KR100232075B1 - The method for embossed carving by electric casting - Google Patents

The method for embossed carving by electric casting Download PDF

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KR100232075B1
KR100232075B1 KR1019960061482A KR19960061482A KR100232075B1 KR 100232075 B1 KR100232075 B1 KR 100232075B1 KR 1019960061482 A KR1019960061482 A KR 1019960061482A KR 19960061482 A KR19960061482 A KR 19960061482A KR 100232075 B1 KR100232075 B1 KR 100232075B1
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composition
relief
copper
treatment
electroforming
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KR1019960061482A
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KR19980043568A (en
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이재복
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이재복
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/0033D structures, e.g. superposed patterned layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/38Electroplating: Baths therefor from solutions of copper
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/48Electroplating: Baths therefor from solutions of gold
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

본 발명은 가정 및 사무실 등의 벽면에 취부, 박물관 도서관 대형 건물의 초석 등에 취부, 묘지의 비석 및 상석에 취부, 납골당 각개의 함에 취부할 수 있어 그 인물상에 대한 실체적인 감각으로서 보는 사람으로 하여금 기념과 교육적인 차원으로서 대중 보급 할 수 있는 것으로서 고무 음각형을 제작하는 제1공정과 전기주조하는 제2공정과 착색 및 금도금하는 제3공정과 액자의 제작 및 취부하는 제4공정으로서 완성되어 있고 이러한 인물상 부조의 제작으로서 가정 및 사무실 등의 벽면, 박물관, 도서관 대형건물의 초석, 묘지의 비석 및 상석, 납골당 각개의 함에 취부하여 조각품과 같은 심미감을 표출하여 과거 역사를 회상할 수 있게 하는 것이다.The present invention can be mounted on the walls of homes and offices, on the cornerstones of large museums, library buildings, on gravestones and topstones of graveyards, and on each box of the ossuary. It is completed as the first process of producing rubber engraved form, the second process of electroforming, the third process of coloring and gold plating, and the fourth process of making and mounting picture frames, which can be widely used as educational and educational dimensions. As a figure relief, it is installed on the walls of homes and offices, the cornerstones of large museums, libraries, gravestones and statues of graveyards, and each box per ossuary to express the aesthetics of sculptures so that the past history can be recalled.

Description

전기주조에 의한 인물상 부조의 제작방법Manufacturing method of figure relief by electric casting

본 발명은 전기주조(Electroforming)에 의한 인물상부조의 제작방법에 관한 것으로 더 상세하게는 예술적 기법에 의한 인물상 부조를 공업적으로 양산 할 수 있음으로서 조형미가 있는 작품을 저렴하게 대중 공급할 수 있게 한 것이다.The present invention relates to a manufacturing method of the character relief by electroforming, and more particularly, it is possible to industrially mass-produce the character relief by artistic techniques, thereby enabling the mass supply of works with molding beauty at low cost. .

인물상 부조는 신, 성인, 역대왕, 위인, 장군이나 조상, 학자, 창업자, 선배 및 동인들의 얼굴을 청동, 석재, 석고, 목재 등의 재료로서 조각하여 안치함으로서 그 사람들의 업적과 공헌을 기념하고 후세 사람들에게 교육적 귀감이 되도록 하고 있다.Relief statues celebrate the achievements and contributions of gods, saints, generations of kings, great men, generals or ancestors, scholars, founders, seniors, and fellows by engraving the faces of bronze, stone, plaster, wood, etc. It is intended to be an educational example for future generations.

그러나 이러한 조각 작업은 조각가나 숙달된 장인이 아니면 그대로 묘사할 수 없어서 그 작품제작 과정이 길고 또한 가격이 비싸므로 일반대중에게는 실용화 되지 못하고 있다.However, these sculptures cannot be portrayed as they are not sculptors or master craftsmen, making them long and expensive.

그래서 일반적인 사진으로서 대체하는 경우 입체감이 없어 보는 사람에게 감응을 주기에 미흡한 실정이다.Therefore, if you replace it as a general photograph, it is insufficient to give an impression to the viewer who does not have a three-dimensional effect.

본 발명은 이러한 인물상 부조를 과학기술적으로 제작하여 양산 공급할 수 있게 하기 위하여 고무 음각형을 제작하는 제1공정과 전기주조하는 제2공정과 착색 및 금도금하는 제3공정과 액자의 제작 및 취부하는 제4공정으로서 완성되어 있고 이러한 인물상 부조의 제작으로서 가정 및 사무실 등의 벽면, 박물관, 도서관 대형건물의 초석, 묘지의 비석 및 상석, 납골당 각개의 함에 취부하여 조각품과 같은 심미감을 표출하여 과거 역사를 회상할 수 있게 하는 것이다.The present invention provides a first process for producing rubber engravings, a second process for electroforming, a third process for coloring and gold plating, and a production and mounting of a frame to enable the manufacture and production of such a statue relief. It is completed as a four-step process, and this figure is used as a relief for the walls of homes and offices, the cornerstones of large museums and libraries, the gravestones and statues of graveyards, and the crests of each ossuary. To do it.

