KR0177235B1 - Method for controlling focus level of camera for chip component identification in mounting system - Google Patents

Abstract

In the chip mounter for mounting an electronic component, the focus level adjustment of the component recognition camera used to recognize the size of various chip components adsorbed on the suction nozzles provided in each head for mounting to a PCB substrate is automatically performed. The present invention relates to a method for adjusting a focus level, and to this, the present invention provides a predetermined memory having reference data of actual size values for N chip components to be mounted on a PCB board through a user interface means. Storing in the first process; When the mode signal for adjusting the focus level of the camera for component recognition is input from the user interface means, the servo motor is driven based on the driving control signal provided from the main control block, and the corresponding head installed in the index is installed at the station where the camera for component recognition is installed. Moving to the second process; The chip component obtained by continuously photographing the chip component adsorbed by one of the N adsorption nozzles in the head while moving the camera for component recognition by one pulse in the vertical direction by driving the camera driving pulse motor. Generating measurement data for a size value of? A fourth step of continuously comparing the reference data and the size measurement data of the size of the corresponding chip component among the N reference data to calculate an offset value between the measurement data having the minimum error value and the reference data and to store the offset data in a predetermined memory; When the calculated number of offset values is compared with the number of reference data for N chip parts, and the value is judged to be not the same, the head driving pulse motor is driven to rotate the head, and then another suction nozzle is used as a part recognition camera. By setting the imaging position of the chip, repeating the third and fourth processes, the chip components adsorbed on the other adsorption nozzles in the head are differently offset between the measurement data for the size and the reference data for the corresponding size measurement data. A fifth step of calculating values and storing the values in a predetermined memory; And comparing the calculated number of offset values with the number of reference data for the N chip parts, and if the value is determined to be the same, a sixth step of terminating the focus level adjustment of the camera for recognizing the part. The offset values of the N chip components stored in the internal memory are used to correct the focus level of the component recognition camera for the size recognition of the chip components mounted on the PCB board.

Description

How to adjust the focus level of the part recognition camera for chip mounter

1 is a schematic schematic diagram of a chip component supply and work system included in a chip mounter suitable for applying a focus level error compensation method of a component recognition camera for a chip mounter according to the present invention.

2 is a diagram schematically illustrating a structure of a component recognition camera for capturing a test jig (or chip component) adsorbed on a suction nozzle when adjusting a focus level for chip component recognition according to the present invention.

3 is a schematic block diagram of a control system for a chip mounter suitable for carrying out a method for adjusting a focus level of a component recognition camera according to the present invention.

4 is a process of calculating and storing an offset value between a measured value and a measured value of a test jig (or chip component) by adjusting a focus level for component recognition using a chip mounter control system according to the present invention. Flowchart showing the.

* Explanation of symbols for main parts of the drawings

10: chip supply system 20: index

30: PCB supply / discharge system 32: supply conveyor

34: X-Y table (work table) 36: discharge conveyor

41: shaft 43: suction nozzle

45: test jig 50: camera

51: Lens 53: Mirror

55, 57: half-mirror 56: high magnification camera

58: low-profile camera 102: keyboard

104: I / O and signal processing control block

106: main control block 108: servo motor control block

110: servo motor drive block 112: servo motor

114: pulse motor drive block 116: pulse motor drive block

118: pulse motor 120: vision control block

122: camera for component recognition 124: monitor

The present invention relates to a method of adjusting the focus level of a recognition camera used in a chip mounter, which is a device for automatically mounting various types of electronic components on a printed circuit board (hereinafter, referred to as PCB). The present invention relates to a method for adjusting the focus level of a component attitude recognition camera for recognizing the attitude of a chip component adsorbed by the suction nozzle of each head.

In general, the chip mounter is one of the manufacturing equipment that automatically mounts various kinds of electronic components, such as resistors, capacitors, diodes, integrated circuits (ICs), etc. on the PCB board according to a program input by the operator. . In the field operation (line installation) of such a chip mounter, when installing the chip mounter on the line for the first time, the operator tests the overall operation of each function before or after the line installation or the chip mounter installed on the line. When an error (failure or malfunction) occurs during operation (mounting), the operator (or user) performs various tests according to the type of the error.

