KR0116405Y1 - Solder oxidation of prevention for reflow machine - Google Patents
Solder oxidation of prevention for reflow machine Download PDFInfo
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- KR0116405Y1 KR0116405Y1 KR2019940016221U KR19940016221U KR0116405Y1 KR 0116405 Y1 KR0116405 Y1 KR 0116405Y1 KR 2019940016221 U KR2019940016221 U KR 2019940016221U KR 19940016221 U KR19940016221 U KR 19940016221U KR 0116405 Y1 KR0116405 Y1 KR 0116405Y1
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- hot air
- nitrogen gas
- leaf
- air circulation
- fan
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
본 고안은 전자회로기판상의 칩부품을 크림납이 녹아서 납땜할 때에 발생하는 납산화를 사전에 방지하여 납산화방지와 질소가스를 대폭적으로 절감할 수 있는 리프로장치에 관한 것으로, 고정받침(3)으로 고정되는 후레임(2)내에 크림솔더가 도포된 위치에 부품이 실장된 전자회로기판이 이송콘베어(4)상으로 이동되고, 리프로오픈의 케이스뚜껑(1)이 덮어져 있는 리프로장치내에 있어서, 가능한 밀폐상태로 유지되면서 상기 이송콘베어(4)가 지나가는 윗부분에 각 열풍순환용 모터(8)로 회전시키는 팬(5)이 설치되면서 그 밑부분에 배열된 적외선히터(10, 10', 10)는 열을 각각의 순환통로(6)를 통하여 리프로의 예열위치에 각각의 열풍순환로(9)가 형성설치되고, 리프로의 예열실을 전자회로기판이 통과하는 리프로납땜실인 적외선히터(10')는 열을 모터(8)의 팬(5)으로 순환통로(6)의 열풍순환로(9)가 형성설치되면서 질소가스(7)가 투입되어 리프로납땜을 하게 질소가스 공급구(11,11')가 설치되며, 상기 적외선히터(10')의 우측에는 열풍순환용 모터(8)의 팬(5)으로 냉각순환로(20)가 형성설치된 것을 특징으로 하는 납산화방지용 리프로장치.The present invention relates to a reflow apparatus that can prevent lead oxidation and significantly reduce nitrogen gas by preventing lead oxidation generated when soldering a chip component on an electronic circuit board by melting and soldering cream lead. A reflow apparatus in which an electronic circuit board on which a component is mounted at a position where a cream solder is applied in a frame (2) fixed by a frame is moved onto a transfer conveyor (4), and a case lid (1) of a reopen opening is covered. In the inside, the infrared heater (10, 10 'arranged at the bottom while the fan (5) for rotating with each hot air circulation motor (8) is installed in the upper portion of the conveying conveyor (4) while maintaining as possible closed state , 10) is formed by the respective hot air circulation path (9) is formed in the preheating position of the leaf passage through each circulation passage (6), infrared ray which is a leaf furnace solder thread passing the preheating chamber of the leaf passage through the electronic circuit board Heater 10 'heats the motor 8 Nitrogen gas supply ports (11, 11 ') are installed to make the reflow solder by introducing nitrogen gas (7) while the hot air circulation path (9) of the circulation passage (6) is formed as a fan (5), the infrared heater On the right side of the 10 (10 '), the lead oxidation prevention reef furnace apparatus, characterized in that the cooling circulation path 20 is formed as a fan 5 of the hot air circulation motor (8).
Description
본 고안은 상기와 같은 종래의 리프로장치가 가지고 있는 단점을 해소하기 위해 안출한 것으로, 종래의 리프로장치가 가지고 있는 납산화문제와 질소가스 주입량에 따른 경제적인 문제점을 동시에 해소할 수 있도록 적외선히터가 각기 설치되는 공간중 최초로 크림솔더가 녹아 납땜이 되는 위치(제 2 도(B))에서만 질소가스를 분포케하여 납산화를 방지해줌으로써 상기 질소가스를 대폭적으로 절감 할 수 있는 납산화방지용 리프로장치를 제공함에 그 목적이 있다.The present invention has been devised to solve the drawbacks of the conventional reflow apparatus as described above. Infrared rays can be solved at the same time to solve both the lead oxidation problem and the economic problems caused by the nitrogen gas injection amount of the conventional reflow apparatus. For lead oxidation prevention, which can significantly reduce the nitrogen gas by distributing nitrogen gas only in the position where the cream solder is melted and soldered for the first time in the space where the heaters are respectively installed (Figure 2 (B)). The purpose is to provide a reflow apparatus.
