KR0125798Y1 - Radiation plate of integrated circuit element - Google Patents

Radiation plate of integrated circuit element Download PDF

Info

Publication number
KR0125798Y1
KR0125798Y1 KR2019920024058U KR920024058U KR0125798Y1 KR 0125798 Y1 KR0125798 Y1 KR 0125798Y1 KR 2019920024058 U KR2019920024058 U KR 2019920024058U KR 920024058 U KR920024058 U KR 920024058U KR 0125798 Y1 KR0125798 Y1 KR 0125798Y1
Authority
KR
South Korea
Prior art keywords
integrated circuit
heat sink
circuit device
heat
heat dissipation
Prior art date
Application number
KR2019920024058U
Other languages
Korean (ko)
Other versions
KR940018672U (en
Inventor
조상현
Original Assignee
정장호
엘지정보통신주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 정장호, 엘지정보통신주식회사 filed Critical 정장호
Priority to KR2019920024058U priority Critical patent/KR0125798Y1/en
Publication of KR940018672U publication Critical patent/KR940018672U/en
Application granted granted Critical
Publication of KR0125798Y1 publication Critical patent/KR0125798Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials

Abstract

본 고안은 집적회로 소자의 방열판에 관한 것으로 계속적인 신호의 입, 출력등에 의하여 발생되는 열의 방출이 용이하고, 부착이 용이하도록 한 집적회로 소자의 방열판에 관한 것이다.The present invention relates to a heat sink of an integrated circuit device, and more particularly to a heat sink of an integrated circuit device to facilitate the release of heat generated by the continuous input and output of the signal, and the like.

종래의 집적회로용 소자의 방열판은 직접회로 소자와 방열판이 별도로 되어 회로기판에 고정하도록 하되 접착제로 접합하고, 스크류가 방열판을 나선결합하므로써 열의 방열 효과가 나쁘며 구조가 복잡하고 조립 공정이 번잡한 문제점이 있었다.The heat dissipation plate of the integrated circuit element of the conventional integrated circuit device is separated from the heat dissipation plate to be fixed to the circuit board, but is bonded with an adhesive and the heat dissipation effect is poor due to the screw coupling the heat dissipation plate, and the structure is complicated and the assembly process is complicated. There was this.

본 고안은 알루미늄 재질의 방열판 본체(1)의 표시부(1a)와 중간부(3)에 지지부(3a)와 받침부(4)를 형성하여 안내부(5)를 구성하고, 측면에 고정부(6)와 받침턱(6a)을 일체로 구비하므로써 집적회로 소자에 결합이 용이하고, 발생하는 열의 방열 효과를 증대시키고자 한 것이다.The present invention forms the guide portion 5 by forming the supporting portion 3a and the supporting portion 4 on the display portion 1a and the middle portion 3 of the heat sink body 1 made of aluminum, and the fixing portion ( 6) and the supporting jaw 6a are integrally provided to facilitate the coupling to the integrated circuit device and to increase the heat dissipation effect of the generated heat.

Description

집적 회로 소자의 방열판Heat sink for integrated circuit devices

제1도의 (a)는 종래의 방열판을 부착한 상태의 평면도.(A) is a top view of the state which attached the conventional heat sink.

(b)는 종래의 방열판을 부착한 상태의 정면도.(b) is a front view of the state which attached the conventional heat sink.

제2도는 본 고안의 방열판을 전개한 상태의 평면도.2 is a plan view of a state in which the heat sink of the present invention is deployed.

제3도는 본 고안의 방열판을 접은 상태의 정면도.3 is a front view of a state in which the heat sink of the present invention is folded.

제4도는 본 고안의 방열판을 접은 상태의 사시도.Figure 4 is a perspective view of the folded state of the heat sink of the present invention.