Although there are various kinds of partial test due to the test when the chip mounter as described above is first installed on the line or the abnormal operation after the installation, what is addressed in the present invention is the focus level of the camera for recognizing the component posture. It is related to the method of adjusting the focus level of the camera that can automatically adjust the speed and perform the error compensation during the actual mounting operation.

SUMMARY OF THE INVENTION An object of the present invention is to adjust the focus level of a component recognition camera used to recognize the size of various chip components adsorbed on an adsorption nozzle provided in each head in a chip mounter for mounting an electronic component. It is to provide a focus level adjustment method that can be performed automatically.

According to an aspect of the present invention, there is provided a user interface means including a key input means and a monitor for user operation, and a main control block for generating various control signals corresponding to mode signals from the user interface means. And a servo motor which is driven in accordance with a drive control signal from the main control block to move an index having a plurality of heads in a clockwise or counterclockwise direction, and is driven in accordance with a drive control signal from the main control block. A first pulse motor for rotating the plurality of adsorption nozzles respectively installed in the plurality of suction nozzles, a part recognition camera operated according to a recognition control signal from the main control block to image chip components adsorbed to the respective adsorption nozzles in the respective heads; Driven according to a drive control signal from the main control block In the method for adjusting the focus level of the component recognition camera for a chip mounter including a second pulse motor for moving the component recognition camera by one pulse in the vertical direction, N chips to be mounted on the PCB substrate through the user interface means. A first step of storing reference data of an actual size value of the component in a predetermined memory embedded in the main control block; When a mode signal for adjusting the focus level of the component recognition camera is input from the user interface means, the servo motor is driven based on a driving control signal provided from the main control block so that the corresponding head installed at the index is replaced with the head. A second step of moving to a station where a recognition camera is installed; The second pulse motor is driven to move the component recognition camera by one pulse in a vertical direction while continuously imaging the corresponding chip component adsorbed by one of the N adsorption nozzles in the head. Generating measurement data on a size value of the chip component; Comparing the reference data for the size of the corresponding chip component of the N pieces of reference data and the size measurement data continuously to calculate the offset value between the measurement data having the minimum error value and the reference data and to store in a predetermined memory Fourth process; When the calculated number of offset values is compared with the number of reference data for the N chip components, and the value is determined to be not the same, the first pulse motor is driven to rotate the head, and then another suction nozzle is used. By setting the image pickup position of the component recognition camera, the third and fourth processes are repeatedly performed, so that the chip components adsorbed on the other adsorption nozzles in the head are measured on the size measurement data and the corresponding size measurement data. A fifth step of calculating different offset values between reference data for the reference data and storing the offset values in the predetermined memory; And a sixth process of comparing the calculated number of offset values with the number of reference data for the N chip parts and terminating the focus level adjustment of the camera for recognizing the parts if the value is determined to be the same. The offset values of the N chip components stored in a memory embedded in a main control block are used for error correction of a focus level of the component recognition camera for size recognition of chip components mounted on the PCB board. A method of adjusting the focus level of a component recognition camera for a chip mounter is provided.

According to another aspect of the present invention, there is provided a user interface means including a key input means and a monitor for user operation, and a main control block for generating various control signals corresponding to mode signals from the user interface means. A servo motor driven according to a drive control signal from the main control block to move an index having a plurality of heads in a clockwise or counterclockwise direction, and operated according to a recognition control signal from the main control block. A chip mounter including a component recognition camera for imaging a chip component adsorbed on an adsorption nozzle, and a pulse motor which is driven according to a driving control signal from the main control block and moves the component recognition camera by one pulse in a vertical direction In the focus level adjustment method of the component recognition camera for A first process of storing a predetermined built-in memory a reference data of the actual size value for the N number of chip components to be mounted to the PCB board via the user interface means based on the main control block diagram; When a mode signal for adjusting the focus level of the component recognition camera is input from the user interface means, the servo motor is driven based on a driving control signal provided from the main control block so that the corresponding head installed at the index is replaced with the head. A second step of moving to a station where a recognition camera is installed; The said chip obtained by carrying out the curb image of the said chip component adsorb | sucked to the adsorption nozzle of one of N adsorption nozzles in the said head by moving the said component recognition camera by 1 pulse up and down by driving the said pulse motor. Generating measurement data on a size value of the component; Comparing the reference data for the size of the corresponding chip component of the N pieces of reference data and the size measurement data continuously to calculate the offset value between the measurement data having the minimum error value and the reference data and to store in a predetermined memory Fourth process; When the calculated number of offset values is compared with the number of reference data for the N chip components and the value is determined to be not the same, the second process, the third process, and the fourth process are repeated to perform the index. A fifth step of calculating, by the chip component adsorbed to specific adsorption nozzles in other heads installed in the head, different offset values between the measurement data on the size and the reference data on the size measurement data corresponding thereto, and storing the offset values in the predetermined memory; And a sixth process of comparing the calculated number of offset values with the number of reference data for the N chip parts and terminating the focus level adjustment of the camera for recognizing the parts if the value is determined to be the same. The offset values of the N chip components stored in a memory embedded in a main control block are used for error correction of a focus level of the component recognition camera for size recognition of chip components mounted on the PCB board. A method of adjusting the focus level of a component recognition camera for a chip mounter is provided.

