KR100253357B1 - Apparatus for measuring interface roughness using scm - Google Patents

Apparatus for measuring interface roughness using scm Download PDF

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KR100253357B1
KR100253357B1 KR1019970061760A KR19970061760A KR100253357B1 KR 100253357 B1 KR100253357 B1 KR 100253357B1 KR 1019970061760 A KR1019970061760 A KR 1019970061760A KR 19970061760 A KR19970061760 A KR 19970061760A KR 100253357 B1 KR100253357 B1 KR 100253357B1
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roughness
oxide film
specimen
measuring
interface
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KR1019970061760A
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KR19990041203A (en
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김영철
정칠성
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김영환
현대반도체주식회사
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/34Measuring arrangements characterised by the use of electric or magnetic techniques for measuring roughness or irregularity of surfaces
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/30Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring roughness or irregularity of surfaces
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

PURPOSE: An interfacial surface roughness measuring device is provided to measure a roughness of an interfacial surface precisely with a SCM by separating roughness of the interface and roughness of the surface from thickness of an oxide film. CONSTITUTION: A roughness measuring apparatus of an interface comprises a finding indicator(13) reflecting light having the designated frequency according to roughness of a test piece(23) with adjusting an angle; a detecting unit(12) detecting the roughness of the surface by the light reflected from the indicator; a sensor(21) detecting the surface roughness and the interface roughness of an oxide film(22) by variables of capacitance generated in the test piece in applying direct current and alternating current to the indicator and the test piece; and a lock-in amplifier(20) amplifying and outputting an output signal of the sensor. The surface roughness of the test piece, and the roughness of the interfacial surface between the oxide film and silicon are detected with measuring the angle change of the light reflected by the indicator.

Description

에스씨엠을 이용한 계면거칠기 측정장치{APPARATUS FOR MEASURING INTERFACE ROUGHNESS USING SCM}Interfacial roughness measuring device using SMC M {APPARATUS FOR MEASURING INTERFACE ROUGHNESS USING SCM}

본 발명은 에스씨엠을 이용한 계면거칠기 측정장치에 관한 것으로, 특히 산화막의 표면거칠기와 계면거칠기를 분리 측정할 수 있도록 한 에스씨엠을 이용한 계면거칠기 측정장치에 관한 것이다.The present invention relates to an apparatus for measuring interfacial roughness using SCM, and more particularly, to an apparatus for measuring interfacial roughness using SCM to separately measure surface roughness and interfacial roughness of an oxide film.

일반적으로 에스씨엠은 도우펀트 프로파일 측정용으로 개발된 장치로서, 이와같은 에스씨엠을 이용한 도우펀트 프로파일 측정을 첨부한 도면을 참조하여 설명하면 다음과 같다.In general, SCM is a device developed for measuring a dopant profile, which will be described below with reference to the accompanying drawings for measuring a dopant profile using SMC.

도1은 종래 에스씨엠을 이용한 표면 거칠기 측정장치에 대한 구성을 보인 블록도로서, 이에 도시된 바와같이 일정한 주파수를 가진 빛을 방출하는 레이저다이오드(10)와; 상기 레이저다이오드(10)로부터 방출된 빛을 적정각으로 반사하는 거울(11)과; 시편표면(14)에 접촉한 후 상기 거울(11)에 의해 반사된 빛을 상기 시편표면(14)의 거칠음에 따라 각을 변화하여 반사하는 탐지침(13)과; 상기 탐지침(13)으로부터 반사된 빛을 입력받아 그에 따라 표면의 거칠기를 검출하는 검출부(12)와; 상기 시편(14)을 스캔하는 스캐너(15)로 구성되며, 이와같이 구성된 종래 장치의 동작을 설명하면 다음과 같다.Figure 1 is a block diagram showing a configuration for a surface roughness measuring apparatus using a conventional SMC, as shown in the laser diode 10 for emitting light having a constant frequency; A mirror 11 reflecting light emitted from the laser diode 10 at an appropriate angle; A detector needle 13 which contacts the specimen surface 14 and reflects the light reflected by the mirror 11 at varying angles according to the roughness of the specimen surface 14; A detector 12 receiving light reflected from the detector 13 and detecting roughness of the surface accordingly; It is composed of a scanner 15 for scanning the specimen 14, the operation of the conventional device configured as described above is as follows.

