KR0150761B1 - Water trasfer - Google Patents
Water trasfer Download PDFInfo
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- KR0150761B1 KR0150761B1 KR1019950012291A KR19950012291A KR0150761B1 KR 0150761 B1 KR0150761 B1 KR 0150761B1 KR 1019950012291 A KR1019950012291 A KR 1019950012291A KR 19950012291 A KR19950012291 A KR 19950012291A KR 0150761 B1 KR0150761 B1 KR 0150761B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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Abstract
본 발명은 웨이퍼를 잡아주는 헤드 콤을 구비하여 테이블 상에서 좌/우 구동하는 헤드 구동수단, 카세트를 상/하 또는 좌/우로 구동시키는 카세트 구동수단, 석영보트를 상/하 구동하는 석영보트 구동수단, 상기 헤드콤을 회전구동시키는 헤드 콤 구동수단, 카세트 상에 실린 웨이퍼의 플랫존을 얼라인하는 플랫존 얼라인 구동수단을 한 테이블 상에서 각각 독립적으로 구비하고, 각각의 상기 구동수단을 통괄적으로 제어하는 마스터 제어부를 구비하여 웨이퍼를 카세트에서 석영보트로 또는 석영보트에서 카세트로 전달하는 것을 특징으로 하는 웨이퍼 트랜스퍼에 관한 것으로, 상기 설명과 같은 본 발명은 웨이퍼를 옮기는데 걸리는 시간을 단축하고, 작업자의 공수가 절감되며, 장비유지보수를 위한 시간을 감축하며, 웨이퍼 플랫존 얼라인을 별도의 장비에서 실시하지 않아도 되는 이점이 있다.The present invention has a head comb for holding a wafer, the head driving means for driving the left / right on the table, the cassette driving means for driving the cassette up / down or left / right, the quartz boat driving means for driving the quartz boat up / down And a head comb driving means for rotationally driving the head comb, and a flat zone align driving means for aligning the flat zone of the wafer loaded on the cassette, independently on a table, and collectively each of the driving means. The present invention relates to a wafer transfer having a master control unit for controlling a wafer from a cassette to a quartz boat or a quartz boat to a cassette. The present invention as described above reduces the time taken to transfer a wafer, Reduced man-hours, reduced time for equipment maintenance, and separate wafer flat zone alignment There is an advantage that does not require implementation in the rain.
Description
제1a도 내지 제1c도는 본 발명의 웨이퍼 트랜스퍼 평면도, 정면도 및 우측면도.1A to 1C show a wafer transfer plan view, front view and right side view of the present invention.
제2도는 본 발명의 웨이퍼 트랜스퍼 구동부의 블록도.2 is a block diagram of a wafer transfer driver of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 카세트 2 : 카세트 마운트1: cassette 2: cassette mount
3 : 카세트 리프트 4 : 석영보트 마운트3: cassette lift 4: quartz boat mount
5 : 헤드 6 : 헤드 콤5: head 6: head comb
7 : 플랫존 얼라이너 8 : 헤드 이동 시스템7: Flat zone aligner 8: Head moving system
9 : 테이블 이동 시스템 10 : 파워 스위치 판넬9: table moving system 10: power switch panel
11 : 메인 스위치 판넬 12 : 석영보트 리프트 시스템11: main switch panel 12: quartz boat lift system
13 : 카세트 리프트 시스템 14 : 웨이퍼13: cassette lift system 14: wafer
15 : 카세트 웨이퍼 센서 16 : 카세트 센서15: cassette wafer sensor 16: cassette sensor
17 : 헤드 웨이퍼 센서 18 : 석영 보트 센서17 head wafer sensor 18 quartz boat sensor
19 : 석영보트 웨이퍼 센서 20 : 얼라인 롤러19: quartz boat wafer sensor 20: alignment roller
100 : 마스터 제어부 200 : 테이블 이동 구동부100: master control unit 200: table moving drive unit
300 : 헤드 이동 구동부 400 : 카세트 리프트 구동부300: head moving drive 400: cassette lift drive
500 : 석영 보트 리프트 구동부 600 : 헤드콤 로테이션 구동부500: quartz boat lift drive unit 600: headcomb rotation drive unit
700 : 플랫존 얼라이너 구동부700: flat zone aligner drive unit
본 발명은 반도체 공정의 생산 보조 장비인 웨이퍼 트랜스퍼에 관한 것이다.The present invention relates to a wafer transfer, which is a production aid of a semiconductor process.
