KR100237201B1 - Pdic junction apparatus and method of hologram pickup module - Google Patents

Abstract

The present invention is to improve the shape of the adsorption mechanism to accurately perform the position of the PDIC, and by performing the two position recognition using the camera to compensate the error due to the thermal expansion of the machine can be precise position control during bonding Disclosed are a light receiving device bonding apparatus and method thereof in a hologram pickup module.

The present invention is to determine the position of the stem (stem) and the light receiving element (PDIC), the camera receiving the stem and PDIC as an image signal, the image signal input through the camera to determine the position and accordingly A microcomputer for calculating the amount of PDIC movement, an adsorption head for fixing the light receiving element, a Y-axis transfer table for moving the adsorption head in a horizontal direction, or a Y direction, and a movement of the adsorption head in a vertical direction, a Z direction Z-axis transfer table, θ-axis transfer table for adjusting the angle of the suction head to the Y-axis, joining unit for joining the PDIC moved to a predetermined position of the stem, and the operator to check the progress of work It is configured to include a monitor for outputting the video signal input through the camera so as to check.

Description

Light-receiving device bonding device and method in hologram pickup module

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-receiving device bonding apparatus and a method thereof in a hologram pickup module, and more particularly, to a light-receiving device bonding apparatus and a method for assembling a photo diode IC (PDIC) without error in an assembly process of a laser diode. It is about.

1 is a view showing the configuration of a hologram pickup module (hologram pickup module) generally used, a perspective view, a plan view and a side view.

In FIG. 1, reference numeral 10 denotes a stem serving as a body of the system, 20 denotes a lead wire connected to the stem 10 to transmit a signal, and 30 denotes a laser. Represents a laser diode for emitting light, 40 represents a silicon submount for stably bonding the laser diode 30, and 50 represents light emitted from the laser diode 30 and reflected from the optical disk. A photodiode (PDIC: photo diode IC) for receiving a laser beam and reading a signal is shown.

In the hologram pickup module configured as described above, the laser diode 30 emits a laser toward the optical disc, and the light receiving element (hereinafter referred to as PDIC) 50 receives the laser reflected from the optical disc to process a signal. do.

At this time, the PDIC 50 receives audio and video signals and at the same time receives an auxiliary signal for reading the correct signal of the optical disk and a control signal for focusing and tracking control, so that the relative position from the laser diode 30 is received. Is an important factor in determining product performance.

Accordingly, the assembly of the PDIC 50 should have high accuracy.

The method of assembling the PDIC 50 operates the laser diode 30 and corrects the position according to the signal read out from the PDIC 50, and bonds the same to the PDIC 50 from the light emitting point of the laser diode 30 being driven. A method of bonding the PDIC 50 using a mounter at a constant distance is used.

However, the former method requires a lot of time because the disk must be rotated and the signal must be analyzed and corrected for position. The latter method uses the mounter to move the PDIC 50 to join, thus the precision of the joining position. There is a problem that is lowered.

Due to the above problems, an apparatus for precisely controlling the bonding position of the PDIC 50 is required.

2 is a view for explaining a light receiving element bonding operation in the hologram pickup module according to the prior art.

1 and 2, first, the position of the stem 10 is determined and energized, and the PDIC 50 is formed by using a first camera 120 positioned above the PDIC supply unit HOOP 110. Be aware of the presence of Afterwards, the PDIC 50 is absorbed by the PDIC transfer head to move to a predetermined position, and the position of the PDIC 50 is recognized using the second camera 130 to calculate the position data and simultaneously correct the position data. Perform the operation of the value. Then, the PDIC 50 is moved to a predetermined position of the stem 10 in accordance with the position data and the correction value by using the PDIC transfer head to perform bonding.

In the conventional method for bonding a light receiving element in the hologram pickup module as described above, the position of the light receiving element is recognized using the second camera 130 and the correction is performed so that the PDIC head transfers the PDIC 50 according to the result. Since the joint is moved to a predetermined position, thermal expansion of the machine occurs due to mechanical repetition error and temperature change, and thus there is a problem of deteriorating product quality by changing the bonding position.

In the case of performing a work using a constant temperature chamber as a method for preventing the temperature change, there is a problem in that the cost of maintaining the equipment increases, thereby increasing the price of the product.

The present invention has been made to solve the problems of the prior art as described above, the object is to improve the shape of the adsorption mechanism to accurately perform the position of the PDIC when the adsorption, by performing two position recognition by using a camera The present invention provides a light-receiving device bonding apparatus and method thereof in a hologram pickup module that can compensate for errors due to thermal expansion of a machine and perform precise position control during bonding.

1 is a perspective view, a plan view and a side view of a typical hologram pickup module;

2 is a view for explaining a light receiving element bonding operation according to the prior art,

3 is a view showing the configuration of a light receiving element bonding apparatus according to the present invention;

4 is a plan view and a front view of the adsorption head according to the present invention;

5 is a view showing a state in which the adsorption head adsorption of PDIC in the present invention,

6 is a flowchart illustrating a method of bonding a light receiving element according to the present invention.