The above and other objects and various advantages of the present invention will become more apparent from the preferred embodiments of the present invention described below with reference to the accompanying drawings by those skilled in the art.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a chip component schematically showing a chip supply system 10, an index 20 and a PCB supply / discharge system 30 in a chip mounter suitable for applying a camera focus level adjustment method for a chip mounter according to the present invention. A schematic diagram of the supply and operation system is shown.

In FIG. 1, the chip supply system 10 includes various types of electronic components, such as resistors, to be mounted on PCB boards each mounted in a form of tapering to a plurality of tape cassettes (not shown). Electronic components such as capacitors, diodes, and integrated circuits (ICs) are supplied to the index 20 for adjustment.

In addition, the index 20 is mounted on the work table (XY table) by absorbing the various chip components supplied from each tape cassette (not shown) in the chip supply system 10 through the head having a plurality of nozzles, respectively. It is to perform various adjustments such as correcting the position of parts and adjusting the height of parts so that they can be mounted on the PCB board.

Here, the index 20 used in the chip mounter suitable for applying the present invention, as can be seen from Figure 1, a total of 12 stations formed at regular intervals along the outer diameter of the index 20 (ST1-ST12) Detailed illustration in the same drawing is omitted, but in each of these stations, the head which can be rotated clockwise or counterclockwise is used for each process according to its position, for example, detecting the presence of a chip component, recognizing component posture, and mounting. Height control and the like are carried out, and each of these heads is formed so as to adsorb a plurality of nozzles, for example, electronic components having different shapes (size + thickness) supplied from each tape cassette in the chip supply system 10. Five nozzles are provided.

Here, the method of adjusting the focus level of the camera according to the present invention is substantially carried out at station 3 on the index 20. As such, the chip component adsorbed to each suction nozzle mounted on each head for mounting to the PCB At a predetermined position of the station 3 that performs the function of recognizing the posture of the camera, two cameras for recognizing the posture of the chip component, that is, a high magnification camera and a large size for imaging the small chip component adsorbed on the suction nozzle A camera is formed integrally with a low magnification camera for imaging a chip component of the present invention. The configuration and operation of such a camera will be described later in detail with reference to FIG. Accordingly, by adjusting the focus level of such a camera according to the present invention, the offset value compensation of the camera focus level between the size measured value and the measured value will be realized. Here, the offset value means the closest difference value between the size (area) value of the corresponding chip component measured using the 3D measuring instrument and the image size measurement value obtained when the image is captured by the component recognition camera.

On the other hand, the PCB supply / discharge system 30, when largely divided, having a supply conveyor 32, a work table 34, the discharge conveyor 36, the supply and supply of PCB for mounting chip components It is to perform work on mounting of various electronic components on the PCB board and discharging the PCB where the mounting of the chip components is completed. In addition, indicated as reference A in the feed conveyor 32 and the X-Y table 34 represents the PCB substrate for component mounting.

Therefore, in the chip component supply and work system as described above, when the PCB substrate supplied through the supply conveyor 32 is first seated on the XY table 34 to complete the position error correction operation of the PCB substrate, The index 20 having a plurality of stations is operated on the basis of an operation control signal from a main control block described later with reference to the drawings, so that the chip component mounting work on the PCB board in accordance with a changeable program input by an operator is performed. It begins.

