KR0117491Y1 - A device for correcting an robot arm - Google Patents

A device for correcting an robot arm

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Publication number
KR0117491Y1
KR0117491Y1 KR2019940020048U KR19940020048U KR0117491Y1 KR 0117491 Y1 KR0117491 Y1 KR 0117491Y1 KR 2019940020048 U KR2019940020048 U KR 2019940020048U KR 19940020048 U KR19940020048 U KR 19940020048U KR 0117491 Y1 KR0117491 Y1 KR 0117491Y1
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South Korea
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robot arm
center
wafer
calibration
glass
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KR2019940020048U
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Korean (ko)
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KR960007258U (en
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정길종
최영일
김성진
김광성
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김주용
현대전자산업주식회사
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Priority to KR2019940020048U priority Critical patent/KR0117491Y1/en
Publication of KR960007258U publication Critical patent/KR960007258U/en
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Publication of KR0117491Y1 publication Critical patent/KR0117491Y1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

내용없음No content

Description

로봇아암 교정장치Robot Arm Straightening Device

제 1 도는 본 고안에 의한 로봇아암 교정장치의 일실시예 구성을 나타낸 분해 사시도,1 is an exploded perspective view showing an embodiment configuration of a robot arm calibration apparatus according to the present invention,

제 2 도의 (a), (b), (c)는 본 고안에 의한 로봇아암 교정장치의 사용상 태도.(A), (b) and (c) of FIG. 2 show attitudes toward use of the robot arm calibration device according to the present invention.

* 도면의 주요부분에 대한 부호의 설명 *Explanation of symbols on the main parts of the drawings

1 : 로봇아암2 : 측정글라스1: Robot Arm 2: Measuring Glass

2a : 중심원3 : 교정글라스2a: center circle 3: calibration glass

4 : 광학 망원경4a : 중심점4: optical telescope 4a: center point

5 : 척5a : 진공홀5: Chuck 5a: Vacuum Hole

6 : 양극판7 : 리프트홀6: bipolar plate 7: lift hole

8 : 챔버9 : 카세트8 chamber 9: cassette

10 : 로드락11 : 고정편10: load lock 11: fixed piece

본 고안은 반도체 식각공정장비인 옥사이드 에처(OXIDE ETCHER) 장비에 포함되며, 웨이퍼가 챔버내의 양극판위에 정확히 놓여졌는가를 검사하기 위하여 로봇암의 위치를 상기 웨이퍼의 중심부에 정확히 일치시킬 수 있도록 하는 로봇암 교정장치에 관한 것이다.The present invention is included in OXIDE ETCHER equipment, which is a semiconductor etching process equipment, and allows the robot arm to be exactly aligned with the center of the wafer to check whether the wafer is placed on the anode plate in the chamber. It relates to a calibration device.

종래의 반도체 제조공정에서의 식각공정을 간단히 살펴보면 먼저 로봇아암이 초기 기준위치인 로드락에 위치하여 전후, 좌우 동작을 수행하면서 플랫 얼라이너로 이동하게 되면, 웨이퍼가 상기 프로세스 챔버내로 인입되기 전에 척과 웨이퍼의 플랫존을 일정한 방향으로 맞추게 된다.Referring to the etching process of the conventional semiconductor manufacturing process, first, the robot arm is positioned at the load lock, which is the initial reference position, and moves to the flat aligner while performing the front, rear, left and right movements, and before the wafer is introduced into the process chamber, The flat zone of the wafer is aligned in a constant direction.

상기 플랫존 정렬작업이 끝나면 척은 일정거리만큼 하강하게 됨으로써 상기 웨이퍼가 로봇아암에 자연적으로 얹혀지게 되며, 상기 로봇아암은 로드락으로 원위치하여 다시 프로세스 챔버로 이동한다.When the flat zone alignment is completed, the chuck is lowered by a predetermined distance so that the wafer is naturally placed on the robot arm, and the robot arm is moved back to the load lock and moved back to the process chamber.

이때, 상기 리프트가 일정거리 만큼 상승되면서 웨이퍼를 자연적으로 로봇아암으로 부터 이동시켜 상기 챔버의 양극판위에 안착되게 하는 것이다. 상기 리프트로 웨이퍼가 옮겨지면 로봇아암은 다시 로드락으로 원위치한다.At this time, as the lift is raised by a predetermined distance, the wafer is naturally moved from the robot arm to be seated on the anode plate of the chamber. When the wafer is moved to the lift, the robot arm is returned to the load lock.

