JP5180804B2 - Wood flooring - Google Patents

Description

  The present invention relates to a wooden flooring.

  Conventionally, a wooden floor material in which a decorative material such as a veneer is stuck on a wooden board such as plywood is used.

  Most plywood is made by laminating veneers cut from natural natural wood such as lauan. However, in recent years, recycled raw materials can be used as an alternative to plywood such as lauan for preventing environmental destruction and preventing global warming. Wood boards such as particle boards using sapphire are being used.

  Particleboard is a chip made of woodworking waste, waste wood, plant fiber, etc. as a raw material and bonded with an adhesive such as urea / melamine co-condensation resin or phenol resin, and the adhesive is mixed or applied to the chip Thus, after preparing a mixture of the chip and the adhesive, the mixture is obtained by hot pressing.

  The particle board includes a single-layer structure and a three-layer structure. Among these, the particle board having a three-layer structure includes a core layer and a surface layer provided on the both sides of the core layer with the same thickness. It consists of a back layer. The core layer is obtained by adhering chips mainly composed of coarse pieces with an adhesive, and the surface layer and the back layer are obtained by adhering chips mainly composed of small pieces with an adhesive. This three-layer particle board has a high surface smoothness, a low density of the whole particle board, and a higher bending strength.

  However, since the dimensional change due to humidity is relatively small in plywood, the dimensional change due to humidity is relatively large in particle board, so if you apply a decorative material directly to this to make a building material such as a wooden floor, Due to dimensional changes due to the humidity of the boards, there are cases where gaps or push-ups occur at the joints between the particle boards.

  Therefore, when using particle board for building materials, such as a wooden flooring, the technique which reduces the dimensional change by humidity is requested | required. As one of such techniques, a method of suppressing moisture absorption and release by sticking a moisture-proof sheet on both sides of the particle board can be considered.

On the other hand, in recent years, floor heating systems have become widespread in buildings such as houses, but floor heating systems generally have electric heating elements such as electric and hot water heating elements, and wooden flooring disposed thereon. (See Patent Documents 1 and 2).
JP-A-8-246649 Japanese Patent No. 4041065

  However, the above method of attaching moisture-proof sheets to both sides of the particle board is effective for reducing dimensional changes due to humidity when applied to normal wood flooring, but when applied to a floor heating system. There were the following problems. In other words, when a wooden flooring with moisture-proof sheets attached to both sides of a three-layer particle board is applied to the heating element for floor heating, the heating element for floor heating that faces the back layer of the particle board when floor heating is used. Due to this heating, the moisture in the particle board is distributed, the moisture content of the back layer is lower than the surface layer, and convex warpage occurs. When convex warpage occurs in this way, the appearance of the wooden flooring material is impaired, and the practical function may be hindered.

  The present invention has been made in view of the circumstances as described above, and when a particleboard wood flooring is used in a floor heating system, the dimensional change due to humidity can be reduced, and further heat generation for floor heating. An object of the present invention is to provide a wooden floor material that can suppress the convex warpage of the particle board due to heating from the body.

  The present invention is characterized by the following in order to solve the above problems.

  1stly, the wooden flooring of this invention is a wooden flooring constructed | assembled on the heating element for floor heating, Comprising: On both surfaces of the core layer which mainly adhere | attached the chip | tip which consists of a coarse piece with the adhesive, It is equipped with a particle board with a surface layer and a back layer, which are chip chips bonded with an adhesive, and a moisture barrier sheet is attached to the surface layer and back layer of the particle board. It faces the heating element for use, and the thickness of the back layer is smaller than the thickness of the surface layer.

  Second, in the first wood floor material, the thickness of the back layer of the particle board is 0.5 to 0.8 times the thickness of the surface layer.

  Third, in the first or second wood floor material, the back layer of the particle board is ground and adjusted in thickness.

  According to the first aspect, by adhering the moisture-proof sheet to the surface layer and the back layer of the particle board, moisture absorption / release of the particle board is suppressed, and dimensional change due to humidity can be reduced. Furthermore, by making the thickness of the back layer facing the heating element for floor heating smaller than the thickness of the surface layer, even if the moisture in the particle board is distributed due to heating from the heating element for floor heating, The dimensional change can be reduced, and the convex warpage of the particle board can be suppressed.

  According to the second aspect of the invention, the thickness of the back layer of the particle board is 0.5 to 0.8 times the thickness of the surface layer. In particular, it can be suppressed.

  According to the third aspect of the invention, by grinding the back layer of the particle board, it is possible to remove the surface side portion of the back layer in which many fine particles are distributed among small pieces depending on the conditions at the time of manufacturing the particle board. it can. The surface side portion of the back layer where many fine pieces are distributed has a particularly large dimensional change due to moisture content change. However, by removing the portion by grinding the back layer, the effects of the first and second inventions can be obtained. In addition, the convex warpage of the particle board can be particularly suppressed.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a cross-sectional view showing an embodiment of the wooden flooring of the present invention, and FIG. 2 is a cross-sectional view showing a part of a back layer and a core layer thereon in an embodiment of the wooden flooring of the present invention. is there.

  The wooden flooring 1 of this embodiment is constructed on a heating element 20 for floor heating as a floor heating system, and includes a particle board 2, a moisture-proof sheet 6 adhered to both sides thereof, and a particle board 2 And a decorative material 7 attached to the moisture-proof sheet 6 on the upper surface side of the.

  The particle board 2 includes a core layer 4, a surface layer 3 provided on the surface of the core layer 4, and a back layer 5 provided on the back surface of the core layer 4.

  As shown in FIG. 2, the core layer 4 is a chip mainly composed of coarse pieces 10 bonded with an adhesive 12, and the surface layer 3 and the back layer 5 are composed mainly of small pieces 11 with an adhesive 12. Adhered with.