Therefore, when the chip component mounting process is completed by repeatedly performing the chip component mounting process on the PCB substrate as described above, the PCB substrate on which the chip component mounting is completed will be discharged through the discharge conveyor 36.

2 is a schematic block diagram showing a camera for recognizing a posture of a chip component and one suction nozzle as an example according to the present invention. In the preferred embodiment of the present invention will be described as an example the case where the test jig is adsorbed to the adsorption nozzle in place of the chip component as an example for adjusting the focus level of the camera for component attitude recognition.

In Fig. 2, the test jig 45 is sucked to the suction nozzle 43 attached to the shaft 41 for mounting the nozzle. Although not shown in the drawings, the shaft 45 on which the suction nozzle 43 is mounted is supported by being mounted to each head provided in each station shown in FIG.

Here, as the test jig, for example, a plurality of test jigs having different sizes and thicknesses may be used so as to correspond to chip components having different sizes and thicknesses. That is, a test jig having a thickness of 2.0 m, 4.5 m, and 6.5 m may be respectively adsorbed to each of the adsorption furnaces in one head to calculate an offset value with respect to the focus level. At this time, when the focus level is adjusted, the camera 50 may move in the vertical direction by driving the pulse motor according to the thickness of the test jig for measurement.

On the other hand, in order to recognize the attitude of the chip component, the camera 50 for imaging the test jig 45 (or the chip component) adsorbed to the suction nozzle 43 according to the present invention is a test adsorbed to the suction nozzle 43. It is formed to maintain a predetermined interval (appropriate interval for imaging) in the downward direction of the jig 45, such a camera 50 is a chip component adsorbed to the suction nozzle 43 by the driving of a pulse motor (not shown) It is driven by one pulse in the vertical direction depending on the thickness of.

Referring to FIG. 2, the component posture recognition camera 50 includes a lens 51, a mirror 53, two half mirrors 55 and 57, a high magnification camera 56, and a low magnification camera 58. have. Here, the high magnification camera 56 captures a small chip component adsorbed by the adsorption nozzle 43, and the low magnification camera 58 captures a large chip component adsorbed by the adsorption nozzle 43. The selective operation of such high and low cameras 56, 58 is based on control signals from the main control block described below.

That is, as can be seen from FIG. 2, the lens 51 focuses an image of the test jig 45 in a direction opposite to the test jig 45 absorbed by the adsorption nozzle 43. The image of the focused test jig 45 is reflected through the mirror 52 and transmitted to the first half mirror 55 and the second half mirror 57, wherein the chip component focused through the lens 51. (Or the test jig 45 adsorbed to the suction nozzle 43) is small, the image is captured by the high magnification camera 56, and when the size of the focused chip component is large, the image is captured by the low magnification camera 58. . Then, the image signal (test jig or chip component) thus captured is provided to the main control block via the vision control block in FIG.

Herein, in the present invention, chip component recognition is performed by adjusting a focus level of a camera to detect an offset value between a preset size measurement value (reference data) and a size measurement value (measurement data) captured by the camera, and to store an embedded memory. The offset values thus stored are used to automatically compensate the focus level value of the component recognition camera during the mounting operation of the chip mounter.

3 is a schematic block diagram of a chip mounter control system for compensating for error compensation of a focus level of a camera for size recognition of a chip component photographed using a component attitude recognition camera having the above-described configuration.

As shown in the figure, a control system suitable for adjusting the focus level of a camera for component recognition according to the present invention includes a keyboard 102, an input / output and signal processing control block 104, a main control block 106, Servo motor control block 108, servo motor drive block 110, servo motor 112, pulse motor control block 114, pulse motor drive block 116, pulse motor 118, vision control block 120 And a recognition camera set 122 and a monitor 124, each of which is interconnected via a system bus (S-BUS) 100.

In FIG. 3, the keyboard 102, input / output and signal processing control block 104 and monitor 124 form a kind of industrial PC system for the user interface, and the user (or operator) uses such an industrial PC system. Inputting the size (width × length) and thickness values of the reference data (for example, a test jig (or a chip component) measured using a 3D measuring instrument) for adjusting the focus level of the camera according to the present invention. Also, a program applied to mounting various chip components on a PCB board is input, and the camera set 122 is input to the monitor 124 when the focus level of the camera for component recognition according to the present invention is adjusted according to a user's selection. Comparison between measurement data of an image on a subject (test jig or chip component) photographed through the camera 50 in the camera and reference data set in advance (actual values) If the offset value for the display is also displayed by other various result signal thereto upon other testing of chip parts mounter.