제5도는 본 고안의 방열판을 직접회로 소자에 조립한 상태의 사시도.5 is a perspective view of the heat sink of the present invention assembled to an integrated circuit device.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 방열판 본체 1a : 표시부1: heat sink body 1a: display unit

2 : 상면부 3 : 중간부2: upper part 3: middle part

3a : 지지부 4 : 받침부3a: support portion 4: support portion

5 : 안내부 6 : 고정부5: guide part 6: fixed part

6a : 받침턱6a: stand

본 고안은 집적회로 소자의 방열판에 관한 것으로, 특히 집적회로 소자(IC)에 계속적인 신호의 입, 출력등에 의하여 발생되는 열의 방출이 용이하도록 하고, 열전도율이 우수한 알루미늄판을 사용함으로써 발열효과가 증대되도록한 집적회로 소자의 방열판에 관한 것이다.The present invention relates to a heat sink of an integrated circuit device, and in particular, to facilitate the discharge of heat generated by the continuous input and output of the signal to the integrated circuit device (IC), the heat generation effect is increased by using an aluminum plate having excellent thermal conductivity. The present invention relates to a heat sink of an integrated circuit device.

종래의 집적회로용 소자의 방열판은 제1도에서와 같이 집적회로 소자(IC)(20)와 방열판(21)을 별도로하여 회로기판(22)에 고정하되 집적회로 소자(IC)(20)와 방열판(21)을 접착제(23)로 접착한 다음 방열판(21)과 회로기판(22)을 스크류(24)로 나사 결합하여 고정하였다.The heat sink of the conventional integrated circuit device is fixed to the circuit board 22 separately from the integrated circuit device (IC) 20 and the heat sink 21 as shown in Figure 1, but the integrated circuit device (IC) 20 and The heat sink 21 was bonded with an adhesive 23, and then the heat sink 21 and the circuit board 22 were screwed together with a screw 24 to fix it.

그러나 종래의 방열판을 설치하기 위해서는 접착제를 도포하는 공정과 스크류로 체결하는 공정을 거쳐야 하므로 조립공정수가 많고, 접착제를 도포하는 공정이 번거로우며 접착제로 인하여 방열효과가 떨어지는 등의 문제점이 있었다.However, in order to install a conventional heat sink, a process of applying an adhesive and a process of fastening with a screw are required, and thus there are many assembly processes, a cumbersome process of applying an adhesive, and a poor heat dissipation effect due to the adhesive.

본 고안은 이와같은 문제점을 해결하기 위하여 안출한 것으로서 방열판을 고정시키기 위한 접착제나 스크류가 필요없이 단지 집적회로 소자(IC) 몸체에 방열판을 끼우기만 하면 부착되는 부착이 용이하고, 방열효과가 우수한 방열판을 제공하는 것이 목적이다.The present invention has been devised to solve such a problem, and it is easy to attach the heat sink to the integrated circuit device (IC) body without the need for an adhesive or a screw to fix the heat sink. The purpose is to provide.

첨부 도면에 의거하여 본 고안을 상세히 설명하면 다음과 같다.Referring to the present invention in detail based on the accompanying drawings as follows.

제1도와 같이 알루미늄 재질로된 판상의 방열판 본체(1)를 상면부(2)와 중간부(3) 및 받침부(4)의 3 부분으로 구분하여 상면부(2)와 중간부(3)의 중앙부를 4 각형으로 따내어 표시부((1a)를 형성하고, 중간부(3)의 양측에는 지지부(3a)를 형성하며, 상면부(2)와 중간부(3)와의 경계부위에는 받침턱(6a)이 있는 고정부(6)를 형성한 구성으로 된다.As shown in FIG. 1, the plate-shaped heat sink body 1 made of aluminum is divided into three parts, the upper surface portion 2, the middle portion 3, and the support portion 4, and the upper surface portion 2 and the middle portion 3 are separated from each other. The center portion of the center is formed into a quadrangular display portion (1a), the support portion 3a is formed on both sides of the intermediate portion 3, and the supporting jaw at the boundary between the upper surface portion 2 and the intermediate portion 3 is formed. It becomes the structure which provided the fixed part 6 with 6a.

상기 고정부(6)는 방열판 본체(1)의 상면부(2)와 중간부(3)에 걸쳐 소정 길이로 절결하여 이를 형성하고, 상기 각부 상면부(2) 중간부(3) 받침부(4)의 경계부위는 방열판 설치시 제4도와 같이 각부 상면부(2) 중간부(3) 받침부(4)간에 소정 거리가 유지되면서 용이하게 접어지도록 처리한다.The fixing part 6 is formed by cutting a predetermined length over the upper surface portion 2 and the middle portion 3 of the heat sink body 1, and the upper portion 2, the intermediate portion (3) of the supporting portion ( The boundary portion of 4) is easily folded while maintaining a predetermined distance between the upper surface portion 2, the middle portion 3 and the supporting portion 4 of each portion as shown in FIG.

