KR0120502Y1 - Chemical supplying apparatus for semiconductor manufacturing equipment - Google Patents
Chemical supplying apparatus for semiconductor manufacturing equipmentInfo
- Publication number
- KR0120502Y1 KR0120502Y1 KR2019950000041U KR19950000041U KR0120502Y1 KR 0120502 Y1 KR0120502 Y1 KR 0120502Y1 KR 2019950000041 U KR2019950000041 U KR 2019950000041U KR 19950000041 U KR19950000041 U KR 19950000041U KR 0120502 Y1 KR0120502 Y1 KR 0120502Y1
- Authority
- KR
- South Korea
- Prior art keywords
- process solution
- pure water
- circulation
- solution
- semiconductor manufacturing
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
Abstract
본 고안은 서로 다른 조건 및 성질을 가지는 두가지 용액을 효과적으로 혼합시킬 수 있도록 구성한 공정용액 공급장치에 관한 것이다.The present invention relates to a process solution supply device configured to effectively mix two solutions having different conditions and properties.
본 고안에 따른 공정용액 공급장치는 순환라인, 순환펌프, 필터 및 히터로 이루어진 공정용액 순환부와 공정용액 순환부와 연결된 공정용액 저장조를 구비한 반도체 제조장비용 공정용액 공급장치중 공정용액 순환부에 일정량의 순수를 공급하는 순수공급부를 연결하여 순환되는 공정용액에 순수를 공급, 1차 혼합시킨 후 혼합된 용액을 공정용액 저장조에 공급할 수 있도록 구성한 것이 그 요지이다.The process solution supply device according to the present invention is a process solution circulation part of a process solution supply device for semiconductor manufacturing equipment having a process solution circulation part consisting of a circulation line, a circulation pump, a filter, and a heater and a process solution storage tank connected to the process solution circulation part. The main point is to connect the pure water supply unit for supplying a certain amount of pure water to supply pure water to the circulating process solution, and to mix the first solution, and to supply the mixed solution to the process solution reservoir.
Description
도면은 본 고안의 전체적인 구성도.Figure is the overall configuration of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
1 : 공정용액 저장조 2 : 공정용액 순환부1: process solution storage tank 2: process solution circulation
2A,2B,2C : 순환라인 3 : 순환펌프2A, 2B, 2C: circulation line 3: circulation pump
4 : 필터 5 : 히터4: filter 5: heater
10 : 순수공급부 11 : 정량펌프10: pure water supply unit 11: metering pump
12 및 13 : 제 1 및 제 2 순수공급라인12 and 13: first and second pure water supply lines
본 고안은 반도체 제조장비용 공정용액 공급장치에 관한 것으로서, 서로 다른 조건 및 성질을 가지는 두가지 용액을 효과적으로 혼합시킬 수 있도록 구성한 공정용액 공급장치에 관한 것이다.The present invention relates to a process solution supply device for semiconductor manufacturing equipment, and to a process solution supply device configured to effectively mix two solutions having different conditions and properties.
반도체 제조공정중의 하나인 식각(Etching)공정, 특히 웨이퍼 표면에 증착되어 있는 질화막(Nitride)을 식각하기 위해서 고온(약 160℃)의 공정용액(인산용액(H3PO하부임)을 이용하게 되며, 공정용액이 저장된 공정용액 저장조(Bath)내에 웨이퍼를 장시간 담근 상태에서 질화막을 일정한 식각비율로 식각하게 된다.In order to etch the nitride process, which is one of the semiconductor manufacturing processes, especially the nitride deposited on the wafer surface, a high temperature (about 160 ° C) process solution (phosphate solution (below H3PO)) is used. The nitride film is etched at a constant etching rate while the wafer is immersed in a process solution storage basin in which the process solution is stored.
이때, 고온의 공정용액이 증발하는 관계로 공정용액의 일정한 농도유지(일정한 식각비율 유지)를 위하여 공정용액이 소량의 순수(De-Ionized Water ; 純水)를 추가로 공급하여야 한다.In this case, in order to maintain a constant concentration of the process solution (maintaining a constant etching rate), a small amount of de-ionized water must be additionally supplied in order to maintain a constant concentration of the process solution.