Meanwhile, the main control block 106 receives a mode switching signal for switching from the input / output and signal processing control block 104 to the adjustment mode through the system bus 100 according to a user's operation for adjusting the focus level of the camera. When the index 20 is moved to a preset speed, a control signal is generated. When the head (head in which the test jig is sucked to each suction nozzle) is moved to station 3, the test jig (or chip component) is completed. The high or low magnification camera corresponding to the < RTI ID = 0.0 > 1) < / RTI > then adjusts the focus level of the camera 50, thereby performing control for imaging the test jig (or chip component) adsorbed on each suction nozzle.

That is, in the main control block 106, for example, when three test jigs having different sizes and thicknesses are adsorbed to the respective adsorption nozzles, the high or low cameras 56 and 58 are applied to one test jig. After inputting the measurement data (size measurement value) captured by the camera, the offset value (error value) between the preset reference data (size measurement value measured using a three-dimensional measuring instrument) and the input measurement data is calculated, and then built-in. In the memory (not shown), the pulse motor for moving the suction nozzle is continuously driven, and the offset values for the other test jig and the other test jig are continuously calculated and stored in the memory, respectively. These offset values will be used to compensate for the focus level of the corresponding chip components in the actual mounting operation when the focus of the component recognition camera is slightly shifted due to various factors.

On the other hand, the servo motor control block 108 is an index 20 based on a control signal provided through the system bus 100 from the main control block 106 as described above in the focus level adjustment mode of the camera according to the present invention. ) Generates a control signal, and the generated control signal is provided to the next stage servo motor drive block 110.

In addition, the servo motor driving block 110 switches the power supply from the outside based on the control signal from the servo motor control block 108 to provide the driving force necessary to move the index 20 ( Supply power for forward or reverse rotation to 112). At this time, the servo motor 112, as is well known in the art, is provided with a detector (not shown) to detect a position or a speed and to correct and control a target value according to the detection result. Therefore, the index motor 20 is driven by forward or reverse rotation of the servo motor 112 according to the power supplied from the servo motor driving block 110, and thus the test jigs are adsorbed for adjusting the camera focus level. The head with the suction nozzle is moved to station 3.

Next, when the head having the adsorption nozzle to which the test jig is adsorbed is completed to the station 3 through the procedure as described above, the main control block 106 recognizes the test jig through the system bus 100. Provides a control signal for the vision control block 120. Therefore, the vision control block 120 generates a drive signal for imaging the test jig (first jig of the three jigs) to the camera 50 according to the control signal from the main control block 106 described above. The high magnification or low magnification cameras 56 and 58 in the part recognition camera 50 are selected to image the test jig.

At this time, the image signal on the subject for the test jig captured by the high or low cameras 56 and 58 as described above is converted into a digital signal through a predetermined signal processing process through the vision control block 120 again. It is input to the main control block 106 via the system bus 100.

Here, although the detailed illustration of FIG. 3 is omitted since it is a well-known technique well known in the art, the vision control block 120 performs the signal processing of the image signal captured by the camera 122 for component recognition. In order to convert the control signal in the digital form provided from the main control block 106 through the system bus 100 into an analog signal, and convert the analog video signal captured from the component recognition camera 122 into a digital signal. And a signal processing circuit for performing predetermined signal processing on the control signal and the video signal.

Therefore, in the main control block 106, as described above, the measurement of the image of a certain subject (the first test jig) generated in accordance with the vertical movement of the camera 122 from the vision control block 120 and provided continuously. Data (measurement size value) is compared with preset reference data (actual size value). That is, the main control block 106 drives the pulse motor 118 by one pulse by forward or reverse rotation by the control of the pulse motor control block 114 and the pulse motor driving block 116, so that the camera 50 of FIG. ) Determines the measurement data having the most similar value to the predetermined reference data among the measurement data obtained by moving the up and down direction, and the offset value (error value) between the measured data and the predetermined reference data of the first test jig It is calculated and stored in the built-in memory.