웨이퍼 트랜스퍼는 웨이퍼에 확산과 같은 소정의 공정을 진행시키기 위해 웨이퍼를 카세트에서 석영보트로 옮겨주거나, 공정이 완료된후 웨이퍼를 석영보트에서 카세트로 옮겨주는 로드 및 언로드 하기 위한 시스템을 일컫는다.Wafer transfer refers to a system for loading and unloading a wafer from a cassette to a quartz boat for a predetermined process such as diffusion to the wafer, or for transferring a wafer from a quartz boat to a cassette after the process is completed.
현재 반도체 제조 공정에 사용되고 있는 여러 형태의 웨이퍼 트랜스퍼를 사용하고 있으며, 전량 수입장비에 의존하고 있고, 반도체 공정에서 이 장비의 문제점 발생시 문제점 해결을 위한 장비의 가동중단 시간 증가 및 장비를 수입함으로써 비용 및 납기의 손실을 가져오게 된다.We use various types of wafer transfers that are currently used in semiconductor manufacturing processes, rely on imported equipment in total, and increase the downtime of equipment and import equipment to solve problems in the semiconductor process. This leads to a loss of delivery time.
더욱, 종래의 웨이퍼 트랜스퍼는 웨이퍼의 플랫존 얼라이너가 분리되어 작업자의 공수증가 및 공정시간 증가를 가져오고 장비의 유지보수에 대한 어려움과 장비의 부식마모에 의한 불순물의 발생등 여러요인이 발생하고 있다.In addition, the conventional wafer transfer has caused many factors such as the separation of the flat zone aligner of the wafer, leading to increased labor and process time of the operator, difficulty in maintenance of the equipment, and generation of impurities due to corrosion wear of the equipment. .
따라서, 본 발명은 웨이퍼 플랫존 얼라인 기능이 추가되고, 시스템을 구성하는 각 구동부를 독립적으로 구성한 다음, 주제어부에서 통괄 제어하는 웨이퍼 트랜스퍼를 제공함을 그 목적으로 한다.Accordingly, an object of the present invention is to provide a wafer transfer which adds a wafer flat zone alignment function, independently configures each drive unit constituting the system, and then controls the overall control at the main control unit.
상기 목적을 달성하기 위하여 본 발명은 웨이퍼를 잡아주는 헤드 콤을 구비하여 테이블 상에서 좌/우 구동하는 헤드 구동수단, 카세트를 상/하 또는 좌/우로 구동시키는 카세트 구동수단, 석영보트를 상/하 구동하는 석영보트 구동수단, 상기 헤드콤을 회전구동시키는 헤드 콤 구동수단, 카세트 상에 실린 웨이퍼의 플랫존을 얼라인하는 플랫존 얼라인 구동수단을 한 테이블 상에서 각각 독립적으로 구비하고, 각각의 상기 구동수단을 통괄적으로 제어하는 마스터 제어부를 구비하여 웨이퍼를 카세트에서 석영보트로 또는 석영보트에서 카세트로 전달하는 것을 특징으로 한다.In order to achieve the above object, the present invention is provided with a head comb for holding a wafer, the head driving means for driving the left / right on the table, the cassette driving means for driving the cassette up / down or left / right, the quartz boat up / down Quartz boat driving means for driving, head comb driving means for rotating the headcom, and flat zone alignment driving means for aligning the flat zone of the wafer loaded on the cassette are provided on a table, respectively, A master control unit for controlling the driving means is characterized in that the wafer is transferred from the cassette to the quartz boat or from the quartz boat to the cassette.
이하, 첨부된 도면 제1a도 내지 제2도를 참조하여 본 발명을 상세히 설명한다.Hereinafter, with reference to the accompanying drawings 1a to 2 will be described in detail the present invention.