공정용액에 순수를 공급하는 일반적인 방법으로는 유량계를 이용하여 일정한 양의 순수를 공정용액 저장조 상부에서 직접 투여하여 공정용액에 순수를 혼합시키는 방법을 이용하였으나, 이 경우 순수가 공정용액과 접촉하는 순간에 고온의 공정용액과 함께 증발하기 때문에 공정용액에 혼합되는 순수의 양을 정확하게 제어하기 어렵게 된다. 순수와 공정용액의 온도차이로 인하여 순수가 증발되기도 하며, 순수와 접촉된 공정용액은 비등상태로 공정용액 저장조에서 외부로 튀어나가기 때문에 공정용액의 낭비등과 같은 문제점이 발생하게 된다. 이와 같은 이유로 하여 공정용액의 농도는 8시간이 경과 된 후 현저하게 차이가 발생하게 되며, 따라서 웨이퍼의 균일한 식각을 위해서는 공정용액을 교체해야하는 낭비적인 문제점이 야기된다.As a general method of supplying pure water to the process solution, a method of mixing pure water with the process solution by directly administering a certain amount of pure water from the upper part of the process solution reservoir using a flow meter, in which case the moment the pure water comes into contact with the process solution Evaporation with the high temperature process solution makes it difficult to accurately control the amount of pure water mixed in the process solution. Pure water may be evaporated due to the temperature difference between pure water and the process solution, and the process solution contacted with pure water may be boiled out of the process solution reservoir in a boiling state, causing problems such as waste of process solution. For this reason, the concentration of the process solution is significantly different after 8 hours, and thus a wasteful problem of replacing the process solution is required for uniform etching of the wafer.
본 고안은 반도체의 식각공정에 이용되는 공정액 공급장치에서 발생되는 이와 같은 문제점을 해결하기 위한 것으로서, 공정용액의 일정농도를 유지하기 위한 순수의 공급을 외부공급이 아니라 내부순환식으로 공급함으로서 공정액 증발의 최소화 및 순수의 정확한 양을 지속적으로 공급할 수 있는 공정액 공급장치를 제공하는데 그 목적이 있다.The present invention is to solve the problems caused by the process solution supply apparatus used in the etching process of the semiconductor, the process by supplying the pure water supply to maintain a constant concentration of the process solution by the internal circulation rather than the external supply process The purpose is to provide a process liquid supply device capable of minimizing liquid evaporation and continuously supplying an accurate amount of pure water.
상술한 목적을 실현하기 위한 본 고안은 순환라인, 순환펌프, 필터 및 히터로 이루어진 공정용액 순환부와 공정용액 순환부와 연결된 공정용액 저장조를 구비한 반도체 제조장비용 공정용액 공급장치중 공정용액 순환부에 일정량의 순수를 공급하는 순수공급부를 연결하는 순환되는 공정용액에 순수를 공급, 1차 혼삽시킨후 혼합된 용액을 공정용액 저장조에 공급할 수 있도록 구성한 것을 그 특징으로 한다.The present invention for realizing the above object is a process solution circulation part of the process solution supply unit for semiconductor manufacturing equipment having a process solution circulation section consisting of a circulation line, a circulation pump, a filter and a heater and a process solution reservoir connected to the process solution circulation section The pure water is supplied to the circulating process solution connecting the pure water supply unit for supplying a predetermined amount of pure water to the primary solution, and then the mixed solution is configured to be supplied to the process solution storage tank.
이하, 본 고안은 첨부한 도면을 참고하여 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
도면은 본 고안의 전체적인 구성도로서, 본 고안의 가장 큰 특징은 순수를 공정용액 저장조(1)의 외부에서 투입하는 것이 아니라 공정용액의 어느 한 순화라인(2A)에 공급하여 공정용액과 1차 혼합시킨 후 순환라인(2B,2C)을 통하여 공정용액과 함께 공정용액 저장조(1) 내부로 직접 공급하는 것이다.The drawing is the overall configuration of the present invention, the biggest feature of the present invention is that the pure water is not injected from the outside of the process solution reservoir (1), but is supplied to any one of the purification line (2A) of the process solution and the process solution and the primary After mixing, the process solution is directly supplied into the process solution storage tank 1 together with the process solution through circulation lines 2B and 2C.
공정용액 저장조(1)와 공정용액 순환부(2)인 순환펌프(3) 및 필터(4), 히터(5)는 순환라인(2A,2B,2C)을 통하여 연결되어 있으며, 공정용액 저장조(1)내의 공정용액은 순환펌프(3)에 의하여 순환라인(2A,2B)으로 유입되어 필터(4)에 의하여 식각공정시 발생된 이물질이 제거된다. 또한 필터(4)를 통과한 공정용액은 히터(5)에 의하여 식각공정에 필요한 온도로 재가열되어 공정용액 저장조(1) 내부로 재차 공급된다. 본 고안의 주요지인 순수공급부(10)는 공정용액 저장조(1)와 순환펌프(3)를 연결하는 순환라인(2A)에 설치되며, 순수공급부(10)는 정량펌프(11) 및 정량펌프(11)와 순수 저장조(도시되지 않음). 정량펌프(11)와 순환라인(2A)을 각각 연결하는 제 1 및 제 2 순수공급라인(12 및 13)으로 이루어진다.The process solution reservoir 1 and the process solution circulation section 2, the circulation pump 3, the filter 4, and the heater 5 are connected through circulation lines 2A, 2B, and 2C, and the process solution reservoir ( The process solution in 1) is introduced into the circulation lines 2A and 2B by the circulation pump 3 to remove foreign substances generated during the etching process by the filter 4. In addition, the process solution passed through the filter 4 is reheated by the heater 5 to the temperature required for the etching process and supplied again into the process solution storage tank 1. The pure water supply unit 10, which is the main place of the present invention, is installed in the circulation line 2A connecting the process solution storage tank 1 and the circulation pump 3, and the pure water supply unit 10 is a metering pump 11 and a metering pump ( 11) and net reservoir (not shown). It consists of first and second pure water supply lines 12 and 13 connecting the metering pump 11 and the circulation line 2A, respectively.
정량펌프(11)는 공정용액의 순환량을 고려하여 작동시간 및 공급량을 설정(예를들어 100초 간격으로 30초 가동 및 10 CC/30초의 공급량)한다.The metering pump 11 sets the operation time and the supply amount in consideration of the circulating amount of the process solution (for example, 30 seconds at 100 second intervals and 10 CC / 30 seconds of supply).
이상과 같은 본 고안의 작동을 설명하면, 상술한 바와 같이 공정용액 순환부(2)에는 공정용액 저장조(1)에서 유입된 공정용액이 순환되어지며, 이 상태에서 순수공급부(10)의 정량펌프(11)가 작동하면 설정된 시간동안 설정된 양의 순수가 순수공급라인(12 및 13)을 통하여 공정용액 저장조(1)와 공정용액 순환부(2)의 순환펌프(3)를 연결하는 순환라인(2A)으로 주입되어 진다. 순환라인(2A)내에서 혼합된 공정용액과 순수는 순환펌프(3)를 통하여 필터(4)를 거치게 되며, 따라서 공정용액과 순수에 함유된 이물질은 여과되어진 상태로 히터(5)에 의하여 일정온도(약 160℃)로 가열되어 진다. 일정온도로 가열된 공정용액과 순수의 혼합물은 공정용액 저장조(1) 내부로 유입된다.Referring to the operation of the present invention as described above, the process solution flow in the process solution storage tank 1 is circulated in the process solution circulation unit 2 as described above, in this state the fixed-quantity pump of the pure water supply unit 10 When the operation (11) is operated, a circulation line for connecting the circulating pump 3 of the process solution reservoir 1 and the process solution circulator 2 through the pure water supply lines 12 and 13 for a predetermined time ( 2A). The process solution and the pure water mixed in the circulation line 2A pass through the filter 4 through the circulation pump 3, and thus, the foreign matter contained in the process solution and the pure water is filtered by the heater 5 in a filtered state. Heated to temperature (about 160 ° C.). The mixture of the process solution and the pure water heated to a constant temperature is introduced into the process solution reservoir (1).