제1도는 본 고안의 실시예에 관한 납산화방지용 리프로장치의 내부구성을 도시해 놓은 전체단면도,1 is an overall cross-sectional view showing the internal configuration of the lead-acid prevention reefing apparatus according to an embodiment of the present invention,
제2도는 본 고안의 납산화방지용 리프로장치를 설명하기 위한 온도특성 프로파일을 나타낸 그래프이다.Figure 2 is a graph showing the temperature characteristic profile for explaining the lead-acid reef prevention apparatus of the present invention.
* 도면의 주요 부분에 대한 부호의 설명* Explanation of symbols for the main parts of the drawings
1 : 케이스뚜껑 2 : 후레임1: Case lid 2: Frame
3 : 고정받침 4 : 이송콘베어3: fixed base 4: conveying conveyor
5 : 팬 6, 6' : 순환통로5: fan 6, 6 ': circulation passage
7 : 질소가스 8 : 모터7: nitrogen gas 8: motor
10, 10', 10, 10' : 적외선 히터 11, 11' : 질소가스 공급구10, 10 ', 10, 10': infrared heater 11, 11 ': nitrogen gas supply port
본 고안은 납산화방지용 리프로(Reflow)장치에 관한 것으로, 더욱 상세하게는 전자회로기판상의 칩부품을 크림납이 녹아서 납땜할 때에 발생하는 납산화를 사전에 방지하여 납산화방지와 질소가스를 대폭적으로 절감할 수 있는 리프로장치에 관한 것이다.The present invention relates to a reflow apparatus for preventing lead oxidation, and more particularly, to prevent lead oxidation and nitrogen gas by preventing lead oxidation generated when soldering a chip component on an electronic circuit board by melting and soldering a lead. The present invention relates to a reflow apparatus that can be greatly reduced.
과학기술이 급진적으로 발전되에 따라 전자 및 반도체산업의 발달에 따른 부품납땜의 작업을 수작업으로부터 기계화 및 자동화로 전환되면서 납땜 생산품질이 그 어느 때보다 요구되어, 납땜 전용리프로장치가 생산라인에 크게 보급 설치되어 사용하고 있다.With the rapid development of science and technology, the process of soldering parts from the development of electronics and semiconductor industry is shifted from manual to mechanized and automated, and the quality of solder production is more demanded than ever. It is largely installed and used.
상기 리프로장치는 크림납을 이용한 자동 납땜기계로서 히터의 열을 이용하여 크림솔더를 녹여서 해당 부품을 납땜함으로써 설계된 전자회로를 연결시켜 각종 전기 및 전자제품의 회로기판에 널리 활용하고 있으며, 전기, 전자 제품이 고기능화, 소형화되면서 보급대수가 점차적으로 확산되고 있다.The reflow apparatus is an automatic soldering machine using cream lead, which is connected to an electronic circuit designed by melting a cream solder using a heater heat and soldering a corresponding component, and is widely used in circuit boards of various electrical and electronic products. As electronic products become highly functional and miniaturized, the number of them is gradually spreading.
상기 리프로장치의 리프로납땜과정은, 전자회로기판상에 크림솔더를 인쇄한 다음 칩자동실장기계(SMT)를 이용하여 칩부품을 크림솔더위에 실장케하여 체인콘베어를 이용하고, 상기 리프로장치내의 히터열속을 통과하므로써 크림솔더가 녹아서 납땜이 되고 있다. 그리고, 종래의 리프로장치는 납땜시 발생되는 각종 문제점들을 고려하지 못하고 납땜을 기계적으로 자동화시키는 데에 국한되어 왔었다.In the reflow soldering process of the reflow apparatus, a cream solder is printed on an electronic circuit board, and then chip components are mounted on the cream solder using a chip automatic mounting machine (SMT) to use a chain conveyor. The cream solder is melted and soldered by passing through the heater heat flux in the device. In addition, the conventional reflow apparatus has been limited to mechanically automating soldering without considering various problems generated during soldering.
