KR100216799B1 - Solder ball setting apparatus of solder ball bumping equipment - Google Patents
Solder ball setting apparatus of solder ball bumping equipment Download PDFInfo
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- KR100216799B1 KR100216799B1 KR1019960047917A KR19960047917A KR100216799B1 KR 100216799 B1 KR100216799 B1 KR 100216799B1 KR 1019960047917 A KR1019960047917 A KR 1019960047917A KR 19960047917 A KR19960047917 A KR 19960047917A KR 100216799 B1 KR100216799 B1 KR 100216799B1
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- translucent acrylic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
본 발명은 BGA 반도체 패키지의 배면에 솔더볼을 안착시키기 위한 솔더볼 범핑(Solder Ball Bumping) 장비의 솔더볼 안착장치에 관한 것으로서, 더욱 상세하게는 반도체 패키지(50)의 안착홈(40)과 대응하는 흡착구멍(205)을 형성한 흡착판(201)과, 상기 흡착판(201)의 상부로 소정의 간격을 갖는 연결홈(207)을 형성한 배큠(207)과 연결된 반투명아크릴(217)과, 상기 반투명아크릴(217)의 상부로 형광동(209a)을 설치하여 그 빛을 반투명아크릴(217)로 투과하는 라이트(209)와, 상기 라이트(209)의 상부로 지지대(215)와 연결된 상판(211)을 형성하고 상기의 지지대(215)는 이송수단(220)과 연결하여 다수개의 솔더볼이 BGA 패키지에 형성된 전체의 안착홈에 정확하고 신속하게 안착하여 작업공차를 해소하고 불량률을 저하시켜 원가를 절감함으로서, 제품의 품질을 향상하고 소비자의 신뢰성을 향상시킨 매우 유용한 발명이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball mounting apparatus for solder ball bumping equipment for mounting a solder ball on the back surface of a BGA semiconductor package, A translucent acrylic 217 connected to a discharge port 207 formed with a connection groove 207 having a predetermined interval at an upper portion of the suction plate 201 and a translucent acrylic 217 connected to the discharge port 207, A light 209 is provided on the upper part of the light 209 to transmit the light to the translucent acrylic 217 and a top plate 211 connected to the support 215 on the upper part of the light 209 And the support member 215 is connected to the transfer means 220 so that a plurality of solder balls can be accurately and quickly seated in the entire mounting groove formed in the BGA package to reduce the work tolerance and reduce the defect rate, To improve the quality of This is a very useful invention that improves reliability.
Description
본 발명은 BGA 반도체 패키지의 배면에 솔더볼을 안착시키기 위한 솔더볼 범핑(Solder Ball Bumping) 장비의 솔더볼 안착장치에 관한 것으로서, 더욱 상세하게는 패키지의 솔더볼 안착홈과 대응하는 요홈을 구비한 흡착판을 형성하여 상기의 흡착판을 배큠과 연결한 안착장치를 형성함으로서, 수백개의 솔더볼을 패키지의 배면에 신속하고 정확하게 한번에 안착시켜 작업공정을 간소화하는 솔더볼 범핑 장비의 솔더볼 안착장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a solder ball mounting apparatus for mounting a solder ball on a rear surface of a BGA semiconductor package, and more particularly to a solder ball mounting apparatus for mounting a solder ball bumping apparatus The present invention relates to a solder ball mounting apparatus of a solder ball bumping apparatus that mounts several hundreds of solder balls on a back surface of a package quickly and accurately at one time by forming a seating apparatus in which the above attracting plate is connected to a bobbin.
