KR100209263B1 - Chip carrier and its manufacturing method, semiconductor accessory using its chip carrier - Google Patents

Abstract

A chip carrier and a method of manufacturing the same are disclosed. The chip carrier includes a metal plate having a plurality of holes formed in a predetermined pattern, a first conductive film applied to each of the holes, a plurality of insulating layers stacked on the metal plate, and a predetermined pattern on the upper insulating layer. The second conductive film has a conductive layer connected to the first conductive film by passing the lower insulating layers in a predetermined pattern. The manufacturing method is characterized in that after coating the insulating material on the metal material and coating the conductive ink on the coating pattern by the silk screen printing method. This chip carrier has the effect of heat dissipation, process simplification and cost reduction.

Description

Chip carrier and manufacturing method and semiconductor component using the chip carrier

The present invention relates to a chip carrier, a method for manufacturing the same, and a semiconductor component using the chip carrier. More particularly, the present invention relates to a semiconductor component having improved chip carrier materials and provided with heat dissipation fins.

In recent years, since semiconductors of high-density and high-speed devices emit heat due to electrical conduction, heat sinks are attached inside and outside most packages (ie, containers such as integrated circuits).

Especially in the case of a ball grid array or a package of 200 pins or more, a large amount of heat is emitted from the high-power integrated circuit chip. Therefore, heat dissipation such as heat sink or heat slug is used for heat dissipation. The metallic material which can be made was conventionally attached.

However, there are some differences in each method of attachment. In the case of a ball grid array package, there are various methods such as attaching directly to an inactive layer of an integrated circuit chip, capping a metal when molding a package, or attaching a metal plate to a lower layer. In the case of heat sinks applied to high density fins, if the heat sink is directly attached instead of the pad of the lead frame, the method of attaching the heat sink to the necessary part during molding There was an existing technology.

On the other hand, as the material of the support body used in the past, the board is made of a polymer (mostly overlapped with a thin plate), so there is a problem of heat release, so it does not smooth heat release, such as bending of the board and cracking of the chip The device was not functioning properly. In other words, in the case of conventional resins, the processability is convenient, but it does not satisfy the reliability in moisture and heat. Therefore, heat resistance polymers must be used for thermal stability, which are not only very expensive materials but also do not provide satisfactory thermal stability compared to ceramics and metals. In addition, in the case of using a ceramic chip carrier, there is a problem in that the cost of raw materials is high, as well as processing difficulties and processing costs. In addition, the manufacturing method has a long manufacturing time by producing a chip carrier through the etching process, and has a problem in the waste water treatment of the remaining chemical liquid.

SUMMARY OF THE INVENTION The present invention has been made to solve this problem, and provides a chip carrier, a method of manufacturing the same, and a semiconductor component using the chip carrier, which can prevent various cracks caused by bending and heat of a board, which has been generated when a polymer is used as a draw. Has its purpose. It is also an object of the present invention to provide a chip carrier manufacturing method which simplifies the process and thereby reduces the cost. In addition, an object of the present invention is to provide a semiconductor component using a chip carrier capable of accelerating heat dissipation by attaching a heat dissipation fin to a metal plate as well as heat dissipation of the board itself.

1 to 9 is a process chart showing a manufacturing process of a chip carrier according to the present invention,

10 to 14 is a process chart showing a manufacturing process of another embodiment according to the present invention,

15 to 16 are cross-sectional views illustrating a semiconductor component using a chip carrier according to the present invention having heat dissipation fins.

Explanation of symbols for the main parts of the drawings

11 insulating layer 12 conductive film

13 Through hole 14 Chip carrier

15 ... inner hole 20 ... semiconductor parts

21 Heat sink 22 Resin layer

23 Integrated circuit chip 10, 24 metal plate

25.Solder Ball 26 ... 1st Challenge

27.Wire 28 ... 2nd conductive film

In order to achieve the above object, a chip carrier according to the present invention includes a metal plate having a plurality of holes formed in a predetermined pattern, a first conductive film applied to each hole, and a plurality of insulating layers stacked on the metal plate; And a second conductive film formed on the uppermost insulating layer in a predetermined pattern and having a conductive layer connected to the first conductive film by passing the lower insulating layers in a predetermined pattern.

In order to achieve the above object, a method of manufacturing a chip carrier according to the present invention includes a first step of forming a plurality of holes in a metal plate; Applying a photosensitive insulating material to an inner wall of the hole and an outer surface of the metal plate; A third step of exposing the photomask having a predetermined pattern formed on the photosensitive insulating material and then exposing the photomask; A fourth step of forming an insulating layer having a predetermined pattern by photographing the photosensitive insulating material on which the pattern is formed; A fifth step of forming a second conductive film having a predetermined pattern having an inner hole in which an upper surface of the metal plate on which the insulating layer of the predetermined pattern is formed is communicated with the through hole; And a sixth step of forming a first conductive film by filling a conductive ink in the through hole.

