KR100235831B1 - A dryer for semiconductor device fabrication unit and a method for circulation of its air - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing process article and a tool dryer, and an air circulation method thereof, and more particularly, to clean and dry various articles and tool tools used in a semiconductor manufacturing process with chemicals or pure water. A dryer and a method for circulating the air, which is a conventional semiconductor manufacturing process article and a tool dryer, a ventilation fan 50 for rotating the air in the chamber 10 by rotating the motor 40 in the lower part of the dryer. It is internally installed, and the heater 60 is internally spaced at a predetermined distance from the ventilation fan 50, and the filter 70 is internally installed on the outer side of the chamber 10, between the ventilation fan 50 and the heater 60. It provides a semiconductor manufacturing process article and a dryer for the tool, characterized in that the nitrogen gas outlet 44 in communication with the nitrogen gas supply pipe 42 is provided, the life is semi-permanent and the temperature in the chamber 10 The present invention relates to a semiconductor manufacturing process article and a tool dryer for drying the article with purified air as well as to increase the amount that can be dried at once, and to the air circulation method.

Description

Equipment for manufacturing semiconductors and dryers for tools and air circulation method

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing process article, a tool dryer, and an air circulation method thereof. In particular, various articles such as a cassette containing a wafer used in a semiconductor manufacturing process and a tool are washed with chemicals or pure water, and dried. The semiconductor manufacturing process supplies and tools for heating the air in the dryer and purifying the contaminated air by using a circulation method for forcibly circulating the dryer and the air heated in the dryer to the fan to pass through the filter. It relates to a dryer and its air circulation method.

The semiconductor manufacturing process deals with a few millimeters of a millimeter, so dust is the worst enemy.

One dust, a few microns in diameter, that is invisible to our eyes, has a devastating effect on a mask or silicon wafer.

In particular, if the dust was in the area where the fine circuits were connected, the semiconductor chip would have to be a defective product with only one dust. Each room undergoing the manufacturing process would be kept in a dust-free room, and the human body would be cleaned by an air purifier. Remove and wear dust-free clothes called dustproof clothing (防塵 服) is put into the manufacturing process.

Therefore, various supplies and tools used in the semiconductor manufacturing process should not be the cause of defective products by maintaining the cleanliness. Therefore, clean them with chemicals or pure water, dry them, put them into the manufacturing process, and this process should be repeated periodically. do.

The present invention relates to a dryer and an air circulation method inside the dryer for cleaning the articles and tools used in the semiconductor manufacturing process, and then put into the chamber to dry.

Conventionally, such a dryer installs a halogen lamp that heats air while emitting light on the side or bottom in a chamber, a space into which an article and a tool are put, or a plate heater with a heater installed on an iron plate. It was made to circulate.

In other words, the hot air moves to the upper part of the chamber, the cool air moves to the lower part of the chamber, and some air is taken through the air circulation system through the exhaust port installed at the upper part of the chamber.

However, a dryer for heating the air inside by using a halogen lamp has a problem in that the life of the halogen lamp is not semi-permanent, and thus, frequent replacement is required, and if it is not replaced, the dryer cannot be heated to a desired temperature and the heating time is long.

In addition, the temperature in the chamber was not uniform.

In other words, the temperature difference between the clothing near the halogen lamp and the temperature away from the halogen lamp is severe.

Since halogen lamps are installed on the side or bottom of the chamber, the internal space is small and the amount of drying can be very small at a time. When the door of the dryer is inadvertently hot, the halogen lamp directly touches the skin. There was a problem of concern.

On the other hand, the dryer that heats the air inside the chamber using a plate heater is semi-permanent, but the temperature in the chamber is not uniform and the internal space that can be accommodated is small so that it can be dried at a time. When the door was opened, there was a problem that a hot plate heater inadvertently touches the skin may cause burns.

The present invention has been made to solve the above-mentioned problems, the object to provide is to install the heater in the bottom of the chamber, not installed in the chamber and forced heating of the air to pass through the filter is semi-permanent and within the chamber The temperature is uniform and the internal space that can be accommodated can increase the amount of drying at once, and the heater is not exposed to the chamber even when the door of the dryer is opened, so there is no risk of burns. The present invention provides a semiconductor manufacturing process article and a tool dryer for drying the article or the tool with purified air, and an air circulation method thereof.

In order to achieve the above object, the present invention is a semiconductor manufacturing process article and a tool dryer comprising a chamber, a heater and an exhaust port, the fan is rotated by a motor of the lower part of the dryer to circulate the air in the chamber is built-in The heater is installed at a predetermined distance from the ventilation fan, and a filter is installed at the outer side of the chamber, and a nitrogen gas outlet connected to the nitrogen gas supply pipe is interposed between the ventilation fan and the heater. To provide a dryer.

In order to achieve the above object, the air in the chamber is forcibly sucked by the rotation of the fan, heated with nitrogen gas supplied from the outside, and then passed through a filter to be introduced into the chamber, and some air in the chamber is discharged to the outside. It is to provide an air circulation method of the semiconductor manufacturing process article and the tool for drying tools characterized in that the process is repeated.

1 is a front view of a dryer according to the present invention.

2 is a structural diagram and an air flow diagram of a dryer according to the present invention.