일반적으로 BGA 반도체 패키지는 제5도에 도시된 바와 같이 PCB기판(20)의 저면으로 수백개의 솔더볼(30)이 부착되고 상기 PCB기판(20)의 상면에는 반도체 칩(10)이 에폭시등의 접착수단(12)에 의해 접착되면, 이 반도체 칩(10)은 신호전달을 위하여 와이어(11)로 PCB기판(20)의 상면에 형성된 본드 핑거(Bond Finger)에 본딩되어 상기 반도체 칩(10) 및 그 외의 주변 구성품을 외부로부터 보호하기 위하여 컴파운드(13)로 몰딩된다.As shown in FIG. 5, hundreds of solder balls 30 are attached to a bottom surface of a PCB substrate 20, and a semiconductor chip 10 is bonded to the top surface of the PCB substrate 20 by epoxy bonding The semiconductor chip 10 is bonded to the bond finger formed on the upper surface of the PCB substrate 20 by wires 11 for signal transmission so that the semiconductor chip 10 and / And is molded into the compound (13) to protect the other peripheral components from the outside.
상기에서 BGA 반도체 패키지(50)의 PCB기판(20) 저면에 부착된 솔더볼(30)은 한 패키지당 수백개(그 수를 한정짓는 것은 아니나 보통 200-300개이고 이 보다 많거나 적을 수도 있다.)의 솔더볼(30)이 BGA 패키지(50)의 안착홈(40)에 안착되어 상기 BGA 패키지(50)의 입출력 단자로서 리드 역할을 하게 된다.The number of the solder balls 30 attached to the bottom of the PCB substrate 20 of the BGA semiconductor package 50 may be several hundreds per package (though the number of the solder balls 30 is not limited to 200-300, more or less). The solder ball 30 of the BGA package 50 is seated in the seating groove 40 of the BGA package 50 and serves as a lead as an input / output terminal of the BGA package 50.
이와 같이 구성되는 BGA 반도체 패키지(50)는 솔더볼(30)을 일일이 손으로 하나씩 안착홈(30)에 안착시키거나 티져(Tweezer)나 핀셋 등으로 안착시켜서 장시간의 작업시간이 소요되어 생산성이 저하되고, 또한 신속하고 정확히 솔더볼을 안착홈에 안착시켜야 하므로 작업자의 피로도가 가중되어 불량률을 상승시켜서 생산원가를 상승시키므로 소비자의 신뢰성을 저하시키는 문제점등이 있었다.The BGA semiconductor package 50 configured as described above requires a long working time by placing the solder balls 30 one by one in the seating grooves 30 one by one or placing them with tweezers or tweezers or the like, In addition, since the solder ball must be seated in the seat groove quickly and accurately, the fatigue of the worker is increased and the defective rate is raised, thereby raising the production cost.
본 발명은 이와 같은 종래 기술의 문제점을 개선하기 위하여 안출된 것으로서, 본 발명의 목적은 수백개의 솔더볼이 BGA 패키지에 형성된 전체의 안착홈에 정확하고 신속하게 안착하여 작업공차를 해소하고 불량률을 저하시켜 원가를 절감함으로서, 제품의 품질을 향상하고 소비자의 신뢰성을 향상시키는 솔더볼 범핑 장비의 솔더볼 안착장치를 제공하는 데 있다.SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the prior art described above, and it is an object of the present invention to provide a solder ball mounting structure, in which hundreds of solder balls are accurately and quickly seated in an entire mounting groove formed in a BGA package, And to provide a solder ball mounting apparatus for a solder ball bumping apparatus that improves product quality and improves reliability of a consumer by reducing cost.
이와 같은 목적을 실현하기 위하여 이루어진 본 발명에 의한 솔더볼 범핑 장비의 솔더볼 안착장치는 패키지의 안착홈과 대응하는 흡착구멍을 형성한 흡착판과, 상기 흡착판의 상부로 소정의 간격을 갖는 연결홈을 형성한 배큠과 연결된 반투명아크릴과, 상기 반투명아크릴의 상부로 형광등을 설치하여 그 빛을 반투명아크릴로 투과하는 라이트와, 상기 라이트의 상부로 지지대와 연결된 상판을 형성하고 상기의 지지대는 이송수단과 연결되는 것을 특징으로 하는 솔더볼 범핑 장비의 솔더볼 안착장치를 제공한다.The solder ball mounting apparatus of the solder ball bumping apparatus according to the present invention is provided with a suction plate having a suction hole corresponding to a mounting groove of the package and a connection groove having a predetermined gap formed on the suction plate A translucent acrylic which is connected to the vacuum pump, a translucent acrylic which is installed on the upper part of the translucent acrylic, a light which transmits the light through translucent acrylic, and an upper plate connected to the support by the upper part of the light, The present invention provides a solder ball seating device for solder ball bumping equipment.