In order to achieve the above object, a semiconductor component using a chip carrier according to the present invention includes a metal plate having a plurality of holes formed in a predetermined pattern, a first conductive film applied to each of the holes, and a plurality of stacked on the living metal plate. A chip carrier comprising an insulating layer of the first conductive layer and a second conductive layer formed on the uppermost insulating layer in a predetermined pattern and passing through the lower insulating layers in a predetermined pattern to be connected to the first conductive layer; A chip wire-bonded with a second conductive film formed on an upper surface of the chip carrier; A resin layer surrounding the chip; And a heat sink provided in contact with the resin layer and the metal plate.

In addition, the semiconductor component using the chip carrier according to the present invention, the step is formed in the inside of the central portion, the metal plate is formed with a plurality of holes formed in a predetermined pattern at the edge, the first conductive film applied to each hole, A plurality of insulating layers stacked on the stepped portion and the center portion of the metal plate, and a second conductive film formed in a predetermined pattern on the upper insulating layer passes through the lower insulating layers in a predetermined pattern to connect with the first conductive film. A chip carrier comprising conductive layers; A chip wire-bonded with the second conductive film formed on the stepped portion and the center portion of the chip carrier; A resin layer surrounding the chip; And a heat sink installed in contact with the metal plate.

According to the characteristic constitution of the present invention, not only has the heat dissipation effect of the board itself, but also the heat dissipation fins attached to the metal plate can not only accelerate heat dissipation, but also simplify the process and thereby reduce costs.

Hereinafter, a chip carrier, a method of manufacturing the same, and a semiconductor component using the chip carrier will be described in detail with reference to the accompanying drawings. 1 to 9 is a process chart showing a manufacturing process of a chip carrier according to the present invention, 10 to 14 is a process chart showing a manufacturing process of another embodiment according to the present invention, Figures 15 to 16 is provided with a heat radiation fin Figure 1 shows a semiconductor component using a chip carrier according to the present invention.

In the chip carrier according to the present invention, a plurality of through holes 13 are formed in the metal plate 10 in a predetermined pattern through drilling, and an insulating material is applied to the entire outer surface of the through holes 13 and the metal plate 10. Thus, a plurality of insulating layers 11 are formed. A first conductive film 26 is formed by injecting a conductive ink into the through hole 13, and a photomask is placed on an upper surface of the insulating layer 11 formed on one surface of the metal plate 10 to form a margin of a predetermined pattern. Conductive ink is injected into the blank to form the second conductive film 28. In this case, the conductive film 12 is formed on the insulating layer by using a silk screen printing method. The second conductive film 28 is formed in a predetermined pattern and forms a conductive film 12 so as to be connected to the first conductive film 26 by passing the lower insulating layers 11 in a predetermined pattern. Chip carriers are made.

The insulating layer 11 including the conductive film 12 on one surface of the metal plate 10 is subjected to a plurality of times by a silk screen printing method on the margin of the insulating layer 11 formed on the metal plate 10. It is formed, and the other side of the metal plate 10 is also subjected to a plurality of times by a silk screen printing method to form a multi-layer, the metal plate 10 is formed on both sides is characterized in that the symmetrical with each other.

In detail, the silk screen printing method is mainly used for patterning liquid conductive ink. The conductive ink is placed on the patterned silk mesh and pushed out with a squeegee so that the conductive ink passes through the patterned silk screen and is patterned. .

The chip carrier may be provided and used in a semiconductor package, and in particular, a ball grid array package used by bonding a ball to a lower portion of a substrate and connecting an input / output terminal, and a chip on board that directly attaches a chip to the board ( chip on board package, multi chip module package for attaching several chips on one board

The chip carrier is provided in the ball grid array package, the chip on board, and the multi chip module to solve the problem of heat dissipation caused by the package.

In the semiconductor component 20 using the chip carrier according to the present invention, as shown in FIG. 15, a semiconductor chip 23 is wire-bonded with a second conductive film 28 on an upper surface of the chip carrier, and the chip 23 is formed. The resin layer 22 is wrapped. The heat sink 21 is provided in contact with the resin layer 22 and the metal plate 24.

The heat sink 21 may be attached to the resin layer 22 and the metal plate 24 to immediately dissipate heat, thereby increasing the effect of heat dissipation. The material of the heat sink is a metal plate such as the metal plate 24 of the chip carrier, and it is preferable that the heat sink is a metal plate having better thermal conductivity than the metal plate.