* Explanation of symbols for main parts of the drawings

10 chamber 12 shelf

14 frame 16: protrusion

18: exhaust port 20: adjustment and display unit

30 door 32 handle

40: motor 42: nitrogen gas supply pipe

44 nitrogen gas outlet 50 vent fan

60: heater 70: filter

100: dryer

Hereinafter, the present invention will be described with reference to FIGS. 1 and 2.

1 is a front view of a dryer according to the invention, and FIG. 2 is an internal structure diagram and an air flow diagram of the dryer according to the present invention.

First, the basic configuration of the present invention, in a dryer for a semiconductor manufacturing process article and a tool consisting of the chamber 10, the heater 60 and the exhaust port 18, the chamber is rotated by a motor 40 in the lower part of the dryer The ventilation fan 50 for circulating the air in the (10) is internally installed and the heater 60 is installed at a predetermined distance from the ventilation fan 50, and the filter 70 is installed on the outer side of the chamber 10. The nitrogen gas ejection opening 44 through which the nitrogen gas supply pipe 42 communicates is disposed between the ventilation fan 50 and the heater 60.

Hereinafter, the present invention will be described in more detail with reference to the present invention.

A typical semiconductor manufacturing process article and tool dryer 100 is composed of an exhaust port 18, a heater 60, and a chamber 10 as described in the prior art.

Referring to the configuration of the dryer 100 according to the present invention in accordance with the flow of air below the position of the chamber 10, that is, the chamber 10 by being rotated together by the rotation of the motor 40 in the lower portion of the dryer 100 The ventilation fan 50 which sucks air in the lower part and forcibly circulates is installed.

The heater 60 for heating the air at a predetermined distance from the ventilation fan 50 is installed.

Here, the heater 60 is preferably a ceramic heater using a ceramic that is heat-resistant and particles (particle-free).

The ceramic heater is configured such that a plurality of ceramics are arranged in parallel and a heating wire passes through a recess formed in the ceramic.

Since the heater 60 is installed in the lower part of the chamber 10, the space inside the chamber 10 can be increased.

A nitrogen gas ejection port 44 communicating with the nitrogen gas supply pipe 42 for supplying nitrogen gas N2 is interposed between the ventilation fan 50 and the heater 60.

The air transferred downward by the fan 50 is mixed with the nitrogen gas introduced through the nitrogen gas outlet 44 and heated through the heater 60.

The reason for supplying the nitrogen gas is that when the air in the chamber 10 is suddenly drawn out, the cavitation phenomenon occurs inside the chamber 10, and the door 30 is much more concerned due to condensation. Nitrogen gas is clean.

A filter 70 is installed on the outer side of the chamber 10 to purify the heated air through the heater 60.

Therefore, since only the purified hot air flows into the chamber 10, the cleanliness of the chamber 10 may be increased.

After the air introduced into the chamber 10 passes through the article or tool that is introduced into the chamber 10, most of the air is transferred to the lower portion by the ventilation fan 50 and some is discharged to the outside through the exhaust port 18. .

By repeating the circulation of purified and heated air, the liquid is left in the cleaning process to cleanly dry the remaining articles or tools.

Reference numeral 12 denotes a shelf on which an article or a tool can be placed, 14 denotes a frame, 16 denotes a protrusion which is uniformly protruded from the frame 14, 20 denotes a protruding piece on which the shelf 12 is placed, and 20 denotes a temperature time. 32 is a handle attached to the door (30).

In the air circulation method of the semiconductor manufacturing process article and the tool dryer having the above-described configuration, the air in the chamber 10 is forcibly sucked by the rotation of the fan 50 and heated together with the nitrogen gas supplied from the outside. Pass through the filter 70 is introduced into the chamber 10, characterized in that the process of discharging some air in the chamber 10 to the outside is repeated.

As described above, in the present invention, the heater 60 is not installed in the chamber 10 but installed in the lower part of the dryer, and the heated air is circulated forcibly to pass through the filter 70 so that the life is semi-permanent and the chamber ( 10) The temperature inside is uniform and the internal space that can be accommodated is not only large to increase the amount of drying at once, but also the heater 60 is exposed to the chamber 10 even when the door 30 of the dryer 100 is opened. There is no risk of burns because it is not, and it is a particularly useful invention that can purify the air and dry the article or the tool with the purified air.

Claims (3)

In the dryer for a semiconductor manufacturing process article and a tool which consists of the chamber 10, the heater 60, and the exhaust port 18, the ventilation fan which rotates by the motor 40 in the lower part of the dryer, and circulates the air in the chamber 10. 50 is internally installed, and the heater 60 is internally spaced at a predetermined distance from the ventilation fan 50, and the filter 70 is internally installed on the outer side of the chamber 10, wherein the ventilation fan 50 and the heater ( And a nitrogen gas outlet (44) in communication with the nitrogen gas supply pipe (42). The method of claim 1, wherein the heater (60) is a semiconductor manufacturing process article and tool dryer, characterized in that the heating heater passes through the ceramic interior ceramic heater. The air in the chamber 10 is forcibly sucked by the rotation of the ventilation fan 50 and heated together with the nitrogen gas supplied from the outside, and then passed through the filter 70 to be introduced into the chamber 10 and the chamber 10. The air circulation method of the dryer for a semiconductor manufacturing process article and the tool, characterized in that the process of discharging some air in the) is repeated.

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