먼저, 제1a도는 본 발명의 웨이퍼 트랜스퍼 평면도, 제1b도는 정면도, 제1c도는 우측면도로서, 도면에서 1은 카세트, 2는 카세트 마운트, 3는 카세트 리프트, 4는 석영보트 마운트, 5는 헤드, 6은 헤드 콤(Comb), 7을 플랫존 얼라이너, 8은 헤드 이동 시스템, 9는 테이블 이동 시스템, 10은 파워 스위치 판넬, 11은 메인 스위치 판넬, 12는 석영보트 리프트 시스템, 13은 카세트 리프트 시스템, 14는 웨이퍼, 15는 카세트 웨이퍼 센서, 16은 카세트센서, 17은 헤드 웨이퍼 센서, 18은 석영보트센서, 19는 석영보트 웨이퍼 센서, 20은 얼라인 롤러를 각각 나타낸다.First, Figure 1a is a wafer transfer plan view of the present invention, Figure 1b is a front view, Figure 1c is a right side view, in the drawings 1 is a cassette, 2 is a cassette mount, 3 is a cassette lift, 4 is a quartz boat mount, 5 is a head 6 is head comb, 7 is flat zone aligner, 8 is head moving system, 9 is table moving system, 10 is power switch panel, 11 is main switch panel, 12 is quartz boat lift system, 13 is cassette The lift system 14 is a wafer, 15 is a cassette wafer sensor, 16 is a cassette sensor, 17 is a head wafer sensor, 18 is a quartz boat sensor, 19 is a quartz boat wafer sensor, and 20 is an alignment roller.
제2도는 본 발명의 웨이퍼 트랜스퍼 구동부의 블록도로서, 도면에 도시된 바와같이 마스터 제어부(100)에서 테이블 이동 구동부(200), 헤드 이동 구동부(300), 카세트 리프트 구동부(400), 석영 보트 리프트 구동부(500), 헤드콤 로테이션 구동부(600) 및 플랫존 얼라이너 구동부(700)로 구성되는 각각의 단위 시스템을 제어하도록 구성된다.FIG. 2 is a block diagram of the wafer transfer driver of the present invention. As shown in the drawing, the table moving driver 200, the head moving driver 300, the cassette lift driver 400, and the quartz boat lift of the master controller 100 are illustrated in FIG. It is configured to control each unit system consisting of the driver 500, the headcomb rotation driver 600 and the flat zone aligner driver 700.
그리고, 각 단위별 구동부는 인터페이스를 통해 모터 및 센서와 연결되며, 마스터 제어부(100)는 인터페이스를 통해 센서와 연결되고, 전원을 공급받으며, 스위치 입력부 및 램프/버저와 연결되어 있다.In addition, the driving unit for each unit is connected to the motor and the sensor through the interface, the master control unit 100 is connected to the sensor, the power is supplied, and the switch input unit and the lamp / buzzer through the interface.
이상, 상기 설명과 같은 웨이퍼 트랜스퍼의 각 구성요소 동작과 전체적인 동작 순서를 동시에 설명한다.In the above, the operation | movement of each component of the wafer transfer and overall operation | movement sequence as above-mentioned are demonstrated simultaneously.
먼저, 웨이퍼에 소정의 공정을 진행하기 위해서는 웨이퍼를 공정튜브에 로딩하기 위해서는 카세트에 꼿힌 다수의 웨이퍼를 석영보트로 옮겨야 하는데, 그 동작순서를 살펴본다.First, in order to perform a predetermined process on a wafer, in order to load the wafer into a process tube, a plurality of wafers packed in a cassette need to be transferred to a quartz boat.
웨이퍼가 실린 카세트(1)를 본 발명의 웨이퍼 트랜스퍼의 카세트 마운트(2)상에 올려놓고, 석영보트를 석영보트 마운트(4)상에 올려놓는다. 이때, 카세트 마운트 부분의 센서(16)와 석영보트 마운트 부분의 센서(18)가 카세트 및 석영보트를 감지한다.The cassette 1 on which the wafer is loaded is placed on the cassette mount 2 of the wafer transfer of the present invention, and the quartz boat is placed on the quartz boat mount 4. At this time, the sensor 16 of the cassette mount portion and the sensor 18 of the quartz boat mount portion detect the cassette and the quartz boat.
