a of the cooling unit 3 in the high temperature side heat transfer space 17 of the housing 13. The electric heater 5 is for heating the air flowing through the high temperature side heat transfer space 17 so that the temperature in the sealed space 15 is higher than the lower limit temperature. This is because when the temperature in the sealed space 15 of the housing 13 is lower than the lower limit temperature (for example, 0 ° C.), the performance of the electrical components (for example, semiconductor elements) 11 and 12 is lowered. Because. The electric heater 5 in this embodiment has a heat quantity of 1,2 kW, for example.

As shown in Fig. 54A, the electric heater 5 includes four heater bodies 53, 54, 55, 56 suspended between a pair of support plates 51, 52 facing each other, two heater bodies 53, 54. A plurality of plate-like fins (heat radiating fins) 57 provided in 54, a plurality of plate-like fins (heat radiating fins) 58 provided in two heater bodies 55 and 56, and a front flange 59 fixed to one support plate 51. ), And a rear flange 60 fixed to the other support plate 51.

In the case of the two heater bodies 53, 54, for example, a sheath heater is used. The heater terminal on one side is connected to the controller 25 by a conducting wire, and the heater terminal on the other side connects the two main bodies.

In the case of the two heater bodies 55, 56, for example, a seed heater similar to the two heater bodies 53, 54 is used. The heater terminal on one side is connected to the controller 25 by a conductor, and the heater terminal on the other side connects the two main bodies.

The plurality of plate fins 57 and 58 act as heat radiating fins. A plurality of thin plates (for example, about 0.02 to 0.5 mm in thickness) made of a metal material having excellent thermal conductivity such as aluminum are arranged at intervals of a fine pin pitch (for example, 5 mm), so that the four heater bodies 53, The heat generated in the 54, 55, 56 is discharged to the space circulating in the closed space (15).

The front flange 59 is formed of a substantially rigid flat plate made of a metal material of high rigidity, and the casing 20 is used to hold and fix one end (open end) of the four heater bodies 53, 54, 55, and 56. It is provided on the open side. The flange 59 acts as a front mounting stay for connecting to the heater mounting device 6.

The front flange 59 is fixed using fastening means 61 such as two screws, nuts and the like in close contact with one support plate 51. In the part which protruded outward from the support plate 51 of the front flange 59, the front recessed part 62 on the semicircle which is a recessed part by the side of the opening part fitted to the heater mounting apparatus 6 is formed. In addition, the front flange 59 is provided with an internal thread life 66 that engages a fastening means 63, such as a screw, which is a fastening means in a generally semicircular portion projecting downward as shown in Fig. 54B.

The rear flange 60 is formed to have the same shape with the same material as the front flange 59 and is disposed to face the front flange 59 on the opposite side (deep side) with respect to the open side of the casing 20. The rear flange 6 holds and fixes the other ends (rear ends) of the four heater bodies 53 and 56. The flange 60 acts as a rear mounting stay for connecting to the heater mounting device 6.

The rear flange 60 is fastened and fixed using fastening means 64 such as two screws while being in intimate contact with the other support plate 52. In the portion projecting outward from the support plate 51 of the rear flange 60, the rear recess 65 on the semicircle to be fitted to the heater mounting apparatus 6 is formed. The rear flange 60 has a round hole portion (engagement portion) corresponding to the internal screw hole portion of the front flange 59.

The heater mounting device 6 is provided integrally with the casing 20 and slides the rear surfaces of the flanges 59 and 60 so as to slidably axially slide the rear flanges 59 and 60 and a pair of fronts of the electric device. It has a guide shaft 73 suspended between the front and rear brackets 71 and 72 of the pair of front and rear brackets 71 and 72 of the electric heater 5 for holding and fixing.

The front bracket 71 is a metal material having high rigidity and is generally formed to have an L-shape, and the connecting plate 74 having a flat plate shape connected to the inner surface of the outer wall plate 26 of the casing 20 by means of spot welding or the like. Has

The binding plate 75 is formed with an internal threaded hole into which the fastening means 63 such as a screw is inserted. In this case, the binding plate 75 uses the fastening means 63 such as a screw to fix the front flange 59 so that the binding plate 75 is perpendicular to the horizontal direction parallel to the axial direction of the guide shaft 73 and perpendicular to the horizontal direction described above. It acts as a papermaking means for restraining (papermaking) the movement of the front flange 59 (electric heater 5) in the direction. In addition, the binding plate 75 supports the guide shaft 73 by connecting the guide shaft 73 by means such as spot welding while the end of the guide shaft 73 passes.

The rear bracket 72 is formed to have the same shape with the same material as the front bracket 71 and has a flat plate-shaped connecting plate 77 and a binding plate 78 bent in a direction perpendicular to the connecting plate 77. Has

The binding plate 78 is firmly fixed in a state in which a single pin (protrusion, engaging portion) 79 protrudes inward. In this case, the binding plate 78 has the rear surface in the horizontal direction parallel to the axial direction of the guide shaft 73 and perpendicular to the horizontal direction, with the pin 79 fitted into the round hole of the rear flange 60. It acts as a deterrent means for restraining (constraining) the movement of the flange 60 (electric heater 5). The end of the guide shaft 73 is connected to and supported by the binding plate 78 by means such as spot welding.

The guide shaft 73 is a metal shaft formed to have a circular or cylindrical cross section, as shown in Fig. 55A. The guide shaft 73 is for guiding the electric heater 5 between the mounting position and the opening when the electric heater 5 is detached.

The front concave portion 62 formed on the front flange 59 is slidably fitted in the guide shaft 73, and the rear concave portion 65 formed on the rear flange 60 is slidably fitted in the axial direction. Lose. In this way, when the electric heater 5 is mounted to the heater firewood apparatus 6, the guide shaft 73 is provided with front and rear flanges 59, in a direction perpendicular to the horizontal direction horizontal to the axial direction of the guide shaft. 60) acts as a restraining means for restraining (restraining) the movement of the electric heater 5.

The controller 25 is a thermal sensing element such as an electric motor 32 for two upper centrifugal blowers 22, an electric motor 35 for two lower centrifugal blowers 23, and a dummyistor. Of the cooling device 14 such as the electric heater 5 (four heater bodies 53, 54, 55, 56) operated based on the temperature in the enclosed space 15 detected by the formed temperature sensor 9. To control the electrical device.

When the temperature in the enclosed space 15 is higher than the lower limit temperature (for example, 0 ° C.), the controller 25 sets the two upper centrifugal blowers 22 and the two lower centrifugal blowers 23 Hi (a large amount of airflow). ) Or Lo mode, and turns off the electric heater (5). In addition, when the temperature in the enclosed space 15 is lower than the lower limit temperature (for example, 0 ° C), the controller 25 turns off the electric motor 32 for the two upper centrifugal blowers 22, The electric motors 35 for the two lower centrifugal blowers 23 are operated in Hi (large air flow) or Lo (small air flow) mode, and the electric heater 5 is turned on.

47 and 52 to 55, a method for mounting the electric heater 5 to the heater mounting apparatus 6 according to the present invention will be described.

When the electric heater 5 is mounted to the heater mounting apparatus 6, first, the hatch 20a is first opened so that an opening provided on one side of the casing 20 opens. In the heater mounting apparatus 6, the connecting plates 74 and 77 of the front and rear brackets 71 and 72 having the guide shafts 73 are made of the outer wall plate 26 of the casing 20 by means such as spot welding. ) Is fixed to the inner surface.

Next, as shown in FIG. 54A, an electric heater 5 having a component built therein is inserted from the opening in the direction as indicated by the solid line shown in FIG. At this time, the front and rear recesses 62 and 65 of the pair of front and rear flanges 59 and 60 of the electric heater 5 are fitted to the guide shaft 73, and in this state, the electric heater 5 Is inserted along the guide shaft 73 in the direction indicated by the solid line shown in FIG. In this case, even if the weight of the electric heater 5 is heavy, an operator can insert the electric heater 5 with one hand.

Then, when the rear flange 60 comes into contact with the rear bracket 72, the insertion work for the electric heater 5 is completed. Thereafter, the near hole 80 of the rear flange 60 is inserted into the pin 79 fixed to the rear bracket 72, and the rear flange 60 is a horizontal plane parallel to the axial direction of the guide shaft 73. Constrained to the rear bracket 72, in a plane perpendicular to the horizontal direction.

Subsequently, the inner threaded hole 76 of the front bracket 71 is fitted into the inner threaded hole 66 of the front flange 59, and the operator puts one hand into the opening of the hatch 20a, such as a screw. The fastening means 63 are inserted into both inner holes 76 and tightened. In this case, the front flange 59 is constrained to the front bracket 71 in a horizontal plane parallel to the guide shaft 73 and is fixed in a vertical plane with respect to the horizontal direction. From the foregoing description, the mounting work of the electric heater 5 to the heater mounting apparatus provided integrally with the housing 13 (casing 20) is completed.

52 to 55, a description will be given of a method for separating the electric heater 5 from the heater mounting apparatus 6.

When the electric heater 5 is detached from the heater mounting apparatus 6, the work is performed in the reverse order to the mounting work. That is, the operator inserts one hand into the opening of the hatch 20a, removes the fastening means 63 such as a screw, and releases the fixation to the front flange by the front bracket 71, and the pin 79 and the round hole part. Release the restraint between (80) to remove the rear flange (60) from the rear bracket (72).

Subsequently, the electric heater 5 is separated along the guide shaft 73 in the direction opposite to the mounting operation of the electric heater 5. At this time, the front and rear recesses 62 and 65 of the pair of front and rear flanges 59 and 60 can be pulled out in a state of being fitted to the guide shaft 73, and thus, the electric heater 5 Even if the weight is heavy, the worker can pull out the electric heater 5 with one hand. In the foregoing description, the operation of removing the electric heater 5 from the heater mounting apparatus 6 is completed.

46 to 51, the operation of the cooling device 14 according to the present embodiment will be briefly described.

When the temperature in the enclosed space 15 of the housing 13 is higher than the lower limit temperature (for example, 0 ° C.), the electric muffler 32 for the two upper centrifugal blowers 22 and the two lower centrifugal blowers 23. The electric supply to the electric motor 35 is started, and the centrifugal fans 31 and 34 start to operate. In this case, the flow of hot air (clean internal air that does not contain foreign substances such as dust or water) circulates in the enclosed space 15 (high temperature side heat transfer space 17) in the housing 13. In addition, a flow of low temperature air (unclean external air containing foreign matter such as dust or water) circulates in the low temperature side heat transfer space 18 outside the housing 13.

In the cooling unit 3 mounted in the state of penetrating the fluid separation plate 2 of the housing 13, the refrigerant encapsulated in each cooling tube 4a of the high temperature side heat exchanger 3a is shown in FIG. As described above, the heat transmitted by the hot air through the heat receiving fins 6a is received, boiled and evaporated. The evaporative refrigerant passes through the high temperature side top tank 28a and the first connection pipe 9a, and is liquefied to condense on the inner wall surface of the condensation unit 8 provided to the low temperature side heat exchanger exposed to low temperature air. It is transmitted to the low temperature air through the heat radiation fin (6b).

The refrigerant condensed and liquefied by the condensation unit 8 is moved to the inner wall surface of each cooling tube 4b due to its own weight, and is moved to the low temperature side lower tank 29b and the second connection tube 9b so that the high temperature side heat exchanger 3a ) To the boiling section 7 provided. As described above, the refrigerant sealed in the cooling tubes 4a and 4b alternately repeats boiling (evaporation) and condensation (liquefaction). In this case, the heat of the hot air is moved to the low temperature air, and the heat generated from the electronic components 11 and 12 can be radiated by the multi-layer cooling unit 3.

Accordingly, the electronic components 11 and 12 circulate in the hot air (clean air in the housing 13) and the cold air circulated in the low temperature side heat transfer space 18 of the sealed space 15. It can be cooled without mixing (unclean air outside the housing 13).

When the temperature in the enclosed space 15 of the housing 13 is lower than the lower limit temperature (for example, 0 ° C.), electricity is supplied to the electric heater 5 and prevents malfunction of the electronic components 11 and 12. In order to heat the air flowing through the high temperature side heat transfer space (17). At this time, the two upper centrifugal blowers 22 remain stationary.

Meanwhile, the hot air in the sealed space 15 of the housing 13 is formed in the electronic part accommodating space 16 for accommodating the electronic parts 11 and 12 therein and in the rear diaphragm 27 of the casing 20. It flows into the cooling apparatus 14 from the high temperature suction port 27a. The hot air flowing in the cooling device 14 passes through the narrow passage surrounded by the fluid separation plate 2 and the rear diaphragm 27 and then through the hot side heat exchanger 3a. That is, hot air passes between the plurality of cooling tubes 4a, and heat is received by the heat receiving fins 6a.

When hot air flows through a narrow flow path, the flow rate of the hot air increases. When the electric heater 5 provided with a plurality of plate fins 57 and 58 having a fine pin pitch is installed in a narrow flow path, the pressure loss is increased to reduce the circulation amount of the hot air, and the The heat dissipation performance is lowered.

In order to overcome the above-mentioned difficulties, in the present embodiment, the electric heater 5 (electric heating device 24), as shown in FIG. 47, the high temperature side heat exchange of the cooling unit 3 through which the hot air circulates. It is provided in the downstream side of group 3a. In this case, the pressure loss in the sealed space 15 of the housing 13 (particularly, the high temperature side heat transfer space 17) can be greatly reduced.

The effects of the present embodiment will be described below.

As described above, in the present embodiment, a plurality of plate-shaped fins 57, 58 formed of a thin plate member are disposed in the electric heater 5 to secure a heat transfer area. However, because the pin pitch is extremely dense (fine), when the air flow rate is large, the pressure loss increases, the amount of circulating air in the ventilation system decreases, and the heat dissipation performance of the electric heater 5 decreases.

On the other hand, since the effective heat exchange area of the high temperature side heat exchanger 3a is large, the flow rate of the hot air is lowered on the downstream side of the high temperature side heat exchanger 3a. Therefore, in this embodiment, the electric heater 5 is installed downstream of the high temperature side heat exchanger 3a of the cooling unit 3 through which the hot air circulates. In this case, the pressure loss in the housing 13 (high temperature side heat transfer space 17 is greatly reduced to prevent the heat dissipation performance of the electric heater 5 from being lowered. In this way, the housing 13 is sealed. The temperature in space 15 can be maintained at an optimum value.

In addition, in this embodiment, the mounting operation for mounting the electric heater 5 to the heater mounting apparatus 6 and the separation operation for separating the electric heater 5 from the heater mounting apparatus 6 can be performed very simply. have. The pin 79 of the rear bracket of the heater mounting apparatus 6 is rounded to the round hole 80 of the rear flange 60 of the electric heater 5 so as to be constrained in the direction perpendicular to the axial direction of the guide side 73. Inserted, thereby providing a structure with excellent vibration resistance.

In the present embodiment, the cooling device 14 is provided with a heat exchanger 21 having a cooling unit 3 arranged in multiple layers in the air flow direction, and the high temperature side heat exchanger 3a forming the boiling portion 7. And the low temperature side heat exchanger 3b forming the condensation section 8 are annularly connected to the cooling unit by two first and second connecting tubes 9a and 9b. With the above configuration, a refrigerant circulation flow is formed in each cooling unit 3 to prevent a collision between the evaporative refrigerant (boiling vapor) and the liquid refrigerant (condensate), and thus, the heat dissipation performance of the single cooling unit 3 ( Improve cooling performance). Since the cooling unit 3 is arranged in a plurality of layers, the heat dissipation performance (cooling performance) of the cooling unit 3 of the heat exchange device 21 can be further improved.

Hereinafter, a modification of the sixteenth embodiment will be described.

The cooling device 14 provided with the heat exchange device 21 according to the present embodiment may be utilized when heat generating elements such as the electronic components 11 and 12 need to be accommodated in a sealed space. In cases where the heating element needs to be contained in a confined space, the heating element is used in an inert gas (helium gas, argon) when used in a poor use environment including, for example, oil, water, iron, corrosive gas, or the like. Gas, etc.) is used to prevent sparking and oxidation at the point of electrical short, or gas that is harmful to the human body (e.g., hydrogen-based fluoride decomposed from fluorocarbons) leaks to the outside. It includes a case to prevent.

In this embodiment, a multiple flow path tie heat exchanger having corrugated fin-tubes is used as the cooling unit 3, the hot side heat exchanger 3a and the cold side heat exchanger 3b; However, heat exchangers with plate-shaped fin-tubes, heat exchangers with thin pin-tubes, S-curve type heat exchangers with flat tubes bent in a zig-zag manner, and two press-formed plates A heat exchanger having a plurality of stacked cooling tubes connected to each other may be used as the cooling unit 30, the high temperature side heat exchanger 3a, and the low temperature side heat exchanger 3b.

Slit fins or louver fins may be used as the heat sink fins 6a or the heat sink fins 6b.

In this embodiment, hot gas such as hot air heated by heat generating elements such as the electronic components 11 and 12 is used as the air inside the housing 13. That is, hot fluid is used as the fluid (inner air) inside the casing; However, high temperature liquids such as coolant and oil (working oil and lubricating oil) for cooling heating elements such as the electronic components 11 and 12 can be used as the high temperature fluid. In the same way, low temperature gases such as low temperature air, as well as low temperature liquids such as water and oil may be used as low temperature fluid (external air), which is air outside the housing and fluid outside the casing. In this case, a pump is used as the inner fluid circulation means and the outer fluid circulation means. As means for operating the pumps and centrifugal fans 31 and 34, not only the electric motors 32 and 33, but also internal combustion engines, water wheels, windmills, etc. may be used as in this embodiment.

In the present embodiment, the electric heater 5 is used as an internal heater, but a fluid type heater core for transferring waste heat of the internal combustion engine and the heating portion to a fluid such as cooling water may be employed, and the fluid may be used with a high temperature fluid (inner fluid). Heat the hot fluid by heat exchange. A plurality of plate-like fins 57, 58 are used as heat radiation fins, but corrugated fins, fine fin fins, slit fins, louver fins, and the like may also be used as the radiation fins.