제1도는 본 발명이 장착된 상태를 개략적으로 보인 평면도.FIG. 1 is a plan view schematically showing a state in which the present invention is mounted. FIG.
제2도는 본 발명의 동작상태 측면도.FIG. 2 is a side view of the operating state of the present invention; FIG.
제3도는 본 발명의 동작상태를 보인 요부 단면도.3 is a cross-sectional view of the main part showing the operation state of the present invention.
제4도는 본 발명을 이용하여 BGA 패키지에 솔더볼이 안착된 상태를 보인 BGA 패키지의 평면도.FIG. 4 is a plan view of a BGA package in which a solder ball is placed on a BGA package using the present invention. FIG.
제5도는 일반적인 BGA 패키지의 구성을 보인 단면도.FIG. 5 is a sectional view showing the configuration of a general BGA package. FIG.
* 도면의 주요부분에 대한 부호의 설명DESCRIPTION OF THE REFERENCE NUMERALS
140 : 바이브레이션 솔더볼 트레이 143 : 볼박스140: Vibrating solder ball tray 143: Ball box
200 : 솔더볼 안착장치 201 : 흡착판200: Solder ball mounting device 201: Suction plate
203 : 요홈 205 : 흡착구멍203: groove 205: suction hole
207 : 연결홈 209 : 라이트207: Connection groove 209: Light
220 : 이송수단220: conveying means
이하, 본 발명의 바람직한 실시예를 첨부된 도면에 따라서 더욱 상세하게 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
제1도는 본 발명이 장착된 상태를 개략적으로 보인 평면도이고, 제2도는 본 발명의 동작상태 측면도이며, 제3도는 본 발명의 동작상태를 보인 요부 단면도이다.FIG. 1 is a plan view schematically showing a state in which the present invention is mounted, FIG. 2 is a side view of an operation state of the present invention, and FIG. 3 is a sectional view of a main part showing an operation state of the present invention.
그리고 제4도는 본 발명을 이용하여 BGA 패키지에 솔더볼이 안착된 상태를 보인 BGA 패키지의 평면도로서, 솔더볼 범핑 장치의 솔더볼 안착장치(200)는 일측에 다수개의 BGA패키지(50)가 적층된 매거진을 장착하여 순차적으로 BGA 패키지(50)를 로딩하는 로딩부(110)와, 상기 로딩부(110)에서 순차적으로 BGA 패키지(50)를 배큠에 의해 고정하고 순차적인 작업공정을 위해 이송레일(125)을 따라 정확한 위치로 이송시키는 인덱스유니트(120)와, 상기 인덱스유니트(120)에 고정된 BGA 패키지(50)의 배면에 스크린프린팅 방식에 의해 플럭스를 도포하는 플럭스도포부(120)를 형성한다.4 is a plan view of a BGA package in which a solder ball is mounted on a BGA package using the present invention. The solder ball mounting apparatus 200 of the solder ball bumping apparatus includes a magazine in which a plurality of BGA packages 50 are stacked on one side A loading unit 110 for sequentially loading the BGA package 50 and a loading unit 110 for sequentially mounting the BGA package 50 on the transferring rail 125 for sequential operations, And a flux cover 120 for applying a flux to the back surface of the BGA package 50 fixed to the index unit 120 by a screen printing method.