다음, 카세트에 실린 다수의 웨이퍼는 그 방향이 각각 다르게 형성되어 있으므로, 웨이퍼의 플랫존을 일정 방향으로 모두 정렬하는 플랫존 얼라인을 실시하여야 한다.Next, since a plurality of wafers loaded in the cassette are formed in different directions, flat zone alignment is necessary to align all of the flat zones of the wafer in a predetermined direction.
따라서, 플랫존 얼라이너의 얼라인롤러(20)를 구동하여 웨이퍼를 정렬한 다음, 카세트를 오른쪽으로 이동시켜 카세트 리프트(3)에 올려놓고 헤드(5)를 좌측으로 이동시켜 정면에서 보았을시 카세트와 일직선상에 놓이도록 한다.Therefore, the alignment roller 20 of the flat zone aligner is driven to align the wafers, and then the cassette is moved to the right, placed on the cassette lift 3, and the head 5 is moved to the left to view the cassette from the front. Place them in a straight line.
계속해서, 카세트 리프트(3)를 상승시키고 열려있는 헤드 콤(6)을 닫아주어 웨이퍼를 집도록 한후, 카세트 리프트를 다시 하강시킨 다음 헤드를 오른쪽으로 이동시켜 헤드 콤(6)이 잡아주고 있는 웨이퍼가 석영보트 상부와 일치되는 위치에 오도록 한다.Subsequently, the cassette lift 3 is raised and the open head comb 6 is closed to pick up the wafer, and then the cassette lift is lowered again and the head is moved to the right to hold the wafer held by the head comb 6. Should be in the same position as the top of the quartz boat.
그리고, 석영보트 마운트(4)를 상승시키고 헤드 콤(6)을 열어주면 웨이퍼는 석영보트에 실리게 된다.Then, when the quartz boat mount 4 is raised and the head comb 6 is opened, the wafer is loaded on the quartz boat.
마지막으로, 석영보트를 하강시키고, 카세트를 원위치에 갖다 놓으면 로드시의 웨이퍼 전달이 완료되게 된다.Finally, the quartz boat is lowered and the cassette is returned to its original position to complete wafer transfer upon loading.
한편, 웨이퍼를 로딩시키지 않고 단지 웨이퍼의 플랫존만을 얼라인 시키기 위해서는 플랫존 얼라인 구동부만을 구동시켜 웨이퍼를 얼라인시킬 수 있다.Meanwhile, in order to align only the flat zone of the wafer without loading the wafer, only the flat zone alignment driver may be driven to align the wafer.
마찬가지로, 공정이 완료 후 웨이퍼를 언로딩 시킬시에는 상기 방법의 역순으로 진행되며 단지, 플랫존 얼라인은 실시되지 않는다.Likewise, when the wafer is unloaded after completion of the process, the process proceeds in the reverse order, except that flat zone alignment is not performed.
이상, 상기 설명과 같은 본 발명은 웨이퍼를 옮기는데 걸리는 시간을 단축하고, 작업자의 공수가 절감되며, 장비유지보수를 위한 시간을 감축하며, 웨이퍼 플랫존 얼라인을 별도의 장비에서 실시하지 않아도 되는 이점이 있다.As described above, the present invention reduces the time taken to move the wafer, reduces the labor of the operator, reduces the time for equipment maintenance, and does not require the wafer flat zone alignment to be performed in a separate equipment. There is this.
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| Application Number | Priority Date | Filing Date | Title |
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| KR1019950012291A KR0150761B1 (en) | 1995-05-17 | 1995-05-17 | Water trasfer |
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| KR1019950012291A KR0150761B1 (en) | 1995-05-17 | 1995-05-17 | Water trasfer |
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| KR960043080A KR960043080A (en) | 1996-12-23 |
| KR0150761B1 true KR0150761B1 (en) | 1998-12-01 |
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| KR1019950012291A KR0150761B1 (en) | 1995-05-17 | 1995-05-17 | Water trasfer |
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