이와같이 구성된 본 고안의 작용 효과를 설명하면 다음과 같다.Referring to the effects of the present invention configured as described above are as follows.

상기 표시부(1a)는 방열판 본체(1)를 집적회로 소자(20)에 설치하였을때 회로소자의 명판이 보이기 위하여 형성하는 것이고, 지지부(3a)와 고정부(6)는 방열판 본체(1)를 집적회로(20)에 결합시키는 역할을 하는 것이다.The display portion 1a is formed so that the name plate of the circuit element is visible when the heat sink main body 1 is installed in the integrated circuit element 20. The support portion 3a and the fixing portion 6 form the heat sink main body 1. It serves to couple to the integrated circuit (20).

본 고안 방열판 본체(1)를 집적회로 소자(20)에 설치하려면 먼저 도면 제2도 상태의 중간부(3) 아래 양지지부(3a) 사이에 회로소자(20)를 위치시키고 받침부(4)를 시계방향으로 90°더 접으면 중간부(3)와 받침부(4)의 고정부(6)사이에 회로소자(20)가 놓이게 된다. 이 상태에서 집적회로 소자(20)는 제5도에서와 같이 전, 후 좌, 우 상, 하로 방열판 본체(1)의 지지부(3a)와 고정부(6), 중간부(3), 받침부(4) 및 받침턱(6a)으로 둘러싸여 방열판 본체(1)의 안내부(5)내에 단단히 고정되어 있게된다. 이어서 방열판 본체(1)의 상면부(2)를 시계 방향으로 90°접은 후 다시 90°더 접으면 제5도와 같이 집적회로 소자(20)에 방열판(1)의 결합이 이루어지는 것이다.In order to install the heat sink body 1 of the present invention on the integrated circuit device 20, the circuit device 20 is placed between the supporting parts 3a under the middle part 3 of FIG. When F is further 90 ° clockwise, the circuit element 20 is placed between the fixing part 6 of the intermediate part 3 and the supporting part 4. In this state, the integrated circuit device 20 is left, right, up and down as shown in FIG. 5, and the supporting portion 3a, the fixing portion 6, the middle portion 3, and the supporting portion of the heat sink body 1 are shown in FIG. It is enclosed by (4) and the supporting jaw 6a, and is fixed firmly in the guide part 5 of the heat sink main body 1. Subsequently, when the upper surface portion 2 of the heat sink body 1 is folded by 90 ° clockwise and then further folded by 90 °, the heat sink 1 is coupled to the integrated circuit device 20 as shown in FIG.

이와같은 구성의 본 고안은 방열판이 설치된 집적회로 소자에서 열이 발생하면 이 열은 방열판 본체(1)의 중간부(3) 받침부(4) 뿐만 아니라 지지부(3a)와 고정부(6)를 통하여서도 방열되고, 중간부(3)와 지지부(3a) 및 고정부(6)가 흡수한 열은 방열판 본체(1)의 상면부(2)로 전도되므로 방열효과가 극대화 되는 것이다.According to the present invention having such a configuration, when heat is generated in the integrated circuit device in which the heat sink is installed, the heat is applied to the support part 3a and the fixing part 6 as well as the intermediate part 3 and the support part 4 of the heat sink body 1. Heat is also radiated through, the heat absorbed by the middle portion 3, the support portion 3a and the fixing portion 6 is conducted to the upper surface portion 2 of the heat sink body (1) is to maximize the heat radiation effect.

따라서 본 고안은 접착제나 접착용 스크류를 사용치 않고 간단히 접는 작업으로써 방열판을 견고히 부착시킬 수 있으며 방열 효과가 매우 뛰어난 특징이 있으므로 집적회로 소자 뿐만 아니라 다른 전자 부품을 보호하는데에도 유용한 고안인 것이다.Therefore, the present invention is a useful design for protecting not only integrated circuit devices but also other electronic components because the heat sink can be firmly attached to the heat sink by simply folding without using an adhesive or an adhesive screw.

