KR100234530B1 - Semiconductor wafer boat - Google Patents
Semiconductor wafer boat Download PDFInfo
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- KR100234530B1 KR100234530B1 KR1019960035151A KR19960035151A KR100234530B1 KR 100234530 B1 KR100234530 B1 KR 100234530B1 KR 1019960035151 A KR1019960035151 A KR 1019960035151A KR 19960035151 A KR19960035151 A KR 19960035151A KR 100234530 B1 KR100234530 B1 KR 100234530B1
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- boat
- semiconductor wafer
- wafer support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67306—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by a material, a roughness, a coating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
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- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
본 발명은 반도체 웨이퍼 보트에 관한 것이다.The present invention relates to a semiconductor wafer boat.
본 발명은, 피스톤이 상하로 이동할 수 있도록 중앙부에 홀이 형성되어 있고, 복수개의 석영로드에 의해서 서로 연결된 복수의 웨이퍼 받침부를 구비하는 반도체 웨이퍼 보트에 있어서, 상기 웨이퍼 받침부는 중앙부에 상기 홀이 형성된 내부링과 상기 내부링과 소정간격 외부로 이격되어 상기 내부링을 둘러싸는 외부링과 상기 내부링 및 외부링을 서로 연결하는 복수의 연결부가 일체로 형성된 것을 특징으로 한다. 따라서, 웨이퍼 및 석영로드가 환경요인에 의해서 휘어지는 것을 방지함으로써 웨이퍼의 표면이 찢어지는 것을 방지할 수 있는 효과가 있다.In the present invention, a hole is formed in the center portion so that the piston can move up and down, and a semiconductor wafer boat having a plurality of wafer support portions connected to each other by a plurality of quartz rods, wherein the wafer support portion has the hole formed in the center portion. The inner ring is spaced apart from the inner ring by a predetermined interval, and an outer ring surrounding the inner ring and a plurality of connection parts connecting the inner ring and the outer ring to each other are integrally formed. Therefore, the surface of the wafer can be prevented from being torn by preventing the wafer and the quartz rod from bending due to environmental factors.
Description
본 발명은 반도체 웨이퍼 보트에 관한 것으로서, 보다 상세하게는 복수의 웨이퍼를 적재한 상태로 공정챔버 내부에서 반도체소자 제조공정이 진행되는 반도체 웨이퍼 보트에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer boat, and more particularly, to a semiconductor wafer boat in which a semiconductor device manufacturing process is performed in a process chamber with a plurality of wafers loaded thereon.
일반적으로, 반도체 공정챔버 내부에는 웨이퍼가 안착될 수 있도록 복수의 슬롯(Slot)이 구비된 보트(Boat)가 설치되며, 상기 보트가 공정챔버 내부에 투입된 상태로 반도체소자 제조공정이 진행된다.In general, a boat provided with a plurality of slots is installed in the semiconductor process chamber so that the wafer is seated, and the semiconductor device manufacturing process is performed with the boat introduced into the process chamber.
또한, 상기 보트는 공정챔버 내부 및 외부로 이동함으로써 보트에 적재된 각 웨이퍼를 공정챔버 내/외부로 로딩(Loading) 및 언로딩(Unloading)시킨다.In addition, the boat moves into and out of the process chamber to load and unload each wafer loaded in the boat into / out of the process chamber.
도 1은 종래의 반도체 웨이퍼 보트를 나타내는 사시도이다.1 is a perspective view showing a conventional semiconductor wafer boat.
도 1을 참조하면, 종래의 반도체 웨이퍼 보트는 석영재질인 원형의 상부 고정부(10) 및 하부 고정부(12)가 3개의 석영로드(Quartz rod : 14)에 의해서 연결고정된다. 상기 석영로드(14) 내측면에는 다수의 슬롯(Slot)이 형성되어, 상기 슬롯에 웨이퍼가 고정되도록 되어 있다.Referring to FIG. 1, in the conventional semiconductor wafer boat, a circular upper fixing portion 10 and a lower fixing portion 12 made of quartz are connected and fixed by three quartz rods 14. A plurality of slots are formed in the inner surface of the quartz rod 14 to fix the wafer to the slots.