Next, when the calculation of the offset value for the focus level for the first test jig is completed, the main control block 106 controls the pulse motor control block 114 and the pulse motor driving block 116. The second test jig is moved to the imaging position of the camera 50 by forward or reverse rotation of the pulse motor 118 through the same process as in the first test jig described above. Calculate and store the offset value between the measured data most similar to it in the built-in memory, and calculate the offset value between the measured data most similar to the reference data through the same control process for the third test jig and store it in the built-in memory. do.

Meanwhile, in the above description and FIG. 3, only one pulse motor is shown, but in practice, at least two pulse motors, that is, a camera for moving the camera 50 of FIG. And a pulse motor for rotating the head having a pulse motor and at least five suction nozzles by one pulse in a clockwise or counterclockwise direction.

Therefore, the offset value for the focus level of the specific chip component (chip component to be mounted on the PCB substrate) obtained through the above process is calculated in advance and stored in the built-in memory, and the stored offset value during the mounting operation. By compensating for the error of the focus level of each chip component that is actually measured, more accurate component recognition will be possible. As a result, by minimizing the misunderstanding of inadequate part determination, the production efficiency of the chip mounter will be further improved or enhanced.

Meanwhile, in the above description, a plurality of test jigs to be tested are simultaneously adsorbed to each suction nozzle provided in one head to perform focus level adjustment for error compensation for each jig. In this process, a plurality of test jigs to be measured are adsorbed to each suction nozzle provided in each head, that is, one test jig is adsorbed to one head to adjust the focus level for compensating the focus level error of the camera for component recognition. The same result can be obtained even if

Next, an operation process of automatically adjusting the focus level of the component recognition camera using the chip mounter control system having the above-described configuration will be described in detail with reference to FIG. 4 showing the flow thereof. First, in the present embodiment, as an example, it is assumed that the focus level for the error compensation is adjusted for three test jigs having different thicknesses and sizes.

4 is to adjust the focus level of the component recognition camera to automatically adjust the focus level of the component recognition camera using the chip mounter control system according to the present invention to adjust the focus level of the component recognition camera. A flowchart illustrating a process of calculating and storing an offset value for a signal is shown.

Referring to FIG. 4, measurement data of a jig measured by a three-dimensional measuring instrument for N test jigs (that is, three test jigs) to be measured through the keyboard 102 shown in FIG. When the user (or operator) switches to the focus level adjustment mode using the keyboard 102 to adjust the focus level of the part recognition camera 50 of FIG. The level adjustment mode is set (steps S40 and S42).

Therefore, in the main control block 106, the servo motor 112 is driven to move the index 20 clockwise by one pitch so that the corresponding head, in which the jigs to be measured are adsorbed to the suction nozzle, is used as a part recognition camera ( 50) is moved to the installed station 3 (step S44).

Then, when the head is set to station 3, the main control block 106 is a vision control block 120 based on the size data of the test jig adsorbed to the suction nozzle at the position to be imaged (recognized). The high and low cameras 56 and 58 are selected and operated by the camera 50 through step S46.

More specifically, of the plurality of adsorption nozzles installed in the head, as can be seen from FIG. 2, the test jig 45 adsorbed to the adsorption nozzle 43 at the current imaging position is compared with the preset value. If the size is small, the high magnification camera 56 is selected. On the contrary, if the size is larger than the reference value, the low magnification camera 58 is selected (step S44), so that the video signal for the test jig 45 photographed through the selected camera is selected. Is inputted to the main control block 106 (step S46), that is, if the size is smaller than the reference value, the high magnification camera 56 is inputted through the lens 51, the mirror 53, and the first half mirror 55. An image of the test jig 45 is photographed, and the image signal thus captured may be input to the main control block 106 after undergoing a predetermined signal processing process through the vision control block 120. On the contrary, if the size is larger than the reference value, the low magnification camera 58 captures an image of the test jig 45 input through the lens 51, the mirror 53, and the second half mirror 57, and the image is thus captured. The video signal may be input to the main control block 106 after undergoing a predetermined signal processing process through the vision control block 120.