(Example 17)

A seventeenth embodiment in which a cooling device provided with a heat exchanger is incorporated in an electronic device will be described with reference to Figs.

56 is a diagram showing the overall configuration of an electronic device.

The electronic device 1 is a wireless base station of a mobile wireless telephone such as a cordless telephone, an automobile telephone, and the like, and includes a housing 13 for sealing the electronic components 11 and 12 therein and an electronic component 11 and 12. It includes a chiller (cooler) 14 embedded in the housing 13 for cooling.

The electronic component 11 is a heat generating element (for example, a semiconductor switching element constituting a high frequency switching circuit built in a transceiver) that performs a predetermined operation by electricity supply and generates heat. The electronic component 12 is a heating element (for example, a semiconductor amplification element such as a power transistor embedded in a power amplifier) that generates heat by performing a predetermined operation by supplying electricity.

The housing 13 for sealing the inside to be sealed from the outside defines an airtight space 15 therein. The sealed space 15 is completely formed by a fluid separation plate or the like of a cooling device, which will be described later, in order to prevent the performance of the electronic parts 11 and 12 from being degraded due to the deposition of dust or water in the electronic parts 11 and 12. Sealed and separated from the outside

The enclosed space 15 is an electronic component accommodating space 16 for accommodating the electronic components 11 and 12 therein and a high temperature side heat transfer space 17 that is an internal passage inside the casing by a fluid separation plate of the cooling device 14. ) And a casing of the cooling device 14. The flow path of the high temperature side heat transfer space 17 is narrowed on the upper side in order to minimize the depth size of the cooling device 14, while widening the flow path of the space on the lower side. In addition, the housing 13 forms a low temperature side heat transfer space 18 as an outer passage outside the casing sealed to be sealed from the high temperature side heat transfer space 17 by a fluid separation plate.

The cooling device 14 includes a casing 20 integrally provided in the housing 13, two upper centrifugal blowers 21 for generating an air flow of low temperature air (external fluid, low temperature fluid), and hot air (external fluid, high temperature). Two lower centrifugal blowers 22 which generate an air flow of fluid), an electric heater 23 which maintains the air temperature of the enclosed space 15 at a level not lower than the lower limit temperature (eg 0 ° C.), cooling A controller 24 for controlling the supply of electricity to the electrical device of the device 14, and a heat exchanger for maintaining the air in the enclosed space 15 at a level no higher than the upper limit temperature (e.g., 65 [deg.] C.) 25) and the like.

The casing 2 includes an outer wall plate 26 disposed on the outermost side of the electronic device 1 and a rear diaphragm 17 for enclosing the high temperature side heat transfer space 17. These outer wall plates 26 and rear plates 27 are joined to the housing 13, for example, by spot welding or by using fastening means such as screws.

The two upper centrifugal blowers 21 are a centrifugal fan 31 for generating air flow in the low-temperature heat transfer space 18, an electric motor 32 for rotating the centrifugal fan 31, and a centrifugal fan 31 therein. Scroll casing 33 for rotatably receiving.

The two lower centrifugal blowers 22 are a centrifugal fan 34 for generating air flow in the high temperature side heat transfer space 18, an electric motor 35 for rotating the centrifugal fan 34, and a centrifugal fan 34 therein. Scroll casing 36 for rotatably receiving.

Since the electric heater 23 deteriorates the performance of the electronic components (eg, semiconductors) 11 and 12 when the air temperature in the sealed space 15 is lower than the lower limit temperature (eg, 0 ° C.), Internal fluid heating means for heating the air flowing through the high temperature side heat transfer space such that the temperature in the sealed space 15 is higher than the lower limit temperature.

The controller 24 is for controlling electric devices such as the electric motor 32 of the two upper centrifugal blowers 21, the electric motor 35 of the two lower centrifugal blowers 22, and the electric heater 23.

The controller 24 has two upper centrifugal blowers 21 and two lower parts to turn off the electric heater 23 when the temperature of the enclosed space 15 is higher than the lower limit temperature (eg 0 ° C.). The centrifugal blower 22 is controlled to operate in Hi mode (large air capacity) and Lo mode (small air capacity). When the temperature of the enclosed space 15 is lower than the lower limit temperature (for example, 0 ° C.), the controller 24 turns off the electric motor 32 of the two upper centrifugal blowers 21 and the two lower parts. The electric motor 35 of the centrifugal blower 22 operates in the Hi mode or in the Lo mode to turn off the electric heater 23.

56 to 60, a heat exchanger 25 provided with a cooling unit will be described in detail. Fig. 57A shows a schematic configuration of the cooling device, Fig. 57B shows a heat exchanger having cooling units arranged in multiple layers, Fig. 58 shows a detailed configuration of the cooling unit, and Figs. 59 and 60 show the cooling unit 20. Figs. Represents a fluid separator to divide into two parts.

The heat exchanger 25 passes through the fluid separation plate 2 and the fluid separation plate 2 for sealing and isolating the internal air circulating in the housing 13 from the external air circulating outside the housing 13. The furnace fluid separation plate (2) includes a cooling unit (3) mounted in multiple (two) layers.

The fluid separation plate 2 includes one wall surface (part of the casing) of the housing 13 constituting one wall surface of the sealed space 15 having a high internal temperature, and a low temperature side heat transfer space 18 having a low internal temperature. Form one wall. The fluid separation plate 2 is formed of a thin plate made of a metal having excellent thermal conductivity such as aluminum, and seals the sealed space 15 including the high temperature side heat transfer space 17 from the outside including the low temperature side heat transfer space. It is soldered integrally with the casing 20 and the cooling unit 3 to define.

As shown in Fig. 59, the fluid separation plate 2 has a plurality of elongated rectangular or elliptical through-holes 38 (for example, 1.7 mm in width) through which the cooling tubes of the cooling unit 3 pass at predetermined intervals. , Length 16mm) is drilled. The fluid separation plate 2 may be a split plate (in this embodiment, divided into two pieces), as shown in FIG.

The cooling unit 3 is a multiple flow path type heat exchanger assembled in a plurality of layers while being inclined at a predetermined angle in the casing 20, and a plurality of cooling tubes 4 in which a fluorine type or a freon type refrigerant is encapsulated; And a pair of connecting tubes 5 in communication with the cooling tubes 4, and a plurality of heat transfer fins 6 mounted on the outside of the cooling tubes 4. Side plates 37 which act on both sides of the cooling unit 3 to fix the fluid separation plate 2 and the casing 20 by fastening means and to reinforce the plurality of cooling tubes and the plurality of heat transfer fins 6. ) And the fluid separation plate 2 are connected. The cooling unit 3 is arranged in multiple layers (for example, two layers) in the flow direction of hot air and cold air.

The plurality of cooling tubes 4 are formed of flat tubes having a long rectangular or elliptical cross section (eg, width: 1.7 mm, length: 16 mm) having excellent thermal conductivity such as aluminum or copper, and the fluid separation plate 2 It passes through the through hole 38 of the. The cooling unit 3 composed of these cooling tubes 4 includes a refrigerant tank (boiling portion) 7 and a fluid separation plate at one side (lower side in Fig. 58) disposed on the hot air side from the fluid separation plate 2. An evaporative refrigerant tank (condensation) on the other side (upper side in Fig. 58) disposed on the low temperature air side from (2). In the present embodiment, the boiling portion 7 and the condensation portion 8 have a width of 360 mm (size in the width direction), a height of 430 mm, and a thickness of 16 mm.

The connecting pipe 5 is connected to the upper end of the high temperature side tank 41 and the plurality of cooling pipes 4 (condensation part) 8 connected to the lower ends of the plurality of cooling pipes 4 (boiling part) 7. A low temperature side tank 42; These hot and cold side tanks 41 and 42 comprise a core plate provided on the side of the cooling tube 4 and a generally U-shaped tank plate connected to the core plate. The high temperature side tank 41 or the low temperature side tank 42 is provided with one refrigerant opening (not shown) for enclosing the refrigerant in the cooling unit 3. The refrigerant is enclosed in the cooling tube 4 of the cooling unit 3 to a height whose water level corresponds to the position of the fluid separation plate 2, that is, the height of the boiling portion 7. The coolant is sealed after the heat transfer fins 6 are soldered to the cooling tube 4. The hot side tank 41 need not be provided with the pin.

The heat transfer fins 6 are the heat receiving fins 6a inserted between the cooling tubes 4 adjacent to each other on the high temperature side (boiling portion) 7 of the cooling unit 3 and the low temperature side (condensation) of the cooling unit 3. And a heat dissipation fin 6b inserted between the cooling tubes 4 adjacent to each other in the section 8). The heat radiation fin 6b is a corrugated tube formed in a wave shape by alternately bending a thin plate (for example, having a thickness of about 0.02 to 0.5 mm) formed of a metal material having excellent thermal conductivity such as aluminum. That is, the outer wall surfaces of the cooling tube 4 and the heat dissipation fin 6 are connected in the molten state.

The heat receiving fins 6a are disposed below the fluid separation plate 2. Pin pitch P1 is 2.4 mm, for example, and pin width B1 is 16 mm, for example. The pin pitch P1 is, for example, preferably in the range of 1.5 mm to 2.9 mm, more preferably in the range of 2 mm to 2.5 mm. The heat dissipation fins 6b are disposed above the fluid separation plate 2. Pin pitch P2 is 3.75 mm, for example, and pin width B2 is 16 mm, for example. The pin pitch P2 is, for example, in the range of 3 mm to 4.5 mm, and more preferably 3.5 mm to 4 mm. That is, the cooling unit 3 has a pin pitch P1 of the heat receiving fins 6a which is smaller by, for example, about 50% to 65% than the fin pitch P2 of the heat radiating fins 6b.

In the heat exchanger 25, the cooling unit 3 is arranged in a plurality of layers in the flow direction of the high temperature and low temperature air, whereby hot air circulated in the high temperature side heat transfer space 17 of the sealed space 15 ( Clean air in the housing 13 and cold air circulating in the low temperature heat transfer space 18 (unclean air outside the housing 13) flow in opposite directions.

That is, in the heat exchanger 25 including the plurality of layers of cooling units 3, the lower end portion (boiling portion 7) of the cooling tube 4 of the second layer cooling unit 3 is an inlet for hot air. The lower left portion (boiling portion 7) of the cooling tube 4 of the first floor cooling unit 3 is the outlet of the hot air. Further, in the heat exchanger 25, the upper left portion (condensation portion 8) of the cooling tube 4 of the first layer cooling unit 3 is the inlet for hot air, and the second layer cooling unit 3 The right part of the upper end part (condensation part 8) of the cooling pipe 4 is an outlet of hot air.

57 and 58, the operation of the cooling device 14 provided with the heat exchanger 25 in which the cooling unit 3 of this embodiment is arranged in a plurality of layers so that hot air and low temperature air flow in opposite directions will be briefly described. do.

When the temperature in the enclosed space 15 in the housing 13 is higher than the lower limit temperature (eg 0 ° C.), the electricity is electric motor 32 of the two upper centrifugal blowers 21 and the two lower centrifugal blowers. The electric motor 35 of 22 is supplied, and the centrifugal blowers 31 and 34 start to operate. In this case, the flow of hot side air (clean internal air that does not contain foreign matter such as dust or water) circulates in the enclosed space 15 of the housing 13. In addition, the flow of low temperature side air (unclean external air containing foreign matter such as dust or water) circulates in the low temperature side heat transfer space 18 outside the housing 13.

In the cooling unit 3 mounted while penetrating the fluid separation plate 2 of the housing 13, the refrigerant encapsulated in the cooling tube 4 of the plurality of layers of cooling units 3 is shown in FIG. 57A. As described above, the heat transmitted from the hot air through the heat sink fins 6a is received, boiled and evaporated. The evaporative refrigerant is condensed and liquefied by contacting the inner wall surface in the condensation unit 8 provided at the upper end of the cooling unit 3, which is exposed to low temperature air, and the latent heat of condensation is transferred to the low temperature air through the heat radiation fins 6b. .

The refrigerant condensed and liquefied in the condensation unit 8 falls to the boiling portion 7 provided on the lower side of the cooling unit 3 along the inner wall surface of the cooling unit 4 by self weight, as shown in FIG. 57A. . As described above, by alternately repeating the evaporation, condensation and liquefaction of the refrigerant enclosed in the cooling tube 4 of the cooling unit 3, the heat of the hot side air moves to the low temperature air. In this case, heat generated in the electronic components 11 and 12 is radiated in the cooling unit 3 of the plurality of layers.

Accordingly, the electronic components 11 and 12 are disposed in the hot air circulating in the high temperature side heat transfer space 17 of the sealed space 15 (clean air in the housing 13) and the low temperature side heat transfer space 18. It can be cooled without mixing of circulating low temperature air (unclean air outside the housing 13).

In the cooling unit 3 of the present embodiment, since the fin pitch P1 of the heat receiving fin 6a is smaller than the fin pitch P2 of the heat radiating fin 6b, the cooling unit 3 moves downward from the fluid separation plate 2 in the plurality of cooling units 3. The effective heat exchange effective area of the boiling portion 7 which protrudes (protrudes into the housing 13) is effective of the condensation portion 8 which protrudes upward from the fluid separation plate 2 (protrudes out of the housing 13). Smaller than area; However, the boiling portion 7 can improve the heat exchange performance by a small amount of pin pitch, and even if the heat exchange effective area of the boiling portion 7 is small, the heat exchange performance is not lowered.

The effect of this embodiment is explained.

In the cooling unit 3 of the present embodiment, since the high temperature side is sealed and sealed by the housing 13 (fluid separation plate 2), the cooling tube 4 constituting the boiling portion 7 which does not cause flow disturbance is provided. The fin pitch P1 of the provided heat receiving fins 6a is earlier than the fin pitch P2 of the heat dissipation fins 6b provided in the cooling conduit 4 constituting the condensation unit 8 exposed to external air containing foreign substances such as water. It is set small.

In this way, the pin pitch P1 of the boiling part 7 is condensed compared with the case where the pin pitch on the high temperature side (inner air side) of the fluid separation plate 2 is the same as the pitch on the low temperature side (outer air side). It sets smaller than the pin pitch P2 of (8), and improves the cooling performance of hot air. Further, the vertical size of the heat sink fins 6a can be shorter than the heat sink fins 6b by the amount that the pin pitch P1 is reduced. In this case, the vertical size (heat dissipation effective area) of the boiling portion 7 of the plurality of cooling tubes 4 can be reduced, and the whole cooling unit 3 and the cooling device 14 can be downsized.

Features of the heat exchanger in which the cooling unit 3 is arranged in multiple layers in the flow direction of hot air and cold air will be described with reference to Figs. 61A and 61B.

61A and 6B show the temperature distribution in the flow passage direction of the refrigerant and the temperature distribution in the flow passage direction of the air when the cooling unit 3 is a single layer (one layer) and a plurality of layers (two layers). Each is a schematic diagram shown. In the above schematic, the ordinate represents the temperature (lower, upper temperature), and the abscissa represents the flow direction of the fluid (air).

In the case of a heat exchanger in which the cooling unit 3 is composed of a single layer (one layer), as shown in Fig. 51A, the low temperature air flows from the right side (shown) of the lower layer cooling unit (boiling portion 7). . After the temperature of the hot air is lowered as heat is released to the upper layer cooling unit (condensation part 8), the hot air (cooled hot air) flows out to the left side (shown) of the cooling unit 3. Further, in the case of the heat exchanger in which the cooling unit 3 is composed of a single layer (one layer), as shown in Fig. 61A, the low temperature air is shown on the left side of the cooling unit (condensing part 8) of the upper layer (as shown). ), The temperature of the hot air rises as heat is absorbed from the cooling unit, and the hot air flows out to the right side (shown) of the cooling unit 3.

Assuming that the temperature difference between the inlet air and the outlet air of the condensation unit 8 of the cooling unit 3 is ΔT1, the coolant encapsulated in the cooling unit 3 and the heat exchange medium heat-exchanged are air The cooling unit 3 is rapidly heated by the heat dissipation fins 6b, and the temperature of the cold air rises rapidly at the inlet; However, the low temperature air becomes saturated, whereby the temperature difference DELTA T (cooling performance) does not become very large.

On the other hand, in the case where the cooling unit 3 is a heat exchanger arranged in a plurality of layers (as in the seventeenth embodiment), as shown in Fig. 61B, heat exchange between the refrigerant and the air enclosed in the cooling unit 3 is carried out by air flow. In at least two layers in the direction. At this time, between the refrigerant encapsulated in the first cooling unit 3 and the refrigerant encapsulated in the second cooling unit 3 there is a temperature difference (temperature difference between the heat sink fins, temperature difference between the heat sink fins) indicated by broken lines, After reaching the saturation temperature in the middle of the condensation unit of the cooling unit 3 of the first layer, the temperature rises further near the inlet of the cooling unit 3 of the second layer, while as shown in Fig. 61B. After the hot air has reached the saturation temperature in the middle of the boiling section 7, the temperature is further lowered near the inlet of the cooling unit 3 of the first layer.

Therefore, in the case of the present embodiment (heat exchanger 25 having cooling unit 3 arranged in multiple layers), the temperature difference ΔT2 is the temperature in the case of heat exchanger provided with single-layer cooling unit 3. It can be set larger than the difference ΔT1, and as shown in Figs. 61A and 61B, the heat of the hot air can be radiated into the cold air so that the cooling performance of the hot air can be improved. In this case, since the cooling effect of the electronic components 11 and 12 can be improved, the electronic components 11 and 12 can operate stably. Further, in this embodiment, compared with the cooling unit having the same heat dissipation performance (cooling performance) as in the prior art, the heat exchange effective area (heat dissipation effective area) of the cooling unit 3 can be reduced, and therefore, a small heat exchanger The whole cooling device 14 provided in 25 can be downsized.