따라서, 로봇 암(Robot arm)에 의해서 웨이퍼는 보트의 석영로드(14) 내측면에 형성된 특정 슬롯 사이에 삽입된다.Thus, the robot arm inserts the wafer between specific slots formed on the inner side of the quartz rod 14 of the boat.
그리고, 전술한 바와 같이 로봇 암이 연속적으로 동작함으로써 석영로드(14) 내측면에 형성된 각 슬롯에는 웨이퍼가 완전히 적재된다.As described above, the robot arm is continuously operated so that a wafer is completely loaded in each slot formed on the inner side of the quartz rod 14.
이후, 상기 보트는 공정챔버 내부로 투입되며, 상기 공정챔버 내부에서는 높은 온도에서 반응가스를 이용한 반도체소자 제조공정이 진행되며, 상기 반도체소자 제조공정이 진행된 후, 보트는 공정챔버 외부로 방출된다.Thereafter, the boat is introduced into the process chamber, and the semiconductor device manufacturing process using the reaction gas is performed at a high temperature in the process chamber. After the semiconductor device manufacturing process is performed, the boat is discharged to the outside of the process chamber.
그런데, 상기 반도체소자 제조공정은 보트가 공정챔버 내부에서 투입된 상태로 진행됨으로써 보트의 석영로드(14)가 공정챔버 내부의 고온 등의 공정환경요소에 영향을 받아 휘어지는 사깅(Sagging)현상이 발생하였다.However, in the semiconductor device manufacturing process, the boat is introduced into the process chamber, so that the sagging phenomenon occurs in which the quartz rod 14 of the boat is bent under the influence of process environment factors such as high temperature inside the process chamber. .
또한, 대구경화된 웨이퍼는 단순히 석영로드(14)의 내측면에 형성된 슬롯에 삽입고정되어 있음으로써 웨이퍼는 자체하중 및 공정챔버의 고온 등의 환경요인에 의해서 웨이퍼가 아래로 휘어지는 슬립라인(Slip line) 현상이 심하게 발생되어 웨이퍼 표면이 찢어지는 공정불량이 발생하는 문제점이 있었다. 특히, 상기 문제점은 최근에 반도체 웨이퍼가 12인치(Inch) 등으로 대구경화됨에 따라 더욱 심하게 발생되고 있다.In addition, the large-diameter wafer is simply inserted into a slot formed on the inner surface of the quartz rod 14, so that the wafer is a slip line in which the wafer is bent downward due to environmental factors such as self load and high temperature of the process chamber. ), The phenomenon is severely generated, there is a problem that the process defect that the wafer surface is torn. In particular, the problem is more serious as the semiconductor wafer is largely sized to 12 inches (Inch) in recent years.
본 발명의 목적은, 공정챔버에 투입되는 보트의 석영로드가 공정챔버의 고열에 의해서 휘어지는 사깅현상이 발생하는 것을 방지할 수 있는 반도체 웨이퍼 보트를 제공하는데 있다.SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor wafer boat which can prevent the sagging phenomenon in which the quartz rod of the boat introduced into the process chamber is bent due to the high temperature of the process chamber.
본 발명의 다른 목적은, 웨이퍼를 적재한 보트가 공정챔버로 이송되어 반도체 소자 제조공정이 이루어질 때, 웨이퍼가 아래로 휘어지는 슬립라인 현상이 발생하는 것을 방지할 수 있는 반도체 웨이퍼 보트를 제공하는데 있다.Another object of the present invention is to provide a semiconductor wafer boat which can prevent a slip line phenomenon in which a wafer is bent downward when a boat on which a wafer is loaded is transferred to a process chamber to produce a semiconductor device.
제1도는 종래의 반도체 웨이퍼 보트를 나타내는 사시도이다.1 is a perspective view showing a conventional semiconductor wafer boat.