그 이하 발명의 구성과 작용을 그 실시예인 제작공정에 연계시켜 상세히 설명하면 다음과 같다.Hereinafter, the configuration and operation of the present invention will be described in detail with reference to the manufacturing process of the embodiment as follows.

[제1공정 : 고무 음각형 제작][Step 1: Rubber Engraving]

(1) : 사각(약10㎝×50㎝) 또는 타원형의 구조물에 유점토 또는 석고를 사용하여 인물상 부조를 양각 제작한다.(1): Embossed reliefs of figures are made by using clay or plaster on square (approx. 10cm × 50cm) or oval structure.

(2) : 제작된 양각 부조물에 실리콘 액체 고무 및 액체 엑폭시를 부어 경화시킨후 고체형화된 형틀을 박리하여 음각형의 부조상을 제작한다.(2): Pour silicone liquid rubber and liquid epoxy into the embossed reliefs, and then solidify the mold to make the relief relief.

[제2공정 : 전기 주조][Step 2: Electric Casting]

(1) : 피 주조체를 세척한다.(1): Clean the casting object.

(2) : 피 주조체에 전도성 부여(2): giving conductivity to the cast object

「1」 감수성 처리"1" sensitivity treatment

처리액 조성Treatment liquid composition

SnCl 2H2O(염화 제1주석) : 4g/ℓSnCl 2 H 2 O (TiN Chloride): 4g / ℓ

HCl(녹염산) : 10㎎/ℓHCl (green hydrochloric acid): 10mg / l

「2」 활성화 처리"2" activation processing

처리액 조성Treatment liquid composition

NH4OH(암모니아) 용액에 AgNO3(질산은)을 녹인다.Dissolve AgNO 3 (silver nitrate) in NH 4 OH (ammonia) solution.

「3」 화학 동도금"3" chemical copper plating

처리액 조성Treatment liquid composition

(1액) : CuSO4(황산동) : 35g/ℓ(1 liquid): CuSO 4 (copper sulfate): 35g / ℓ

NaOH(수산화 소다) : 50g/ℓNaOH (Sodium Hydroxide): 50g / ℓ

C4H4KNaO64H2O(못셀염) : 170g/ℓC 4 H 4 KNaO 6 4H 2 O (Moxel salt): 170 g / ℓ

(2액) : 포르말린 37%(2 fluids): formalin 37%

처리 방법 : 1액과 2액의 비율을 5:1로 조성하여 3~5분 침지 시킨다.Treatment method: The ratio of 1 liquid and 2 liquids is 5: 1 and immersed for 3 to 5 minutes.

(3) : 1차 전기 동도금(3): primary electroplating

액 조성Liquid composition

CuSO45H2O(황산동) : 50g/ℓCuSO 4 5H 2 O (Copper Sulfate): 50g / ℓ

H2SO4(황산) : 20g/ℓH 2 SO 4 (sulfuric acid): 20g / ℓ

광택제 : 소량Polishes: Small amount

처리 방법 : 낮은전류 밀도(0.5~1.5A/dm)에서 2~5분 처리한다.Treatment method: 2 ~ 5 minutes at low current density (0.5 ~ 1.5A / dm).

(4) : 2차 동도금(4): 2nd copper plating

액조성Liquid composition

CuSO45H2O (황산동) : 250g/ℓCuSO 4 5H 2 O (copper sulfate): 250g / ℓ

H2SO4(황산) : 10~50g/ℓH 2 SO 4 (sulfuric acid): 10 ~ 50g / ℓ

처리방법 : 정지식Treatment method: Stationary

온 도 : 상온Temperature: Room temperature

전류밀도 : 2~4A/dmCurrent density: 2 ~ 4A / dm

처리시간 : 1~48 시간Treatment time: 1 ~ 48 hours

DUTY 비 : 18 : 6Duty ratio: 18: 6

사용정류기 : 고 전류부 저 전류부에 똑같은 두께의 피막을 얻기 위해 DUTY 비율의 변환 가능한 정류기의 사용Rectifier used: Use of convertible rectifier with duty ratio to obtain the same thickness of film for high current and low current

(5) : 박리 및 제 도금(5): peeling and first plating

고무 형틀에서 박리하여 나온 동전주 제품을 고리 및 장식을 절곡 또는 용접을 하고 제3차 동도금에 의하여 깨끗하고 매끄럽게 제작한다.Coin liquor products peeled from the rubber mold are bent or welded with rings and decorations, and are made clean and smooth by the third copper plating.