The heat exchanger 25 equipped with the cooling unit 3 is disposed so that hot air and cold air flow in opposite directions. Therefore, there is a difference in temperature between the temperature of the refrigerant encapsulated in the first cooling unit 3 (heat sink fin temperature, heat sink fin temperature) and the temperature of the refrigerant enclosed in the second cooling unit 3 (heat sink fin temperature, heat sink fin temperature). Since it is effectively provided, the temperature difference can be increased and decreased substantially efficiently by using the refrigerant, thereby reducing the temperature of the cold air and the hot air. In this case, it becomes possible to further improve the cooling performance and to downsize the whole cooling device 14.

In the present embodiment, two layers of cooling unit 3 are described, but it is necessary to increase the temperature difference between the boiling portion 7 of the heat exchanger 25 and the air inlet and air outlet of the condensation portion 8. If so, three or more layers may be employed, and their actions and effects are the same, and a description thereof will be omitted.

(Example 18)

An eighteenth embodiment of the present invention will be described with reference to Figs. 62 to 64 show a detailed configuration of a cooling device incorporated in an electronic device, FIG. 65 shows a detailed configuration of a cooling unit, and FIG. 66 shows a schematic structure of a heat exchanger in which a plurality of cooling units are arranged.

The cooling unit 3 constituting the heat exchanger 25 according to the present embodiment is mounted in a plurality of layers (three layers) in an inclined state at a predetermined angle in the casing, for example, a plurality of cooling tubes 4a. The low temperature side heat exchanger (outside air side heat exchanger) in which the high temperature side heat exchanger (internal air side heat exchanger) 3a and the plurality of cooling tubes 4b constituting the boiling portion 7 constitute the condensation unit 8. (3b) is divided into two parts. These hot and cold side heat exchangers 3a and 3b are connected by two first and second connecting tubes 9a and 9b through which the refrigerant is circulated.

The casing 20, like the seventeenth embodiment, includes an outer wall plate 26 and a rear partition plate 27 (rear diaphragm), and in the center portion of the outer wall plate 26, low temperature air (dust or water) is included. One rectangular low temperature side suction port 26a is opened to suck the unclean internal air from the outside into the low temperature side heat transfer space 18. On the upper side of the outer wall plate 26, two rectangular low temperature side outlets 26b for discharging low temperature air from the upper centrifugal blower 21 to the outside are opened.

On the other hand, the upper side of the rear partition plate 27 for sucking hot air (clean internal air containing no foreign matter such as dust or water) from the electronic component accommodating space 16 to the high temperature side heat transfer space 17. The high temperature side suction port 27a is opened. The lower side of the rear plate 27 (dividing plate) is a duct 27b for introducing cooled hot air from one lower centrifugal blower 22 to the electronic component 11 and another cooled lower centrifugal blower ( A duct 27c for entering the electronic component 12 in 22 is joined by means such as spot welding or the like. Ducts 27b and 27c are integrally connected with the scroll casing 36 for the two lower centrifugal blowers 22.

The high temperature side heat exchanger 3a includes a plurality of cooling tubes 4a, a high temperature side upper bank 41a, a high temperature side lower tank 42a, and a heat receiving fin 6a inserted between the cooling tubes 4a adjacent to each other. Plate 37a and the like. The high temperature side heat exchanger 3a is disposed in the high temperature side heat transfer space 17 sealed from the outside by the housing 13, and the high temperature side heat exchanger 3a is exposed to external air containing foreign matter such as dust or water. There is no possibility to be.

The low temperature side heat exchanger 3b includes a plurality of cooling tubes 4b, a low temperature side upper tank 41b, a low temperature side lower tank 42b, a heat radiation fin 6b inserted between adjacent cooling tubes 4b, and a side plate. (37b) and the like. The low temperature side heat exchanger 3b is arranged to be generally coplanar with the high temperature side heat exchanger 3a in the low temperature side heat transfer space 18 exposed to the outside air containing foreign substances such as dust or water. The low temperature side lower tank 42b may be inclined such that the second connecting pipe 9b side is positioned downward.

In the cooling unit 3 according to the present embodiment, the pin pitch P1 (for example, 1.5 mm to 2.9 mm, particularly preferably 2 mm to 2.5 mm) of the heat receiving fins 6a provided to the high temperature side heat exchanger 3a. In this embodiment, 2.4 mm is the pin pitch (for example, 3 mm-4 mm, especially preferably 3.5 mm-4 mm, this embodiment of the fin pitch P2 of the heat radiation fin 6 of the low temperature side heat exchanger 3b). In the example it is smaller than 3.75mm). That is, the cooling unit 3 is smaller by, for example, 50% to 65% than the fin pitch of the heat dissipation fins 6b.

The first connecting pipe 9a is a metal pipe made of the same metal as the cooling pipe 4 and is formed to have a circular cross section. The first connecting pipe 9a communicates the hot side upper tank 41a provided at the upper end of the boiling part 7 with the cold side upper tank provided at the upper end of the condensation part 8. The first connecting pipe 9a is a high-temperature low temperature guide means for introducing the evaporative refrigerant boiled and evaporated by the boiling portion 7 into the condensation portion 8.

The second connecting pipe 9b is a metal pipe made of the same metal material as the first connecting pipe 9a and is formed to have a circular cross section. The second connecting pipe 9b connects the cold storage lower tank 42b provided at the lower end of the condensation part 8 with the high temperature side lower tank provided at the lower end of the boiling part 7. The second connecting pipe 9b is a low-temperature guide means for introducing the liquid refrigerant condensed by the condensation part 8 into the boiling part 7.

The effects of the eighteenth embodiment of the present invention will be described below.

In this embodiment, when the pin pitch at the high temperature side (inner air side) of the fluid separation plate 2 is the same as the case where the pin pitch is at the low temperature side (outer air side), the fin pitch P1 of the high temperature side heat exchanger 3a is Since it is smaller than the fin pitch P2 of the low temperature side heat exchanger 3b, the cooling performance of hot air is improved, and the whole cooling unit 3 and the cooling apparatus 14 can be miniaturized.

In this embodiment, a cooling unit 3 having a boiling portion 7 and a condensation portion 8 annularly connected by two first and second connecting pipes 9a and 9b is arranged in multiple layers in the air flow direction. There is provided a chiller (14) provided with a heat exchanger (25). With the above configuration, the circulation flow of the refrigerant is formed in the cooling unit 3 to prevent a collision between the evaporative refrigerant (boiling vapor) and the liquid refrigerant (condensate). Therefore, the heat dissipation performance (cooling performance) of the single cooling unit 3 can be further improved as compared with the seventeenth embodiment. As described above, by arranging the cooling units 3 in a plurality of layers, the heat dissipation performance (cooling performance) of the heat exchanger 25 can be further improved as compared with the seventeenth embodiment.

(Example 19)

Referring to Fig. 67, a nineteenth embodiment of the present invention will be described.

The cooling unit 3 constituting the heat exchanger 25 according to the present embodiment is mounted in a multi-layered manner (three layers) inclined at a predetermined angle in the casing, for example, the boiling section 7 is mounted. It is divided into the high temperature side heat exchanger (internal air side heat exchanger) 3a which comprises, and the low temperature side heat exchanger (external air side heat exchanger) 3b which comprises the condensation part 8, The said high temperature side and low temperature side heat exchanger The groups 3a and 3b are connected by first and second connecting tubes 9a and 9b.

In the cooling unit 3 according to the present embodiment as compared with the eighteenth embodiment, the high-temperature side heat exchanger 3a and the low-temperature side heat exchanger 3b are arranged on both sides (left and right in the figure) and generally on the same plane in the width direction. It is arranged to miss. Further, the first and second connecting pipes 9a and 9b connecting the high temperature side heat exchanger 3a and the low temperature side heat exchanger 3b are disposed at the displaced positions 51 and 52.

The first connecting pipe 9a is a metal pipe and the high temperature side upper tank 41a provided on the top of the high temperature side heat exchanger 3a (boiling portion 7) is connected to the low temperature side heat exchanger 3b (condensation portion 8). The low temperature side upper tank 41a provided at the upper end of the communication is in communication with the evaporated refrigerant which is boiled in the boiling part 7 and evaporated. The second connecting tube 9b is a metal tube and the low temperature side bottom tank 42b provided in the low temperature side heat exchanger 3b communicates with the high temperature side heat exchanger 3a provided in the high temperature side heat exchanger 3a to condense the portion 8. ) And the liquefied liquefied refrigerant is introduced into the boiling unit (7).

The effects of the nineteenth embodiment are described below.

In this embodiment, the high temperature side heat exchanger 3a and the low temperature side heat exchanger 3b are arranged to deviate from each other on both sides in the width direction and on substantially the same plane, and the high temperature side heat exchanger 3a and the low temperature side heat exchanger 3b ) And the first and second connecting pipes 9a and 9b for circulating the refrigerant are disposed at the displaced positions 51 and 52. In this case, the first and second connecting pipes 9a and 9b are unnecessary spaces in comparison with the eighteenth embodiment provided so as to protrude on both sides (left and right sides in the figure) in the width direction of the cooling unit 3. The size can be reduced by the portion 9a and the tube projection, and accordingly, the compact cooling unit 3 is provided, so that the entire cooling apparatus 14 can be further miniaturized.

Hereinafter, modifications of the seventeenth to nineteenth embodiments will be described.

The cooling device 14 provided with the heat exchange device 21 according to these embodiments is utilized when the electronic components 11 and 12 need to be accommodated in a sealed space. If the heating element needs to be housed in a confined space, the heating element is used under inert gas conditions (eg, helium gas, argon) when used under harsh operating environmental conditions, including, for example, oil, water, iron, corrosive gases, etc. Gas, etc.) is used to prevent sparking and oxidation at the point of contact during an electrical short circuit, or to prevent external leakage of gases harmful to the human body (e.g., hydrogen-based fluorides decomposed from fluorocarbons). It includes the case for doing this.

In this embodiment, the multiple flow path type heat exchanger having corrugated fin tube is used as the cooling unit 3, the high temperature side heat exchanger 3a, and the low temperature side heat exchanger 3b; However, a heat exchanger having a plate-shaped fin-tube, a heat exchanger having a fine fin fin-tube, an S-curve type heat exchanger having a flat tube bent in a zigzag shape, and two press-formed plates are mutually A draw-cup type heat exchanger having a plurality of laminated cooling pipes connected is also used as the cooling unit 3, the high temperature side heat exchanger 3a, and the low temperature side heat exchanger 3b. Slit fins or louver fins may be used as the heat sink fins 6a or the heat sink fins 6b.

In these embodiments, hot gases such as hot air heated by heating elements such as electrical components 11 and 12 are used as hot fluid (internal air) which is the fluid in the casing and the air in the housing 13; However, hot liquids such as coolant and oil (including hydraulic oil and lubricating oil) for cooling heating elements such as the electronic components 11 and 12 may be used as the hot fluid. In the same way, cold liquids, such as water and oil, as well as cold gases, such as cold air, can be used as cryogenic fluids which are fluids outside the housing and fluid outside the casing. In this case, a pump is used as the inner fluid circulation means and the outer fluid circulation means. As means for operating the pumps and centrifugal fans 31, 34, as well as electric motors 32, 33, as well as internal combustion engines, aberrations, or windmills can be used.

(Example 20)

Referring to the drawings, a twentieth embodiment of the present invention will be described.

68 to 77 show a twentieth embodiment of the present invention. Fig. 68 is a diagram showing the overall structure of an electronic device, Fig. 69 is a diagram showing the structure of a cooling device embodying the present invention, Fig. 70 is a diagram showing the upper structure of a cooling device, and Fig. 71 is cooling. Diagram showing the undercarriage of the device.

The electronic device 1 is a device of a radio base station of a mobile radio telephone such as a radio telephone or an automobile telephone. The electronic device 1 includes a housing 13 for accommodating the electronic components 11 and 12 in a sealed state and a cooling device (cooler) mounted in the housing 13 to cool the electronic components 11 and 12. Include.

The electronic component 11 is, for example, a heat generating means such as a high frequency switching element built in a transceiver, and performs a predetermined operation and generates heat when electricity is supplied. The electronic component 12 is, for example, a heat generating element such as a semiconductor boost element such as a power transistor built in a power amplifier, and performs a predetermined operation and generates heat when electricity is supplied.

The housing 13 in which the inside is sealed from the outside has a sealed space 15 formed therein. In order to prevent deterioration of the electronic parts 11 and 12 due to deposition of foreign matter such as dust or water on the electronic parts 11, the sealed space 15 is externally provided by a fluid separation plate provided in the cooling device 14 to be described later. Is completely sealed from.

The enclosed space 15 is a high temperature side heat transfer space that serves as an inner passage and an electronic component accommodating space 16 for accommodating the electronic components 11 and 12 by a casing and a fluid separator plate of the cooling device 14. First heat transfer passage). In the high temperature side heat transfer space 17, the flow path area is narrowed on the upper side (upstream side) to reduce the depth (vertical length) of the cooling device, and the flow path area is wider on the lower side than the upstream side. With the fluid separation plate, the housing 13 forms a low temperature side heat transfer space, which is a second heat transfer space, as an outer passage partitioned to be sealed from the high temperature side heat transfer space 17.

Next, the cooling apparatus 14 is demonstrated with reference to FIGS. 68-74. 72 and 73 are diagrams each showing the structure of the cooling device 14.

The cooling device 14 is a cooler for cooling the electronic components 11 and 12 using a semiconductor as a heat generating element.

The cooling device 14 includes a cabinet 2 integral with the housing 13, a heat exchanger 3 that maintains the air temperature of the sealed space 15 at a level not higher than an upper limit temperature (eg, 65 ° C.), Two high temperature side centrifugal blowers 4 for forcibly circulating high temperature air (high temperature fluid) as internal air, a low temperature side centrifugal blower for forcibly circulating low temperature air (low temperature fluid) for external air, and a closed space (15). Controller for controlling the power supply to the electric heater 6 to maintain the air temperature at the level not lower than the lower limit temperature (for example, 0 ° C.), and the electric device used in the cooling device 14 ( 7).

The cabinet 2 includes a door plate 21 disposed on the outermost side of the electronic device 1, a front plate (front plate) 22 attached to the rear surface of the door plate 21, and a high temperature side heat transfer space 17. And a rear diaphragm (back plate) 23 that surrounds it. These parts are fixed to the housing 13 by a joining method such as spot welding or by using fastening means such as screws or bolts. On the upper side of the cabinet 2 is mounted a detachable upper fan cover 8 which covers the two low temperature side centrifugal blowers 5, while on the lower side of the cabinet 2 two hot side centrifugal blowers 4 are mounted. The covering lower fan cover 9 is detachably mounted.

In the central portion of the door plate 21 and the front plate 22, as shown in Figs. 69 and 72, low-temperature air (unclean external air including dust or moisture) is supplied from the outside to the low-temperature side heat transfer space 18 One rectangular low temperature side suction port 21a suctioned by) is formed. In the door plate 21 and the upper cover 8, as shown in Figs. 69 and 74, two rectangular low-temperature sides for discharging low-temperature air from the two low-temperature centrifugal blowers 5 to the outside The discharge port 21b is formed.

Two quadrilateral shapes are attached to a plurality of louver 24 or a foreign matter intrusion prevention means such as a mesh 24 to the low temperature side discharge port 21b so that water droplets such as rain water are discharged from the outside of the two low temperature side centrifugal blowers 5 Difficult to enter) The fan case of the centrifugal blower 5 is fixed to the rear surface of the upper end of the door plate 21 by a fastening means such as a screw and a washer through the packing 21c.

As shown in FIG. 70, the fan case of the centrifugal blower 5 is fixed to the upper plate portion of the front diaphragm 22 by the fastening means 22b such as a screw through the packing 22a, and is shown in FIG. As shown, the fan cases of the two centrifugal blowers 4 are fixed to the bottom plate portion of the front plate (plate) 22 by means of fastening means such as screws through the packing 22c.

69 and 75, the upper side of the rear diaphragm 23 has hot air (clean internal air containing no foreign matter such as dust or moisture) from the electronic component accommodating space 16 to the high temperature side heat transfer space ( One rectangular high-temperature side suction opening 231 for suctioning through 17) is formed. On the lower side of the rear diaphragm 23, a duct 23b for introducing the cooled internal air into the electronic component 11 from one high-temperature centrifugal blower 4 is connected. The duct 23c flowing into the electronic component 12 from the high temperature side centrifugal blower 4 is connected by spot welding or the like. Each duct 23b, 23c is integrally connected to two centrifugal blowers 4. As shown in FIG. 71, the rear diaphragm 23 is fixed to the lower part (bottom) of the front diaphragm 22 by the fastening means 23b like a screw.

As shown in Figs. 68 to 70, the upper fan cover 8 is provided with a suction port for sucking cold air from the sealed space 15 into the upper plate portion thereof, and further includes cold air from the inside. 15) is provided with a discharge port 24b for discharging to the rear side thereof. The upper fan cover 8 is fixed to the rear diaphragm 23 by fastening means 24c such as a screw, so that the main body side of the cabinet 2 (door plate 21, front diaphragm 22, rear diaphragm 23). ) Is detachably mounted.

As shown in Figs. 68, 69 and 71, the lower fan cover 9 is provided at its lower part (bottom) with an inlet (not shown) for sucking cold air from the enclosed space 15 to the inside. Further, a discharge port 25b for discharging cool air from the inside into the sealed space 15 is provided at its rear part. The lower fan cover 9 is fixed to the front plate 22 (front plate) by fastening means 25c such as a screw, and the main body side (door plate 21, front plate 22, rear side of the cabinet 2). Removably mounted to the diaphragm (23). In addition, the lower fan cover 9 fixes the support stand 26 with fastening means 25d such as a screw. The support stand 26 secures the controller 7 by clamping means such as bolts and nuts.

Next, with reference to Figs. 68, 69, 74 and 75, the heat exchanger 3 will be described. FIG. 74 is a diagram showing the structure of a cooling device, and FIG. 75 is a diagram schematically showing the structure of a cooling device.