제2도는 본 발명에 따른 반도체 웨이퍼 보트에 장착된 웨이퍼 받침부 및 피스톤을 설명하기 위한 단면도이다.2 is a cross-sectional view illustrating a wafer support and a piston mounted to a semiconductor wafer boat according to the present invention.
제3도는 본 발명의 일 실시에에 따른 반도체 웨이퍼 보트를 나타내는 사시도이다.3 is a perspective view showing a semiconductor wafer boat according to one embodiment of the present invention.
제4도의 (a) 및 (b)는 본 발명에 따른 반도체 웨이퍼 보트에 웨이퍼가 로딩되는 방법을 설명하기 위한 도면이다.4A and 4B are diagrams for describing a method of loading a wafer into a semiconductor wafer boat according to the present invention.
〈도면의 주요부분에 대한 부호의 설명〉<Explanation of symbols for main parts of drawing>
10 : 상부 고정부 12 : 하부 고정부10: upper fixing part 12: lower fixing part
14,30 : 석영로드 20 : 웨이퍼 받침부14,30: quartz rod 20: wafer support
22 : 외부링 24 : 내부링22: outer ring 24: inner ring
25 : 홀 26 : 연결부25: hole 26: connection
28 : 덮개부 32 : 피스톤28: cover 32: piston
34 : 웨이퍼 36 : 로더34: wafer 36: loader
상기 목적을 달성하기 위한 본 발명에 따른 반도체 웨이퍼 보트는, 피스톤이 상하로 이동할 수 있도록 중앙부에 홀이 형성되어 있고, 복수개의 석영로드에 의해서 서로 연결된 복수의 웨이퍼 받침부를 구비하는 반도체 웨이퍼 보트에 있어서, 상기 웨이퍼 받침부는 중앙부에 상기 홀이 형성된 내부링과 상기 내부링과 소정간격 외부로 이격되어 상기 내부링을 둘러싸는 외부링과 상기 내부링 및 외부링을 서로 연결하는 복수의 연결부가 일체로 형성된 것을 특징으로 한다.In the semiconductor wafer boat according to the present invention for achieving the above object, a hole is formed in the center portion so that the piston can move up and down, and in the semiconductor wafer boat having a plurality of wafer support portion connected to each other by a plurality of quartz rods The wafer support part may include an inner ring formed with the hole at a central portion thereof, and an outer ring surrounding the inner ring spaced apart from the inner ring by a predetermined distance, and a plurality of connecting portions connecting the inner ring and the outer ring to each other. It is characterized by.
상기 적층된 웨이퍼 받침부 최상부에는 상기 웨이퍼 받침부를 덮을 수 있는 덮개부가 구성될 수 있다.A lid portion may be formed at an uppermost portion of the stacked wafer support portion to cover the wafer support portion.
상기 적층된 웨이퍼 받침부 최상부에는 상기 웨이퍼 받침부를 덮을 수 있는 덮개부가 구성될 수 있다.A lid portion may be formed at an uppermost portion of the stacked wafer support portion to cover the wafer support portion.
그리고, 상기 웨이퍼 받침부와 석영로드 및 상기 덮개부는 석영재질로 이루어질 수 있다.The wafer support, the quartz rod, and the cover may be made of quartz.
이하, 본 발명의 구체적인 실시예를 첨부한 도면을 참조하여 상세히 설명한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 2는 본 발명에 따른 반도체 웨이퍼 보트에 장착되는 웨이퍼 받침부 및 피스톤의 소정부위 단면도이고, 도 3은 본 발명에 따른 반도체 웨이퍼 보트를 나타내는 사시도이다.2 is a cross-sectional view of a predetermined portion of the wafer support portion and the piston mounted to the semiconductor wafer boat according to the present invention, Figure 3 is a perspective view showing a semiconductor wafer boat according to the present invention.
또한, 도 4의 (a) 및 (b)는 본 발명에 따른 반도체 웨이퍼 보트에 웨이퍼가 로딩되는 방법을 설명하기 위한 도면이다.4A and 4B are diagrams for describing a method of loading a wafer into a semiconductor wafer boat according to the present invention.
