KR0137451Y1 - Indoor flooring - Google Patents
Indoor flooring Download PDFInfo
- Publication number
- KR0137451Y1 KR0137451Y1 KR2019960017784U KR19960017784U KR0137451Y1 KR 0137451 Y1 KR0137451 Y1 KR 0137451Y1 KR 2019960017784 U KR2019960017784 U KR 2019960017784U KR 19960017784 U KR19960017784 U KR 19960017784U KR 0137451 Y1 KR0137451 Y1 KR 0137451Y1
- Authority
- KR
- South Korea
- Prior art keywords
- heat storage
- storage material
- paper
- laminated
- flooring
- Prior art date
Links
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/16—Flooring, e.g. parquet on flexible web, laid as flexible webs; Webs specially adapted for use as flooring; Parquet on flexible web
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/18—Separately-laid insulating layers; Other additional insulating measures; Floating floors
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F2290/00—Specially adapted covering, lining or flooring elements not otherwise provided for
- E04F2290/04—Specially adapted covering, lining or flooring elements not otherwise provided for for insulation or surface protection, e.g. against noise, impact or fire
- E04F2290/044—Specially adapted covering, lining or flooring elements not otherwise provided for for insulation or surface protection, e.g. against noise, impact or fire against impact
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Floor Finish (AREA)
Abstract
본 고안은 건축물의 실내바닥에 시공되는 실내용 바닥재에 관한 것으로, 목재를 주재로 하는 축열재상에 보강, 무늬모양, 표면보호를 위한 종이를 합지한 합지장판재를 구비하고 상기 축열재 하위에는 신축성을 완충시키는 완충구조와 수맥영향을 차단하면서 열확산 및 전도를 위한 동판을 접착하여서 됨을 특징으로 한 것이다.The present invention relates to an indoor flooring material that is constructed on the indoor floor of a building, and includes a laminated sheet material laminated with paper for reinforcement, pattern shape, and surface protection on a heat storage material mainly based on wood, and has elasticity under the heat storage material. It is characterized in that by bonding the copper plate for thermal diffusion and conduction while blocking the buffer structure and the water vein effect buffering.
Description
제1도는 본 고안의 구성을 예시한 확대단면도.1 is an enlarged cross-sectional view illustrating the configuration of the present invention.
제2도는 본 고안의 구성을 예시한 분해 사시도.Figure 2 is an exploded perspective view illustrating the configuration of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10 : 합지장판재 11 : 보강합지10: laminated sheet material 11: reinforcement laminated
12 : 무늬장판지 13 : 보호지12: pattern paper 13: protective paper
20 : 축열재 21 : 완충홈20: heat storage material 21: buffer groove
30 : 동판 40 : 삭산비닐수지계 접착제30: copper plate 40: cut vinyl resin adhesive
50 : 클로로프렌고무계 접착제50: chloroprene rubber adhesive
본 고안은 건축물의 실내바닥에 시공되는 실내용 바닥재에 관한 것으로 특히 온돌장판 대용으로 사용하도록 한 것이다.The present invention relates to an indoor flooring material which is constructed on the indoor floor of a building, and is intended to be used as a substitute for an ondol floor board.
일반적으로 온돌장판은 시멘트 몰탈을 시공한 바닥에 합성수지제 시트를 깔아주거나, 장판지를 접착하게 되는데 이와 같은 장판은 내구성이 약하고 축열성이 없으며 방습이 잘되지 않는 결점이 있고 근자에는 수맥에 의한 인체에 미치는 악영향을 방지할 수 없는 문제점이 있었다.In general, the ondol floorboard is a synthetic resin sheet is laid on the floor where cement mortar is applied, or the floorboard is bonded. Such a floorboard has a weak durability, heat storage and moisture resistance, and in recent years, There was a problem that can not prevent adverse effects.
본 고안에서는 이상과 같은 문제점을 해결하기 위하여 목재를 주재로 하는 축열재상에 보강, 무늬모양, 표면보호를 위한 종이를 합지한 합지장판재를 구비하고 상기 축열재 하위에는 신축성을 완충시키는 완충구조와 수맥영향을 차단하면서 열확산 및 전도를 위한 동판을 접착하여서 됨을 특징으로 한 것이다.In order to solve the above problems, the present invention is provided with a laminated board material laminated with paper for reinforcement, pattern shape, and surface protection on a heat storage material based on wood, and a buffer structure for cushioning elasticity under the heat storage material. It is characterized in that by bonding the copper plate for thermal diffusion and conduction while blocking the water vein effect.
이를 첨부된 도면에 의하여 그 구성을 상세히 설명하면 다음과 같다.This configuration will be described in detail with reference to the accompanying drawings.
본 고안은 제1도의 예시 단면과 같이 상부로부터 합지장판재(10)과 축열재(20) 및 동판(30)의 순으로 적층 구성된 것이다.The present invention is configured to be laminated in the order of the laminated sheet material 10, the heat storage material 20 and the copper plate 30 from the top as shown in the exemplary cross-section of FIG.
상기 합지장판재(10)는 크라프트지와 같은 견고한 재질의 종이 2-4장을 페놀수지를 함침시켜 접합한 보강합지(11)와, 상기 보강합지(11)상에 접착하여 장판의 표면을 장식하는 무늬장판지(12)와, 상기 무늬장판지(12)의 보호를 위하여 메라민수지를 함침하였을 때 투명해지는 보호지(13)를 합지하여 합지장판재(10)를 구성한다.The laminated sheet material 10 is bonded to the reinforcement paper 11 and the reinforcing paper (11) bonded by impregnating 2-4 sheets of a rigid material such as kraft paper phenolic resin, and decorate the surface of the floor plate The laminated cardboard (12) and the protective paper 13, which becomes transparent when impregnated with the melamine resin for the protection of the decorative cardboard (12) to form a laminated sheet material (10).