먼저, 탐지침(13) 끝부분에 있는 팁을 시편표면(14)에 접촉한후 스캐너(15)로 스캔을 하고, 이에따라 상기 시편표면(14)의 거칠기에 따라 상기 탐지침(13)이 움직이게 된다.First, the tip at the end of the probe 13 is in contact with the specimen surface 14 and then scanned by the scanner 15, and accordingly the probe 13 moves according to the roughness of the specimen surface 14 do.

이때, 상기 시편표면(14)의 거칠기는 상기 탐지침(13) 끝부분에 있는 팁(TIP)의 반대면에 반사되는 빛의 각도 변화를 검출부(12)가 검출하여 측정한다.At this time, the roughness of the specimen surface 14 is detected by the detector 12 detects the change in the angle of the light reflected on the opposite surface of the tip (TIP) at the end of the detection needle (13).

즉, 레이저다이오드(10)에서 방출되는 빛을 거울(11)을 이용하여 스캐너(15)에 의해 움직이는 상기 탐지침(13)의 후면에 조사하고, 이때 반사되는 빛의 각도변화를 검출부(12)를 이용하여 측정함으로써 시편표면(14)의 거칠기를 판단한다.That is, the light emitted from the laser diode 10 is irradiated to the rear surface of the detection needle 13 which is moved by the scanner 15 using the mirror 11, and at this time, the angle change of the reflected light is detected by the detection unit 12. The roughness of the specimen surface 14 is determined by measuring using.

여기서, 계면거칠기는 표면층인 산화막을 제거하여 상기 시편표면(14)의 거칠기를 측정하는 방법과 동일한 방법으로 측정한다.Here, the interfacial roughness is measured by the same method as the method of measuring the roughness of the specimen surface 14 by removing the oxide film as the surface layer.

즉, 측정할 샘플의 표면층인 산화막을 화학적 에칭방법으로 제거한후 그 계면에 상기 탐지침(13) 끝부분에 있는 팁(TIP)을 접촉한후 스캐너(15)로 스캔을 하고, 이에따라 상기 계면의 거칠기에 따라 상기 탐지침(13)이 움직이게 된다.That is, after removing the oxide layer, which is the surface layer of the sample to be measured, by chemical etching, the tip (TIP) at the tip of the probe 13 is contacted with the interface, and then scanned by the scanner 15. The probe 13 moves according to the roughness.

이때, 상기 계면의 거칠기는 상기 탐지침(13) 끝부분에 있는 팁(TIP)의 반대면에 조사되어 반사되는 빛의 각도 변화를 검출부(12)가 검출하여 측정한다.At this time, the roughness of the interface is detected by the detection unit 12 detects the change in the angle of the light reflected by the opposite surface of the tip (TIP) at the end of the detection needle (13).

그러나, 상기와 같이 종래에는 측정할 샘플을 주로 화학적 에칭방법을 이용하여 표면층을 제거하는데 기판인 실리콘도 어느 정도 에칭되어 계면거칠기를 정확히 측정할 수 없는 문제점이 있었다.However, as described above, there is a problem in that the sample to be measured is mainly removed by using a chemical etching method, but silicon as a substrate is etched to some extent so that the roughness of the interface cannot be accurately measured.

따라서, 상기와 같은 문제점을 감안하여 창안한 본 발명은 산화막의 두께로부터 표면거칠기와 계면거칠기 정보를 분리하여 측정함으로써 정확한 계면거칠기를 측정할 수 있도록 한 에스씨엠을 이용한 계면거칠기 측정장치를 제공함에 그 목적이 있다.Accordingly, the present invention devised in view of the above problems provides an apparatus for measuring interfacial roughness using SMC to measure accurate interfacial roughness by separating and measuring surface roughness and interfacial roughness information from the thickness of an oxide film. There is a purpose.

도 1은 종래 에스씨엠을 이용한 표면거칠기 측정장치의 구성을 보인 블록도.1 is a block diagram showing the configuration of a surface roughness measuring apparatus using a conventional SM.

도 2는 본 발명 에스씨엠을 이용한 계면거칠기 측정장치의 구성을 보인 블록도로.Figure 2 is a block diagram showing the configuration of the surface roughness measuring apparatus using the present invention SM.