도 2를 참조하면, 본 발명에 따른 반도체 웨이퍼 보트에 장착되는 석영재질의 웨이퍼 받침부(20)는, 중앙부에 피스톤(32)이 상하로 이동할 수 있는 홀(25)이 형성된 내부링(24)과 상기 내부링(24)과 소정간격 외부로 이격되어 내부링(24)을 둘러싸는 외부링(22)과 상기 내부링(24) 및 외부링(22)을 서로 연결하는 3개의 연결부(26)가 일체로 형성되어 있다.Referring to FIG. 2, a quartz support wafer 20 mounted on a semiconductor wafer boat according to the present invention has an inner ring 24 having a hole 25 in which a piston 32 can move up and down at a central portion thereof. And an outer ring 22 which is spaced apart from the inner ring 24 by a predetermined interval and surrounds the inner ring 24, and three connecting portions 26 connecting the inner ring 24 and the outer ring 22 to each other. Is integrally formed.
도 3을 참조하면, 본 발명에 따른 반도체 웨이퍼 보트는, 도 2에서 도시된 바와 같은 복수의 웨이퍼 받침부(20)가 복수의 석영로드(30)에 의해서 각각 소정간격 이격되어 서로 연결됨으로써 서로 적층되어 있고, 서로 적층된 웨이퍼 받침부(20)의 최상층에는 웨이퍼가 오염되는 것을 방지할 수 있도록 석영재질의 덮개부(28)가 설치되어 있다.Referring to FIG. 3, the semiconductor wafer boat according to the present invention is stacked on each other by connecting a plurality of wafer support parts 20 as shown in FIG. 2 to be spaced apart from each other by a plurality of quartz rods 30. The top layer of the wafer support 20 stacked on each other is provided with a cover 28 made of quartz so as to prevent the wafer from being contaminated.
또한, 적층된 웨이퍼 받침부(20)의 최하층 하부에는 피스톤(32)이 위치하여 구동원(도시되지 않음)에 의해서 적층된 웨이퍼 받침부(20)의 내부링(24)내부의 홀(25)을 통하여 상하운동을 할 수 있도록 되어 있다.In addition, a piston 32 is positioned below the lowermost layer of the stacked wafer support 20 so that the hole 25 in the inner ring 24 of the wafer support 20 stacked by the driving source (not shown) is opened. Through the up and down movement is to be.
도 4의 (a) 내지 (b)를 참조하여 본 발명에 따른 반도체 웨이퍼 보트의 작용을 설명한다.The operation of the semiconductor wafer boat according to the present invention will be described with reference to FIGS. 4A to 4B.
먼저, 도 4의 (a)도를 참조하면, 로더(Loader : 36)에 의해 웨이퍼(34)가 수평방향으로 이동하여 적층된 웨이퍼 받침부(20)와 웨이퍼 받침부(20) 사이에 웨이퍼(34)가 위치하면, 웨이퍼 받침부(20) 하부에 위치한 피스톤(32)은 구동원에 의해서 상승되어 웨이퍼(34)를 들어올린다.First, referring to FIG. 4A, the wafer 34 is moved between the wafer support portion 20 and the wafer support portion 20 stacked in a horizontal direction by a loader 36. When the 34 is positioned, the piston 32 positioned below the wafer support 20 is lifted by the driving source to lift the wafer 34.
피스톤(32)이 웨이퍼(34)를 들어올리면, 로더(36)는 원래의 위치로 이동하게 되고, 웨이퍼(34)는 피스톤(32) 상부에 안착하게 된다.When the piston 32 lifts the wafer 34, the loader 36 moves to its original position, and the wafer 34 rests on the piston 32.
이어서, 웨이퍼(34)를 안착시킨 피스톤(32)은 구동원의 구동에 의해서 하강함에 따라 웨이퍼(34)는 웨이퍼 받침부(20) 상부에 로딩딘다.Subsequently, as the piston 32 on which the wafer 34 is seated is lowered by the driving of the driving source, the wafer 34 is loaded on the wafer support 20.