이때 페놀수지와 메라민수지에는 적외선 세라믹을 소량 혼합하여 사용할 수 있다.In this case, a small amount of infrared ceramic may be mixed with the phenol resin and the melamine resin.
상기 축열재(20)는 목재로 된 판재로서 파티클보드, 합판 또는 화이버보드 등으로서 된 것으로 상기 합지장판재(10)와 삭산비닐수지계 접착제(40)로 접착한다.The heat storage material 20 is made of a wood board, such as a particle board, plywood or fiber board, and is bonded to the laminated sheet material 10 and the cut vinyl resin-based adhesive (40).
상기 동판(30)은 상기 축열재(20)와 클로로프렌고무에 접착제(50)로 접착한다.The copper plate 30 is bonded to the heat storage material 20 and the chloroprene rubber with an adhesive (50).
이때 축열재(20)와 동판(30)은 온도변화에 따른 신축성에 차이가 있으므로 이를 보완하기 위하여 축열재(20) 저면에 바둑판형의 완충홈(21)을 형성한 것이다.In this case, since the heat storage material 20 and the copper plate 30 have a difference in elasticity due to temperature change, a buffer-type groove 21 having a checkerboard shape is formed on the bottom surface of the heat storage material 20 to compensate for this.
이상과 같은 본 고안 실내용 바닥재는 종래의 바닥재 시공방법과 같이 주로 실내바닦이나 온도바닦에 깔어주게 되는데 하부에는 동판(30)이 적층되어 있어 수맥의 악영향이 인체에 전달되지 못하도록 차단하면서 공지의 온돌 시공된 가열수단으로부터 발산되는 열을 흡수하여 그 상부에 적층된 축열재(20)에 빠르고, 고르게 전달한다.The indoor flooring of the present invention as described above is mainly laid on the indoor flooring or temperature flooring as in the conventional flooring construction method. Absorbs heat emitted from the constructed heating means and transfers it quickly and evenly to the heat storage material 20 laminated thereon.
동판(30)으로부터 전도된 열은 축열재(20)에 축열되면서 그 상부에 적층된 합지장판재(10)에 전달된다.Heat conducted from the copper plate 30 is transferred to the laminated sheet material 10 stacked on top of the heat storage material 20.
이와 같은 바닥재의 축열재(20)에 축열된 열은 장시간 체류하면서 서서히 합지장판재(10)으로 발산하므로 온돌의 가열수단을 정지시킨 상태에서도 장시간 온돌효과를 갖게 된다.Since the heat accumulated in the heat storage material 20 of the flooring material stays for a long time and gradually diverges to the laminated sheet material 10, it has a long ondol effect even when the heating means of the ondol is stopped.
이때 축열재(20)와 동판(30) 접합부는 신축성 차이에 의하여 이완되기 쉬우나 축열재(20) 저면의 완충홈(21)에 의하여 오차를 완충시킴은 물론 양자의 접착시 접착제를 신축성 있는 클로로프렌고 무계 접착제(50)를 사용하였으므로 접착상태를 유지하면서 완충되는 효과가 있고, 바닥재의 평판을 유지하는데에도 효과가 있게 된다.At this time, the heat storage material 20 and the copper plate 30 is easy to relax due to the difference in elasticity, but the buffer groove 21 of the bottom surface of the heat storage material 20 buffers the error, as well as the adhesive when the bonding between the chloroprego elastic Since the non-adhesive adhesive 50 is used, there is an effect to be buffered while maintaining the adhesive state, it is also effective to maintain the flat plate of the flooring material.
이상과 같은 구성 및 작용효과를 갖는 본 고안 바닥재는 실내의 바닥에 마루판재 또는 장판 대용으로 사용하기 매우 적합하고, 상부 합지장판재(10)의 무늬장판지(12)의 무늬모양 선택에 따라 외관상, 마루, 장판, 석재바닦 등의 분위기를 연출할 수 있게 되고 동판(30)에 의해 수맥으로 인한 피해를 방지하는 등의 효과를 갖는다.The flooring design of the present invention having the above-described construction and action effects is very suitable for use as a floorboard or floorboard substitute on the floor of the room, and in appearance depending on the pattern shape selection of the patterned paperboard 12 of the upper laminated floorboard 10 It is possible to produce an atmosphere of flooring, flooring, stone flooring, etc., and has the effect of preventing damage caused by water veins by the copper plate 30.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960017784U KR0137451Y1 (en) | 1996-06-27 | 1996-06-27 | Indoor flooring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960017784U KR0137451Y1 (en) | 1996-06-27 | 1996-06-27 | Indoor flooring |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR980003184U KR980003184U (en) | 1998-03-30 |
| KR0137451Y1 true KR0137451Y1 (en) | 1999-04-01 |
Family
ID=19459703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960017784U KR0137451Y1 (en) | 1996-06-27 | 1996-06-27 | Indoor flooring |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0137451Y1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010100072A (en) * | 2001-09-04 | 2001-11-14 | 최명부 | Gluc to shicld the watcr vcin |
-
1996
- 1996-06-27 KR KR2019960017784U patent/KR0137451Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR980003184U (en) | 1998-03-30 |
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