상기와 같이 식각공정을 수행하는 소정의 챔버내로 웨이퍼를 로딩 및 언로딩시키는 로봇아암은 웨이퍼의 플랫존을 항시 일정한 방향에 맞추어 챔버내에 구비된 양극판상에 안착되도록 함으로서 식각공정을 수행한다.The robot arm for loading and unloading the wafer into a predetermined chamber for performing the etching process as described above performs the etching process by allowing the flat zone of the wafer to be seated on the anode plate provided in the chamber at a constant direction at all times.

여기서, 상기 웨이퍼의 플랫 존이 일정한 방향으로 챔버내의 양극판상에 정확히 안착되어야만 식각공정 완료후의 웨이퍼 반송에 따른 파손을 방지할 수 있는데, 상기 로봇아암이 초기 웨이퍼를 카세트로 부터 받아 이송하는 도중에 주변기기에 부닥침등의 주위환경으로 인하여 웨이퍼의 위치가 틀어지는 경우가 종종 발생하였다.Here, the flat zone of the wafer must be correctly seated on the anode plate in the chamber in a predetermined direction to prevent breakage due to the wafer transfer after the etching process is completed. The robot arm receives the initial wafer from the cassette and transfers the peripheral device to the peripheral device. In some cases, the wafer is displaced due to the surrounding environment such as a bump.

또한, 상기 웨이퍼를 양극판상에 정확히 안착되었는가를 검사하기 위해서는 웨이퍼와 로봇아암의 중심위치가 일치되었는가를 육안으로 검사하여 확인하고, 맞지 않았으면 상기 로봇아암을 교정하여 식각 공정을 수향하였던 것이다.In addition, in order to check whether the wafer is correctly seated on the positive electrode plate, visual inspection of the coincidence of the center position of the wafer and the robot arm is checked, and if it is not corrected, the robot arm is corrected and the etching process is directed.

그러나, 작업자들간의 시각차이에 의하여 로봇아암의 교정이 정확히 맞지 않는 경우가 발생되므로써 식각공정의 완료후 웨이퍼의 반송에 따른 파손이 다발하는 문제점이 내포되어 있었다.However, there is a problem in that the calibration of the robot arm is not exactly correct due to the visual difference between the workers, so that the damage caused by the conveyance of the wafer after the completion of the etching process occurs frequently.

따라서, 본 고안은 상기의 제반문제점을 해결하기 위하여 안출된 것으로써, 간단한 구성으로 웨이퍼 이송에 따른 로봇아암의 틀어진 정도와 정확한 교정점을 확인하여 신뢰성있게 교정할 수 있는 로봇아암 교정장치를 제공함에 그 목정이 있다.Accordingly, the present invention has been made to solve the above problems, to provide a robot arm calibration device that can be reliably corrected by checking the twisted degree and the correct calibration point of the robot arm according to the wafer transfer in a simple configuration. There is a pastor.

상기 목적을 달성하기 위하여 본 고안은, 소정의 챔버내에 형성된 양극판상에 웨이퍼를 정확히 안착되도록 로딩 및 언로딩하는 로봇아암에 있어서, 상기 로봇아암에 끼워져 장착되며, 그 중앙부에 중심위치를 제공하도록 소정크기의 중심홀이 형성된 측정글라스; 상기 측정글라스의 하단부에 위치되되, 그 중심부가 표시될 수 있도록 X자가 형성된 교정글라스; 및 상기 측정글라스의 X자 중심부와 일치되었는가를 검사하여 교정포인트와 로봇아암의 위치가 정확히 일치될 수 있도록 조정하는 중심조정수단을 제공한다.In order to achieve the above object, the present invention provides a robot arm for loading and unloading a wafer to be seated accurately on a bipolar plate formed in a predetermined chamber, the robot arm being fitted to the robot arm and provided with a central position at the center thereof. A measuring glass in which a center hole of a size is formed; A calibration glass which is located at the lower end of the measurement glass and has an X-shape so that its center portion can be displayed; And a center adjusting means for inspecting whether the center of the measuring glass coincides with the X-shaped center and adjusting the position of the calibration point and the robot arm to be exactly matched.

이하, 첨부된 제 1도 및 제 2 도의 도면을 참조하여 본 고안의 실시예를 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings of FIGS. 1 and 2.