이때, 사용되는 크림솔더는 다른 금속에 비해 열에 의한 산화가 빠르게 이어지지만, 특히 크림솔더가 녹을 때 급속히 산화된다는 단점을 가지고 있어 산화된 납찌꺼기 등의 불순물로 인해 전자회로기판에 납땜크랙, 납볼등 납때상태를 나쁘게 한다. 또한, 납산화로 인한 납량을 적게하므로 각종 전자회로의 불량을 유발시키게 된다는 원인이 되어 품질을 저하시키고 있다.In this case, the cream solder used is more rapidly oxidized by heat than other metals, but it has a disadvantage that it is rapidly oxidized when the cream solder is melted. Therefore, solder cracks and lead balls on the electronic circuit board are caused by impurities such as oxidized lead dregs. Bad condition when lead. In addition, since the amount of lead due to lead oxidation is reduced, it causes the failure of various electronic circuits, thereby degrading the quality.
그러나, 상기와 같은 문제점들을 방지하기 위해 리프로장치의 내부전체에다 질소가스를 분포되게하여 질소가스가 분포된 상황하에서 납땜이 되도록 사용하므로 납산화는 방지하였으나, 리프로장치의 전체 질소가스주입에 따른 질소가스의 과다소모에 따른 생산비용의 증가로 인해 경제성이 없게 되었다.However, in order to prevent the above problems, the lead gas is prevented because the nitrogen gas is distributed throughout the inside of the reflow apparatus so that it can be soldered under the situation where the nitrogen gas is distributed. Due to the excessive consumption of nitrogen gas, the increase in the production cost caused the economy to be ineffective.
상기 목적을 달성하기 위한 본 고안의 납산화방지용 리프로장치는, 고정받침(3)으로 고정되는 후레임(2)내에 도포된 위치에 부품이 실장된 전자회로기판이 이송콘베어(4)상으로 이동되고, 리프로오픈의 케이스뚜껑(1)이 덮어져있는 리프로장치내에 있어서, 가능한 밀폐상태로 유지되면서 상기 이송콘베어(4)가 지나가는 윗부분에 각 열풍순환용 모터(8)로 회전시키는 팬(5)이 설치되면서 그 밑부분에 배열된 적외선히터(10, 10', 10)는 열을 각각의 순환통로(6)를 통하여 리프로의 예열위치에 각각의 열풍순환로(9)가 형성설치되고, 리프로의 예열실을 전자회로기판이 통과하는 리프로납땜실인 적외선히터(10')는 열을 모터(8)의 팬(5)으로 순환통로(6)의 열풍순환로(9)가 형성설치되면서 질소가스(7)가 투입되어 리프로납땜을 하게 질소가스 공급구(11, 11')가 설치되며, 상기 적외선히터(10')이 우측에는 열풍순환용 모터(8)의 팬(5)으로 냉각순환로(20)가 형성설치된 것으로써 기존의 질소가스의 과다소모를 크게 줄일 수 있어 산업체의 전자제품생산에 따른 경제적인 원가절감에 큰 효과가 있다.In order to achieve the above object, the lead-acid prevention reefing apparatus of the present invention includes an electronic circuit board mounted on a conveying conveyor (4) in which a component is mounted at a position applied in a frame (2) fixed by a fixed support (3). In the reflow apparatus in which the case lid 1 of the reopen opening is covered, the fan which rotates with each hot wind circulation motor 8 in the upper portion through which the conveying conveyor 4 passes while being kept as closed as possible ( 5) is installed, the infrared heaters 10, 10 ', 10 arranged at the bottom of each of the hot air circulation path (9) is formed in the preheating position of the reflow path through each circulation passage (6) Infrared heater 10 ', which is a reflow soldering chamber, through which an electronic circuit board passes through a preheating chamber of a leaf, heats a circulation path 9 of a circulation passage 6 to a fan 5 of a motor 8. Nitrogen gas (7) is introduced and nitrogen gas supply ports (11, 11 ') are installed to solder the leaf. In addition, the infrared heater 10 ′ is installed on the right side of the fan 5 of the hot air circulation motor 8, and the cooling circulation path 20 is formed so that excessive consumption of the existing nitrogen gas can be greatly reduced. It has a great effect on economic cost reduction by electronic product production.
이하, 본 고안의 실시예를 예시도면에 의거하여 상세히 설명한다.Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
제1도는 본 고안의 실시예에 관한 납산화방지용 리프로장치의 내부구성을 도시해 놓은 전체단면도로서, 본 고안의 납산화방지용 리프로장치는 납이 녹아있는 동안에 산화가 급격하게 이루어진 것을 방지하기 위해 납이 녹아 있는 질소가스 공급구(11, 11')에 납이 녹어 았는 제 2 도의 B부분에만 질소가스(7)를 투입시켜 질소소모를 대폭적으로 절감시킬 뿐만 아니라 납산화를 방지하여 줌으로써 전자, 전기제품의 생산품질을 향상시킬 수 있다.1 is an overall cross-sectional view showing the internal structure of the lead-acid anti-leaf rero apparatus according to the embodiment of the present invention, the lead-acid anti-oxidation reef device of the present invention to prevent the oxidation is suddenly made while lead is melted The nitrogen gas (7) is only injected into the part B of FIG. 2 where lead is melted in the nitrogen gas supply ports 11 and 11 'where lead is melted, thereby significantly reducing nitrogen consumption and preventing lead oxidation. It can improve the production quality of electrical appliances.
본 고안의 리프로 장치의 전체구성을 간략히 보면, 좌우측의 고정받침(3)으로 고정되는 후레임(2)내에 전자회로기판의 부품을 리프로납땜할 수 있도록 이송콘베어(4)상으로 이동되고, 그 위를 리프로오픈의 케이스뚜껑(1)이 덮어져 있다. 한 방향으로 일정한 속도로 회전되는 이송콘베어(4)의 밑부분에는 각각의 순환통로(6')가 설치되고, 마지막 순환통로(6')에는 질소가스 공급구(11')가 있어 질소가스(7)가 공급된다.In brief, the overall configuration of the apparatus with the leaf of the present invention is moved onto the conveying conveyor (4) so that the components of the electronic circuit board can be soldered to the leaf in the frame (2) fixed by the left and right fixed base (3), The lid of the case 1 of the reopen opening is covered on it. Each circulation passage 6 'is provided at the bottom of the conveying conveyor 4 which rotates at a constant speed in one direction, and the nitrogen gas supply port 11' is provided at the last circulation passage 6 '. 7) is supplied.
이때, 리프로 위치내(콘베어입구에서 출구까지)는 밀폐상태를 만들 수 있도록 하면 납산화를 대폭적으로 줄일 수 있는 특성을 가진다.At this time, in the reflow position (from the conveyor inlet to the outlet), it is possible to make a sealed state has a characteristic that can significantly reduce lead oxidation.
상기 순환통로(6')와 대응되는 상기 이송콘베어(4)의 윗부분에는 각각의 열풍순환용 모터(8)로 팬(5)을 회전시켜 적외선히터(10, 10', 10)의 열을 각각의 순환통로(6)를 통해 각각의 열풍순환로(9)를 형성시키므로 예열하는 위치가 제2도에 도시된 예열부분(A)이고, 적외선히터(10')의 열을 열풍순환용 모터(8)의 팬(5)으로 순환통로(6)의 열풍순환로(9)를 형성시켜주면서 질소가스 공급구(11, 11')로 통한 질소가스(7)의 분위기를 형성시키고 최초로 크림솔더가 녹아 납땜이 되는 위치가 제 2 도에 도시된 질소가스 부분(B)이며, 열풍순환용 모터(8)의 팬(5)으로 냉각순환로(20)를 형성시켜 납땜된 제품이 냉각부분을 통과하면서 강랭되어 리프로납땜이 완성된다.In the upper portion of the conveying conveyor 4 corresponding to the circulation passage 6 ', the fan 5 is rotated by the respective hot wind circulation motors 8 to heat the infrared heaters 10, 10' and 10, respectively. Since each hot air circulation path 9 is formed through the circulation passage 6 of the preheating part, the preheating position is the preheating part A shown in FIG. 2, and the heat of the infrared heater 10 'is transferred to the hot air circulation motor 8. The atmosphere of nitrogen gas (7) through the nitrogen gas supply ports (11, 11 ') while forming the hot air circulation path (9) of the circulation passage (6) with the fan (5) of the This position is the nitrogen gas part B shown in FIG. 2, and the cooling circuit 20 is formed by the fan 5 of the hot air circulation motor 8, and the soldered product is cooled by passing through the cooling part. Reflow soldering is completed.