Another semiconductor component 20 using a chip carrier according to the present invention includes a chip carrier, an integrated circuit chip 23 and a resin layer 22 surrounding the chip 23, as shown in FIG. It is roughly divided into the heat sink 21 provided in contact with the metal plate 24. In the chip carrier, a step is formed inside a central portion of the metal plate 24, and a plurality of holes are formed in a predetermined pattern at an edge thereof. A first conductive film (not shown) is formed by injecting conductive ink into each hole, and a plurality of insulating layers are stacked on the stepped portion and the center portion of the metal plate, and the second conductive layer is formed in a predetermined pattern on the top of the insulating layer. A film 28 is formed to pass through the lower insulating layers in a predetermined pattern to connect with the first conductive film (not shown) to form a conductive layer. Of course, the conductive film is formed on the plurality of insulating layers by using a photo imageable method or a silk screen printing method, and the insulating layer is laminated not only on one side of the metal plate but also on the other side of the chip carrier. Formed and both sides of the metal plate may be symmetrical. The second conductive film and the chip formed on the stepped portion of the chip carrier and the center portion thereof are wire-bonded, and the resin layer surrounds the chip. The metal plate and the heat sink are installed in contact with each other. The heat sink is preferably made of a metal plate having better thermal conductivity than the metal plate of the chip carrier as in the above-described embodiment.

Chip carrier manufacturing method according to the present invention is as follows.

First, as shown in FIG. 1, a metal plate 10 is provided, and through the drilling operation, the metal plate 10 forms a through hole 13 and an insulating material is applied to form an insulating layer 11.

As illustrated in FIG. 2, the entire outer surface of the metal plate 10 is coated on the metal plate 10 having the insulating layer 11 formed in the through hole 13 to form the insulating layer 11.

The photomask is positioned on the insulating layer on the upper surface of the metal plate, and then exposed to light to pattern the photosensitive material.

This patterned portion is developed and excavated as shown in FIG.

As shown in FIG. 5, conductive ink is injected into the indentation to form a conductive film 12.

As shown in FIG. 6, the insulating layer 11 is applied again, and then the inner hole 15 is formed by repeating the process of FIG. 3 to FIG. 5.

In the case of a multi-layer, as shown in FIG. 7, the patterning process and the process of the inner hole 15 are repeated, and each layer of the chip carrier 14 is produced.

Preferably, as shown in FIG. 8, the inner pattern is manufactured on the other side of the metal plate 10 through patterning processing and processing of the inner hole 15.

As illustrated in FIG. 9, the conductive ink is filled in the through hole 13 of the metal plate 10 in which the multilayer is formed.

The process of FIG. 10 thru | or 14 is a figure explaining the process to make it symmetrical on both surfaces of the metal plate 10. FIG.

In order to fabricate the pattern symmetrically, as shown in FIG. 10, an insulating material is applied to the lower portion to form the insulating layer 11, and then the process of FIG. 3 to 5 is repeated to manufacture the pattern.

Again, as shown in FIG. 11, the insulating layer 11 is applied to the upper surface of the metal plate 10, and the inner hole 15 is manufactured by repeating the process of FIG. 3 to FIG. 5.

In the case of the multilayer, as shown in FIG. 12, the patterning process and the processing of the inner hole 15 are repeated to fabricate each layer of the chip carrier 14.

In the same manner, the patterning process and the inner hole 15 process are repeated on the lower part of the metal plate 10 as shown in FIG. 13 to produce each layer of the chip carrier 14.

Finally, as shown in FIG. 14, the conductive ink is filled in the through hole 13 to allow electrical conduction between the layers.

The chip carrier 14 may be manufactured by coating a conductive ink using a photo-imageable method in a process of forming the conductive layer 12 on the insulating layer 11.

On the other hand, to manufacture a package using the chip carrier 14 made of a metal material directly, it is difficult to manufacture by the conventional etching method. Therefore, in the present invention, the silk screen printing method was used.

The operation of the semiconductor component using the chip carrier according to the present invention is as follows. Referring to the semiconductor component 20 shown in FIG. 15, the chip 23 is electrically conductive through the wire-bonded second conductive film 28, and the second conductive film 28 penetrates the metal plate 24. Through the first conductive film 26 formed in the hole (13 of FIG. 13), the electricity is conducted to the bottom surface of the metal plate 24, and the solder ball 25 formed at the shortest through the electrical conduction is connected to a predetermined substrate. Send and receive electrical signals. Heat generated in the chip 23 is discharged out through the heat sink 21 in contact with the metal plate 24 and the resin layer 22. The semiconductor component 20 illustrated in FIG. 16 differs in structure from the semiconductor component 20 illustrated in FIG. 15, but has the same operation.