*****도면의 주요부분에 대한 부호의 설명********** Description of the symbols for the main parts of the drawings *****

12:검출부 13:탐지침12: Detection part 13: Detection probe

15:스캐너 20:락인앰프15: scanner 20: lock-in amplifier

21:센서 22:산화막21: sensor 22: oxide film

23:반도체23: Semiconductor

상기와 같은 목적을 달성하기 위한 본 발명은 일정한 주파수를 가진 빛을 시편 표면의 거침음에 따라 각을 변화하여 반사하는 탐지침과; 상기 탐지침으로부터 반사되는 빛에 의해 표면의 거칠기를 검출하는 검출부와; 상기 탐지침과 시편 내부에 직류전압과 교류전압이 인가되면 그 시편 내부에서 발생하는 커패시턴스의 변화값으로 산화막의 표면거칠기 및 계면거칠기에 대한 정보를 센싱하는 센서와; 상기 센서의 출력신호를 소정 레벨로 증폭하여 출력하는 락인앰프를 포함하여 구성한 것을 특징으로 한다.The present invention for achieving the above object is a detection needle for reflecting the light having a constant frequency by changing the angle according to the rough sound of the specimen surface; A detector for detecting the roughness of the surface by the light reflected from the detector needle; A sensor for sensing information about surface roughness and interfacial roughness of an oxide film as a change value of capacitance generated inside the specimen when a DC voltage and an AC voltage are applied to the detection needle and the specimen; And a lock-in amplifier configured to amplify and output the output signal of the sensor to a predetermined level.

이하, 본 발명 에스씨엠을 이용한 계면거칠기 측정장치의 구성에 대한 실시예의 작용 및 효과를 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, with reference to the accompanying drawings the operation and effects of the embodiment of the configuration of the apparatus for measuring the surface roughness using the present invention SM.

도2는 본 발명 에스씨엠을 이용한 계면 거칠기 측정장치의 구성을 보인 블록도로서, 이에 도시한 바와 같이 일정한 주파수를 가진 빛을 시편(23) 표면의 거칠음에 따라 각을 변화하여 반사하는 탐지침(13)과; 상기 탐지침(13)으로부터 반사되는 빛에 의해 표면의 거칠기를 검출하는 검출부(12)와; 상기 탐지침(13)과 시편(23) 내부에 직류전압과 교류전압이 인가되면 그 시편(23) 내부에서 발생하는 커패시턴스의 변화 값으로 산화막(22)의 표면 거칠기 및 계면 거칠기에 대한 정보를 센싱하는 센서(21)와; 상기 센서(21)의 출력신호를 소정 레벨로 증폭하여 출력하는 락인앰프(20)를 구비하며, 이와같이 구성한 본 발명의 일 실시예의 동작을 설명하면 다음과 같다.Figure 2 is a block diagram showing the configuration of the interface roughness measuring apparatus using the present invention SMC, as shown in the detection needle for changing the angle by reflecting light having a constant frequency according to the roughness of the surface of the specimen (23) 13); A detector 12 which detects roughness of the surface by the light reflected from the detector 13; When a DC voltage and an alternating voltage are applied to the detector needle 13 and the specimen 23, information about the surface roughness and the interface roughness of the oxide film 22 is sensed as a change in capacitance generated in the specimen 23. A sensor 21; A lock-in amplifier 20 for amplifying and outputting the output signal of the sensor 21 to a predetermined level will be described below.

먼저, 에스씨엠의 탐지침(13)에 직류전압과 교류전압을 가하여 주면 시편(23) 내부에 존재하는 도우펀트가 표면에 존재하는 산화막(22)쪽으로 축적되거나 시편(23) 내부로 공핍된다.First, when a DC voltage and an alternating voltage are applied to the detection needle 13 of SMC, a dopant existing in the specimen 23 accumulates toward the oxide film 22 present on the surface or depletes into the specimen 23.