그리고 상기 BGA 패키지(50)의 배면에 솔더볼(30)을 안착시키기 위해 수백만개의 솔더볼(30)이 담겨진 상태로 진동하는 볼 박스(143)와, 솔더볼(30)의 불량품을 담아 두는 리젝박스(145)로 이루어진 바이브레이션 솔더볼 트레이(140)를 형성한다.A ball box 143 vibrating in a state in which millions of solder balls 30 are embedded in the rear surface of the BGA package 50 for mounting the solder balls 30 and a rebox box 145 for holding defective products of the solder balls 30 (Not shown).
상기에서 볼박스(143)는 편심을 갖고 회전운동을 하는 구동축(141)과 연결된 바이브레이션 장치(149)와 연결하고, 상기 볼박스(143)의 상부에 솔더볼(30)의 크기나 모양에 이상이 발견되면 불량품을 담아두는 리젝박스(145)가 구동모터(147)에 의하여 전 후진이 자유롭도록 형성되어 있다.The ball box 143 is connected to the vibration device 149 connected to the drive shaft 141 which is rotated in an eccentric manner and the ball box 143 is provided with a solder ball 30, And a recharge box 145 for storing defective products is formed so as to be free to move forward and backward by a drive motor 147 when it is found.
그리고 상기 바이브레이션 솔더볼 트레이(140)의 상부에 솔더볼(30)을 흡착하여 플럭스가 도포된 BGA 패키지(50)의 배면에 솔더볼(30)을 안착시키는 솔더볼 안착장치(200)와, 상기 바이브레이션 솔더볼 트레이(140)에서 솔더볼 안착장치(200)로 솔더볼(30)을 흡착한 상태를 레이져와, 빛에 의해 검사하는 1차 인스펙션유니트(150)와, 상기 BGA 패키지(50)에 솔더볼(30)이 정확하게 안착된 상태를 비젼카메라로 검사하는 2차 인스펙션유니트(160)와, 상기 2차 인스펙션유니트(160)에서 검사가 완료된 BGA 패키지(50)를 양호와 불량으로 구분하여 매거진에 적층시키는 언로딩부(170)로 이루어진다.A solder ball mounting device 200 that attracts the solder ball 30 to the upper portion of the vibration solder ball tray 140 to seat the solder ball 30 on the back surface of the flux- A first inspection unit 150 for inspecting a state where the solder ball 30 is adsorbed by the solder ball mounting unit 140 in the solder ball mounting unit 140 by using a laser, And an unloading unit 170 for stacking the BGA package 50, which has been inspected in the secondary inspection unit 160, in good and bad states and stacking the same on the magazine, ).
상기에서 솔더볼 안착장치(200)는 제2도 내지 제3도에 나타난 바와 같이 바이브레이션 솔더볼 트레이(140)의 상부로 솔더볼 안착장치(200)가 이송수단(220)과 연결되고 상기의 이송수단(220)은 본체(100)에 고정 설치된다.The solder ball mounting apparatus 200 is connected to the transferring means 220 on the upper side of the vibration solder ball tray 140 as shown in FIGS. 2 to 3 and the transferring means 220 Is fixedly installed on the main body 100.
그리고 상기 이송수단(220)은 고정판(227)의 상부 일측에 구동모터(225)를 형성하여 벨트(223)와 풀리(221)로 연결하며 고정판(227)의 외측에는 풀리(221)와 연결된 볼나사(229)를 수직으로 형성하여 지지대(215)와 결합 설치된다.A drive motor 225 is formed on one side of the top of the fixing plate 227 to connect the belt 223 with the pulley 221 and the ball 220 connected to the pulley 221 on the outer side of the fixing plate 227. [ A screw 229 is vertically formed and is coupled with the support table 215.