As described above, when the chip carrier using the metal (14 in FIG. 10) is used, since the material of the board itself is metal, it has its own heat dissipation effect. In addition, the semiconductor component using this chip carrier is a heat sink, and the heat dissipation fin and the heat dissipation slug can be attached to accelerate heat dissipation.

In addition, the chip carrier manufacturing method is simple, and since the chip carrier is manufactured by the silk screen printing method, since there is no waste water, there is an additional advantage of environmental protection, and the cost can be reduced in terms of material price, manufacturing man-hour, and facility investment. Therefore, the cost of the product can be reduced.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (17)

A metal plate having a plurality of holes formed in a predetermined pattern; A first conductive film applied to each of the holes, A plurality of insulating layers stacked on top of the metal plate, And a second conductive film formed on the uppermost insulating layer in a predetermined pattern and having a conductive layer connected to the first conductive film by passing the lower insulating layers in a predetermined pattern. The method of claim 1, The second carrier film and the insulating layer including the conductive film is a chip carrier, characterized in that the multilayer is formed on one surface of the metal plate. The method of claim 2, The metal plate having a multilayer formed on one surface is a chip carrier, characterized in that the insulating layer including the second conductive film is formed on the other side of the metal plate. The method of claim 3, The metal plate has a multilayer formed on both sides is a chip carrier, characterized in that symmetrical with each other. A metal plate having a plurality of holes formed in a predetermined pattern; A first conductive film applied to each of the holes, A plurality of insulating layers laminated on the living metal plate, A chip carrier having a second conductive film formed in a predetermined pattern on the uppermost insulating layer and having a conductive layer connected to the first conductive film by passing the lower insulating layers in a predetermined pattern; A chip wire-bonded with a second conductive film formed on an upper surface of the chip carrier; A resin layer surrounding the chip; And a heat sink disposed in contact with the resin layer and the metal plate. The method of claim 5, The second conductive film of the chip carrier and the insulating layer including the conductive film is a multilayer component formed on one surface of the metal plate, the semiconductor component using a chip carrier. The method of claim 6, The metal plate having a multilayer formed on one surface of the semiconductor component using a chip carrier, characterized in that the insulating layer including the second conductive film is formed on the other side of the metal plate. The method of claim 7, wherein The metal plate having a multilayer formed on both sides is a semiconductor component using a chip carrier, characterized in that symmetrical with each other. A metal plate having a plurality of holes formed in a predetermined pattern at an edge thereof and having a step formed inside the central portion thereof; A first conductive film applied to each of the holes, A plurality of insulating layers laminated on the stepped portions and the central portions of the metal plate, A chip carrier having a second conductive film formed in a predetermined pattern on the uppermost insulating layer and having conductive layers connected to the first conductive film by passing a lower insulating layer in a predetermined pattern; A chip wire-bonded with the second conductive film formed on the stepped portion and the center portion of the chip carrier, A resin layer surrounding the chip; And a heat sink installed in contact with the metal plate. The method of claim 9, The second conductive film of the chip carrier and the insulating layer including the conductive film is a multilayer component formed on one surface of the metal plate, the semiconductor component using a chip carrier. The method of claim 10, The metal plate having a multilayer formed on one surface of the semiconductor component using a chip carrier, characterized in that the insulating layer including the second conductive film is formed on the other side of the metal plate. The method of claim 11, The metal plate having a multilayer formed on both sides is a semiconductor component using a chip carrier, characterized in that symmetrical with each other. Forming a plurality of holes in the metal plate; Applying a photosensitive insulating material to an inner wall of the hole and an outer surface of the metal plate; A third step of exposing the photomask having a predetermined pattern formed on the photosensitive insulating material and then exposing the photomask; A fourth step of forming an insulating layer having a predetermined pattern by photographing the photosensitive insulating material on which the pattern is formed; A fifth step of forming a second conductive film having a predetermined pattern having an inner hole in which an upper surface of the metal plate on which the insulating layer of the predetermined pattern is formed is communicated with the through hole; And a sixth step of forming a first conductive film by filling a conductive ink in the through hole. The method of claim 13, The metal plate is a chip carrier manufacturing method, characterized in that the multi-layer is formed on one surface of the metal plate by performing a plurality of times by the silk screen printing method a fifth step in which the insulating layer of the predetermined pattern is formed on the upper surface and the conductive film is formed. The method of claim 14, The metal plate having a multi-layer formed on one surface of the chip carrier is characterized in that the multi-layer is formed by performing the fifth step of forming an insulating layer having a predetermined pattern on the other side of the metal plate and forming a conductive film a plurality of times by a silk screen printing method. Way. The method of claim 15 The metal plate has a multilayer formed on both sides is a chip carrier manufacturing method, characterized in that symmetrical with each other. The method according to any one of claims 13 to 16, And a second insulating film and an insulating layer including the conductive film are formed by using a photoimageable method.