전술한 방법으로 웨이퍼 보트 상부에서 하부로 웨이퍼를 적재한 보트는 반도체 소자 제조공정이 진행되는 공정챔버로 이송되어 고온에서 반응가스를 이용한 반도체 소자 제조공정이 진행된다. 상기 반도체 소자 제조공정시, 반응가스는 내부링(24)과 외부링(22) 사이의 이격공간을 통해서 원활하게 웨이퍼 받침부(20) 상에 로딩된 웨이퍼에 충분히 공급된다.The boat in which the wafer is loaded from the top of the wafer boat to the bottom by the above-described method is transferred to the process chamber where the semiconductor device manufacturing process is performed, and the semiconductor device manufacturing process using the reaction gas is performed at high temperature. In the semiconductor device manufacturing process, the reaction gas is sufficiently supplied to the wafer loaded on the wafer support part 20 through the spaced space between the inner ring 24 and the outer ring 22.
본 발명에 따라서, 웨이퍼를 적재한 보트가 고온의 공정챔버로 이송되어 반응가스를 이용한 반도체 소자 제조공정이 진행되어도, 각 웨이퍼 받침부를 연결고정하는 석영로드의 길이가 짧으므로 석영로드가 고온에서 쉽게 휘는 것이 방지되고, 웨이퍼 받침부의 외부링, 내부링 및 연결부가 각각 웨이퍼의 가장자리 부위를 포함한 웨이퍼 전체부위를 안정적으로 지지함으로써 웨이퍼가 자체하중 및 공정챔버의 고온 등의 환경요소에 의해서 휘어 웨이퍼의 표면이 찢어지는 것이 방지된다.According to the present invention, even when the boat on which the wafer is loaded is transferred to a high temperature process chamber and the semiconductor device manufacturing process using the reaction gas proceeds, the length of the quartz rod connecting each wafer support part is short, so that the quartz rod is easily at high temperature. The warp is prevented, and the outer ring, inner ring, and joint of the wafer support portion stably support the entire wafer portion including the edge of the wafer, respectively, so that the wafer is bent by environmental factors such as self-loading and high temperature of the process chamber. This tearing is prevented.
이상에서 본 발명은 기재된 구체예에 대해서만 상세히 설명되었지만 본 발명의 기술사상 범위 내에서 다양한 변경 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연한 것이다.Although the present invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made within the technical scope of the present invention, and such modifications and variations belong to the appended claims.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960035151A KR100234530B1 (en) | 1996-08-23 | 1996-08-23 | Semiconductor wafer boat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960035151A KR100234530B1 (en) | 1996-08-23 | 1996-08-23 | Semiconductor wafer boat |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19980015715A KR19980015715A (en) | 1998-05-25 |
| KR100234530B1 true KR100234530B1 (en) | 1999-12-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960035151A KR100234530B1 (en) | 1996-08-23 | 1996-08-23 | Semiconductor wafer boat |
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| KR (1) | KR100234530B1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR102527988B1 (en) * | 2016-01-07 | 2023-05-04 | 삼성전자주식회사 | Wafer boat and semiconductor fabricating apparatus including the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR940016668A (en) * | 1992-12-03 | 1994-07-23 | 스테펜 에프. 왈쉬 | Vertical boat and wafer support |
| JPH088201A (en) * | 1994-06-23 | 1996-01-12 | Nec Kyushu Ltd | Boat for vertical heat treating furnace |
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1996
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR940016668A (en) * | 1992-12-03 | 1994-07-23 | 스테펜 에프. 왈쉬 | Vertical boat and wafer support |
| JPH088201A (en) * | 1994-06-23 | 1996-01-12 | Nec Kyushu Ltd | Boat for vertical heat treating furnace |
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| Publication number | Publication date |
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| KR19980015715A (en) | 1998-05-25 |
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