KR100232524B1 - The strength solder of pb free - Google Patents
The strength solder of pb free Download PDFInfo
- Publication number
- KR100232524B1 KR100232524B1 KR1019950043891A KR19950043891A KR100232524B1 KR 100232524 B1 KR100232524 B1 KR 100232524B1 KR 1019950043891 A KR1019950043891 A KR 1019950043891A KR 19950043891 A KR19950043891 A KR 19950043891A KR 100232524 B1 KR100232524 B1 KR 100232524B1
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- South Korea
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- weight
- present
- strength
- solder material
- free
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Conductive Materials (AREA)
Abstract
본 발명은 고강도 무연 땜납용 재료에 관한 것으로서, 더욱 상세하게는 알루미늄, 비스무스 등을 첨가하여 이루어짐으로써 전기비저항이 감소되어 땜납 부위의 전기전도도가 증가하고 강도가 향상되며 인체에 무해할 뿐만 아니라 조직내에 기공의 형성이 거의 없이 품질이 우수한 땜납용 재료에 관한 것이다.The present invention relates to a high-strength lead-free solder material, and more particularly, by adding aluminum, bismuth, and the like, to reduce electrical resistivity, thereby increasing the electrical conductivity of the soldered portion, improving the strength, and harmless to the human body. The present invention relates to a solder material having high quality with little pore formation.
Description
본 발명은 고강도 무연 땜납용 재료에 관한 것으로서, 더욱 상세하게는 알루미늄, 비스무스 등을 첨가하여 이루어짐으로써 전기비저항이 감소되어 땜납 부위의 전기전도도가 증가하고 강도가 향상되며 인체에 무해할 뿐만 아니라 조직내에 기공의 형성이 거의 없어 품질이 우수한 땜납용 재료에 관한 것이다.The present invention relates to a high-strength lead-free solder material, and more particularly, by adding aluminum, bismuth, and the like, to reduce electrical resistivity, thereby increasing the electrical conductivity of the soldered portion, improving the strength, and harmless to the human body. The present invention relates to a solder material having almost no pores and having excellent quality.
종래에 땜납용 재료에 관한 특허로는 미국특허 제 4,670,217 호에서는 안티몬 0.5~4중량%, 은 0.5~2.0 중량%, 아연 0.5~4.0 중량% 및 그외 주석으로 이루어진 납땜 조성물을 개시하고 있으며, 미국특허 제 4,695,428 호에서는 상기 조성에 구리를 0.1~2.0 중량%를 첨가하여 이루어진 납땜용 조성물을 개시하고 있다.Conventionally, the patent for the solder material discloses a soldering composition consisting of 0.5 to 4% by weight of antimony, 0.5 to 2.0% by weight of silver, 0.5 to 4.0% by weight of zinc, and other tins in US Patent No. 4,670,217, US Patent No. 4,695,428 discloses a soldering composition comprising 0.1 to 2.0% by weight of copper in the composition.
그러나, 상기의 재료들은 아연이 함유되어 있어서 땜납용 재료로서의 융점을 낮추는 역할을 하고 있으나, 조직내에서 기공(porosity)을 만들어 품질이 안정되지 않는 문제점이 있다.However, the above materials contain zinc, which plays a role of lowering the melting point of the solder material, but there is a problem in that porosity is not stabilized in the structure.
따라서, 본 발명자는 상기와 같은 종래 땜납용 재료의 문제점을 해결하기 위하여 연구노력한 결과, 아연의 함유를 억제하고 대신에 알루미늄과 비스무스를 첨가함으로써 조직내에 기공의 형성이 없으며 강도가 향상된 본 발명의 땜납용 재료를 개발하게 되었다.Therefore, the present inventors have made efforts to solve the above problems of the conventional solder material, and as a result, by suppressing the content of zinc and adding aluminum and bismuth instead, there is no formation of pores in the tissue and the solder of the present invention has improved strength. I developed a material for it.
본 발명은 기공의 형성이 없으며 강도가 향상되고 전기전도도가 우수한 땜납용 재료를 제공하는데 그 목적이 있다.An object of the present invention is to provide a solder material which is free of pores, which has improved strength and excellent electrical conductivity.
이하, 본 발명을 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail.
본 발명은 알루미늄 0.5~10.0 중량%, 비스무스 0.3~5.0 중량%, 은 0.1~5.0 중량%, 안티몬 0.2~3.0 중량%, 납 0.2 중량% 이하 및 그외 주석과 미량의 불순물로 이루어진 땜납용 재료에 관한 것이다.The present invention relates to a solder material composed of 0.5 to 10.0% by weight of aluminum, 0.3 to 5.0% by weight of bismuth, 0.1 to 5.0% by weight of silver, 0.2 to 3.0% by weight of antimony, 0.2% by weight or less of lead, and other tin and trace impurities. will be.
이와같은 본 발명을 더욱 상세하게 설명하면 다음과 같다.The present invention will be described in more detail as follows.
본 발명은 고강도이면서 기공의 형성이 없는 무연 땜납용 재료에 관한 것으로서, 본 발명에서는 납은 인체에 해롭기 때문에 0.2 중량% 이하로 제한한다.The present invention relates to a lead-free solder material having high strength and no pore formation. In the present invention, lead is limited to 0.2% by weight or less because it is harmful to the human body.
알루미늄은 전기전도도가 우수하고 강도를 향상시키기 때문에 0.5 중량% 이상 첨가하며, 그 함량이 10 중량%를 초과하면 소재가 부서지기 쉽고 딱딱해지기 때문에 알루미늄의 함량은 0.5~10 중량%로 첨가하는 것이 바람직하다.Since aluminum has excellent electrical conductivity and improves strength, it is added at least 0.5% by weight. If the content is more than 10% by weight, the material is brittle and hardened. desirable.
은(Ag)은 땜납용 재료에 첨가시 융점을 낮추고 유동성(folwability)을 좋게하기 때문에 0.1 중량% 이상을 첨가하며 3 중량%를 초과하는 경우 비용이 상승하고 유동성이 너무 커서 퍼지기 때문에 그 함량을 0.1~3 중량% 범위로 한다.Silver (Ag) adds more than 0.1% by weight because it lowers the melting point and improves fluidity when added to the soldering material, and when it exceeds 3% by weight, the cost increases and the fluidity is too large to spread, so the content is 0.1. It is made into the range of -3 weight%.
그리고, 비스무스는 융점을 떨어뜨리기 위해서 0.5 중량% 이상을 첨가하는데, 그 함량이 5 중량%를 초과하면 강도를 저하시키고 전기비저항을 높이기 때문에 상기와 같이 0.5~5 중량% 범위로 첨가한다.In addition, bismuth is added in an amount of 0.5% by weight or more in order to lower the melting point, but if the content exceeds 5% by weight, it is added in the range of 0.5 to 5% by weight as described above because it lowers the strength and increases the electrical resistivity.
또한, 안티몬은 강도와 경도를 향상시키기 위해 첨가되는 것으로서 0.2~3.0 중량% 첨가하며, 그 함량이 3.0 중량%를 초과하면 융점이 극도로 상승하게 되는 문제가 있다.In addition, antimony is added to improve the strength and hardness, 0.2 to 3.0% by weight is added, when the content exceeds 3.0% by weight there is a problem that the melting point is extremely raised.
마지막으로 아연은 조직내에서 기공을 발생시키므로 전혀 함유시키지 않거나, 필요하다면 그 함량을 최고 0.2 중량% 이하로 제한하여 함유시키도록 한다.Finally, zinc does not contain any zinc because it generates pores in the tissue, or if necessary, the content is limited to up to 0.2% by weight or less.
이하, 본 발명을 실시예에 의거하여 상세히 설면하면 다음과 같은 바, 본 발명이 실시예에 의해 한정되는 것은 아니다.Hereinafter, the present invention will be described in detail based on Examples, as follows, but the present invention is not limited by the Examples.
[실시예 및 비교예 1~2][Examples and Comparative Examples 1 and 2]
다음 표에 나타낸 바와 같은 함량 및 조성으로 땜납용 재료를 주조하여 제조하였으며, 제조된 땜납용 재료에 대하여 전기비저항 및 인장강도를 측정하였으며 그 결과는 다음 표에 나타낸 바와 같다.The solder material was cast by the content and composition as shown in the following table, and the electrical resistivity and tensile strength of the prepared solder material were measured, and the results are shown in the following table.
여기서, 전기비저항은 톰슨브리지(Thomson Bridge) 방법에 의해 측정한 후 계산하였으며, 인장강도는 만능재료 시험기를 이용하여 측정하였다.Here, the electrical resistivity was calculated after the measurement by the Thomson Bridge (Thomson Bridge) method, the tensile strength was measured using a universal testing machine.
[표][table]
상기 표의 결과로부터 본 발명의 땜납용 재료는 종래의 땜납용 재료에 비하여 전기비저항이 감소되어 땜납 부위의 전기전도도가 증가하며, 알루미늄을 첨가함으로 인한 강도가 향상되어 내구피로수명이 증가됨을 알 수 있다.It can be seen from the results of the table that the solder material of the present invention has a reduced electrical resistivity compared to the conventional solder material, thereby increasing the electrical conductivity of the solder portion, and improving the strength due to the addition of aluminum to increase the endurance fatigue life. .
그밖에 본 발명의 땜납 재료는 은과 알루미늄의 열전도도가 좋기 때문에 사용시 발생한 열의 방출이 쉽게 되어 땜납 부위의 온도 상승이 작으며, 납을 사용하지 않아서, 인체에 무해하고 아연을 소량 함유함으로 인하여 조직내에 기공이 없어서 그 품질이 우수하다.In addition, the solder material of the present invention has a good thermal conductivity of silver and aluminum, so it is easy to release heat generated during use, so that the temperature rise of the solder portion is small, and it is harmless to the human body because it does not use lead. There is no pore, so the quality is excellent.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950043891A KR100232524B1 (en) | 1995-11-27 | 1995-11-27 | The strength solder of pb free |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950043891A KR100232524B1 (en) | 1995-11-27 | 1995-11-27 | The strength solder of pb free |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970025826A KR970025826A (en) | 1997-06-24 |
| KR100232524B1 true KR100232524B1 (en) | 1999-12-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950043891A KR100232524B1 (en) | 1995-11-27 | 1995-11-27 | The strength solder of pb free |
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| Country | Link |
|---|---|
| KR (1) | KR100232524B1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR19980041034A (en) * | 1996-11-30 | 1998-08-17 | 이형도 | Solder for Electronic Parts with Low Lead Content |
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1995
- 1995-11-27 KR KR1019950043891A patent/KR100232524B1/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| KR970025826A (en) | 1997-06-24 |
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