<Description of the symbols for the main parts of the drawings>

10: stem 30: laser diode 31: light emitting point

50: PDIC 51: Index Mark 210: Camera

220: adsorption head 221: through hole 222: adsorption hole

230: Y axis feed table 240: Z axis feed table 250: θ axis feed table

260 monitor 270 sheet

A first aspect of the present invention for achieving the above object, the position detection unit for calculating the movement amount by recognizing the position of the stem (stem) and the light receiving element (PDIC), and moving the light receiving element to a predetermined position of the stem In the light-receiving device bonding apparatus of the hologram pickup module comprising a transfer robot for the portion and a bonding unit for bonding the light-receiving element moved to a predetermined position of the stem,

The position detecting unit includes a camera for inputting a stem and a light receiving element as an image signal, and a microcomputer for analyzing each of the image signals inputted through the camera to determine each position, and calculating a movement amount of the light receiving element.

The transfer robot unit includes an adsorption head for fixing the light receiving element, a Y axis transport table for moving the adsorption head in a Y direction, a horizontal direction, a Z axis transport table for moving the adsorption head in a Z direction, or a vertical direction; To provide a light-receiving device bonding apparatus in a hologram pickup module comprising a θ-axis feed table for adjusting the angle in the horizontal plane of the suction head.

According to an exemplary embodiment of the present invention, an index mark of a "+" type is formed on the light receiving element to indicate a position and a direction, and the suction head is formed on the index mark and the stem formed on the light receiving element using a camera. Through holes of "±" shape are formed to check the light emitting point of the mounted laser diode.

The display apparatus may further include a display unit configured to output an image signal input through the camera so that an operator may check the progress of the work.

On the other hand, the second aspect of the present invention for achieving the above object, the first process for supplying a stem (stem) and a light receiving element (PDIC) to a predetermined position, and the light emitting point and the light receiving point of the laser diode mounted on the stem Performing a second process of recognizing the position of the device to calculate the movement amount, a third process of moving the light receiving element to a predetermined position of the stem to correspond to the position of the light emitting point, and bonding the light receiving element to the predetermined position of the stem It provides a light receiving element bonding method in a hologram pickup module, characterized in that it comprises a fourth process.

In this case, according to an embodiment of the present invention, the second process receives an index mark formed on the light receiving element using a camera as an image signal, recognizes the position of the light receiving element, and energizes the stem so that the laser diode emits light. Recognize the position of stem by receiving a point as a video signal.

On the other hand, the third aspect of the present invention for achieving the above object, the first process for supplying the stem (stem) and the light receiving element (PDIC) to a predetermined position, and recognizes the light emitting point of the laser diode mounted on the stem A second process of storing, a third process of recognizing a position to detect an angle formed by the light receiving element on a horizontal plane, a fourth process of calculating a movement amount and moving on the θ axis according to the position recognition result, and the light emission A fifth process of recognizing a position in order to detect a Y-axis and a Z-axis distance to which the light receiving element should move in consideration of a relative position with a point, and calculating a movement amount according to the position recognition result and moving to the Y-axis and Z-axis And a seventh process of performing bonding of the light receiving element to a predetermined position of the stem, to provide a light receiving element bonding method in the hologram pickup module.

Hereinafter, with reference to the accompanying drawings a preferred embodiment of the light receiving element bonding apparatus in the hologram pickup module according to the present invention will be described in detail.

Figure 3 is a view showing the configuration of a light receiving element bonding apparatus according to the present invention, Figure 4 is a plan view and a front view showing an adsorption head according to the present invention, Figure 5 is the adsorption head in the operation of the present invention to correctly adsorb the PDIC 6 is a flowchart illustrating a state, and FIG. 6 is a flowchart illustrating a light receiving element bonding method according to the present invention.

Referring to FIG. 3, the light receiving element bonding apparatus of the hologram pickup module according to the present invention may recognize the positions of the stem 10 and the light receiving element (hereinafter referred to as PDIC) 50. And a camera 210 receiving the PDIC 50 as an image signal and a video signal inputted through the camera 210 to determine a position and to calculate a movement amount of the PDIC 50 accordingly. ), An adsorption head 220 for fixing the light receiving element 50, a Y-axis transfer table 230 for moving the adsorption head 220 in a horizontal direction, or a Y direction, and the adsorption head 220. ) Z-axis feed table 240 for moving the vertical direction, that is, Z direction, θ-axis feed table 250 for adjusting the angle of the suction head 220 and the Y-axis, and the stem 10 of Joining unit (not shown) that performs the bonding of the PDIC 50 moved to a predetermined position, and the worker's progress state It is configured to include a monitor 260 for outputting a video signal input through the camera 210 so as to check.

The PDIC 50 is supplied in the form of a sheet 270 because a plurality of wafers are simultaneously formed and individually cut on the wafer, and the top and bottom surfaces thereof are shown in FIG. 5 as shown in FIG. 5. An index mark 51 of "+" type is formed for this purpose.