In the particle board 2, the thickness t ₂ of the back layer 5 facing the heating element 20 for floor heating is smaller than the thickness t _{1 of the} surface layer 3. The thickness t ₂ of the back layer 5 is preferably adjusted by grinding and cutting the back layer 5 with a sander, but the amount of chips on the surface layer 3 side is made larger than the amount of chips on the back layer 5 side. The particle board 2 can be adjusted by manufacturing.

  In the back layer 5 of the particle board 2, as shown in FIG. 2, due to the conditions at the time of manufacturing the particle board 2, particularly fine pieces 11 a among the small pieces 11 are largely distributed in the surface side portion of the back layer 5. ing. Therefore, the surface side portion of the back layer 5 has a particularly large dimensional change due to the change in moisture content due to the fine micro-pieces 11a. In the case of the method of manufacturing the particle board 2 by grinding the back layer 5 with a sander, the back layer By grinding 5, the portion can be removed by cutting, and the convex warpage of the particle board 2 can be particularly suppressed.

The thickness t ₂ of the backing layer 5 of particleboard 2, preferably are 0.5 to 0.8 times the thickness t ₁ of the surface layer 3 by grinding. The thickness t ₂ of the backing layer 5 of particleboard 2 With this range, it is possible to particularly suppress the convex warping of the particle board 2. May thickness t ₂ of the backing layer 5 of the particle board 2 is convex warpage occurs when more than 0.8 times the thickness t ₁ of the surface layer 3, the thickness t ₂ of the backing layer 5 of the particle board 2 is the surface layer 3 If the thickness t ₁ is less than 0.5, concave warpage may occur.

  In addition, the thickness of the surface layer 3 is usually 1 to 3 mm, and the thickness of the core layer 4 is usually 5 to 15 mm.

  A moisture-proof sheet 6 is attached to the surface layer 3 and the back layer 5 of the particle board 2. As the moisture-proof sheet 6, various types can be used. For example, a synthetic resin sheet, a metal sheet, a composite sheet obtained by combining these with a paper layer, or the like can be used.

  A decorative material 7 is attached to the moisture-proof sheet 6 on the surface side of the particle board 2. As the decorative material 7, for example, a veneer or a decorative sheet such as a polypropylene sheet, a polyethylene sheet, or a polyester sheet can be used.

  The wooden flooring 1 of the present embodiment having the above configuration is constructed on the floor heating element 20 and used as a floor heating system. As the heating element 20 for floor heating, for example, a floor heating panel heated by an electric method, a hot water method, or the like can be used.

And the wooden flooring 1 of this embodiment sticks the moisture-proof sheet | seat 6 to the surface layer 3 and the back layer 5 of the particle board 2, and the moisture absorption / release of the particle board 2 is suppressed and the dimensional change by humidity is reduced. be able to. Furthermore, by making the thickness t ₂ of the back layer 5 facing the heating element 20 for floor heating smaller than the thickness t _{1 of the} surface layer 3, the heating from the heating element 20 for floor heating increases the moisture in the particle board 1. Even if the distribution occurs, the dimensional change of the back layer 5 can be reduced, and the convex warpage of the particle board 2 can be suppressed.

EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to these Examples at all.
<Example 1>
A wooden flooring having the configuration shown in FIG. 1 was produced. As the particle board, a three-layer board having a total thickness of 11.8 mm including a surface layer thickness of 2.0 mm, a core layer thickness of 8.6 mm, and a back layer thickness of 1.2 mm was used. The back layer of the particle board was adjusted by grinding with a sander. A moisture-proof sheet was stuck on both surfaces of the particle board, and a veneer was stuck as a decorative material on the moisture-proof sheet on the surface layer side.

This wooden flooring was applied on a heating element for floor heating, and floor heating was continuously performed for 100 hours. Then, when the amount of warp of the wooden flooring was measured, the convex warp was 0.3 mm, which was significantly small. The appearance of the wooden flooring was also good.
<Comparative Example 1>
As the particle board, a three-layer board having a total thickness of 11.8 mm having a surface layer thickness of 1.6 mm, a core layer thickness of 8.6 mm, and a back layer thickness of 1.6 mm and a total thickness of 11.8 mm is used. Except for the above, a wooden flooring was produced in the same manner as in Example 1.

  This wooden flooring was applied on a heating element for floor heating, and floor heating was continuously performed for 100 hours. Then, when the curvature amount of the wooden flooring was measured, it was 1.0 mm in convex curvature, and a considerable amount of convex curvature occurred. In addition, the appearance of the wooden flooring was also deteriorated by the convex warpage.

It is sectional drawing which shows one Embodiment of the wooden flooring of this invention. It is sectional drawing which shows a part of back layer in one Embodiment of this invention wooden flooring, and a core layer on it.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wood flooring 2 Particle board 3 Surface layer 4 Core layer 5 Back layer 6 Moisture-proof sheet 10 Coarse piece 11 Small piece 12 Adhesive 20 Heating element t for floor heating t ₁ Surface layer thickness t ₂ Back layer thickness

Claims (3)

  A wooden floor material to be constructed on a heating element for floor heating, and a surface layer in which chips mainly composed of small pieces are adhered to both surfaces of a core layer in which chips composed mainly of coarse pieces are adhered with an adhesive, and A particle board with a back layer is provided, and moisture barrier sheets are attached to the surface and back layers of the particle board. The particle board faces the heating element for floor heating, and the thickness of the back layer. A wooden flooring characterized in that is smaller than the thickness of the surface layer.   The wood flooring according to claim 1, wherein the thickness of the back layer of the particle board is 0.5 to 0.8 times the thickness of the surface layer.   The wood flooring according to claim 1 or 2, wherein the back layer of the particle board is ground to adjust the thickness.

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