The heat exchanger (3) penetrates through the fluid separation plate (13a) for sealing and separating hot air, which is internal air circulating inside the housing 13, and low temperature air, which is external air circulating outside the housing, from each other, and the separation plate. And a plurality of (three) layers of cooling units 30 mounted on the fluid separation plate.

The fluid separation plate 13a forming one wall surface (part) of the housing 13 constitutes one wall surface of the sealed space 15 having a high temperature inside and one wall surface of the low temperature side heat transfer space 18 having a low temperature inside. do. For example, the fluid separation plate 13a is formed of a thin metal plate having excellent thermal conductivity such as aluminum, and includes a sealed space 15 including a high temperature side heat transfer space 17 and a low temperature side heat transfer space 18. It is soldered integrally with the cooling unit 30 and the cabinet 2 to seal and partition the outside. In the fluid separation plate, a plurality of elongated rectangular or elliptical through holes through which the connection pipe passes in the cooling unit to be described later are formed at predetermined intervals. The fluid separator plate 13a may be a split plate (eg, divided into two parts).

The cooling unit 3 is mounted in a plurality of (three) layers inclined by a predetermined angle inside the cover net 2, and a portion of a high temperature side heat exchanger in which a fluorocarbon type or a freon type refrigerant is filled therein (internal air side heat exchanger). Part) 3a and the low temperature side heat exchanger part (external air side heat exchanger) 3b, respectively. The hot and cold side heat exchanger portions 3a and 3b are interconnected via two first and second connecting tubes 3c and 3d for circulation of the refrigerant.

The high temperature side heat exchanger portion 3a includes a heat receiving fin 30a inserted between the plurality of cooling tubes 27a, the high temperature side upper tank 28a, the high temperature side lower tank 29a, and the adjacent cooling tube 27a. It is a multi-flow furnace type heat exchanger part (internal heat exchanger part) that includes. On both sides of the high temperature side heat exchanger portion 3a, the heat exchanger portion 3a is fixed to the fluid separation plate 13a and the cabinet 2 by fastening means, thereby providing a plurality of cooling tubes 27a and a plurality of heat receiving fins ( A side plate 3e for reinforcing 30a) is attached. Since the high temperature side heat exchanger portion 3a is disposed in the high temperature side heat transfer space 17 sealed from the outside by the housing 13, the heat exchanger portion 3a is exposed to external air containing foreign matter such as dust or moisture. There is no possibility to be.

The plurality of cooling tubes 27a are formed of flat tubes having elongated rectangles (e.g., 1.7 mm in width, 16.0 mm in length) or elliptical cross-sections, and also have excellent thermal conductivity, for example metallic materials such as aluminum or copper. Is made with. The high temperature side heat exchanger 3a including the cooling tube 27a is constituted by a liquefied refrigerant tank (boiling unit) X, in which the refrigerant enclosed is boiled and vaporized by receiving heat from hot air.

The hot side upper tank 28a and the lower tank 29a each consist of a core plate provided on the side of the cooling tube 27a and a generally inverted U-shaped tank plate connected to the core plate. One of the high temperature side upper tank 28a and the lower tank 29a is provided only at the refrigerant inlet (not shown) for enclosing the refrigerant in the cooling tank 30. The refrigerant is enclosed in each cooling tube 27a of the high temperature side heat exchanger 3a up to the liquid level approximately coincident with the upper end of the tube 27a. That is, it is enclosed to the upper part of the boiling part X. The refrigerant is enclosed in the tube 27a after the heat receiving fins 30a are soldered to the tube 27a.

The heat receiving fins 30a are corrugated fins formed by being pressed or bent in a wavy form in a thin plate (for example, approximately 0.02 to 0.05 mm thick) formed of a metallic material having excellent thermal conductivity such as aluminum. admit. The fin 30a is soldered to the flat outer wall surface of the cooling tube 27a. Therefore, the outer wall surface of the tube 27a and the heat receiving fins 30a are joined together in a molten state.

The low temperature side heat exchanger 3b includes a plurality of cooling tubes 27b, a low temperature side upper tank 28b, a low temperature side lower tank 29b, and a heat radiation fin 30b inserted between adjacent cooling tubes 27b. ) And a multiflow path type heat exchanger (inside the heat exchanger) including the side plate 3f. The heat exchanger 3b is arranged to be positioned substantially the same as the air temperature side heat exchanger 3a in the low temperature side heat transfer space 18 in which external air containing foreign matter such as dust or moisture is accommodated.

The plurality of cooling tubes 27b are formed in the same shape as the cooling tube 27a. The low temperature side heat exchanger 3b including the cooling tube 27b is configured as an evaporative refrigerant tank (condensation) Y to discharge the heat of the refrigerant vapor boiled in the boiling section X to the low temperature air to evaporate. Condensate the refrigerant.

In this manner the hot side upper and lower tanks 28a and 29a and the cold side upper and lower tanks 28b and 29b are each composed of a U-shaped tank plate which is generally inverted with the core plate. The low temperature side lower tank 28b may be bent such that the second connection pipe 3d is positioned downward.

The heat dissipation fins 30b are corrugated fins formed in the same shape as the heat sink fins 30a and are soldered to the flat outer wall surface of the cooling tube 27b. In this way, the outer wall surface of the cooling tube 27b and the heat dissipation fins 30b are joined together in a molten state.

The first connecting pipe 3c is a metal pipe formed to have a circular cross section by using a metallic material such as the cooling tubes 27a and 27b. The first connecting pipe 3c communicates between the high temperature side upper tank 28a positioned at the upper end of the boiling part X and the low temperature side upper tank 28b positioned at the upper end of the condensation unit Y. The first connecting pipe 3c functions as a high temperature-low temperature guide means for introducing the evaporative refrigerant boiled in the boiling portion X into the condensation portion Y.

The second connection pipe 3d is a metal pipe formed to have a circular cross section by using the same metallic material as the first connection pipe 3c. The second connecting pipe 3d communicates between the low temperature side lower tank 29b located at the bottom of the condensation unit Y and the high temperature side lower tank 28b located at the bottom of the boiling section X. The second connecting pipe 3d functions as a low temperature-high temperature guide means for introducing the liquefied refrigerant condensed in the condensation unit Y into the boiling unit X.

The high temperature side centrifugal blower 4 will be described in detail with reference to Figs. 68, 69 and 71.

Two hot side centrifugal blowers 4 are mounted below the heat exchanger 3 and are received between the lower fan cover 9 and the lower end of the cabinet 2. The centrifugal blower (4) includes a centrifugal fan (31) for forcibly circulating hot air into the high temperature side heat transfer space (17), a drive motor (32) for rotating the centrifugal fan (31), and the centrifugal fan. Fan cases 33 are provided, each of which 31 is rotatable therein.

The centrifugal fan 31 includes a plurality of wings and a disk-shaped support plate 34 for supporting the wings. The support plate 34 is fixed on the output shaft 35 of the fan 31.

The heat transfer accelerator plate 37 is fitted and fixed to the drive motor 32 on the outer circumferential wall of the side plate 36 positioned closest to the centrifugal fan 31. At the lower end of the drive motor 32, a cooling fan 38 for blowing atmospheric air (hot air) into the drive motor is mounted on the output shaft 35 to cool the motor.

The fan case 33 forms a vertical forced circulation flow path 39 therein. The fan case 33 includes a fluid inlet 33a for sucking air temperature into the forced circulation flow path 39, a fluid outlet 33b opened toward the electronic component accommodating space 16, and a lower plate. A fan mounting opening 33c is provided, and the opening 33c has a diameter larger than the outer diameter of the centrifugal fan 31.

The fluid suction port 33a is formed in the bell mouth 40 of the upper plate of the fan case 33. The fluid outlet 33b is in communication with a fluid passage formed in the ducts 23b and 23c protruding from the bottom fan cover 9. The upper plate portion of the fan case 33 is fixed to the bottom surface of the lower plate portion of the front plate 22 of the cabinet 2 through the packing 22c by fixing means 22d such as a screw.

The side plate 36 constituting the front frame of the drive motor 32 has a fluid stirrer 36a of concave-convex or jagged shape on the centrifugal fan side. The fluid agitator 36a is a portion for effectively agitating low temperature fluid by assisting air blowing of the fan 31 between the support plate 34 for the centrifugal fan 31 and the heat transfer accelerator plate 37. to be.

The heat transfer accelerator plate 37 is used as a motor mounting means for passing the side plate 36 while at the same time fixing the strut portion 32a of the drive motor 32 by using a fixing means 37b such as a screw. Rather, it serves as a heat transfer accelerator for effectively transferring heat generated from the drive motor 32 to the fan case 33. The heat transfer accelerator plate 37 passes through the side plate 36 and has a circular through hole (not shown) fixed to the lower plate of the fan case 33 by a fixing means 37d such as a screw.

Next, the low temperature side centrifugal blower 5 will be described in detail below with reference to FIGS. 70, 76 and 77. FIG. FIG. 76 is an exploded view for mounting each centrifugal blower 5, and FIG. 77 is a sectional view schematically showing the structure of the blower 5. As shown in FIG.

The two low temperature side centrifugal blowers 5b are mounted to the heat exchanger 3 and housed between the top fan cover 8 and the upper end of the cabinet 2. The centrifugal blower 5 is provided with a centrifugal fan 41, a drive motor 42 for rotating the centrifugal fan, and a fan case 43 rotatably accommodating the fan 41.

The centrifugal fan 41 functions to circulate the low temperature air forcibly into the low temperature side heat transfer space 18. In the same manner as the centrifugal fan 31, the fan 31 includes a plurality of wings and a disk-shaped support plate 44 for supporting the wings. The support plate 44 is fixed on the output shaft 45 of the centrifugal fan 41.

The heat transfer accelerator plate 47 is fitted and fixed to the driving motor 42 on the outer circumference of the side plate 46 positioned closest to the centrifugal fan 41. The cooling fan 48 mounted on the top of the drive motor 42 is mounted on the output shaft 45 for blowing atmospheric air (hot air) to the drive motor to cool the motor.

The fan case 43 accommodates the centrifugal fan 41 therein and separates the hot and cold side heat transfer spaces 17 and 18 from each other. A vertical forced circulation flow path 49 is formed inside the fan case 43. 70, 76 and 77, the fan case 43 has a fluid inlet 43a for sucking low temperature air into the forced circulation flow path 49 and a low temperature side outlet formed in the cabinet 2; A fluid discharge port 43b and a fan mounting opening 43c formed in the upper plate portion are coupled and communicate with each other, and the opening portion 43c has a diameter larger than the outer diameter of the centrifugal fan 41.

The fluid suction port 43a is formed in the bell mouth 50 of the bottom plate of the fan case 43. As shown in Fig. 77, the bell mouse 50 has a cabinet 2 (low temperature side space) through which the water droplets, such as rainwater coming in through the fluid discharge port 43b, pass through the bottom plate of the fan case 43. (18) It acts as a weir to prevent it from entering. 77, the fluid discharge port 43b also functions as a droplet discharge port 43b for discharging droplets remaining on the bottom of the fan case 43 to the outside.

As shown in Fig. 70, the lower plate portion of the fan case 43 is fixed to the plate upper surface of the front diaphragm 22 of the cabinet 2 through the packing 22 by fixing means such as a screw. The front part of the fan case 43 is fixed to the door plate 21 of the cabinet 2 by fixing means 21b such as a screw.

The side plate 46 constitutes the front frame of the drive motor 42 in the same manner as the side plate 36 described above, and has a wavy or serrated fluid stirring portion 46a on the centrifugal fan side thereof. ) The fluid agitator 46a assists air blowing from the fan 41 between the support 44 for the centrifugal fan 41 and the heat transfer accelerator plate 47 to effectively stir the low temperature side fluid. Part.

The heat transfer accelerator plate 47 is generated from the drive motor 42 as well as a motor mounting means for fixing the support 42a of the drive motor 42 and passing the side plate 46 at the same time. It functions as a heat transfer accelerator for effectively transferring heat to the fan case 43. The heat transfer accelerator plate 47 passes through the side plate 46 and is fixed to the upper plate portion of the fan case 43 through the packing 47c by fixing means 47d such as a screw (not shown). Not). The heat transfer accelerator plate 47 and the holding portion 42a of the driving motor 42 are composed of a separating portion forming a part of the fan case 43, and also the high temperature side heat transfer in the low temperature side heat transfer space 18. The space 17 constitutes a water inlet prevention wall for preventing the inflow of water or the like.

In the hot side heat transfer space 17 of the housing 13, the electric heater 6 is disposed downstream of the hot side heat exchanger 3a of each cooling unit 3 in the hot air flow direction. The electric heater 6 is for heating the air flow through the high temperature side heat transfer space 17 so that the internal temperature of the sealed space 15 is maintained at a level not lower than the lower limit temperature (eg 0 ° C.). This is because the performance of the electrical components (for example, semiconductor elements) 11 and 12 decreases when the internal temperature of the sealed space 15 in the housing 13 is lower than the minimum limit temperature. The electric heater 6 is used in this embodiment having a calorific value of 1.2 kW, for example.

The controller 7 is used in the cooling device 14, such as the electric heater 6, in accordance with the internal temperature of the sealed space 15 detected by the temperature sensor 10 constituted by a temperature sensitive element such as the thermistor. The element, the drive motor 32 of the two high temperature side centrifugal blowers 4, and the drive motor 42 of the two low temperature side centrifugal blowers 5 are controlled.

When the internal temperature of the enclosed space 15 is not lower than the lower limit temperature (for example, 0 ° C.), the controller 7 has two high temperature side centrifugal blowers 4 and two low temperature side centrifugal blowers 5 Hi. (High air volume) or Lo (low air volume) control to operate, the electric heater (6) is turned off (turn-off). In addition, when the internal temperature of the sealed space 15 is not higher than the lower limit temperature (eg 0 ° C.), the controller 7 turns off the driving motors 32 of the two low temperature side centrifugal blowers 5. -off), the two hot side centrifugal blowers 4 are controlled to operate in a Hi (large air volume) or Lo (low air volume) manner, and turn on the electric heater (6).

A method of replacing the drive motors 42 of each of the low temperature side centrifugal blowers 5 in this embodiment will be briefly described below with reference to FIG.

Firstly, the fastening means 24c, such as a screw, are removed, and the upper pan cover 8 is separated from the upper end of the cabinet 2. Next, the fixing means 47d such as a screw is removed, and the fan case 43 is also separated from the heat transfer accelerator plate 47. In this case, the drive motor 42 can be easily taken out from the fan case 43 to the upper side of the heat exchanger 3, and at the same time the fan mounting opening 43c is larger than the outer diameter of the fan 41. The heat transfer accelerator plate 47 is mounted to the support portion 42a of the drive motor 42, and the centrifugal fan 41 is mounted on the output shaft 45 of the drive motor 42.

Therefore, the drive motor 42 can be easily separated from the fan case 43 without the complicated work of removing the centrifugal fan 41 from the output shaft 45 of the drive motor 42 in the fan case. When mounting a new drive motor 42, first, the support plate 44 for the centrifugal fan 41 and the output shaft 45 of the drive motor 42 are fixed together by fixing means such as bolts, and the drive motor Is mounted to the fan case 43 in the reverse order.

Next, a method of replacing the drive motors 32 of the high temperature side centrifugal blowers 4 in the present embodiment will be briefly described with reference to FIG.

As described above, first, the fixing means 25c such as a screw is removed, and the lower fan cover 9 is separated from the lower end of the cabinet 2. Next, the fixing means 37d, such as a screw, is removed, and the heat transfer accelerator plate 37 is separated from the fan case 33. At this time, the drive motor 32 can be easily taken out from the fan case 33 to the lower side of the heat exchanger 3, and at the same time, since the fan mounting opening 33c is larger than the outer diameter of the fan 31, heat is transferred. The accelerator plate 37 is mounted on the support 32a of the drive motor 32, and the centrifugal fan 31 is mounted on the output shaft 35 of the drive motor 32.

Therefore, the drive motor 32 can be easily removed from the fan case 33 without the complicated work of removing the centrifugal fan 31 from its output shaft 35. When the new drive motor 32 is mounted, first, the support plate 34 for the centrifugal fan 31 and the output shaft 35 of the drive motor 32 are fixed together by fixing means such as bolts. 32 is mounted to the fan case 33 in the reverse order (shown in FIG. 76) above.

The operation of the cooling device 14 of this embodiment is briefly described below with reference to Figs.

When the internal temperature of the enclosed space 15 in the housing 13 is not lower than the lower limit temperature (for example, 0 ° C.), the drive motors 32 of the two high temperature side centrifugal blowers 4 and the two low temperature sides The centrifugal fans 31 and 41 start to operate by supplying current to the drive motor 42 of the centrifugal blower 5. As a result, the circulation flow of hot air (clean internal air free of foreign matter such as dust or moisture; internal fluid) is formed in the enclosed space 15 formed in the housing 13. In contrast, the circulation flow of the low temperature air (dirty external air containing foreign matter such as dust or moisture; external fluid) is formed in the low temperature side heat transfer space 18 formed outside the housing 13.

In each cooling unit (30) mounted while passing through the fluid separation plate (13a) of the housing (13), the refrigerant enclosed in each cooling tube (27a) of the high temperature side heat exchanger (3a) is connected to the heat receiving fin (30a). It is boiled and evaporated by receiving heat transferred from high temperature air. The evaporated refrigerant passes low temperature air through the high temperature side upper tank 28a and the first connection pipe 3c, and also has an inner wall surface of the condensation portion Y of the low temperature side heat exchanger 30b having a low temperature. As a result, latent heat is transferred to the cold air through the heat radiation fins 30b.

As shown in FIG. 75, the refrigerant condensed in the condensation unit Y falls into the refrigerant tank 3a along the inner wall surface of the cooling tube 27b due to its own weight, and the low temperature side lower tank 29b and ash 2 It passes through the connecting pipe 3d and reaches the boiling part X of the high temperature side heat exchange part 3a. In this way, the refrigerant encapsulated in the cooling tube 27a alternately transfers the heat of the hot air to the low temperature air so that the heat generated from the electronic components 11 and 12 can be released in the plurality of layers of the cooling unit 30. Repeat boiling and condensation to

Therefore, the electronic components 11 and 12 are transferred into the hot air (blue and blue air present in the housing 13) and the low temperature side heat transfer space circulating into the hot side heat transfer space 17 of the enclosed space 15. It can be cooled without mixing the circulating low temperature air (dirty air present outside the housing 13).