In addition, as shown in FIGS. 4 and 5, the adsorption head 220 includes the index mark 51 formed on the PDIC 50 and the laser diode mounted on the stem 10 using the camera 210. A through hole 221 having a “±” type is formed to identify the light emitting point 31 of the 30, and therein, connected to a vacuum device (not shown) so as to be fixed when the PDIC 50 is moved. Four suction holes 222 are formed.

Referring to the operation of the light receiving element bonding apparatus in the hologram pickup module configured as described above in detail as follows.

First, when the stem 10 and the PDIC 50 are supplied to a predetermined position, the camera 210 is operated to determine whether the index mark 51 is in the correct position through the through hole 221 as shown in FIG. 5. The light emitting point 31 and the position of the PDIC 50 of the laser diode 30 mounted on the stem 10 are recognized and stored, and the micom calculates the movement amount.

Thereafter, a vacuum apparatus (not shown) is operated to suck the PDIC 50 from the sheet 270 by the suction head 220, and the θ axis feed table 250 is operated to accurately position the θ axis. Perform the calibration.

Then, using the camera 210, the Y-axis transfer table 230 and the Z-axis transfer table 240 are operated in accordance with the relative position with respect to the light emitting point 31, and thus the upper position of the stem 10. Move to. At this time, the laser diode 30 mounted on the stem 10 is energized and is in a light emitting state.

After the position correction is completed, the PDIC 50 is bonded to the stem 10.

As a result, the position correction operation as described in FIG. 6 detects and stores the light emitting point 31 of the laser diode 30 (S301), and detects the angle made by the PDIC 50 in the horizontal plane. In consideration of the second step (S302) for recognizing the position, the third step (S303) for calculating the movement amount according to the position recognition result and moving to the θ axis, and the relative position of the light emitting point (31) A fourth step (S304) of recognizing a position in order to detect a Y-axis and a Z-axis distance to which the PDIC 50 should move, and a fifth step of calculating a movement amount and moving in the Y-axis and Z-axis according to the position recognition result Step S305 is made.

As described above, the light-receiving device bonding apparatus and method thereof in the hologram pickup module of the present invention perform the position correcting operation after the PDIC 50 is moved to the upper position of the stem 10 and then the position movement and temperature before bonding Compensation for the error caused by the change has the effect of improving the quality of the product.

Claims (6)

A position detection unit for recognizing the position of the stem and the light receiving element (PDIC), calculating a movement amount, a transfer robot unit for moving the light receiving element to a predetermined position of the stem, and the light receiving element moved to the predetermined position of the stem In the light-receiving device bonding apparatus of the hologram pickup module including a bonding unit for performing the bonding of, The position detecting unit includes a camera for inputting a stem and a light receiving element as an image signal, a microcomputer for analyzing a video signal input through the camera to determine a position, and calculating a movement amount of the light receiving element accordingly. The transfer robot unit includes an adsorption head for fixing the light receiving element, a Y axis transport table for moving the adsorption head in the Y direction, a Z axis transport table for moving the adsorption head in the Z direction, and an angle of the adsorption head. Light receiving element bonding apparatus in the hologram pickup module comprising a θ axis feed table for adjusting the. The method of claim 1, The light receiving element is provided with an index mark of a "+" type for indicating a position and a direction, and the suction head has an index mark formed on the light receiving element and a light emitting point of the laser diode mounted on the stem. The light-receiving device bonding device in the hologram pickup module, characterized in that the through hole of the "±" type to be confirmed. The method of claim 1, And a display unit for outputting an image signal input through the camera so that an operator can check the progress of the work. A first process of supplying a stem and a light receiving element (PDIC) to a predetermined position, a second process of calculating a movement amount by recognizing a light emitting point of a laser diode mounted on the stem and a position of the light receiving element, and a light emitting point And a fourth process of moving the light receiving element to a predetermined position of the stem so as to correspond to the position of the stem, and a fourth process of bonding the light receiving element to the predetermined position of the stem. Device bonding method. The method of claim 4, wherein In the second process, the index mark formed on the light receiving element is input as a video signal using a camera to recognize the position of the light receiving element, and the stem is energized so that the laser diode emits light. Light receiving element bonding method in a hologram pickup module, characterized in that the recognition. A first process of supplying a stem and a PDIC to a predetermined position, a second process of recognizing and storing a light emitting point of a laser diode mounted on the stem, and detecting an angle of the light receiving element in a horizontal plane A third process of recognizing a position, a fourth process of calculating a movement amount according to the position recognition result and moving to the θ axis, a Y-axis to which the light receiving element should be moved in consideration of the relative position of the light emitting point, A fifth process of recognizing a position to detect a Z-axis distance, a sixth process of calculating a movement amount according to the position recognition result and moving to the Y-axis and the Z-axis, and bonding the light receiving element to a predetermined position of the stem A light receiving element bonding method in a hologram pickup module comprising a seventh step of performing.

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