Claims (3)

집적회로 소자에서 발영되어지는 열을 외부로 방출 시키는 방열판에 있어서, 알루미늄 재질의 방열판 본체(1)는 상호 ㄹ자 형상으로 접을 수 있도록 상면부(2)와, 이 상면부(2)에 이어져 있으면서 집적회로 소자의 측면부를 걸림지지 할 수 있도록 돌출시킨 지지부(3a)를 갖고 있는 중간부(3)와, 이 중간부와 이어져 있으면서 집적회로 소자의 바닥면을 받침하는 받침부(4)로 이뤄져 있는 것을 특징으로 하는 집적회로 소자의 방열판.In a heat sink for dissipating heat emitted from an integrated circuit device to the outside, the heat sink body 1 made of aluminum is integrated while being connected to the upper surface portion 2 and the upper surface portion 2 so as to be folded in a cross-shaped shape. It consists of an intermediate part 3 having a support part 3a which protrudes so as to hold the side part of the circuit element, and a support part 4 which is connected to the intermediate part and supports the bottom surface of the integrated circuit element. A heat sink of an integrated circuit device, characterized in that. 제1항에 있어서, 상기 상면부(2)와 중간부(3)에는 집적회로 소자의 상면에 표기된 집적회로 명을 볼 수 있도록 소정 형상으로 천설한 표시부(1a)가 구비 되어져 있는 것을 특징으로 하는 집적회로 소자의 방열판.The display unit 1a according to claim 1, wherein the upper surface portion 2 and the intermediate portion 3 are provided with a display portion 1a laid out in a predetermined shape so that the integrated circuit name written on the upper surface of the integrated circuit element can be seen. Heat sink of integrated circuit device. 제1항에 있어서, 상기 상면부(2)와 중간부(3)의 경계부위에는 이 곳을 일정길이 따내어서 집적회로 소자의 단측변에 걸림되기 위한 받침턱(6a)을 갖는 받침부(6)가 형성되어 있는 것을 특징으로 하는 집적회로 소자의 방열판.The support portion 6 according to claim 1, wherein a support portion 6 having a support jaw 6a is formed at a boundary between the upper surface portion 2 and the intermediate portion 3 so as to be pulled at a predetermined length and to be engaged with the short side of the integrated circuit device. Heat sink of the integrated circuit device, characterized in that is formed.
KR2019920024058U 1992-12-01 1992-12-01 Radiation plate of integrated circuit element KR0125798Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019920024058U KR0125798Y1 (en) 1992-12-01 1992-12-01 Radiation plate of integrated circuit element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019920024058U KR0125798Y1 (en) 1992-12-01 1992-12-01 Radiation plate of integrated circuit element

Publications (2)

Publication Number Publication Date
KR940018672U KR940018672U (en) 1994-07-30
KR0125798Y1 true KR0125798Y1 (en) 1999-04-15

Family

ID=19345352

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019920024058U KR0125798Y1 (en) 1992-12-01 1992-12-01 Radiation plate of integrated circuit element

Country Status (1)

Country Link
KR (1) KR0125798Y1 (en)

Also Published As

Publication number Publication date
KR940018672U (en) 1994-07-30

Similar Documents

Publication Publication Date Title
KR970063856A (en) Adjustable mounting system
KR940004789A (en) Semiconductor device with heat dissipation
US4665467A (en) Heat transfer mounting device
KR0125798Y1 (en) Radiation plate of integrated circuit element
KR970008435A (en) Semiconductor device
US4537246A (en) Vertical heat sink
WO2001087033A3 (en) Electronic device
JP2745786B2 (en) TAB semiconductor device
KR20000021368U (en) Heating member fixing device of using heat sink
JPH07336009A (en) Radiation structure of semiconductor element
JP3033045B2 (en) Module heat dissipation structure
JPH0625991Y2 (en) Audio equipment
JPH047175U (en)
JPH0376200A (en) Heat radiator
JPS6228766Y2 (en)
KR100669761B1 (en) Plasma display panel
JPH07307588A (en) Heat dissipation structure of module
JPH09116284A (en) Radiator
JPH0737434Y2 (en) Speaker with built-in amplifier
JP2595054Y2 (en) Radiator for electronic control unit
JPH0644110Y2 (en) Semiconductor device
JPH0558600B2 (en)
JPH0736453U (en) Mounting structure for heat sink to IC package
KR960019679A (en) Semiconductor device
JPS60178691A (en) Method of mounting chip carrier system on hybrid integrated circuit board

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20010423

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee