KR940018672U - Heat sink of integrated circuit device - Google Patents

Heat sink of integrated circuit device

Info

Publication number
KR940018672U
KR940018672U KR2019920024058U KR920024058U KR940018672U KR 940018672 U KR940018672 U KR 940018672U KR 2019920024058 U KR2019920024058 U KR 2019920024058U KR 920024058 U KR920024058 U KR 920024058U KR 940018672 U KR940018672 U KR 940018672U
Authority
KR
South Korea
Prior art keywords
integrated circuit
heat sink
circuit device
sink
heat
Prior art date
Application number
KR2019920024058U
Other languages
Korean (ko)
Other versions
KR0125798Y1 (en
Inventor
조상현
Original Assignee
엘지정보통신주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지정보통신주식회사 filed Critical 엘지정보통신주식회사
Priority to KR2019920024058U priority Critical patent/KR0125798Y1/en
Publication of KR940018672U publication Critical patent/KR940018672U/en
Application granted granted Critical
Publication of KR0125798Y1 publication Critical patent/KR0125798Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR2019920024058U 1992-12-01 1992-12-01 Radiation plate of integrated circuit element KR0125798Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019920024058U KR0125798Y1 (en) 1992-12-01 1992-12-01 Radiation plate of integrated circuit element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019920024058U KR0125798Y1 (en) 1992-12-01 1992-12-01 Radiation plate of integrated circuit element

Publications (2)

Publication Number Publication Date
KR940018672U true KR940018672U (en) 1994-07-30
KR0125798Y1 KR0125798Y1 (en) 1999-04-15

Family

ID=19345352

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019920024058U KR0125798Y1 (en) 1992-12-01 1992-12-01 Radiation plate of integrated circuit element

Country Status (1)

Country Link
KR (1) KR0125798Y1 (en)

Also Published As

Publication number Publication date
KR0125798Y1 (en) 1999-04-15

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20010423

Year of fee payment: 4

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