[3차 공정 : 착색 및 금 도금][3rd process: coloring and gold plating]

전기 주조에 의해 만들어진 적동색의 제품을 다음 방법으로 착색 또는 금 도금한다.The reddish color product produced by electroforming is colored or gold plated by the following method.

(1) : 착색(1): coloring

액 조성Liquid composition

Cu(NO3)23H2O(질산동) : 30gCu (NO 3 ) 2 3H 2 O (copper nitrate): 30g

NACl(염화소다) : 30gNACl (Sodium Chloride): 30g

NH4Cl(염화암몬) : 15gNH 4 Cl (ammonium chloride): 15 g

K2Al2(SO4)224H2O(칼리명반) : 7gK 2 Al 2 (SO 4 ) 2 24H 2 O (Calli Alum): 7g

CH3COOH(6%)(빙초산) : 11CH 3 COOH (6%) (glacial acetic acid): 11

처리방법 : 상기 조성액을 80~90℃로 가열후 10분후에 건조시켜 가공처리함Treatment method: The composition is dried and processed after 10 minutes after heating to 80 ~ 90 ℃

(2) : 금 도금(2): gold plating

액 조성Liquid composition

KAu(CN)2(시안화 금칼리) : 12g/ℓKAu (CN) 2 (gold cyanide): 12g / ℓ

C6H5Na3O7 2H2O(구연산 염) : 90g/ℓC 6 H 5 Na 3 O 7 2 H 2 O (citrate): 90 g / ℓ

온 도 : 25~25℃Temperature: 25 ~ 25 ℃

전 압 : 2~5 VOLTVoltage: 2 ~ 5 VOLT

전류밀도 : 1.0 ~ 2.5A/dmCurrent Density: 1.0 ~ 2.5A / dm

PH : 3.0 ~ 3.5PH: 3.0 ~ 3.5

양 극 : 백금판 로듐 도금 T; 망Anode: platinum plate rhodium plating T; Mans

[제4공정 : 액자의 제작 및 취부][Step 4: Making and attaching frame]

상기 제1~3공정에 의해 제작된 인물상부도를 액자에 넣어 완성하는 것이다.The figure top part produced by the said 1st-3rd process is put into a frame, and is completed.

상기와 같이된 본 발명은 가정 및 사무실 등의 벽면에 취부, 박물관 도서관 대형건물의 초석 등에 취부, 묘지의 비석 및 상석에 취부, 납골당 각개의 함에 취부할 수 있어 그 인물상에 대한 실체적인 감각으로서 보는 사람으로 하여금 기념과 교육적인 차원으로서 대중 보급 할 수 있는 것이다.The present invention as described above can be mounted on the walls of homes and offices, such as the cornerstone of museums and large buildings, tombstones and headstones of the cemetery, and to each box of the ossuary. It can be distributed to the public as a memorial and educational dimension.

Claims (2)