이때, 상기 도우펀트의 축적과 공핍은 도우펀트의 형태와 가해주는 직류전압의 극성에 따라 달라지는데, 예를 들어 도우펀트가 피형이면 양의 직류전압을 가하였을때 시편(23) 내부의 다수캐리어인 홀들이 시편(23) 내부 쪽으로 밀려나 공핍층이 생기고 음의 직류전압을 가하였을 때는 홀들이 표면 쪽으로 몰려 축적된다.At this time, the accumulation and depletion of the dopant is dependent on the shape of the dopant and the polarity of the DC voltage applied to, for example, if the dopant is a blood type, when the positive DC voltage is applied to the multiple carriers in the specimen 23 When the holes are pushed toward the inside of the specimen 23 to form a depletion layer and a negative DC voltage is applied, the holes are accumulated toward the surface.

여기서, 상기 홀들이 축적되는 조건에서 측정된 커패시턴스의 값을 센서(21)를 통해 감지하여 이를 락인앰프(20)에서 소정레벨 증폭하여 구한다.Here, the value of the capacitance measured under the condition in which the holes are accumulated is detected by the sensor 21 and amplified by the lock-in amplifier 20 by a predetermined level.

이때, 상기 커패시턴스의 값은 산화막(22)에 의한 값이고, 이 커패시턴스의 값은

Figure pat00001
의 관계식에서 알수 있듯이 유전율과 두께에 의해서 결정되므로 산화막(22)의 2차원적인 두께에 대한 정보를 얻을 수 있는데, 이 정보는 표면 거칠기와 계면 거칠기가 함께 들어있는 정보로서 둘 중에 하나를 알면 나머지 정보를 알 수 있다.At this time, the value of the capacitance is the value of the oxide film 22, and the value of the capacitance is
Figure pat00001
As can be seen from the relational equation, the information on the two-dimensional thickness of the oxide film 22 can be obtained because it is determined by permittivity and thickness. This information includes surface roughness and interfacial roughness. It can be seen.

그러므로, 에스씨엠의 탐지침(13)에 조사되어 반사되는 빛의 각도변화를 검출부(12)에서 검출함으로써 시편(23) 표면의 거칠기를 구하고, 이 표면 거칠기를 이용하여 산화막(22)과 실리콘(Si) 사이의 계면 거칠기를 구한다.Therefore, the roughness of the surface of the specimen 23 is obtained by detecting the change in the angle of the light irradiated and reflected on the detector needle 13 of the SMC by using the surface roughness, and the oxide film 22 and the silicon ( The interfacial roughness between Si) is obtained.

이상에서 상세히 설명한 바와 같이 본 발명은 산화막의 두께로부터 표면 거칠기와 계면 거칠기 정보를 분리하여 측정함으로써 정확한 계면 거칠기를 측정하고 이에 따라 최적의 계면조건을 구하기 위한 공정조건을 구할 수 있는 효과가 있다.As described in detail above, the present invention has the effect of measuring the exact interface roughness by measuring the surface roughness and the interface roughness information separately from the thickness of the oxide film, and thereby obtaining the process conditions for obtaining the optimum interface conditions.

Claims (1)

일정한 주파수를 가진 빛을 시편 표면의 거침음에 따라 각을 변화하여 반사하는 탐지침과; 상기 탐지침으로부터 반사되는 빛에 의해 표면의 거칠기를 검출하는 검출부와; 상기 탐지침과 시편 내부에 직류전압과 교류전압이 인가되면 그 시편내부에서 발생하는 커패시턴스의 변화 값으로 산화막의 표면 거칠기 및 계면 거칠기에 대한 정보를 센싱하는 센서와; 상기 센서의 출력신호를 소정 레벨로 증폭하여 출력하는 락인앰프를 포함하여 구성한 것을 특징으로 에스씨엠을 이용한 계면 거칠기 측정장치.A detection needle that reflects light having a constant frequency by changing an angle according to roughness of the surface of the specimen; A detector for detecting the roughness of the surface by the light reflected from the detector needle; A sensor for sensing information on the surface roughness and the interface roughness of the oxide film as a change value of capacitance generated inside the specimen when a DC voltage and an AC voltage are applied to the probe and the specimen; And a lock-in amplifier configured to amplify and output the output signal of the sensor to a predetermined level.
KR1019970061760A 1997-11-21 1997-11-21 Apparatus for measuring interface roughness using scm KR100253357B1 (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0933237A (en) * 1995-07-19 1997-02-07 Nikon Corp Measuring probe

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0933237A (en) * 1995-07-19 1997-02-07 Nikon Corp Measuring probe

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