When the internal temperature of the enclosed space 15 in the housing 13 is lower than the lower limit temperature (for example, 0 ° C.), an electric heater 6 for heating the air flow through the high temperature side heat transfer space 17 is provided. Supplied to. At this time, the two low temperature side blowers 5 are separated.

On the contrary, by rotating the two high temperature side centrifugal blowers 4, the hot air is circulated from the housing 13 into the sealed space 15 to accommodate the electronic components 11 and 12 therein. And flows to (16), and enters the cooling device (14) as shown in Figs. 68 and 69 through the high temperature side suction port (23a) formed in the rear diaphragm (23) of the cabinet (2). The high temperature thus entering the cooling device 14 passes through a narrow path surrounded by the fluid separation plate 13a and the rear separation plate 23 and then passes through the high temperature side heat exchanger 3a. That is, the hot air passes through the proximity to the cooling tube 27a and at the same time heat is absorbed by the heat receiving fins 30a.

As shown in Fig. 71, each of the two high temperature side centrifugal blowers 4 rotates the cooling fan 38 together with the centrifugal fan 31 as well. As a result, the hot air is sucked into the lower cover 9 through the inlet of the lower cover to cool the drive motor 32, and also through the discharge port 25b, the electronic component in the enclosed space 15. It is discharged into the receiving space (16).

In addition, the low temperature fluid between the heat transfer accelerator plate 37 and the support plate 34 is formed by the cooperation of both side fluid stirring portions 36a which are formed on the upper surface of the side plate 36 and rotate the air flow from the centrifugal fan 31. It is effectively stirred to cool the drive motor 32. By effectively transferring heat generated from the drive motor 32 to the fan case 33 through the heat transfer accelerator plate 37, the drive motor 32 is effectively cooled.

On the contrary, by the rotation of the centrifugal fan 41 of the two low temperature side centrifugal blowers 5, the low temperature side heat transfer space formed outside the housing 13, as shown in Figs. It circulates in (18) and flows into the cooling apparatus 14 from the outside through the low temperature side suction port 21a formed in the both side door plate 21, and the front plate 22 of the cabinet 2. The low temperature air entering the cooling device 14 passes through the low temperature side heat exchanger 3b. That is, the low temperature air passes between adjacent to the cooling tube (27b), the heat of the evaporated refrigerant boiled in the boiling portion (X) is discharged into the atmosphere through the heat radiation fin (30b).

As shown in FIG. 70, each of the two low temperature side centrifugal blowers 5 also rotates the cooling fan 48 together with the centrifugal fan 41. As a result, the hot air is sucked into the upper fan cover 8 through the inlet port 24a of the upper fan cover to cool the drive motor 42, and also the airtight space 15 through the outlet port 24b. Is discharged to the electronic component receiving space 16 in the space.

The low temperature fluid between the heat transfer accelerator plate 47 and the support plate 44 is formed by the cooperation of both fluid stirring portions 46 formed on the upper surface of the side plate 46 to rotate the air flow from the centrifugal fan 31. It is effectively stirred to cool the drive motor 42. By effectively transferring the heat generated from the drive motor 42 to the fan case 43 through the heat transfer accelerator plate 47, the drive motor 42 is effectively cooled.

In the following, effects of the present embodiment will be described in detail.

According to the present embodiment, as described above, the entire high temperature side centrifugal blower 4 is arranged below the heat exchanger 3, the drive motor 32 being free of interference by the heat exchanger 3. It is detachably fixed under the heat exchanger 3 so as to be detachable from the chiller 14 and mountable. In this way, the entire low temperature centrifugal blower 5 is arranged in the heat exchanger 3, the drive motor 42 being disengaged from the cooling device 14 without him being interfered by the heat exchanger 3. It is detachably fixed to the heat exchanger 3 so as to be mountable. Therefore, it is possible to improve the performance maintenance of the drive motors 32 and 42.

According to an embodiment of the present invention, moreover, fan openings 33c and 43c having a diameter larger than the outer diameter of the centrifugal fans 31 and 41 are formed in the fan cases 33 and 43, respectively, 37 and 47 are respectively disposed between the fan cases 33 and 43, and the drive motors 32 and 42 are detachably fixed to the fan cases 33 and 43, respectively. Therefore, the drive motors 32 and 42 do not deteriorate operation by removing the centrifugal fans 31 and 41 from the output shafts 35 and 45 of the drive motors 32 and 42 inside the fan cases 33 and 43. It can be detached or mounted. In this way, the performance maintenance of the drive motors 32 and 42 can be further improved.

In the above embodiment, since the heat transfer accelerator plates 37 and 47 are in the form of a metal material including aluminum having excellent thermal conductivity as a main component, the heat generated from the drive motors 32 and 42 is such excellent heat. It can be effectively released to the fan case (33, 43) by the transmission. Therefore, the heat resistance of the drive motors 32 and 42 can be improved, and the size of both motors can be reduced due to the heat transfer acceleration effect.

According to this embodiment, as shown in FIGS. 70 and 77, droplets contained in the low temperature fluid (external air) to prevent the droplets from flowing into the heat exchanger 3 side through the bottom of the fan case 43. The receiving bell mouth portion 43a is formed at the bottom of the fan case, and a discharge port for discharging the droplets remaining on the bottom of the fan case to the outside of the cooling device 14 is integrally formed with the fluid discharge port 43. Therefore, with a simple structure without the use of special equipment or parts, it is possible to reliably receive and drain small droplets such as rainwater contained in the low temperature fluid flowing into the fan case. Therefore, since such droplets can be prevented from entering the cooling device 14, that is, the heat exchanger 3, the heat exchanger 3 formed of a metal material such as aluminum can be corroded by small droplets. Even when the corrosion of the heat exchanger (3) can be prevented.

In the cooling apparatus 14 of this embodiment, the high temperature side heat exchange part 3a as the boiling part X and the low temperature side heat exchange part 3a as the condensation part Y have two first and second connection pipes 3c. , A heat exchanger 3 comprising annularly connected cooling units 30 arranged in a plurality of layers in the air flow direction by 3d).

According to this structure, since the circulation flow of the coolant is formed in each cooling unit 30, the collision between the evaporated coolant (boiled gas) and the liquefied coolant (condensed liquid) can be prevented, and each cooling unit The thermal radiation performance (cooling performance) of 30 can be improved. By arranging the cooling units 30 in plural layers, the heat exchanger 3 can further improve the heat radiation performance (cooling performance) of each cooling unit 30.

(Example 21)

21 embodiments of the present invention will be described.

78 and 79 are sectional views showing the side plate and the heat transfer accelerator plate of the drive motor.

As shown in FIG. 79, on the centrifugal fan side of the heat transfer accelerator plate 47 used in the present embodiment, a plurality of formed in the same direction as the fluid swing portion 46a of the side plate 46, that is, in the circumferential direction A heat radiation accelerator 43a having a concentric groove is formed. According to the structure, the heat radiation effect from the drive motor 42 to the atmospheric fluid (hot air) through the heat transfer accelerator plate 47 is promoted to improve the heat resistance of the drive motor 42, and the motor It can be further miniaturized as compared with the twenty embodiments.

(Example 22)

A twenty-second embodiment of the present invention will be described with reference to Figs.

Fig. 80 is a sectional view schematically showing the structure of the low temperature side centrifugal blower, and Fig. 81 is a plan view showing the support plate for the centrifugal fan.

In the present embodiment, on the motor side of the support plate 44 for the centrifugal fan 41, a radially extending groove or a ridge is formed, and a fluid stirring portion 44a centering the output shaft 45 is formed. By the cooperation of the fluid stirring part 46a of the side plate 46 and the fluid stirring part 44a of the said support plate 44 which rotates airflow from the centrifugal fan 41, the support plate 44 and the heat transfer acceleration plate ( The low temperature fluid between the 47) is effectively agitated so that the drive motor 42 can be effectively cooled. In addition, the support plate 44 is formed in a concave-convex shape, the strength of the centrifugal fan 31 can also be improved by the fluid stirring portion 44a functions as a reinforcing rib.

(Example 23)

A twenty-third embodiment of the present invention will be described with reference to FIG.

82 is a sectional views schematically showing the structure of a low temperature side centrifugal blower.

In the present embodiment, the bottom plate portion 51 of the fan case 43 positioned near the fluid discharge port 43b is inclined outwardly by a predetermined angle, for example, 2 ° to 3 ° with respect to the horizontal direction. According to this structure, the water droplets of the bellows mouth portion 50 of the droplets are located on the horizontal surface of the fan case, and the amount of droplets is larger than that of the 20 embodiment formed of the small plate-shaped portion of the fan case 43. Even at this time, small droplets such as rainwater are prevented from entering the heat exchanger 3 side through the bottom of the fan case 43 and can be reliably discharged.

(Example 24)

A twenty-fourth embodiment of the present invention will be described with reference to Figs.

Fig. 83 is a sectional view schematically showing the structure of the low temperature side centrifugal blower, and Fig. 84 is a mounting diagram showing the main structure of the low temperature side centrifugal blower.

The low temperature side centrifugal blower 5 according to the present embodiment includes a centrifugal fan 41 for forcibly circulating low temperature air into the low temperature side heat transfer space 18 (the forced circulation flow path 49) as in the 20th embodiment. A fan case 43 is provided in which a drive motor 42 for rotating the centrifugal fan 41 and a centrifugal fan 41 are rotatably received.

The centrifugal fan 41 includes a plurality of wings and a disk-shaped support plate 44. The support plate 44 is fixed to the output shaft of the fan 41. The drive motor 42 is fixed by fitting the heat transfer accelerator plate 47 on the outer circumference of the side plate 46.

The heat transfer accelerator plate 47 has a circular through hole 47e in communication with the side plate 46. The strut portion 42a of the drive motor 42 communicating with the through hole 47e at a predetermined position of the side plate 46 is fixed to the heat transfer accelerator plate 47 by fixing means 47b such as a screw. Sealant 47f For example, the silicone sealant is a holding part 42a to improve the airtightness between the low temperature side heat transfer space 18 (forced circulation flow path 49) and the high temperature side heat transfer space 17. Is attached to the outer circumference of the head) and the fixing part of the plate 47. The heat transfer accelerator 47 and the support 42a of the driving motor 42 form a separation part forming a part of the fan case 43 and a water inflow preventing wall.

The fan case 43 has a fan mounting opening 43c having a diameter larger than the outer diameter of the centrifugal fan 41. The edge of the fan mounting opening 43c has a rubber packing 47c and is formed of a circular rib portion 43d for performing linear sealing. A tab hole 43e for the fixing means 47d, such as a screw, is formed in the fan case 43, and the fixing means 47d is for fastening and fixing the heat transfer accelerator plate 47 to the upper plate of the fan case 43. will be. In the vicinity of the tab hole 43e, a plate stopper 43f is formed to keep the clearance between the rib portion 43d and the packing 47c constant to prevent breakage of the packing. The upper plate portion of the fan case 43 near the tab hole 43e is formed as a block portion 43g such as a ring in which a cutting process is performed toward the bottom plate portion.

In the above embodiment, the edge of the fan mounting opening portion 43c formed in the fan case 43 and the outer circumferential portion of the heat transfer accelerator plate 47 are sealed by the packing 47c in the shape of a circular plate, and the through hole 47e Since an edge is formed in the heat transfer accelerator plate 47, and the outer circumferential portion of the side plate 46 of the drive motor 42 is sealed by the sealing material 47f, a low temperature is obtained through the fluid suction part 43a of the fan case 43. Foreign matter such as dust or moisture that has entered the side heat transfer space 18 (forced circulation flow path 49) is transferred to the high temperature side heat transfer space through the fan mounting opening 43c formed in the upper plate of the fan case 43 ( Do not go into 17).

Therefore, the heat transfer accelerator plate 47 and the support portion 42a together with the fluid separation plate 13a are sealed between the high and low temperature heat transfer spaces 17 and 18, and the fan mounting opening of the fan case 43 ( 43c). Accordingly, the possibility of foreign matter entering the high temperature side heat transfer space 17 from the forced circulation flow path 49 through which external air flows is passed through the fan mounting opening 43c.

In this way, it is possible to prevent the occurrence of inconsistency, such as incomplete isolation due to breakage of internal parts or inflow of foreign matter into the drive motor 42. In addition, since it is possible to prevent foreign substances such as dust and moisture from entering the high temperature side heat transfer space 17 through the low temperature side heat transfer space 18, the foreign matter is mounted in the enclosed space 15. There is no possibility of failure of the electronic components 11 and 12 since they do not settle on the electronic components 11 and 12.

In addition, the inflow of foreign matters such as dust or moisture can be prevented without accommodating the entire drive motor 42 in the fan case 43, thereby simplifying the work for installing or replacing each low-temperature side centrifugal blower 5. In addition, it is possible to improve the performance maintenance of such a drive motor 42.

(Variation)

The modifications of the 17 to 19 embodiments will be described below.

The cooling device 14 provided with the heat exchanger 21 according to these embodiments is used when heat generating elements such as the electronic parts 11 and 12 need to be accommodated in a sealed space. When the heating element needs to be accommodated in the enclosed space, it is used under a strong environmental condition including, for example, oil, water, iron, corrosive gas, and the like. In the case of double inert gas (helium gas, argon gas, etc.), it is used to prevent arcing or oxidative contact at the time of electric interruption, and also in the case of gas harmful to the human body (for example, fluorine hydrogen decomposed from fluorocarbons). Gas) is prevented from leaking to the outside.

In these embodiments, a multiflow furnace type heat exchanger having corrugated fin tubes is used as the cooling unit 3 of the high temperature side heat exchanger 3a and the low temperature side heat exchanger 3b, but a heat exchanger having a plate fin tube, Heat exchanger with fine pin-pin tube, corrugated heat exchanger with zigzag flat tube vent, and draw cup type with a plurality of thin plate cooling tubes interconnected by two molded sheets The heat exchanger can be used as the cooling unit 3 of the high temperature side heat exchanger 3a and the low temperature side heat exchanger 3b. Slit fins or louver fins may be used as the heat sink fins 6a or the heat sink fins 6b.

In these embodiments, hot gases such as hot air heated by heating elements such as electronic components 11 and 12 are used as hot fluids such as air in housing 13 or fluids (internal air) in casings. However, high temperature liquids such as coolant and oil (including working oil and lubricating oil) for cooling heating elements such as the electronic components 11 and 12 can be used as the high temperature fluid. In this way, cold liquids such as water or oil, as well as cold gases such as cold air, can be used as cryogenic fluids (external air) which are air outside the housing or fluid outside the casing. In these cases, the pumps are used as internal fluid circulation means and external fluid circulation means. As means for operating the pumps or centrifugal fans 31 and 34, not only the electric motors 32 and 33 as in these embodiments, but also internal combustion engines, aberrations and windmills can be used.

(Example 25)

25 embodiments of the present invention will be described with reference to FIG.

85 is a schematic diagram showing a cooling device integrated with an electronic device according to the present embodiment.

For example, electronic devices are installed in base stations of mobile radiotelephones, such as cordless telephones or automobile telephones. The electronic device is mounted in a housing 80 which seals and receives an electronic component (heat generating element) such as a transceiver or a power amplifier in a sealed state and a housing 80 for cooling the electronic component 7. It includes a cooling device (1).

The electronic components 7 perform a predetermined operation when a current is supplied, thereby performing heat (for example, a semiconductor switching device constituting a high frequency switching circuit integrated with a transceiver and a semiconductor amplifier such as a power transistor integrated with a power amplifier). It is a heat generating element that generates).

The housing 80 has a sealed space 9 therein and is sealed to seal the inside from the outside. The enclosed space 9 is a fluid separation plate (intermediate separation plate) of the cooling device 1 in order to prevent the performance of the electronic parts from being degraded due to the deposition of foreign substances such as dust or moisture on the electronic parts 7. It is separated to be completely sealed from the outside by the.

The enclosed space 9 by the fluid separation plate of the cooling device 1 and the casing of the system 1 includes an electronic component accommodating space for accommodating the electronic component 7 and a high temperature side heat transfer space satisfying the internal passage. Is divided into 11). In the high temperature side heat transfer space 11, the flow path region on the reverse wind side is narrowed to minimize the depth of the cooling device 1, and the flow path region on the pure air side is widened. In the housing 80, furthermore, a low temperature side heat transfer space 12 is formed as an outer passage separated to be sealed in the high temperature side heat transfer space 11 by fluid separation plate means.

The cooling device 1 includes a casing 81 integrated with the housing 80, two upper centrifugal blowers 18 for generating a flow of low temperature air (external fluid, low temperature fluid), and high temperature air (internal fluid). Two lower centrifugal blowers 15 for generating a flow of hot fluid) and an electric heater 19 for maintaining the air temperature in the enclosed space 9 at a level not lower than the lower limit temperature (eg 0 ° C.). And a controller 82 for controlling the supply of electric power to the electric element of the cooling device 1.

The casing 81 includes an outer wall plate 83 located on the outermost side of the housing 80 and a rear diaphragm 22 surrounding the high temperature side heat transfer space 11. The outer wall plate 83 and the rear plate 22 are fixed to the housing 80 by fastening means such as screws or bolts or by a combination such as spot welding.

Each of the two upper centrifugal blowers 18 has a centrifugal fan for generating airflow in the low temperature side heat transfer space 12, an electric motor for rotating the centrifugal fan, and a scroll casing for receiving the rotatable centrifugal fan therein. Have

Each of the two lower centrifugal blowers 15 includes a centrifugal fan for generating airflow in the high temperature side heat transfer space 11, an electric motor for rotating the centrifugal fan, and a scroll casing that accommodates the rotatable centrifugal fan therein. Have

The electric heater 19 is for heating the air flow through the high temperature side heat transfer space 11 so that the internal temperature of the sealed space 9 is maintained at a level not lower than the lower limit temperature (eg 0 ° C.). This is because, when the internal temperature of the sealed space 9 is lower than the lower limit temperature, the performance of an electric component (for example, a semiconductor element) can be degraded. The electric heater 19 in this embodiment has a calorific value of 1.2 kW, for example.

