KR0124554Y1 - Apparatus for separating package between burn-in boards - Google Patents

Abstract

The present invention is a burn-in-board (burn-in-board) with a hole for separating the package and a plastic leaded chip carrier (PLCC) package from the socket on the burn-in board and transported to the tray. An apparatus for separating a package, comprising: a PLCC package separating means; PLCC package transfer means; Burn-in-board fastening means; Support means; It consists of X-axis moving means to prevent chip breakage when removing the package, and connects many of the above configurations in parallel to increase the work efficiency, and is formed in the socket on the burn-in board. Holes of the same size as the shape holes are formed as many as the number of sockets to facilitate package removal.

Description

Device for separating package on burn-in board and burn-in board with hole for package separation

1 is a perspective view of a general semiconductor socket.

2 is a conceptual diagram of the burn-in-board used in the present invention,

(a) is a conceptual diagram showing the arrangement of semiconductor sockets on a burn-in board.

(b) is a cross-sectional view of the burn-in board in which a □ -shaped hole is formed.

3 is a schematic diagram of a device for removing a package of the present invention burn-in board.

* Explanation of symbols for main parts of the drawings

1: PLCC package 2: socket

3: burn-in-board 4: motor

5,7: shaft and screw 6,8,15,18: slider

9: pusher arm 10, 13, 17, 21: cylinder

11: vacuum tip 12: lower base

14: guide base 16: slider bracket

19: lead screw and motor 20: clamp bar

22 tray

The present invention is a burn-in-board (burn-in-board) with a hole for separating the package and a plastic leaded chip carrier (PLCC) package from the socket on the burn-in board and transported to the tray. A device for removing a package.

In general, a semiconductor package separates a wafer into a single chip, bonds the separated chip to a lead frame, wire-bonds the chip to the lead frame, and molds the resin to seal the chip to an external lead portion. The lead sheath is made by lead frame lead plating and the like, and is formed by sequentially performing a process of molding the mold into a designated lead shape and testing the same.

Processes tested in the above process can be roughly divided into electrical test and thermal test, the thermal test is usually performed before the electrical test. The process of testing how to withstand is to combine the package to be tested with a semiconductor socket arranged in several matrices on a burn-in board and apply heat at a set temperature.

After the thermal test is completed, each package key coupled to the socket on the burn-in board must be separated to perform the electrical test. In other words, the electrical test is to test the packages one by one.

Furthermore, when performing the electric bottom test after the thermal test, a method of removing a package stuck on the burn-in board is performed by applying a shock to the package under the burn-in board to remove the package. In this process, there is a problem that the package is damaged or a factor causing a failure.

On the other hand, a perspective view of a general semiconductor socket is shown as shown in FIG. 1, which is omitted since the shape and use thereof are well known. Just remember that the shape of the socket is a rough box shape with open top and bottom surfaces (ie, a □ -shaped hole).

The present invention is to solve the above-described problems, it is possible to facilitate the separation of the device and the device to easily separate the PLCC package (hereinafter referred to as 'package') from the semiconductor socket on the burn-in-board. In order to provide a burn-in-board with a □ -shaped hole equal to the size formed in the socket, a burn-in-board at the bottom of each socket is provided.

That is, the present invention is package separation means for separating the package from the socket; Transfer means for transferring the separated package to a tray; Burn-in board fixing means for fixing the burn-in board; Support means for supporting the socket and the package when the package is detached from the socket; It characterized in that it comprises an X-axis transport means for driving the support means on the X axis,

The package separating means includes a motor, a shaft and a screw, a slider, a pusher arm for pressing the socket, a cylinder for raising and lowering the vacuum tip, and a vacuum tip for adsorbing a package separated from the socket. Is done by; The package conveying means comprises a motor, a shaft and a screw; The burn-in board fixing means comprises a cramp bar and a cylinder at both sides of the upper end of the frame; The support means includes a lower base for supporting the package, a cylinder for driving the lower base; Including a guide base for supporting the socket, a slider for driving the guide base up and down, a slider bracket for supporting the slider, a cylinder for driving the slider, and a slider for driving the slider bracket in the X axis. Is done. In addition, the X-axis moving means operates in conjunction with the package transfer means, which comprises a lead screw and a motor for driving the slider of the support means.

Reference will be made to FIG. 2 to describe one embodiment of the present invention having the features as described above. 2 is a conceptual diagram of the burn-in board used in the present invention, (a) is a conceptual diagram showing the arrangement of semiconductor sockets on the burn-in board, and (b) is a burn-in-form having a □ -shaped hole formed therein. Sectional view of the board.

First, as shown in (a), the N, M semiconductor sockets 2 are seated on the burn-in board 3 in the X and Y axis directions at regular intervals (X axis pitch = Px, Y axis sebum = Py). It is. The burn-in-board 3 having such an arrangement of sockets 2 is formed with a □ -shaped hole having the same size as the □ -shaped hole formed in the socket 2 under each of the sockets 2. This is illustrated in (b). That is, as shown in (b), □ a is formed at the lower part of each socket 2, and □ a is also formed at the burn-in-board 3 under it.

The □ -type hole is formed in the burn-in-board as described above, and the □ -type hole is formed in the socket, so that the package bound to the socket can be easily removed. That is, the package can be easily separated by applying pressure to the socket in a direction opposite to the support in the state of supporting the package with the support through the formed hole.

