JPWO2025134785A1 - - Google Patents

Info

Publication number
JPWO2025134785A1
JPWO2025134785A1 JP2025524347A JP2025524347A JPWO2025134785A1 JP WO2025134785 A1 JPWO2025134785 A1 JP WO2025134785A1 JP 2025524347 A JP2025524347 A JP 2025524347A JP 2025524347 A JP2025524347 A JP 2025524347A JP WO2025134785 A1 JPWO2025134785 A1 JP WO2025134785A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025524347A
Other languages
Japanese (ja)
Other versions
JPWO2025134785A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025134785A1 publication Critical patent/JPWO2025134785A1/ja
Publication of JPWO2025134785A5 publication Critical patent/JPWO2025134785A5/ja
Priority to JP2025272598A priority Critical patent/JP2026053520A/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/32Insulating of coils, windings, or parts thereof
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02KDYNAMO-ELECTRIC MACHINES
    • H02K3/00Details of windings
    • H02K3/32Windings characterised by the shape, form or construction of the insulation
    • H02K3/34Windings characterised by the shape, form or construction of the insulation between conductors or between conductor and core, e.g. slot insulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2025524347A 2023-12-19 2024-12-05 Pending JPWO2025134785A1 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025272598A JP2026053520A (ja) 2023-12-19 2025-12-22 熱硬化性樹脂組成物およびステータ

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023213558 2023-12-19
PCT/JP2024/043041 WO2025134785A1 (ja) 2023-12-19 2024-12-05 熱硬化性樹脂組成物およびステータ

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025272598A Division JP2026053520A (ja) 2023-12-19 2025-12-22 熱硬化性樹脂組成物およびステータ

Publications (2)

Publication Number Publication Date
JPWO2025134785A1 true JPWO2025134785A1 (https=) 2025-06-26
JPWO2025134785A5 JPWO2025134785A5 (https=) 2025-11-19

Family

ID=96138268

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2025524347A Pending JPWO2025134785A1 (https=) 2023-12-19 2024-12-05
JP2025272598A Pending JP2026053520A (ja) 2023-12-19 2025-12-22 熱硬化性樹脂組成物およびステータ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025272598A Pending JP2026053520A (ja) 2023-12-19 2025-12-22 熱硬化性樹脂組成物およびステータ

Country Status (2)

Country Link
JP (2) JPWO2025134785A1 (https=)
WO (1) WO2025134785A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017199639A1 (ja) * 2016-05-18 2017-11-23 住友ベークライト株式会社 Lds用熱硬化性樹脂組成物、樹脂成形品および三次元成形回路部品
JP2020183505A (ja) * 2019-05-07 2020-11-12 長春人造樹脂廠股▲分▼有限公司 樹脂組成物及びその使用
WO2021200490A1 (ja) * 2020-03-31 2021-10-07 デンカ株式会社 アルミナ粉末、樹脂組成物、及び放熱部品
WO2022255226A1 (ja) * 2021-06-04 2022-12-08 住友化学株式会社 アルミナ粒子およびそれを用いた樹脂組成物
WO2023085357A1 (ja) * 2021-11-11 2023-05-19 住友ベークライト株式会社 熱硬化性樹脂組成物およびステータ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017199639A1 (ja) * 2016-05-18 2017-11-23 住友ベークライト株式会社 Lds用熱硬化性樹脂組成物、樹脂成形品および三次元成形回路部品
JP2020183505A (ja) * 2019-05-07 2020-11-12 長春人造樹脂廠股▲分▼有限公司 樹脂組成物及びその使用
WO2021200490A1 (ja) * 2020-03-31 2021-10-07 デンカ株式会社 アルミナ粉末、樹脂組成物、及び放熱部品
WO2022255226A1 (ja) * 2021-06-04 2022-12-08 住友化学株式会社 アルミナ粒子およびそれを用いた樹脂組成物
WO2023085357A1 (ja) * 2021-11-11 2023-05-19 住友ベークライト株式会社 熱硬化性樹脂組成物およびステータ

Also Published As

Publication number Publication date
WO2025134785A1 (ja) 2025-06-26
JP2026053520A (ja) 2026-03-25

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