상기에서 지지대(215)의 하부에는 다수개(4개)의 지지봉(250)과 연결된 상판(211)을 형성하여 상기 상판(211)의 상부 일측에 센서(213)를 형성하며 상기 상판(211)의 하부에는 형광등(209a)을 구비한 라이트(209)를 형성하고, 상기 라이트(209)의 하부에 소정의 폭과 일정의 길이를 갖는 관통구멍(209b)을 형성한다.A sensor 213 is formed on one side of the upper surface of the upper plate 211 by forming an upper plate 211 connected to a plurality of support rods 250 at a lower portion of the support table 215, A light 209 having a fluorescent lamp 209a is formed in a lower portion of the light 209 and a through hole 209b having a predetermined width and a predetermined length is formed under the light 209. [
그리고 상기 라이트(209)의 하부에는 지지봉(250)과 연결된 고정판(240)을 형성하여 상기 고정판(240)의 하단 내측으로 BGA 패키지(50)의 안착홈(40)과 대응하는 수백개(한 패키지당 200~300개)의 흡착구멍(205)을 구비한 흡착판(201)을 형성한다.A fixing plate 240 connected to the support rods 250 is formed on the lower portion of the light 209 so that several hundreds of the fixing holes 240 corresponding to the seating grooves 40 of the BGA package 50 are formed inside the lower end of the fixing plate 240 The adsorption plate 201 having the adsorption holes 205 is formed.
또한 흡착판(201)의 상부에는 소정의 간격을 갖고 연결홈(207)을 형성한 투명아크릴(217)이 형성되어 솔더볼(30)을 안착할 수 있는 배큠(207)과 연결된다.A transparent acrylic 217 having a connection groove 207 is formed at an upper portion of the attracting plate 201 and connected to a punch 207 capable of placing the solder ball 30 thereon.
상기와 같이 이루어진 본 발명의 특징적인 작용을 살펴보면 다음과 같다.Hereinafter, the characteristic operation of the present invention will be described.
수백개(100만~250만개)의 솔더볼(30)을 볼박스(143)에 붓고 난 후에 전원을 인가하면 매거진에 적재된 BGA 패키지(50)를 로딩부(110)에서 인출하여 배큠으로 인덱스유니트(120)와 밀착시켜 이송레일(125)을 따라 이송하면 플럭스도포부(130)를 지나는 BGA 패키지(50)는 스크린프린팅 방식에 의해 플럭스가 도포된다.When the solder ball 30 is poured into the ball box 143 and then the power is applied, the BGA package 50 loaded in the magazine is taken out from the loading unit 110, The BGA package 50 passing through the flux cover 130 is coated with a flux by a screen printing method.
그리고 이와 동시에 바이브레이션 장치(149)의 상부에 위치하여 볼박스(143)의 내부로 이물질이 침투하지 못하도록 덮고있는 리젝박스(145)가 구동모터(147)의 구동력으로 계단식으로 분리되면, 이때 편심축을 갖고 구동하는 구동축(141)이 볼박스(143)를 미세하게 흔들면서 솔더볼(30)을 균일하고 평탄하게 정리한다.At the same time, when the recharge box 145, which is located at the upper part of the vibration device 149 and covers the ball box 143 to prevent foreign matter from penetrating into the ball box 143, is separated stepwise by the driving force of the driving motor 147, The drive shaft 141 that is driven to move the ball box 143 finely shakes the ball box 143 uniformly and flatly.
또한 솔더볼 안착장치(200)의 이송수단(220)에 형성된 구동모터(225)가 동작하여 벨트(221)와 풀리(223)로 연결된 볼나사(229)를 동작시키면, 상기 볼나사(229)와 결합된 지지대(215)가 하강하고 이때 흡착판(201)도 볼박스(143)로 하강하여 다수개의 솔더볼(30)과 밀착한다.When the ball screw 229 connected to the belt 221 and the pulley 223 is operated by operating the drive motor 225 formed on the conveying means 220 of the solder ball mounting apparatus 200, At this time, the attracting plate 201 is also lowered by the ball box 143 to come in close contact with the plurality of solder balls 30.
이때 솔더볼(30)과 밀착한 흡착판(201)은 상기 솔더볼(30)의 반발력으로 지지봉(250)에 안내되어 상부로 밀리면서 센서에 감지되어 이송수단(220)의 구동모터(225)를 정지시킴과 동시에 배큠(230)의 흡입력으로 솔더볼(30)을 흡착구멍(205)의요홈으로 빨아들인다.At this time, the attracting plate 201 closely contacting the solder ball 30 is guided by the support rod 250 by the repulsive force of the solder ball 30 and is pushed upward to be sensed by the sensor to stop the driving motor 225 of the conveying means 220 The solder ball 30 is sucked into the groove of the suction hole 205 by the suction force of the discharge spool 230.