제 1 도는 본 고안에 의한 로봇아암 교정장치의 일실시예 구성을 나타낸 분해사시도이고, 제 2 도의 (a), (b), (c)는 본 고안에 의한 로봇아암 교정장치의 사용상태도로서, (a)는 카세트에 적용시켜 중심을 맞추는 상태도이고, (b)는 플랫 얼라이너에 중심을 맞추는 상태도, (c)는 챔버의 양극판에 중심을 맞추는 상태도를 각각 나타낸다.1 is an exploded perspective view showing an embodiment configuration of a robot arm calibration apparatus according to the present invention, Figure 2 (a), (b), (c) is a use state diagram of the robot arm calibration apparatus according to the present invention, (a) is a state diagram centering on the cassette, (b) is a state diagram centering on the flat aligner, and (c) shows a state diagram centering on the positive plate of the chamber.

도면에서 1은 로봇아암, 2는 측정글라스, 2a는 중심원, 3은 교정글라스, 4는 광학 망원경, 4a는 중심점, 5는 척, 5a는 진공홀, 6은 양극판, 7은 리프트홀, 8은 챔버, 9는 카세트, 10은 로드락, 11은 고정편을 각각 나타낸 것이다.In the drawing, 1 is the robot arm, 2 is the measuring glass, 2a is the center circle, 3 is the calibration glass, 4 is the optical telescope, 4a is the center point, 5 is the chuck, 5a is the vacuum hole, 6 is the bipolar plate, 7 is the lift hole, 8 9 denotes a chamber, 9 a cassette, 10 a load lock, and 11 a fixing piece.

본 고안에 의한 로봇아암 교정장치는 챔버(8)내의 양극판(6)상에 웨이퍼의 중심 위치가 정확히 일치되도록 하기 위하여 로봇아암(1)의 중심위치를 상기 웨이퍼의 중심위치에 맞도록 교정하기 위한 것으로, 도면에 도시한 바와 같이, 상기 챔버(8)에 웨이퍼를 로딩 및 언로딩하기 위하여 구동하는 로드락(10)의 일측에 장착된 상기 로봇아암(1)에는 그의 이동완료된 상태를 점검할 수 있도록 웨이퍼와 똑같은 크기의 아크릴로 형성된 측정글라스(2)가 장착되는데, 상기 측정글라스(2)의 중심부에는 소정크기의 중심홀(2Robot arm calibration apparatus according to the present invention for correcting the center position of the robot arm (1) to match the center position of the wafer in order to ensure that the center position of the wafer on the positive electrode plate 6 in the chamber (8) exactly As shown in the figure, the robot arm 1 mounted on one side of the load lock 10 for driving the loading and unloading of the wafer into the chamber 8 can be inspected for its movement. The measuring glass 2 is formed of acryl having the same size as the wafer so that the center of the measuring glass 2 has a predetermined size of the central hole 2.

a)이 형성되어 상기 로봇아암(1)의 초기 기준점을 형성한다.a) is formed to form an initial reference point of the robot arm (1).

그리고, 상기 측정글라스(2)의 하단부에는 교정글라스(3)가 장착되어 웨이퍼를 고정시키는 척(5) 또는 양극판(6)상에 놓여지도록 하므로서 그들의 중심과 일치되도록 하는데, 상기 교정글라스(3)의 중앙부에는 중심위치를 알 수 있도록 X자가 형성되며, 상기 X자의 각 끝단은 상기 양극판(6)에 형성된 리프트홀(7)과 일치되도록 하여 리프트(도면에 도시하지 않음)를 상승, 하강시키도록 한다.And, the lower end of the measuring glass (2) is mounted on the chuck (5) or bipolar plate (6) for fixing the wafer is mounted on the lower end of the calibration glass (3) to match their center, the calibration glass (3) An X-shape is formed at the central portion of the center so as to know the center position, and each end of the X-shape is made to coincide with the lift hole 7 formed in the bipolar plate 6 to raise and lower the lift (not shown). do.

또한, 상기 척(5)에 위치시킬 때에는 그의 중앙에 형성된 진공홀(5a)에 끼워질 수 있도록 상기 교정글라스(3)의 하단 중앙부에 고정편(11)을 구비시켜 중앙을 맞출 수 있도록 한다.In addition, when positioned in the chuck 5, the fixing piece 11 is provided at the lower end central portion of the calibration glass 3 so as to fit in the vacuum hole (5a) formed in the center thereof so as to be centered.