인물상 부조를 과학기술적으로 제작하여 양산 공급할 수 있게 하기 위하여 고무 음각형을 제작하는 제1공정과 전기주조하는 제2공정과 착색 및 금도금하는 제3공정과 액자의 제작 및 취부하는 제4공정으로서 완성되어 있는 것을 특징으로 하는 전기주조에 의한 인물상 부조의 제작방법.Completed as the first process of producing rubber engraved type, the second process of electroforming, the third process of coloring and gold plating, and the fourth process of making and mounting picture frames for scientifically technically manufacturing and supplying human relief. Method of producing a character image relief by electroforming, characterized in that it is. 사각(약40㎝×50㎝) 또는 타원형의 구조물에 유점토 또는 석고를 사용하여 인물상 부조를 양각 제작하고 제작된 양각 부조물에 실리콘 액체 고무 및 액체 엑폭시를 부어 경화 시킨후 고체형화된 형틀을 박리하여 음각형의 부조상을 제작실시하는 제1공정과, 피 주조체를 세척하고 피 주조체에 전도성 부여하되 「1」 감수성 처리 처리액 조성은 SnCl22H2O(염화 제1주석) : 4g/ℓ, HCl(녹염산): 10㎎/ℓ 으로 하고 「2」 활성화처리로서 처리액조성은 NH4OH(암모니아)용액에 AgNO3(질산은)을 녹이고 「3」 화학 동도금으로서 처리액 조성은 (1액): CuSO4(황산동): 35g/ℓ, NaOH(수산화 소다): 50g/ℓ, C4H4KNaO64H2O(못셀염): 170g/ℓ (2액) : 포르말린 37% 으로 하고 처리 방법 : 1액과 2액의 비율을 5:1로 조성하여 3~5분 침지 시키고 1차 전기 동도금 하되 액 조성 CuSO45H2O(황산동): 50g/ℓ, H2SO4(황산): 20g/ℓ, 광택제 : 소량 처리 방법 : 낮은전류 밀도(0.5~1.5A/dm)에서 2~5분 처리하고 2차 동도금 하되 액 조성 CuSO45H2O(황산동): 250g/ℓ, H2SO4(황산): 10~50g/ℓ 처리방법 : 정지식, 온도 : 상온, 전류밀도 : 2~4A/dm, 처리시간 : 1~48시간, DUTY비 : 18 : 6, 사용정류기 : 고 전류부 저 전류부에 똑같은 두께의 피막을 얻기 위해 DUTY 비율의 변환 가능한 정류기를 사용하며 고무 형틀에서 박리하여 나온 동전주 제품을 고리 및 장식을 절곡 또는 용접을 하고 제3차 동도금에 의하여 깨끗하고 매끄럽게 제작실시하는 제2공정과, 전기 주조에 의해 만들어진 적동색의 제품을 다음 방법으로 착색 또는 금 도금하되, (1) : 착색액 조성 Cu(NO3)23H2O(질산동): 30g, NACl(염화소다): 30g, NH4Cl(염화암몬): 15g, K2Al2(SO4)224H2O(칼리명반) : 7g, CH3COOH(6%)(빙초산) : 11, 처리방법 : 상기 조성액을 80~90℃로 가열후 10분후에 건조시켜 가공처리하고 (2) : 금 도금액 조성 KAu(CN)2(시안화 금칼리):12g/ℓ, C6H5Na3O72H2O(구연산 염): 90g/ℓ, 온도: 25~25℃, 전압: 2~5 VOLT, 전류밀도: 1.0~2.5A/dm, PH: 3.0~3.5, 양극: 백금판 로듐 도금 T; 망으로서 실시하는 제3공정과, 상기 제1~3공정에 의해 제작된 인물상부도를 액자에 넣어 완성하는 것을 결합함을 특징으로 하는 전기주조에 의한 인물상 부조의 제작방법.Embossed reliefs are made by embossing clay or gypsum on a square (approx. 40cm × 50cm) or oval structure, and the silicone relief rubber and liquid epoxy are poured into the relief relief and then solidified. The first step of producing an intaglio embossed phase, and to wash the casting to give the casting to the conductivity, the composition of the "1" susceptible treatment solution is SnCl 2 2H 2 O (1 st tin chloride): 4g / l, HCl (chlorochloric acid): 10 mg / l, the treatment solution composition as the "2" activation treatment was dissolved AgNO 3 (silver nitrate) in NH 4 OH (ammonia) solution and the composition of the treatment solution as (3) chemical copper plating ( 1 liquid): CuSO 4 (copper sulfate): 35 g / l, NaOH (sodium hydroxide): 50 g / l, C 4 H 4 KNaO 6 4H 2 O (moxel salt): 170 g / l (2 liquids): 37% formalin and processing by: the ratio of the first liquid and the second fluid 5: the composition as 13-5 minutes and immersed, but the primary electric copper plating solution composition CuSO 4 5H 2 O (sulfur Copper): 50g / ℓ, H 2 SO 4 ( sulfuric acid): 20g / ℓ, brightener: small processing method: a low current density (process 0.5 ~ 1.5A / dm) 2 ~ 5 min, and the second copper plating solution composition, but CuSO 4 5H 2 O (copper sulfate): 250g / ℓ, H 2 SO 4 (sulfuric acid): 10 ~ 50g / ℓ Treatment method: Static, Temperature: Room temperature, Current density: 2 ~ 4A / dm, Treatment time: 1 ~ 48 Time, duty ratio: 18: 6, used rectifier: high current part Uses convertible rectifier of duty ratio to obtain the same thickness of film at low current part, and bends or decorates coins and products made by peeling from rubber mold. The second process of welding and manufacturing clean and smooth by the third copper plating, and the color of red copper color produced by electroforming is colored or gold plated by the following method. (1): Color composition Cu (NO 3 ) 2 3 H 2 O (copper nitrate): 30 g, NACl (sodium chloride): 30 g, NH 4 Cl (ammonium chloride): 15 g, K 2 Al 2 (SO 4 ) 2 24H 2 O (calicolum): 7 g, CH 3 COOH (6%) (glacial acetic acid): 11, treatment method: The composition solution was heated to 80 ~ 90 ℃ 10 minutes after drying and processing (2): gold plating solution composition KAu (CN) 2 (gold cyanide): 12 g / L, C 6 H 5 Na 3 O 7 2H 2 O (citric acid salt): 90 g / L, temperature: 25-25 ° C., voltage: 2-5 VOLT, current density: 1.0-2.5 A / dm, PH: 3.0-3.5, anode: platinum plated rhodium Plating T; And a third step of performing as a net and combining the figure top view produced by the first to third steps into a picture frame and completing the figure.
KR1019960061482A 1996-12-04 1996-12-04 The method for embossed carving by electric casting KR100232075B1 (en)

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