On the other hand, when the image signal (size measurement data for the test jig) captured by the selected high or low cameras 56 and 58 is input through the above-described process, the main control block 106 drives the camera up and down. The pulse motor 118 is driven forward or backward by 1 pulse to move the camera 50 in the up and down direction while adjusting the optimum focus level for the jig (for example, the first test jig) ( Step S50), the measurement data for the image captured at the time of adjusting the focus level is continuously provided to the main control block 106 through the vision control block 120, the main control block 106 for the corresponding test input The measurement data (size measurement value) for the jig is compared with the reference data (size measurement value) previously inputted in advance, and thus the most optimal measurement data, that is, most similar to the reference data The measurement data having one value is determined (step S52), and an offset value (error value) between the measurement data and reference data for the test jig thus determined is calculated and stored in the built-in memory (step S54).

Next, as described above, the main control block 106 calculates the offset value for the first test jig and stores the offset value in the built-in memory, and at the same time, the number m of offset values stored in the memory is previously input and stored in advance. It is checked whether or not the number N is equal to (step S56).

As a result of the check in the step S56, when it is determined that the number m of offset values stored in the memory is smaller than the number N of reference data stored in advance, the pulse motor is driven to rotate the corresponding head to drive another suction nozzle. After setting to the imaging position of the part recognition camera (step S58), the process returns to step S46 described above and repeats the subsequent process, and the number m of offset values stored in the memory is input in advance. If it is determined that the number of stored reference data is equal to N, that is, it is determined that each offset value for all three test jigs is calculated as in the present embodiment, all processes for adjusting the focus level of the camera are completed.

On the other hand, in the embodiment of the present invention as described above, the test jig is adsorbed to each of the adsorption nozzles in one head, and then the pulse motor is driven to rotate and move each of the adsorption nozzles so as to measure the measured size value for each jig. Although the description has been made by calculating an offset value for a camera focus level between reference size values, it should be understood that the present invention is not necessarily limited thereto.

That is, in another embodiment, the present invention may calculate an offset value for the focus level of each jig in a state in which a plurality of test jigs are respectively adsorbed to a suction nozzle in a plurality of heads corresponding thereto. The same result as in the above-described embodiment can be obtained. If it is desired to apply another embodiment of the present invention, the number m of offset values stored in the memory as a result of the check in step S56 of the above-described embodiment is smaller than the number N of reference data stored in advance. If it is determined, unlike in the above-described embodiment, the process returns to step S44 to repeat the process thereafter.

In addition, the offset values of the focus level for each test jig as described above can be displayed through the monitor 124 at the time of its adjustment or by a user's selective operation. Thus, the user (or operator) will be able to know the offset value for the focus level of each test jig (or chip components) through the monitor 124.

Meanwhile, in the present embodiment, a process for calculating an offset value for error compensation of a focus level of a component recognition camera using a test jig has been described. However, in an application on a practical line, it is calculated according to the present invention. When recognizing the size of each component by error compensating the focus level of the corresponding camera with offset values of the chip components, and determining that the size of the chip component recognized by the component recognition camera is inferior, the main control block 106 Generates a control signal for skipping the head and sends an error message to the input / output and signal processing control block 104. Accordingly, an error signal for a defective chip part size is displayed on the monitor, so that the user It will be easy to see the size defects of the parts.

In addition, when a chip component size defect as described above is detected, if the user is notified of the defect detection by using a buzzer and a lamp as well as an error signal display on the monitor, the user can more quickly determine the chip in the chip mounter. You will notice the component size defect.

Therefore, according to the focus level adjustment method of the chip mounter part recognition camera according to the present invention as described above, the component during the camera image pickup for checking the abnormal size of the part through the part recognition camera during the component mounting operation of the chip mounter By compensating the focus level of the imaging camera with the offset value calculated in accordance with the present invention and stored in the memory, high precision abnormality check of the chip component size to be mounted on the PCB substrate will be possible.