상기 측정글라스(2)의 중심홀(2a)에는 그의 크기에 알맞도록 광학망원경(4)이 장착되되, 그의 하단 화면의 중심부에는 상기 교정글라스(3)의 X선 중심점과 일치되는가를 확인할 수 있도록 검사의 기준이 되는 중심점(4a)이 형성되어 있다.An optical telescope 4 is mounted in the center hole 2a of the measuring glass 2 to suit its size, so that the center of the lower screen of the measuring glass 2 matches with the X-ray center point of the calibration glass 3. The center point 4a which becomes a reference | standard of an inspection is formed.

여기서, 상기 광학망원경(4)은 외부에 제어장치에 의해 이동되어 웨이퍼의 교정포인트와 로봇아암(1)의 위치가 정확히 일치될 수 있도록 조정된다.Here, the optical telescope 4 is moved by an external control device so that the calibration point of the wafer and the position of the robot arm 1 can be exactly matched.

따라서, 웨이퍼를 식각시키는 공정을 수행하는 챔버(8)내의 양극판(6)이나, 웨이퍼의 플랫존을 일정한 방향으로 맞추는 작업을 수향하는 척(5)에 선택적으로 장착시켜 상기 챔버(8)내로 로딩되기 전에 웨이퍼의 중심위치와 로딩 및 언로딩되는 로봇아암(1)의 중심을 일치시켜 그의 초기동작에 다른 에러를 방지할 수 있는 것이다.Therefore, the anode plate 6 in the chamber 8 performing the process of etching the wafer or the chuck 5 for selectively adjusting the flat zone of the wafer in a predetermined direction may be selectively mounted and loaded into the chamber 8. By matching the center position of the wafer with the center of the robot arm 1 that is loaded and unloaded before it is possible to prevent other errors in its initial operation.

상기와 같이 구성되는 본 고안은 로봇아암의 초기위치와 웨이퍼 중심을 선택적으로 일치시킨후 챔버내의 양극판상에 웨이퍼가 정확히 안착되도록 함으로써 식각공정후의 반송시 파손없이 안전하게 이송될 수 있도록 하는 효과가 있다.The present invention configured as described above has an effect of selectively matching the initial position of the robot arm with the center of the wafer so that the wafer is accurately seated on the anode plate in the chamber so that the wafer can be safely transported without damage during transportation after the etching process.

Claims (1)

챔버(8)내에 형성된 양극판(7)상에 웨이퍼를 정확히 안착되도록 로딩 및 언로딩하는 로봇아암(1) 교정장치에 있어서,In the robotic arm (1) calibration apparatus for loading and unloading a wafer so as to accurately seat a wafer on a bipolar plate (7) formed in the chamber (8), 상기 로봇아암(1)에 끼워져 장착되며, 그 중앙부에 중심위치를 제공하도록 소정 크기의 중심홀(2a)이 형성된 측정글라스(2);A measuring glass 2 fitted to the robot arm 1 and having a central hole 2a of a predetermined size to provide a central position at a central portion thereof; 상기 측정글라스(2)의 하단부에 위치되되, 그 중심부가 표시될 수 있도록 X자가 형성된 교정글라스(3); 및A calibration glass 3 positioned at a lower end of the measurement glass 2 and having an X-shape so that its center portion can be displayed; And 상기 측정글라스(2)의 중심홀(2a)에 끼워지며, 그 하단 화면 중심부에 중심점(4a)이 형성되어 상기 교정글라스(3)의 X자 중심부와 일치되었는가를 검사하여 교정포인트와 로봇아암(1)의 위치가 정확히 일치될 수 있도록 조정하는 중심조정수단(4)을 포함하는 것을 특징으로 하는 로봇아암 교정장치.It is inserted into the center hole (2a) of the measurement glass 2, the center point (4a) is formed in the center of the lower screen and check whether the center of the calibration glass 3 and the X-shape of the calibration glass 3 by checking the calibration point and the robot arm ( Robot arm calibration device, characterized in that it comprises a center adjusting means (4) for adjusting the position of 1) to be exactly matched.
KR2019940020048U 1994-08-09 1994-08-09 A device for correcting an robot arm KR0117491Y1 (en)

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KR2019940020048U KR0117491Y1 (en) 1994-08-09 1994-08-09 A device for correcting an robot arm

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KR0117491Y1 true KR0117491Y1 (en) 1998-06-01

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