이와 동시에 라이트(209)의 관통구멍(209b)으로 통과하는 형광등(209a)의 불빛은 투명아크릴(217)로 투과되고 상기의 투명아크릴(217)은 불빛을 고르게 흡착판(201)의 하단으로 투과시켜 솔더볼(30)이 요홈(203)에 하나도 빠짐없이 흡착되었는지를 검사한다.At the same time, the light of the fluorescent lamp 209a passing through the through hole 209b of the light 209 is transmitted through the transparent acrylic 217, and the transparent acrylic 217 transmits the light evenly to the lower end of the attracting plate 201 It is inspected whether or not the solder ball 30 is completely adsorbed to the groove 203.
이때 솔더볼(30)이 요홈(203)에 완전하게 모두다 안착되면 배큠(207)은 진공상태에서 솔더볼(30)을 고정하고 센서(213)는 이를 감지하여 이송수단(220)의 구동모터(225)를 동작시켜 볼나사(229)로 지지대(215)를 상승시킨다.At this time, when the solder ball 30 is completely placed in the groove 203, the solder ball 30 is fixed in the vacuum state and the sensor 213 senses the solder ball 30 and the drive motor 225 And raises the support table 215 with the ball screw 229.
그리고 상승한 흡착판(201)은 인덱스유니트(120)에 고정된 BGA 패키지(50)로 이동하면서 수평선상에서 레이져와 빛에 의해 솔더볼(30)의 이상유무를 확인하는 1차 인스펙션유니트(150)를 거쳐 BGA 패키지(50)의 안착홈(40)에 정확하게 안착시킨다.The ascending attracting plate 201 is moved to a BGA package 50 fixed to the index unit 120 and is passed through a primary inspection unit 150 for confirming the abnormality of the solder ball 30 by laser and light on a horizontal line, (40) of the package (50).
상기에서 BGA 패키지(50)는 안착홈(40)에 솔더볼(30)이 정확하게 안착되어 있는지를 비젼카메라로 검사하는 2차 인스펙션유니트(160)를 지나 BGA 패키지(50)의 정품과 불량을 구분하는 언로딩부(170)로 안내된다.The BGA package 50 passes through the secondary inspection unit 160 for inspecting whether the solder ball 30 is correctly seated in the seating groove 40 by using a vision camera to discriminate between the genuine product and the defect of the BGA package 50 And is guided to the unloading section 170.
이상에서와 같이 본 발명은 다수개의 솔더볼이 BGA 패키지에 형성된 전체의 안착홈에 정확하고 신속하게 안착하여 작업공차를 해소하고 불량률을 저하시켜 원가를 절감함으로서, 제품의 품질을 향상하고 소비자의 신뢰성을 향상시킨 매우 유용한 발명이다.As described above, according to the present invention, a plurality of solder balls are accurately and quickly seated in the entire mounting grooves formed in the BGA package, thereby eliminating the work tolerance and reducing the defect rate, thereby reducing the cost and improving the quality of the product. Which is an extremely useful invention.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960047917A KR100216799B1 (en) | 1996-10-24 | 1996-10-24 | Solder ball setting apparatus of solder ball bumping equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960047917A KR100216799B1 (en) | 1996-10-24 | 1996-10-24 | Solder ball setting apparatus of solder ball bumping equipment |
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| Publication Number | Publication Date |
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| KR19980028747A KR19980028747A (en) | 1998-07-15 |
| KR100216799B1 true KR100216799B1 (en) | 1999-09-01 |
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| KR1019960047917A KR100216799B1 (en) | 1996-10-24 | 1996-10-24 | Solder ball setting apparatus of solder ball bumping equipment |
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