Claims (6)

A user interface means having a key input means and a monitor for user operation, a main control block for generating various control signals corresponding to a mode signal from the user interface means, and driven according to a drive control signal from the main control block Servo motor for moving the index having a plurality of heads in a clockwise or counterclockwise direction, and a first pulse driven by a drive control signal from the main control block to rotate and move a plurality of suction nozzles respectively installed in the plurality of heads. A camera for component recognition which is operated according to a motor, a recognition control signal from the main control block, and photographs a chip component adsorbed to each suction nozzle in each head, and is driven according to a drive control signal from the main control block. Each pulse of the component recognition camera in the vertical direction In the focus level adjustment method of the chip mounter component recognition camera including a second pulse motor to move, the main data is the reference data of the measurement size value for the N chip components to be mounted on the PCB substrate through the user interface means; A first step of storing in a predetermined memory embedded in a control block; When a mode signal for adjusting the focus level of the component recognition camera is input from the user interface means, the servo motor is driven based on a driving control signal provided from the main control block so that the corresponding head installed at the index is replaced with the head. A second step of moving to a station where a recognition camera is installed; The second pulse motor is driven to move the component recognition camera by one pulse in a vertical direction while continuously imaging the corresponding chip component adsorbed by one of the N adsorption nozzles in the head. Generating measurement data on a size value of the chip component; Comparing the reference data for the size of the corresponding chip component of the N pieces of reference data and the size measurement data continuously to calculate the offset value between the measurement data having the minimum error value and the reference data and to store in a predetermined memory Fourth process; When the calculated number of offset values is compared with the number of reference data for the N chip components, and the value is determined to be not the same, the first pulse motor is driven to rotate the head, and then another suction nozzle is used. By setting the image pickup position of the component recognition camera, the third and fourth processes are repeatedly performed, so that the chip components adsorbed on the other adsorption nozzles in the head are measured on the size measurement data and the corresponding size measurement data. A fifth step of calculating different offset values between the reference data for the reference data and storing the offset values in the predetermined memory; And a sixth process of comparing the calculated number of offset values with the number of reference data for the N chip parts and terminating the focus level adjustment of the camera for recognizing the parts if the value is determined to be the same. The offset values of the N chip components stored in a memory embedded in a main control block are used for error correction of a focus level of the component recognition camera for size recognition of chip components mounted on the PCB board. How to adjust the focus level of the component recognition camera for chip mounter. The method of claim 1, wherein the plurality of heads included in the index are 12 heads. The method of claim 2, wherein each of the heads is equipped with five suction nozzles. A user interface means having a key input means and a monitor for user operation, a main control block for generating various control signals corresponding to mode signals from the user interface means, and driven according to a drive control signal from the main control block Servo motor for moving the index having a plurality of heads in a clockwise or counterclockwise direction, and a component recognition for imaging a chip component which is operated according to a recognition control signal from the main control block and adsorbed to each suction nozzle in each head. A focus level adjustment method of a component mounting camera for a chip mounter comprising a camera and a pulse motor driven by a driving control signal from the main control block to move the component recognition camera by one pulse in the vertical direction. Mounted on the PCB board via interface means A first process of storing the reference data on the actual size value for the N number of chip components in a predetermined memory incorporated in the main control block diagram; When a mode signal for adjusting the focus level of the component recognition camera is input from the user interface means, the servo motor is driven based on a driving control signal provided from the main control block so that the corresponding head installed at the index is replaced with the head. A second step of moving to a station where a recognition camera is installed; The chip component obtained by continuously imaging the chip component adsorbed by one of the N adsorption nozzles in the head while moving the pulse recognition camera by one pulse in the vertical direction by driving the pulse motor. Generating measurement data for a size value of? Comparing the reference data for the size of the corresponding chip component of the N pieces of reference data and the size measurement data continuously to calculate the offset value between the measurement data having the minimum error value and the reference data and to store in a predetermined memory Fourth process; When the calculated number of offset values is compared with the number of reference data for the N chip components and the value is determined to be not the same, the second process, the third process, and the fourth process are repeated to perform the index. A fifth step of calculating, by the chip component adsorbed to specific adsorption nozzles in other heads installed in the head, different offset values between the measurement data on the size and the reference data on the size measurement data corresponding thereto, and storing the offset values in the predetermined memory; And a sixth process of comparing the calculated number of offset values with the number of reference data for the N chip parts and terminating the focus level adjustment of the camera for recognizing the parts if the value is determined to be the same. The offset values of the N chip components stored in a memory embedded in a main control block are used for error correction of a focus level of the component recognition camera for size recognition of chip components mounted on the PCB board. How to adjust the focus level of the component recognition camera for chip mounter. The method of claim 1, wherein the plurality of heads included in the index are 12 heads. The method of claim 2, wherein each of the heads is equipped with five suction nozzles.