따라서, 본 고안의 리프로장치는 리프로 위치내(콘베어입구에서 출구까지)는 가능한 밀폐상태를 만들 수 있도록 하고, 납땜이 되는 제 2 도에 도시된 질소가스부분(B)에서 이송콘베어(4)의 상하부분에 질소가스 공급구(11, 11')를 통한 질소가스(7)를 투입하므로 납땜시 발생하는 납산화를 사전에 방지케하여 납산화방지와 질소가스(7)를 대폭적으로 절감할 수 있다.Therefore, the reflow apparatus of the present invention makes it possible to create a sealed state within the reflow position (from the conveyor inlet to the outlet), and the transfer conveyor 4 in the nitrogen gas part B shown in FIG. Nitrogen gas (7) through the nitrogen gas supply ports (11, 11 ') in the upper and lower portions of the) to prevent lead oxidation generated during soldering to prevent lead oxidation and significantly reduce the nitrogen gas (7) can do.
제2도는 본 고안의 납산화방지용 리프로장치를 설명하기 위한 온도특성프로파일을 나타낸 그래프로서, 도면에 도시된 온도특성곡선(12)과 같이 A 지점은 에열되는 특성곡선이고, B 지점은 크림솔더가 녹을 수 있는 지점으로 이 지점에 질소가스가 분포되고 있으며, 급격한 온도곡선을 나타내고 있는 C 지점은 크림솔더가 실질적으로 녹아 납땜이 되는 구간이다. 이는 납땜시에 납산화가 일어나는 지점이며 질소가스가 필요한 위치이다.Figure 2 is a graph showing the temperature characteristic profile for explaining the lead-acid prevention repro apparatus of the present invention, as shown in the temperature characteristic curve 12 shown in the drawing point A is a characteristic curve, B point is a cream solder Is the melting point of nitrogen gas at this point, and point C, which shows a sharp temperature curve, is the section where the cream solder is actually melted and soldered. This is where lead oxidation occurs during soldering and where nitrogen gas is needed.
본 고안의 리프로장치는 종래의 리프로장치와 같이 납산화방지용 가스를 리프로장치 전체에 투입하지 않고 크림솔더가 최초로 녹을 수 있는 위치(제 2 도의 B)를 통과하는 동안 산화가 급격히 이루어진 것을 방지하기 위하여 납이 녹아 있는 B 부분에만 질소분위기를 분포케하여 질소소모를 대폭적으로 절감할 수 있다.The reflow apparatus of the present invention, like the conventional reflow apparatus, does not inject lead-acid gas into the reflow apparatus, and the oxidation is rapidly performed while passing through the position where the cream solder can be first melted (B in FIG. 2). In order to prevent this, the nitrogen atmosphere can be distributed only in the B part where lead is melted, and the nitrogen consumption can be greatly reduced.
이상 설명한 바와 같이 본 고안에 의하면, 종래의 리프로장치가 가지고 있는 납산화문제와 질소가스 주입량에 따른 경제적인 문제점을 동시에 해소할 수 있도록 적외선히터가 각기 설치되는 공간에 최초로 크림솔더가 녹아 납땜이 되는 위치(제 2 도(B))에서만 질소가스를 분포케하여 납산화를 방지해줌으로써 리프로 납땜시 질소가스를 대폭적으로 절감할 수 있는 납산화방지용 리프로장치를 제공할 수 있다.As described above, according to the present invention, in order to solve both the lead oxidation problem and the economic problems caused by the nitrogen gas injection amount of the conventional reflow apparatus, the cream solder is melted for the first time in the space where the infrared heater is installed. By distributing nitrogen gas only in the position (FIG. 2B) to prevent lead oxidation, it is possible to provide a lead-acid reef prevention apparatus that can significantly reduce nitrogen gas when soldering to a leaf.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940016221U KR0116405Y1 (en) | 1994-07-01 | 1994-07-01 | Solder oxidation of prevention for reflow machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019940016221U KR0116405Y1 (en) | 1994-07-01 | 1994-07-01 | Solder oxidation of prevention for reflow machine |
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| Publication Number | Publication Date |
|---|---|
| KR960006679U KR960006679U (en) | 1996-02-17 |
| KR0116405Y1 true KR0116405Y1 (en) | 1998-04-21 |
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| KR2019940016221U KR0116405Y1 (en) | 1994-07-01 | 1994-07-01 | Solder oxidation of prevention for reflow machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030046797A (en) * | 2001-12-06 | 2003-06-18 | 권희경 | a device for printing and drying of a PCB and method thereof |
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1994
- 1994-07-01 KR KR2019940016221U patent/KR0116405Y1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030046797A (en) * | 2001-12-06 | 2003-06-18 | 권희경 | a device for printing and drying of a PCB and method thereof |
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| Publication number | Publication date |
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| KR960006679U (en) | 1996-02-17 |
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