When described in detail with reference to the drawings, the block diagram of the device for separating the package on the present invention burn-in-board can be shown as shown in FIG.

A clamp bar 20 installed at both sides of the upper end of the frame to fix the burn-in board 3 on which the socket 2 to which the package 1 to be removed is attached is mounted; Burn-in-board fixing means comprising a cylinder 21 for fixing the burn-in-board 3;

Package conveying means comprising a shaft and a screw 5 driven by a motor 4 for conveying the separated package key to the tray;

A motor 6 for driving the shaft and screw 7 in the vertical direction, a pusher arm 9 fixed to the slider 8, for pressing the socket 2; A cylinder 10 for raising and lowering the vacuum tip 11; Package separating means comprising a vacuum tip (11) for sucking the package (1) separated from the socket (2);

A lower base 12 for supporting the package 1, a cylinder 13 for driving the lower base 12, a guide base 14 for supporting the socket 2, and a guide base 14. The slider 15 for driving the up and down, the slider bracket 16 for supporting the slider 15, the cylinder 17 for driving the slider 15, and the slider bracket 16 for the X axis. Support means comprising a slider 18 for driving;

X-axis moving means including a lead screw and a motor 19 for driving the slider 18.

On the other hand, by configuring the same device in the embodiment of the present invention in parallel (as many as the number of sockets on the Y-axis; in this embodiment M) in accordance with the arrangement interval of the socket, to reduce the hassle of transferring to the Y-axis, It also allows multiple packages to be separated at the same time.

That is, the lower base 12, the guide base 14, the pusher arm 9, and the vacuum tip 11 are configured to connect M pieces in parallel on the Y-axis to simultaneously separate and transport the M packages.

Of course, the burn-in-board is a □ -shaped hole is formed as described in Figure 2 (b).

On the other hand, when the present invention configured as described above operates;

The burn-in board 3 is mounted on the frame and fixed with the clamp 20 and the cylinder 21. The lid and screw 19 are set in the initial position and stand by in the first row X. The motor 4 and the shaft and screw 5 of the transport means also have a central axis of the pusher arm 9 and the vacuum tip 11 in the first row X. I'm waiting to come. When the cylinder 17 rises at the initial position as described above and the slider 15 is raised, the guide base 14 supports the lower part of the socket 2 under the burn-in-board 3, and the slider 6 The pusher arm 9 fixed to the slider 8 by lower feed of the shaft and the screw 7 presses the upper part of the socket 2 with a constant load, so that the package 1 is separated from the socket 2. Subsequently, the cylinder 13 is raised to raise the lower base 12 so as to support the lower surface of the separated package 1 and move up (move a distance) so that the lid of the package 1 is completely separated from the socket 2. After that, the vacuum tip 11 is lowered by the cylinder 10 and the package 1 is attracted by the vacuum pressure, and the cylinder 10 is raised. Then, the slider 6 is moved by the slider 6 and the shaft and the screw 7. When the 8) rises to a certain position, the pusher arm 9 is also removed from the socket. The cylinder 13 lowers and the lower base 12 returns to the origin, and then the cylinder 17 lowers to guide the base 14. Fall off burn-in-board (3). Thereafter, the slider 18 on the lid and screw 19 is transported by one pitch 1Px to be located in the next row X (second row), and the package picked up by the motor 4 and the shaft and screw 5 ( The first row of the tray 22 is moved to place the package 1 on the tray by lowering the cylinder 10 and removing the vacuum pressure of the vacuum tip 11. In the same way, the cylinder 10 is then in the second row X and the above steps are repeated.

As described above, the present invention includes a PLCC package separating means; PLCC package transfer means; Burn-in-board fastening means; Support means; It consists of X-axis moving means to prevent chip breakage when removing the package, and connects many of the above configurations in parallel to increase the work efficiency, and is formed in the socket on the burn-in board. Holes of the same size as the shape holes are formed as many as the number of sockets to facilitate package removal.

Claims (3)

Fixed burn-in board, including clamp bars installed on both sides of the frame to secure the burn-in board on which the socket to which the package to be removed is seated, and a cylinder for fixing the burn-in board. Means; Package conveying means comprising a shaft and a screw driven by a motor for conveying the separated package to a tray; A motor for driving the shaft and the screw in the vertical direction, a pusher arm fixed to the slider, for pushing the socket; A cylinder for raising and lowering the vacuum tip; Package separating means comprising a vacuum tip for sucking the package separated from the socket; A lower base for supporting the package, a cylinder for driving the lower base, a guide base for supporting the socket, a slider for driving the guide base up and down, a slider bracket for supporting the slider, and a slider A support means comprising a cylinder for driving the cylinder and a slider for driving the X-axis slider bracket; A device for separating a package on a burn-in board comprising an X-axis moving means comprising a lead screw and a motor for driving a slider. The burn-in-board type according to claim 1, wherein the lower base, the guide base, the pusher arm, and the vacuum tip are connected in parallel on the Y axis so that M pieces can be separated and transported at the same time. Device for removing a package. In the burn-in board in which a plurality of sockets are seated, a hole for package separation characterized in that a hole having a shape having the same size as a hole having a shape formed at a lower portion of the socket is formed at the same position as that of the socket. Formed burn-in-board.