The controller 82 is connected to a temperature sensor 84 composed of, for example, a thermistor by an electric element such as an electric motor of two upper centrifugal blowers and an electric motor such as an electric motor of two lower centrifugal blowers 15. The electric heater 19 is controlled according to the internal temperature of the sealed space detected by the same. When the internal temperature of the enclosed space 9 is not lower than the lower limit temperature (for example, 0 ° C.), the controller 82 has two upper centrifugal blowers 18 and two lower centrifugal blowers 15 having Hi ( To operate in the form of a large amount of air) or Lo (less amount of air), and turns off the electric heater 19. The controller 82 turns off the electric motors of the two upper centrifugal blowers 18 when the internal temperature of the enclosed space 9 is lower than the lower limit temperature (eg 0 ° C.). The electric motors of the two lower centrifugal blowers 15 control operation in the form of Hi (large air volume) or Lo (little air volume), and also turn on the electric heater 19.

The cooling device 1 will be described in detail.

FIG. 86 is a front view of the cooling device 1, FIG. 87 is a side view of FIG. 86, and FIG. 88 is a bottom view of the cooling device 1 as seen from below. In the cooling device 1 of the present embodiment, heat is absorbed into the high temperature fluid (e.g., hot air corresponding to intermediate high temperature) in the high temperature side heat transfer space 11, and then the absorbed heat is then transferred to the low temperature side heat transfer. It is released into the low temperature fluid (e.g. low temperature air corresponding to the intermediate low temperature) in the space 12, and is separated from the high temperature fluid by the fluid separation plate 2.

As shown in FIG. 86, the cooling device 1 comprises a refrigerant tank 3a constituted by a plurality of endothermic tubes 31a arranged on the hot fluid side with respect to the fluid separation plate 2, and each endothermic tube 31a. ) Is sealed and is flow-boiled by the heat of the high-temperature fluid is evaporated, the carbon type refrigerant (not shown), one end is in communication with the refrigerant tank (3) to be sealed, the other end fluid separation plate (2) A low-temperature side communication pipe 34a and a high-temperature side communication pipe 34b extending through the low-temperature fluid side through the body, and a contact portion 3a in communication so that the other ends of the low-temperature and high-temperature side communication pipes 34a and 34b are sealed. It is located on the low temperature fluid side with respect to the fluid separation plate 2, and is melted between the condensation unit 3b including the plurality of heat dissipation tubes 31b, and adjacent to the endothermic tube 31a in the refrigerant tank 3. (For example, in a soldered state) to the heat radiating tube 31b from the heat receiving fin 6a and the condensation section 3b. A molten state between the facing comprises an attachment (e. G. The soldering state) radiating fins (6b).

In this embodiment, as shown in FIG. 87, a plurality of cooling units are stacked on the cooling device 1. (In the present embodiment, three units are shown, two, four or more devices may be used. .)

The fluid separation plate 2 is integrally coupled (e.g., soldered) to one side wall surface of the enclosed space and both low temperature and high temperature communication pipes 34a and 34b, for example, formed of a metallic material such as aluminum. It constitutes the interior of the high temperature. The fluid separation plate 2 is formed with a plurality of holes inserted into the pipes 34a and 34b. As shown in Fig. 88, the low temperature side communication pipe 34a is alternately displaced. Although not shown, the hot side communication pipe 34b is also arranged in this manner.

In FIG. 86, the refrigerant tank 3a has a plurality of endothermic tubes 31a disposed substantially parallel to each other, and an endothermic side lower communication positioned below the endothermic tube 31a for communicating lower ends of the tubes 31a with each other. An endothermic side upper communication portion 42 positioned on the endothermic tube 31a for communicating the portion 41 and the upper end of the tube 31a is included. The endothermic tube 31a is each formed in the form of a flat tube having a long rectangular (or elliptical) cross section, and is formed of a metallic material (for example, aluminum or copper) having excellent thermal conductivity.

The condensation part 3b includes a plurality of heat dissipation tubes 31b disposed substantially parallel to each other, and a heat dissipation side lower communication part 43 positioned below the heat dissipation tube 31b so as to communicate the lower ends of the tubes 31b with each other. And a heat dissipation side upper communication portion 44 positioned on the heat dissipation tube 31b to communicate the upper end of the tube 31b. The heat dissipation tube 31b is also formed in the form of a flat tube having a long rectangular (or elliptical) cross section, respectively, and is formed of a metallic material (for example, aluminum or copper) having excellent thermal conductivity.

One end of the low temperature side communication pipe 34a communicates with the heat absorbing side lower communication part 41 of the refrigerant tank 3a, and the other end flows back to the refrigerant tank 3a after the refrigerant has condensed in the condensation part 3b. The condensation part 3b communicates with the heat dissipation side lower communication part 43 so that it may communicate. The connection between the low temperature side communication pipe 34a and the heat absorbing side lower communication portion 41 is assembled by the union 71 and the nut 70. More specifically, as shown in Fig. 89, the connecting portion has a union 71 formed by a tubular member integrally connected to communicate with the heat absorbing side lower communicating portion 41, and the cold side communicating pipe 34a is It fits into the union 71 suitably. The zero ring 72 for improving the airtightness is inserted between the union 71 and the communication pipe 34a so that both the union 71 and the pipe 34a are sealed to each other by a nut 70 as a fixing means. Communicating. The connection between the low temperature side communication pipe 34a and the heat dissipation side lower communication portion 43 is also assembled by the union 71 and the nut 70. Since this connection is the same as the connection between the communication pipe 34a and the heat absorbing side lower communication part 41, description thereof is omitted.

The low temperature side communication pipe 34a has a refrigerant pipe 60 and a refrigerant inlet 61 (shown in FIG. 87), and the refrigerant is sealed into the communication tube 34a from the outside through the refrigerant inlet 61. As shown in FIG. As shown in detail in FIG. 90, the coolant inlet 61 includes a union 73 formed by a pipe member into which a coolant pipe 60 is fitted, a valve 74 disposed in the union 73, and A packing 75 disposed to improve the airtightness between the valve 74 and the refrigerant pipe 60, and a zero ring 76 disposed to improve the airtightness between the valve 74 and the lateral direction of the refrigerant pipe. And a cap 77 fitted to seal on the valve 74 and a zero ring 78 disposed inside the cap to improve the airtightness of the cap 77.

One end of the high temperature side communication pipe 34b communicates with the heat absorbing side upper communication part 42 of the refrigerant tank 3a, and the other end thereof is the condensation part 3b after the refrigerant is boiled and evaporated in the refrigerant tank 3. Communicate with the heat dissipation side upper communication section 44 of the condensation section 3b. The connection between the high temperature side communication pipe 34b and the heat absorbing side upper communication part 42 and between the communication pipe 34b and the heat dissipation side upper communication part 44 are also assembled by the union 71 and the nut 70. . Since this connection is the same as the connection between the low temperature side communication pipe 34a and the heat absorbing side lower communication part 41, their description is omitted here.

The refrigerant is enclosed in the refrigerant tank 3a to a liquid level slightly lower than the heat absorbing side upper communication portion 42 of the refrigerant tank 3a. The refrigerant is sealed after the heat absorbing fins 6a and the heat radiating fins 6b are soldered to each of the heat absorbing tubes 31a and the heat radiating tubes 31b.

The heat receiving fins 6a are disposed between adjacent to the heat absorbing tube 31a, and at the same time, the heat radiating fins 6b are disposed between adjacent to the heat radiating tube 31b. Both pins 6a and 6b are corrugated pins formed by staggering pressing or bending a thin plate (having a plate thickness of approximately 0.02 to 0.05 mm) of high conducting metal (for example, aluminum) in a wavy shape. The fins 6a and 6b are soldered to the flat outer wall surfaces of each of the heat absorbing tube 31a and the heat radiating tube 31b. The heat sink fins 6a facilitate heat transfer from the high temperature fluid side to the refrigerant. At the same time, the fin 6a also improves the strength of the heat absorbing tube 31b. The heat dissipation fins 6b facilitate heat transfer of the refrigerant to the low temperature fluid side. At the same time, the strength of the heat radiation tube 31b is improved.

The procedure for mounting the cooling device 1 on the fluid separation plate 2 will be described in detail.

First, the refrigerant tank 3a and the condensation part 3b are formed to be separated. Therefore, the high temperature side communication pipe 34b is connected to the union 71 for communicating the heat absorbing side upper communication part 42 of the refrigerant tank 3a, and the low temperature side communication pipe 34a is connected to the heat absorbing side lower communication. It is connected to the union 71 which communicates the part 41. Next, both communicating pipes 34b and 34a are inserted into the holes formed in the fluid separation plate 2 and then connected to the hole portions, for example, by soldering. Therefore, the high temperature side communication pipe 34b is connected to the union 71 connecting the heat dissipation side communication pipe 44 of the condensation part 3b, and the low temperature side communication pipe 34a is the heat dissipation side lower communication part ( 43 is connected to the union 71 for connecting. Alternatively, the communication pipes 34b and 34a will first be connected to the condenser 3b side and then inserted into the holes of the fluid separation plate 2 and connected to the refrigerant tank 3a. However, in the case where the refrigerant inlet is attached to the communication pipe 34a, it is difficult for the inlet to pass through the hole, which makes the former mounting procedure simpler. The following will also be employed. First, the condensation part 3b and the high temperature side communication pipe 34b are connected together, and at the same time, the refrigerant tank 3a and the low temperature side communication pipe 34a are connected together. Then, each of these is inserted into a hole formed in the fluid separation plate 2, the condensation part 3b and the low temperature side communication pipe 34a are connected together, and also the refrigerant tank 3a and the high temperature side communication pipe 34b. ) Are linked together.

The operation of this embodiment is described below.

When the internal temperature of the enclosed space 15 in the casing 81 is not lower than the lower limit temperature (eg 0 ° C.), the electric motor of the two upper centrifugal blowers 18 and the two lower centrifugal blowers 15 The centrifugal fan starts operation by starting to supply electric current to the electric motor. As a result, the circulation flow of the hot air (clean inner air or inner fluid which does not contain foreign matter such as dust or moisture) is formed in the enclosed space 9 in the casing 81. In addition, a circulation flow of low temperature air (clean outside air or outside fluid containing no foreign matter such as dust or moisture) is formed inside the low temperature side heat transfer space 12 outside the casing 81.

Multiple layers of each of the cooling devices 1 are mounted through the fluid separation plate 2 of the casing 81, and the refrigerant enclosed in the refrigerant tank 3a receives heat transferred from the hot air through the heat receiving fins 6a. It is boiled and evaporated by receiving. The evaporated refrigerant is condensed on the inner wall surface of the condenser by receiving low temperature air at a low temperature. As a result of latent thermal condensation, it is transferred to the low temperature air through the heat radiation fins 6b.

The refrigerant thus condensed in the condensation unit 3b falls into the refrigerant tank 3a along the inner wall surface of the low temperature side communication pipe 34a due to its own weight. Therefore, the refrigerant enclosed in the heat absorbing tube 31a of the refrigerant tank 3a alternately repeats boiling and condensation. That is, the heat of the hot air is transferred to the low temperature air so that the heat generated from the electronic component 7 can be released to the plurality of layers of the cooling device 1.

Therefore, the electronic component 7 is circulated in the hot air (clean air in the casing 81) and the cold air circulated in the low temperature side heat transfer space 12 in the sealed space 9 into the high temperature side heat transfer space 11. It can be cooled without mixing (dirty air outside the casing 81).

Next, the effect of this embodiment is described.

In this embodiment, the refrigerant tank 3a, the condensation part 3b, the low temperature side communication pipe 34a and the high temperature side communication pipe 34b are sealed and mechanically used by the use of the union 71 and the nut 70. It can be easily connected. In other words, the number of mounting steps can be greatly reduced, and therefore it is possible to prevent deterioration of the mounting work for the fluid separation plate 2.

In addition, since the refrigerant tank 3a, the condensation unit 3b, the low temperature side communication pipe 3a and the high temperature side communication pipe 3b are simply and mechanically connected, the refrigerant tank 3a and the condensation unit 3b are Even when one needs to be replaced, one of these replacement parts can be easily replaced. That is, even in the case of a cooling device that does not have a predetermined level of airtightness contained between the plurality of cooling devices in the airtightness inspection after assembly, the cooling device can be easily replaced or repaired as such.

In this embodiment, the following additional effects may also be included.

(1) When connecting the low temperature and high temperature side communication pipes 34a and 34b together with the refrigerant tank 3a and the condensation part 3b, the heating step can be omitted. Therefore, it is possible to prevent a decrease in durability due to residual stress as well as deformation of a product size due to thermal deformation.

(2) Since a plurality of holes passing through the low temperature and high temperature side communication pipes 34a and 34b are formed in the fluid separation plate 2, the airtightness between the fluid separation plate 2 and the low temperature side communication pipe 34b Waterproofness can be improved. In this embodiment, a three-layer cooling device 1 is used, as a result of which it is necessary to use three low temperature side communication pipes 34a and three high temperature side communication pipes 34b. As shown in Fig. 88, the low temperature side communication pipe 34a is replaced with another one. Although not shown, the hot side communication pipe 34b is also replaced by another one. By this apparatus, even when the nut 70 (to be described later) is formed, the nuts 70 do not interfere with each other and it is possible to minimize the size in the stacking direction, thereby miniaturizing the cooling device 1. Let's do it.

(3) The refrigerant tank 3a includes a plurality of endothermic tubes 31a disposed substantially parallel to each other, and the endothermic side lower communication portion 41 positioned below the endothermic tube 31a has a tube ( The endothermic side upper communication part 42 located on the endothermic tube 31a and in communication with each other is connected to the tube 31a. The communication pipe is disposed substantially parallel to the endothermic tube 31a and also communicates with the endothermic side lower communication portion. Therefore, the cooling apparatus 1 can be miniaturized.

(4) Since the heat receiving fins 6a and the heat radiating fins 6b are attached to the refrigerant tank 3a and the condensation unit 3b in a molten state, respectively, they are mechanically attached to the refrigerant tank 3a and the condensation unit 3b, respectively. Compared with the attached fins 6a, 6b it is possible to reduce the thermal resistance between the fins and the cooling tube. As a result, the entire chiller can be further miniaturized compared to such mechanical connections.

(5) Since the gas which becomes hot due to the heat generated from the heat generating element 7 is smoothly introduced into the air flow path through the discharge port 13, it is possible to maintain a uniform internal temperature of the sealed space 9. Do. More specifically, since the gas heated by receiving heat from the heat generating element 7 rises into the sealed space 9 by convection, the discharge port 13 is preferably cooled in the sealed space 9. It will be formed on top of the enclosed space (9) to improve the efficiency. In other words, when the outlet port 13 is formed at a position lower than the fluid separation plate 2, in the relatively closed space 9, the low temperature gas is introduced into the air flow path 23 through the outlet port 13. In addition, since it is drawn to the refrigerant tank 3a, the cooling efficiency in the closed space 9 is not sufficient.

(6) In this embodiment, moreover, each of the cooling devices 1 in total is arranged long (horizontal in Fig. 90) and at the same time the refrigerant tank 3a and condensation in the heat transfer spaces 11 and 12 on the high and low temperatures. The gas passing through the portion 3b is bent so as to flow smoothly from the suction side discharge ports 13 and 16 toward the exhaust side discharge ports 14 and 17, respectively. Therefore, since the change in the flow direction of the gas passing through the refrigerant tank 3a and the condensation part 3b can be alleviated, it is possible to reduce the loss of the air flow path in a narrow space. As a result, the fan 15 disposed in the enclosed space 9 can be miniaturized, and the heat value of the fan 15 can be further reduced. Therefore, the amount of heat generated from the heat generating element 7 is a reduced heat value (i.e., the fan 15 is a large size for increasing the cooling capacity, and the heat value of the fan 15 increases; The amount of heat generated from the heat generating element 7 can not be increased).

(Example 26)

26 embodiments of the present invention are described below.

The structure of the cooling apparatus according to the present embodiment is the same as the 25th embodiment except for the connection between the low temperature side communication pipe 34a or the high temperature side communication pipe 34b and the refrigerant tank 3a or the condensation part 3b. Therefore, the connecting portion in this embodiment is described below.

In this embodiment, the connection between the low temperature side communication pipe 34a and the heat absorbing side lower communication part, the connection between the communication pipe 34a and the heat radiating side lower communication part 43, the high temperature side communication pipe 34b and the heat absorbing side The connection between the upper communication part 42 and the connection between the communication pipe 34b and the heat dissipation side upper communication part 44 have substantially the same configuration, and only the low temperature side communication pipe 34a and the heat absorbing side lower communication part 41 are provided. Will be described below.

Fig. 91 is a sectional view of the connection in this embodiment.

The connection between the low temperature side communication pipe 34a and the heat absorbing side lower communication part 41 is assembled by the union 71 and the nut 70. More specifically, the union 71 is assembled by a tube member integrally connected to the heat absorbing side lower communication portion 41 in communication with the low temperature side connection pipe 34a. The outer diameter of the union 71 fittingly fitted on the nut 70 is reduced, and the front end of the union 71 is tapered. The contact part of the low temperature side communication pipe 34a with the said union 71 is welded, and it contacts the tapered end of the union. The nut 70 fits snugly on the reduced diameter of the union portion 71 and deflects the communication pipe 34a towards the front end side of the union 71 so as to be sealedly connected therebetween.

In this embodiment, too, as in the 25th embodiment, the refrigerant tank 3a, the condenser 3b, the low temperature side communication pipe 34a, and the high temperature side communication pipe 34b are formed of the union 71 and the nut 70. It can be easily connected mechanically to seal by use. That is, the number of mounting steps can be greatly reduced, making it possible to prevent deterioration of the mounting work for the fluid separation plate 2.

Since the refrigerant tank 3a condensation unit 3b and the low temperature and high temperature side communication pipes 34a and 34b are simply and mechanically connected, it is necessary to exchange one of the refrigerant tank 3a and the condensation unit 3b. Even when it is possible to replace one of these replacement parts easily. That is, in the case of a cooling device that does not have a predetermined level of airtightness contained between the plurality of cooling devices in the airtightness inspection after being assembled, the cooling device can be easily replaced or repaired as described above.

Although the condensation part 3b is installed directly in the refrigerant tank 3a in this embodiment, both sides can be replaced from each other as shown in FIG.

Moreover, it is not always necessary to arrange the condensation part 3b and the refrigerant tank 3a in the same manner. For example, the condensation section 3b formed in the coolant tank 3a may be bent relative to the coolant tank 3a (for example, at right angles) (not shown), and the positional relationship may be used in the housing used. It can be changed depending on the form of. In this embodiment, the connection between the low temperature side communication pipe 34a or the high temperature side communication pipe 34b and the refrigerant tank 3a or the condensation part 3b is provided with a fixing member (union 71, nut 70 and the same). It is possible to change the installation type easily. In addition, the storage space thereof can be reduced as compared with the case where the refrigerant tank 3a or the condensation portion 3b and the communication pipe are previously integrally connected together.

In addition, the connection between the low temperature side connection pipe 34a and the refrigerant tank 3a and the connection between the communication pipe 34a and the condensation part 3b are not always required to be connected according to the present embodiment. At least one of the two connections may be connected according to this embodiment. In this way, at least one of the connection between the high temperature side communication pipe 34b and the refrigerant tank 3a and the connection between the communication pipe 34b and the condensation part 3b can be connected according to the present embodiment.

Although the present invention has been described fully with reference to the preferred embodiments with reference to the accompanying drawings, various modifications or changes are more apparent to those skilled in the art, and the invention defined in the appended claims. It should be understood that they fall within the scope of.

According to the present invention configured as described above, the cooling performance of the cooling device is improved by preventing the refrigerant circulation in the refrigerant flow path and bubble generation, and the effective heat exchange area of the boiling part is smaller than the condensing part, Miniaturization can be achieved, and maintenance of the air conditioner of the cooling device is improved, thereby providing a more economical and efficient cooling device.

Claims (70)

A refrigerant tank in which a refrigerant that receives heat from a high temperature portion and evaporates boiling is sealed; A radiator disposed above the refrigerant tank to radiate heat of the refrigerant evaporated and evaporated from the refrigerant tank to a low temperature portion lower than a temperature of the high temperature portion to condense the refrigerant; One side is sealed and in communication with the refrigerant tank, the other side is extended to the low temperature portion and is sealed and in communication with the radiator, the high temperature side communication pipe for introducing the refrigerant evaporated from the refrigerant tank to the radiator and condensed in the radiator A plurality of communication pipes including a low temperature side communication pipe for returning the liquefied refrigerant to the refrigerant tank; And Heat conduction suppression means for suppressing heat conduction between at least one of the refrigerant tank, the radiator, the high temperature portion and the low temperature portion and the communication pipe Cooling apparatus using boiling and evaporative refrigerant consisting of. The method of claim 1, The heat conduction inhibiting means is formed of a heat insulator and disposed between the coolant tank and the low temperature side communication pipe, and comprises a coolant tank side heat insulating material that suppresses heat conduction from the coolant tank to the low temperature side communication pipe. And a condenser refrigerant cooling device. The method of claim 1, The heat conduction inhibiting means is formed of a heat insulating material disposed between the radiator and the high temperature side communication pipe, the boiling and condensation refrigerant, characterized in that it comprises a heat radiation side heat insulating material for suppressing heat transfer from the high temperature side communication pipe to the radiator. Cooling device using. The method of claim 1, And said heat conduction inhibiting means comprises a heat insulating material covered by an outer circumferential portion of said low temperature side communication pipe to suppress heat transfer from said high temperature part to said low temperature side communication pipe. The method of claim 1, And the heat conduction inhibiting means includes a heat insulator covered on an outer circumference of the high temperature side communication pipe to suppress heat transfer from the high temperature side communication pipe to the low temperature part. The method of claim 1, The heat conduction inhibiting means is a cooling apparatus using a boiling and condensation refrigerant, characterized in that formed of a heat insulating material covering at least a portion of the outer peripheral portion of the low-temperature side communication pipe or the high-temperature side communication pipe. The method of claim 1, And the heat conduction inhibiting means is formed of a heat insulating material covering the entire outer circumference of the low temperature side communication pipe or the high temperature side communication pipe. The method of claim 1, The heat conduction inhibiting means is a cooling device using a boiling and condensation refrigerant, characterized in that formed of a foamed resin insulation. The method of claim 1, The hot portion has a hot passage through which the hot fluid flows, and the coolant tank is disposed in the hot passage; And the heat conduction inhibiting means has a hot side partition member for dividing the hot passage into the fluid separation plate and separating the cold side communication pipe toward a temperature region lower than the temperature of the hot passage. Used chiller. The method of claim 1, The low temperature portion has a low temperature passage through which a low temperature fluid flows, and the radiator is disposed in the low temperature passage; The heat conduction inhibiting means has a low temperature side partition member for dividing the low temperature passage into the fluid separation plate and separating the high temperature side communication pipe into a temperature region higher than the temperature of the low temperature passage. Chiller. The method of claim 1, The refrigerant tank is disposed in parallel with each other, a plurality of heat absorbing pipes, a heat absorbing side lower communication portion disposed under the plurality of heat absorbing pipes and in communication with the plurality of heat absorbing pipes, and disposed above the plurality of heat absorbing pipes. An endothermic side upper communication portion in communication with the plurality of endothermic pipes, The radiator is disposed in parallel with each other, a plurality of heat dissipation pipes disposed in parallel with each other, a heat dissipation side lower communication portion disposed under the plurality of heat dissipation pipes and in communication with the plurality of heat dissipation pipes, and disposed above the plurality of heat dissipation pipes. A heat dissipation side upper communication part in communication with the two heat dissipation pipes, The low temperature side communication pipe is generally disposed in parallel with the heat absorbing pipe to communicate with the heat absorbing side lower communication part and the heat dissipation side lower communication part, And the high temperature side communication pipe is generally parallel to the endothermic pipe to communicate with the endothermic side upper communication part and the heat dissipation side upper communication part. In the cooling device using a boiling and condensation refrigerant in which the hot fluid flowing to the hot portion is separated from the cold fluid flowing to the cold portion by a fluid separation plate, the heat of the hot fluid is transferred to the cold fluid, A refrigerant tank disposed on the high temperature fluid side from the fluid separation plate and containing a refrigerant that receives heat from the high temperature fluid and is boiled and evaporated; A communication pipe having one side sealed and communicating with the refrigerant tank, the other side extending to the low temperature fluid side to pass through the fluid separation plate; Sealed in communication with the other side of the communication pipe and disposed above the refrigerant tank at the low temperature fluid side from the fluid separation plate to radiate heat of the refrigerant boiled in the refrigerant tank to the low temperature fluid to condense the evaporative refrigerant. Radiator to make and liquefy; And And a heat conduction inhibiting means for suppressing heat conduction between at least one of said refrigerant tank, said radiator, said high temperature fluid and said low temperature fluid and said communication pipe. The method of claim 12, The communication pipe includes a high temperature side communication pipe for introducing the refrigerant evaporated and boiled in the refrigerant tank to the radiator, and a low temperature side communication pipe for returning the refrigerant condensed from the radiator to the refrigerant tank. And a condenser refrigerant cooling device. The method of claim 13, And the heat conduction inhibiting means comprises a coolant tank side heat insulating material formed of a heat insulating material and disposed between the coolant tank and the low temperature side communication pipe to suppress heat conduction from the coolant tank to the low temperature side communication pipe. Chiller using condensation refrigerant. The method of claim 13, The heat conduction inhibiting means is formed of a heat insulating material disposed between the radiator and the high temperature side communication pipe, the boiling and condensation refrigerant, characterized in that it comprises a heat radiation side heat insulating material for suppressing heat transfer from the high temperature side communication pipe to the radiator. Cooling device using. The method of claim 13, And the heat conduction inhibiting means includes a heat insulator covered on an outer circumferential portion of the high temperature side communication pipe to inhibit heat transfer from the high temperature part to the low temperature side communication pipe. The method of claim 13, And the heat conduction inhibiting means includes a heat insulator covered on an outer circumferential portion of the high temperature side communication pipe to suppress heat conduction from the high temperature side communication pipe to the low temperature part. The method of claim 13, The heat conduction inhibiting means is a cooling apparatus using a boiling and condensation refrigerant, characterized in that formed of a plurality of the low-temperature side communication pipe or at least a portion of the outer peripheral portion of the high-temperature side communication pipe covering. The method of claim 13, And the heat conduction inhibiting means is formed of a heat insulating material covering the entire outer circumference of the low temperature side communication pipe or the high temperature side communication pipe. The method of claim 12, The heat conduction inhibiting means is a cooling device using a boiling and condensation refrigerant, characterized in that formed of a foamed resin insulation. The method of claim 13, The high temperature portion has a high temperature passage through which a high temperature fluid flows, the refrigerant tank is disposed in the high temperature passage, And the heat conduction inhibiting means has a hot side partition member for dividing the high temperature passage into the fluid separation plate and separating the low temperature side communication pipe into a temperature region lower than the temperature in the high temperature passage. Used chiller. The method of claim 13, The low temperature portion has a low temperature passage through which low temperature fluid flows, and the radiator is disposed in the low temperature passage, The heat conduction inhibiting means has a low temperature side partition member for dividing the low temperature passage into a fluid separation plate and separating the high temperature side communication pipe into a temperature region higher than the temperature in the low temperature passage. Chiller. The method of claim 13, The refrigerant tank may include a plurality of endothermic pipes disposed substantially parallel to each other, a heat absorbing side lower communication portion disposed under a plurality of endothermic pipes and communicating with the plurality of endothermic pipes, and disposed on an upper portion of the plurality of endothermic pipes. An endothermic side upper communication portion in communication with the endothermic pipe, The radiator may include a plurality of heat dissipation pipes disposed substantially parallel to each other, a lower heat dissipation side communication portion disposed under the plurality of heat dissipation pipes to communicate with the plurality of heat dissipation pipes, and disposed on an upper portion of the plurality of heat dissipation pipes. Including a communicating upper radiation side communication portion, The low temperature side communication pipe is disposed substantially parallel to the endothermic pipe so as to communicate with the endothermic side lower communication part and the heat dissipation side lower communication part; And the high temperature side communication pipe is disposed substantially parallel to the heat dissipation pipe to communicate with the heat absorbing side upper communication part and the heat dissipation side upper communication part. The method of claim 12, A sealed casing having an inner space in which the electrical installation which generates heat when operated is received; An internal circulation fan disposed in an internal communication chamber in communication with the internal space of the casing, and configured to generate the hot fluid in the internal communication chamber by circulating air in an area including the electric device; And And a closed-casing cooling unit disposed in an external communication chamber in communication with the outside of the casing, the sealed casing cooling unit including an external circulation fan circulating air through the outside to generate the low temperature fluid in the external communication chamber. And the coolant tank is disposed in the inner communication chamber, and the radiator is disposed in the outer communication chamber. In the cooling device using a boiling and condensation refrigerant in which a high temperature fluid is separated from a low temperature fluid by a fluid separation plate, the heat of the high temperature fluid is transferred to the low temperature fluid, A refrigerant tank disposed on the high temperature fluid side from the fluid separation plate, the refrigerant tank containing a refrigerant that receives heat from the high temperature fluid and is boiled and evaporated, and one side of the fluid separation plate is in communication with the refrigerant tank, and the other side is connected to the fluid separation plate. A high-temperature side communication pipe extending to the low temperature fluid side to pass through and introducing the evaporated refrigerant boiled in the refrigerant tank, the refrigerant being disposed above the refrigerant tank at the low temperature fluid side from the fluid separation plate, A radiator for dissipating heat to condense and liquefy the refrigerant, and a low temperature side that extends to the hot fluid side so that one side is sealedly communicated with the radiator and the other side passes through the fluid separation plate to return the condensed liquefied refrigerant from the radiator It has a plurality of cooling units including a communication pipe, the plurality of The cooling unit is disposed in parallel with each other, whereby, the refrigerant tank is arranged in parallel to each other, the radiators are arranged in parallel to each other a heat exchanger; A high temperature passage through which the high temperature fluid flows and the plurality of refrigerant tanks are disposed; A low temperature passage through which the low temperature fluid flows and the plurality of radiators are disposed; A high temperature partition member that divides the high temperature side passage by the fluid separation plate and separates the low temperature side communication pipe into a temperature region lower than the temperature in the high temperature passage; And Cooling using a boiling and condensation refrigerant, characterized in that the low-temperature side partition member for dividing the low-temperature side communication passage by the fluid separation plate and separating the high-temperature side communication pipe to a temperature region higher than the temperature in the low-temperature passage. Device. The method of claim 25, A casing having an inner space in which the electrical equipment for generating heat during operation is received; An internal circulation fan disposed in an internal communication chamber in communication with the internal space of the casing, and configured to generate the high temperature fluid in the internal communication chamber by circulating air in an area including the electric device; And A casing-shaped cooling unit disposed in an external communication chamber in communication with the outside of the casing, the casing-shaped cooling unit including an external circulation fan circulating air through the outside to generate the low temperature fluid in the external communication chamber, And the coolant tank is disposed in the internal communication chamber, and the radiator is disposed in the external communication chamber. In the cooling device using a boiling and condensation refrigerant in which the hot fluid flowing to the hot portion is separated from the cold fluid flowing to the cold portion by the fluid separation plate, the heat of the hot fluid is transferred to the cold fluid, A refrigerant tank disposed on the high temperature fluid side from the fluid separation plate and containing a refrigerant that receives heat from the high temperature fluid and is boiled and evaporated; A communication pipe having one side sealed to the refrigerant tank and communicating with the other side extending to the low temperature fluid side to pass through the fluid separation plate; And It is disposed above the refrigerant tank from the fluid separation plate to the upper side of the refrigerant tank and sealed and communicated with another axis of the communication pipe, and radiates heat of the refrigerant boiled and evaporated from the refrigerant tank to the low temperature part to condense the refrigerant. And a radiator for liquefying, And said communication pipe is disposed in an area separate from said hot fluid and said cold fluid. The method of claim 27, The communication pipe includes boiling and condensation comprising a high-temperature side communication pipe for introducing refrigerant evaporated and boiled in the refrigerant tank into the radiator, and a low-temperature side communication pipe for returning the refrigerant condensed and liquefied in the radiator to the refrigerant tank. Cooling device using refrigerant. The method of claim 27, An enclosed casing having an inner space in which the electrical equipment which generates heat during operation is accommodated; An internal circulation fan disposed in an internal communication chamber in communication with the internal space of the casing, and configured to generate the hot fluid in the internal communication chamber by circulating air in an area including the electric device; And And a closed-casing cooling unit disposed in an external communication chamber in communication with the outside of the casing, the sealed casing cooling unit including an external circulation fan circulating air through the outside to generate the low temperature fluid in the external communication chamber. And the coolant tank is disposed in the internal communication chamber, and the radiator is disposed in the external communication chamber. In the cooling device using a boiling and condensation refrigerant in which a high temperature fluid is separated from a low temperature fluid by a fluid separation plate, the heat of the high temperature fluid is transferred to the low temperature fluid, A refrigerant tank in which a refrigerant that receives heat from a high temperature fluid and boils is evaporated; A high temperature side communication pipe on which one side communicates with the refrigerant tank and the other side extends to the low temperature fluid side to pass through the fluid separation plate to introduce refrigerant evaporated and boiled in the refrigerant tank; A radiator disposed above the refrigerant tank and sealed in communication with the other side of the high temperature side communication pipe, and radiating the refrigerant evaporated from the refrigerant tank with the low temperature fluid to condense and liquefy the refrigerant; One side is sealed and in communication with the radiator, and the other side is in communication with the refrigerant tank so as to pass through the fluid separation plate comprises a low-temperature side communication pipe for condensing and liquefied refrigerant in the radiator to the refrigerant tank, And the low temperature side communication pipe is arranged to form a predetermined interval with the refrigerant tank, and the high temperature side communication pipe is arranged to form a predetermined interval with the radiator. The method of claim 30, A plurality of endothermic pipes in which the refrigerant tanks are disposed substantially parallel to each other, an endothermic side lower communication portion disposed under the plurality of endothermic pipes and in communication with the plurality of endothermic pipes, and disposed above the plurality of endothermic pipes; An endothermic side upper communication portion in communication with the two endothermic pipes, wherein the refrigerant tank is disposed on the hot side fluid side from the fluid separation plate; The high temperature side communication pipe is a tubular member, one side is sealedly communicated with the heat absorbing side upper communication part, the other side extends to the low temperature side fluid side to pass through the fluid separation plate, and the high temperature side communication pipe is the heat dissipation pipe. And are generally parallel to; The radiator may include a plurality of heat dissipation pipes disposed substantially parallel to each other, a heat dissipation side lower communication portion disposed under the plurality of heat dissipation pipes and in communication with the plurality of heat dissipation pipes, and disposed above the plurality of heat dissipation pipes. And a heat dissipation side upper communication portion in communication with the heat dissipation pipe and in communication with the other side of the high temperature side communication pipe, wherein the heat dissipator is disposed above the refrigerant tank at the low temperature fluid side from the fluid separation plate to boil in the refrigerant tank. Heat dissipating heat of the evaporated refrigerant into the low temperature fluid to condense and liquefy the refrigerant; The low temperature side communication pipe is a tubular member, one side is sealed and in communication with the heat dissipation side lower communication pipe and the other side is in communication with the heat absorbing side lower communication part so as to pass through the fluid separation plate, the low temperature side communication pipe is the endothermic Cooling apparatus using boiling and condensation refrigerant, characterized in that arranged in parallel with the pipe. In the boiling and condensation refrigerant using chiller for cooling the heating element, Refrigerant tank for receiving the heat generated from the heating element to receive the refrigerant evaporated by boiling; A radiator for cooling and liquefying the refrigerant evaporated from the refrigerant tank; The refrigerant tank A vapor passage through which heat is evaporated from the heat generating element communicating with each other at a lower portion thereof, and a condensate passage through which a refrigerant condensed and liquefied by the radiator flows; And And a heat transfer reducing structure provided between the steam passage and the condensate passage to reduce the amount of heat transferred from the steam passage side to the condensate passage side. 33. The method of claim 32, The refrigerant tank includes a heat insulating passage formed between the vapor passage and the condensate passage as a heat transfer reduction structure, Cooling apparatus using a boiling and condensation refrigerant, characterized in that the interior of the heat insulating passage is filled with a refrigerant. The method of claim 33, wherein Cooling apparatus using boiling and condensation refrigerant, characterized in that the inner fin is provided in the heat insulating passage. The method of claim 33, wherein And the heat insulating passage has an inner wall surface formed in a concave-convex shape. 33. The method of claim 32, And the refrigerant tank has a support wall portion for dividing between the steam passage and the condensate passage, and the support wall portion has a reduced portion of a reduced cross-sectional area as a heat transfer reducing structure. 33. The method of claim 32, And the refrigerant tank has a support wall portion that divides the vapor passage and the condensate passage, and an air-cooling fin as the heat transfer structure is formed outside the support wall portion. 33. The method of claim 32, The refrigerant tank is a cooling apparatus using a boiling and condensation refrigerant, characterized in that configured by the extrusion member produced by extrusion processing. A fluid separator for separating hot fluid and cold fluid from each other, and A boiling portion disposed to pass through the fluid separation plate and disposed on the high temperature fluid side from the fluid separation plate to receive heat from the high temperature fluid and to boil the refrigerant encapsulated therein, and to the low temperature fluid side from the fluid separation plate And condensing the evaporative refrigerant by dissipating the heat of the evaporative refrigerant evaporated in the boiling part with a low temperature fluid, and arranged in multiple layers in the flow direction of the high temperature fluid and the low temperature fluid, whereby the two fluids are opposed to each other. A heat exchanger having a cooling unit flowing in a direction; A casing in which a housing has the fluid separation plate as one wall and whose inside is sealed from the outside; An inner passage formed in the casing and having a hot fluid flowing therein and having the boiling portion therein; An outer passage formed outside the casing and sealed off from the inner passage by the casing and having a low temperature fluid flowing therein and having the condensation therein; Internal fluid circulation means for forcibly circulating a high temperature fluid from the second and subsequent layers of the cooling unit to the first layer in the inner passage; And And an external fluid circulation means for circulating the low temperature fluid from the first layer to the second layer and the continuous layer of the cooling unit in the outer passage. The method of claim 39, The fluid separation plate has a separation unit for separating hot fluid and low temperature fluid, the separation unit is a cooling device using a boiling and condensation refrigerant, characterized in that formed in a thin plate shape or irregularities. A fluid separator for separating hot fluid and cold fluid from each other, and A boiling part arranged on the hot fluid side from the fluid separation plate to receive heat from the hot fluid and boiling the refrigerant sealed therein, and a heat of the evaporative refrigerant disposed on the low temperature fluid side from the fluid separating plate and evaporated in the boiling part And a condensation unit for condensing evaporative refrigerant by dissipating heat into a low temperature fluid, and a connection pipe arranged to pass through the fluid separation plate to seal and connect the boiling portion and the condensation portion to each other, A heat exchanger having a cooling unit disposed in layers, whereby the two fluids flow in opposite directions; A casing in which a housing has the fluid separation plate as one wall and whose inside is sealed from the outside; An inner passage formed in the casing, the inner passage for flowing a high temperature fluid and accommodating the boiling portion therein; An outer passage formed outside the casing, sealed from the inner passage by the casing, separated from the inner passage, and having a low temperature fluid flowing therein to accommodate the condensation therein; Internal fluid circulation means for forcibly circulating hot fluid from the second and subsequent layers of the cooling unit to the first layer of the cooling unit in the inner passage; And And an external fluid circulation means for circulating the low temperature fluid from the first layer of the cooling unit to the second and successive layers of the cooling unit in the outer passage. The method of claim 41, wherein The fluid separation plate has a separation unit for separating hot fluid and low temperature fluid from each other, the separation unit is a cooling device using a boiling and condensation refrigerant, characterized in that formed in a thin plate shape or irregularities. The method of claim 41, wherein The fluid separation plate has a through hole into which the connecting pipe of a plurality of layers is inserted; The cooling unit has a split packing for sealing and holding the connecting pipe in a plurality of layers, the split packing has a slot formed at its outer circumference such that a separator plate is inserted, and an edge portion of the through hole of the fluid separation plate is the slot. Is inserted into the And the cooling unit has a sealing material for sealing between the through-hole of the fluid separation plate and the slot of the split packing and between the connecting pipe and the split packing of a plurality of layers. . A fluid separation plate having a separation part for separating a high temperature fluid and a low temperature fluid from each other, the separation part having a thin plate shape or an uneven shape; A boiling portion disposed to penetrate through the fluid separation plate and positioned at a high temperature fluid side with respect to the fluid separation plate to receive heat from the high temperature fluid and to boil the refrigerant encapsulated therein, and a low temperature fluid side with respect to the fluid separation plate A heat exchanger having a cooling unit positioned at and having a condensation unit configured to condense the evaporative refrigerant by dissipating heat of the evaporative refrigerant evaporated in the boiling section with a low temperature fluid; A casing in which a housing has the fluid separation plate as one wall and whose inside is sealed from the outside; An inner passage formed in the casing and configured to receive a boiling part therein, wherein a hot fluid flows; An outer passage formed outside the casing and sealed off from the inner passage by the casing, and having a low temperature fluid flowing therein to accommodate the condensation therein; Internal fluid circulation means for forcibly circulating hot fluid from the second and subsequent layers of the cooling unit to the first layer of the cooling unit in the inner passage; And And an external fluid circulation means for forcibly circulating the low temperature fluid from the first layer of the cooling unit to the second and subsequent layers of the cooling unit in the outer passage. A fluid separation plate having a separation part for separating a high temperature fluid and a low temperature fluid from each other, wherein the separation part is formed in a thin plate shape or an uneven shape; A boiling portion located on the hot fluid side with respect to the fluid separation plate to receive heat from the hot fluid and boiling the enclosed refrigerant, and evaporation located on the cold fluid side with respect to the fluid separation plate and evaporated in the boiling part A heat exchanger having a condensation unit for condensing evaporative refrigerant by dissipating heat of the refrigerant with a low temperature fluid, and a cooling unit disposed to pass through the fluid separation plate, and a connection pipe sealingly connecting the boiling portion and the condensation unit to each other; A casing in which a housing has the fluid separation plate as one wall and whose inside is sealed from the outside; An inner passage formed in the casing and configured to receive a boiling part therein, wherein a hot fluid flows; An outer passage formed outside the casing, separated from the inner passage by the casing, separated from the inner passage, and having a low temperature fluid therein, and accommodating the condensation portion therein; Internal fluid circulation means for forcibly circulating hot fluid from the second and subsequent layers of the cooling unit to the first layer of the cooling unit in the inner passage; And And an external fluid circulation means for forcibly circulating the low temperature fluid from the first layer of the cooling unit to the second and subsequent layers of the cooling unit in the outer passage. A sealed casing having an interior sealed from the outside to separate the inner fluid from the outer fluid; Internal fluid circulation means for forcibly circulating the internal fluid in the casing; An internal heat exchanger disposed within the casing for receiving heat from the inner fluid and transferring heat towards the outer fluid; An external heat exchanger disposed outside the casing to radiate heat received from the internal fluid to the external fluid; An internal heater disposed in the casing to heat the internal fluid; And the internal heater is disposed downstream of the internal heat exchanger in a flow direction of the internal fluid. 47. The method of claim 46 wherein The internal heater is a cooling device using a boiling and condensation refrigerant, characterized in that it comprises a heat radiation fin having a fine pin-pitch. 47. The method of claim 46 wherein The casing is provided with a guide shaft provided on a side from one side of the casing, an opening side bracket disposed on the opening side in the casing, and a casing within the casing to connect with an opening for mounting and detaching the internal heater. A rear side bracket disposed rearward with respect to the opening side and facing the opening side bracket, wherein the opening side bracket, the rear bracket, and the guide shaft pass through the opening side bracket; The internal heater comprises an opening side flange at the opening side and a rear flange at an inner side with respect to the opening side, The open side flange comprises an open side recess in which a guide shaft is fitted from its side, and fixing means for fixing the open side bracket; The rear flange includes a rear recess into which the guide shaft is fitted from its side and binding means for fixing the flange and the rear bracket in a direction perpendicular to the axial direction of the guide shaft. Used chiller. The method of claim 48, The binding means includes a fin provided in the rear bracket and a hole formed in the rear flange, wherein the pin is engaged with the hole, the cooling device using a boiling and condensation refrigerant. A sealed casing having an interior sealed from the outside to separate the inner fluid from the outer fluid; And a cooling unit disposed in the casing to transfer the heat of the inner fluid in the casing to the outer fluid outside the casing. The cooling unit An internal heat exchanger disposed inside the casing for receiving a heat from the internal fluid and constructing a boiling portion for boiling the refrigerant enclosed therein; An external heat exchanger disposed in the casing for constituting a condensation unit for dissipating the heat of the evaporative refrigerant boiled in the boiling section with an external fluid to condense the evaporative refrigerant; A connecting pipe disposed to pass through the casing and sealingly connecting the internal heat exchanger and the external heat exchanger; A heat receiving fin provided in the internal heat exchanger to receive heat from the internal fluid; And A heat dissipation fin provided to the external heat exchanger to radiate heat to an external fluid; And a pin pitch P1 of the heat sink fins and a pin pitch P2 of the heat sink fins satisfy a relationship of P1 < P2. 51. The method of claim 50, And the inner heat exchanger and the outer heat exchanger are disposed on substantially the same plane so as to be deflected from each other in the width direction. The method of claim 51, A first connecting pipe provided on one side of the inner heat exchanger for connecting an upper portion of the inner heat exchanger to an upper portion of the outer heat exchanger; And And a second connection pipe provided on one side of the external heat exchanger to connect a lower portion of the internal heat exchanger to a lower portion of the external heat exchanger. 51. The method of claim 50, The cooling unit is a cooling device using a boiling and condensation refrigerant, characterized in that the inner and outer fluids are arranged in a plurality of layers in the flow direction of the inner fluid and the outer fluid flow in the opposite direction to each other. The method of claim 51, Means for forming an internal passage in the casing, wherein the internal heat exchanger is disposed and the internal fluid flows; Means for forming an outer passage in which the outer heat exchanger is disposed, the outer passage through which an outer fluid flows outside the casing sealed from the inner passage by the casing; Internal fluid circulation means for forcibly circulating the internal fluid in the internal passage; And And an external fluid circulation means for forcibly circulating the external fluid in the external passage. A casing having an interior; A fluid separation plate for dividing the interior into a first heat transfer space and a second heat transfer space; It is arranged to pass through the fluid separation plate, and the inside of the refrigerant having a boiling portion that receives the heat from the hot fluid boiled and the condensation portion that the evaporative refrigerant boiled in the boiling portion radiates its heat with the low temperature fluid to condense Thermosiphon type heat exchanger; First forced circulation means having a first rotor for forcibly circulating high-temperature fluid in the first heat transfer space and a first actuator for rotating the first rotor; And A second forced circulation means having a second rotor for forcibly circulating low-temperature fluid in the second heat transfer space and a second actuator for rotating the second rotor, The first and second forced circulation means are respectively disposed in the upper and lower parts of the heat exchanger in the casing, The first and second actuators are cooling devices using boiling and condensation refrigerant, characterized in that the removable from the upper and lower portions of the heat exchanger, respectively. A casing having an interior; A fluid separation plate for dividing the interior into a first heat transfer space and a second heat transfer space; It is arranged to pass through the fluid separation plate, the refrigerant contained therein is a boiling portion that receives the heat from the high-temperature fluid boils and the condensation portion that the evaporative refrigerant boiled in the boiling portion radiates its heat with the low temperature fluid to condense Thermosiphon type heat exchanger; First forced circulation means having a first rotor for forcibly circulating high-temperature fluid in the first heat transfer space and a first actuator for rotating the first rotor; And A second forced circulation means having a second rotor for forcibly circulating low-temperature fluid in the second heat transfer space and a second actuator for rotating the second rotor, One of the first and second heat transfer spaces communicates with the outside, One of the first and second rotors is disposed in a rotor case that separates the first and second heat transfer spaces from each other, Cooling apparatus using a boiling and condensation refrigerant, characterized in that one of the first and second actuators disposed on the one side of the heat transfer space has a separating portion forming a portion of the rotor case. The method of claim 56, wherein And the separating part of the one actuator forms a part of a water intrusion preventing means for preventing water from being introduced. The method of claim 55, The first and second forced circulation means A fan constituting the rotor; A drive motor constituting the actuator; A fan case covering an outer circumference of the fan, the fan case having at least one fluid inlet port and at least one fluid outlet port, and having a forced circulation flow path therein; A heat transfer acceleration plate disposed between the fan case and the drive motor to fix the drive motor; And A side plate for holding said heat transfer accelerator plate with said drive motor; The fan case has a fan mounting opening, the diameter of the opening is larger than the outer diameter of the fan, The heat transfer acceleration plate is a cooling device using a boiling and condensation refrigerant, characterized in that fixed to the fan case detachably. The method of claim 58, The heat transfer accelerator plate is a cooling device using a boiling and condensation refrigerant, characterized in that formed of a material having excellent thermal conductivity. The method of claim 58, The heat transfer accelerator is a cooling device using a boiling and condensation refrigerant, characterized in that formed of a metal material containing aluminum as a main component. The method of claim 58, And a heat dissipation accelerator having a columnar groove is provided on the surface of the fan of the heat transfer accelerator. The method of claim 58, Cooling apparatus using a boiling and condensation refrigerant, characterized in that the fluid stirring portion formed in the irregular shape, corrugated or sawtooth shape is integrally provided on the surface of the fan of the side plate. The method of claim 58, The fan case A weir portion formed on the bottom of the fan case to prevent water droplets containing a low temperature fluid from leaking from the bottom of the fan case; And And a droplet discharge port formed integrally with the fluid discharge port and discharging droplets stagnant on the bottom of the fan case to the outside. The method of claim 63, wherein The droplet discharge port is a cooling device using a boiling and condensation refrigerant, characterized in that having a bottom inclined toward the outside. In a boiling and condensing refrigerant utilization chiller wherein the hot medium is separated from the cold medium by a fluid separation plate, and the heat of the hot medium is transferred to the hot medium. A refrigerant tank disposed on the high temperature medium side from the fluid separation plate and containing a refrigerant that receives heat from the high temperature fluid and is boiled and evaporated; A communication pipe having one side sealed to the refrigerant tank and communicating with the other side extending to the low temperature medium side through the fluid separation plate; The heat of the refrigerant communicated with the other side of the communication pipe and disposed above the refrigerant tank on the low temperature medium side from the fluid separation plate and boiled in the refrigerant tank to radiate heat to the low temperature medium to condense and liquefy the evaporation refrigerant. Condensation unit to make; A heat sink fin attached to the refrigerant tank in a molten state; And And heat conduction suppression means for suppressing heat conduction between at least one of the refrigerant tank, the radiator, the high temperature portion, and the low temperature portion and the communication pipe; The communication pipe is a cooling device using a boiling and condensation refrigerant, characterized in that connected by sealing means detachably sealed to at least one of the refrigerant tank and the condensation unit. 66. The method of claim 65, Further comprising a tubular member integrally connected to at least one of the refrigerant tank and the condensation unit, Cooling apparatus using a boiling and condensation refrigerant, characterized in that the communication pipe is detachably sealed by a fastening means connected. 66. The method of claim 65, The communication pipe includes a high temperature communication pipe for transferring the refrigerant boiled and evaporated in the refrigerant tank to the condenser, and a low temperature side communication pipe for returning the refrigerant condensed in the condenser to the refrigerant tank; The high temperature side communication pipe has a high temperature side connection connected to the refrigerant tank; The low temperature side communication pipe has a low temperature side connection connected to the refrigerant tank; And the high temperature side connection and the low temperature side connection are located on a high temperature side medium with respect to the medium separation plate. 66. The method of claim 65, The communication pipe includes a high temperature side communication pipe for delivering the refrigerant evaporated and boiled in the refrigerant tank to the condensation unit, and a low temperature side communication pipe for returning the refrigerant condensed in the condensation unit to the condensation tank, The hot side communication pipe has a hot side connection connected to the condensation unit; The cold side communication pipe has a cold side connection connected to the condensation unit; And the high temperature side connection and the low temperature side connection are located on the low temperature medium side with respect to the medium separating means. The method of claim 67, The refrigerant tank may include a plurality of endothermic pipes disposed substantially parallel to each other, an endothermic side lower communication portion formed under the plurality of endothermic pipes to communicate lower portions of the endothermic pipes with each other, and the endothermic pipes above the plurality of endothermic pipes. An endothermic side upper communicating portion communicating with an upper portion of each other; The condensation part is formed on a plurality of heat dissipation tubes disposed substantially parallel to each other, a heat dissipation side lower communication portion formed under the plurality of heat dissipation tubes to communicate with each other, and formed on an upper portion of the heat dissipation tubes. A heat dissipation side upper communication part communicating the upper part with each other; The high temperature side communication pipe communicates between the heat absorbing side upper communication part and the heat dissipation side upper communication part; And the low temperature side communication pipe communicates between the endothermic side lower communication part and the heat dissipation side lower communication part. 66. The method of claim 65, And the high temperature medium is a high temperature fluid, and the low temperature medium is a low temperature fluid.

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