공정용액 저장조(1)로 유입되기 전에 순수는 1차적으로 공정용액과 혼합되어짐은 물론 일정온도로 가열된 상태이므로 공정용액 저장조(1)에 저장되어 있는 공정용액과 무리없이 혼합되어지며, 따라서 순수의 증발 및 공정용액의 튀어나감 현상은 발생하지 않게된다. 이와 같은 방법으로 공정용액에 추가공급된 순수는 고온의 공정용액이 증발됨에 따라 나타나는 공정용액의 농도변화를 장시간동안 보상할 수 있다.Pure water is not only mixed with the process solution but also heated to a constant temperature before being introduced into the process solution storage tank (1), so that the pure water is mixed with the process solution stored in the process solution storage tank (1) without difficulty. The phenomenon of evaporation and splashing of the process solution does not occur. In this way, the pure water additionally supplied to the process solution can compensate for the change in concentration of the process solution for a long time as the high temperature process solution evaporates.
이상과 같은 본 고안은 일정시간동안 일정량의 순수를 공정용액의 순환라인에 공급한후 혼합된 용액을 일정온도로 가열시켜 공정용액 저장조 내부로 공급함으로서 공정용액 저장조내의 공정용액과의 온도차이를 없앨 수 있으며, 따라서 공정용액으로의 무리없는 순수의 공급 및 공급용액의 일정한 농도유지가 가능하게 된다. 이로 인하여 공정용액의 농도변화로 발생하는 식각를 변화방지 및 웨이퍼의 식각불량을 사전에 예방할 수 있으며, 공정용액의 사용시간을 연장할 수 있는 우수한 효과를 기대할 수 있다.The present invention as described above, by supplying a certain amount of pure water for a certain time to the circulation line of the process solution and heating the mixed solution to a certain temperature to supply the inside of the process solution reservoir to eliminate the temperature difference with the process solution in the process solution reservoir Therefore, it is possible to supply pure water to the process solution and maintain a constant concentration of the feed solution. As a result, the etching caused by the change in the concentration of the process solution can be prevented and the etching defect of the wafer can be prevented in advance, and an excellent effect of prolonging the use time of the process solution can be expected.
한편, 이상의 설명에서는 웨이퍼의 식각에 이용되는 공정용액(인산용액)과 공정용액의 농도를 유지시키기 위한 순수의 경우를 예를들어 설명하였으나, 특정 목적을 위하여 또다른 용액을 공급하는 모든 장치에 본 고안의 원리가 적용될 수 있음은 물론이다.Meanwhile, in the above description, the process solution (phosphate solution) used for etching the wafer and the pure water for maintaining the concentration of the process solution have been described as an example, but the present invention is applied to all devices for supplying another solution for a specific purpose. Of course, the principles of the invention can be applied.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950000041U KR0120502Y1 (en) | 1995-01-05 | 1995-01-05 | Chemical supplying apparatus for semiconductor manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950000041U KR0120502Y1 (en) | 1995-01-05 | 1995-01-05 | Chemical supplying apparatus for semiconductor manufacturing equipment |
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| Publication Number | Publication Date |
|---|---|
| KR960027031U KR960027031U (en) | 1996-08-17 |
| KR0120502Y1 true KR0120502Y1 (en) | 1998-08-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| KR2019950000041U KR0120502Y1 (en) | 1995-01-05 | 1995-01-05 | Chemical supplying apparatus for semiconductor manufacturing equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104926468A (en) * | 2015-06-10 | 2015-09-23 | 苏州御亭现代农业产业园发展有限公司 | Bio-enzyme organic compound fertilizer for pomegranate |
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1995
- 1995-01-05 KR KR2019950000041U patent/KR0120502Y1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104926468A (en) * | 2015-06-10 | 2015-09-23 | 苏州御亭现代农业产业园发展有限公司 | Bio-enzyme organic compound fertilizer for pomegranate |
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| Publication number | Publication date |
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| KR960027031U (en) | 1996-08-17 |
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