JPWO2025062526A1 - - Google Patents
Info
- Publication number
- JPWO2025062526A1 JPWO2025062526A1 JP2025547041A JP2025547041A JPWO2025062526A1 JP WO2025062526 A1 JPWO2025062526 A1 JP WO2025062526A1 JP 2025547041 A JP2025547041 A JP 2025547041A JP 2025547041 A JP2025547041 A JP 2025547041A JP WO2025062526 A1 JPWO2025062526 A1 JP WO2025062526A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/40—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
- H10D30/47—FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having two-dimensional [2D] charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
- H10D30/471—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
- H10D30/475—High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having wider bandgap layer formed on top of lower bandgap active layer, e.g. undoped barrier HEMTs such as i-AlGaN/GaN HEMTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/015—Manufacture or treatment of FETs having heterojunction interface channels or heterojunction gate electrodes, e.g. HEMT
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
- H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
- H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/60—Impurity distributions or concentrations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/82—Heterojunctions
- H10D62/824—Heterojunctions comprising only Group III-V materials heterojunctions, e.g. GaN/AlGaN heterojunctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/111—Field plates
- H10D64/112—Field plates comprising multiple field plate segments
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/034091 WO2025062526A1 (ja) | 2023-09-20 | 2023-09-20 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2025062526A1 true JPWO2025062526A1 (https=) | 2025-03-27 |
Family
ID=95072343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025547041A Pending JPWO2025062526A1 (https=) | 2023-09-20 | 2023-09-20 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250386538A1 (https=) |
| JP (1) | JPWO2025062526A1 (https=) |
| CN (1) | CN120826998A (https=) |
| WO (1) | WO2025062526A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008027027A2 (en) * | 2005-09-07 | 2008-03-06 | Cree, Inc | Transistor with fluorine treatment |
| JP5671100B2 (ja) * | 2008-02-13 | 2015-02-18 | 株式会社東芝 | 半導体装置 |
| JP5790461B2 (ja) * | 2011-12-07 | 2015-10-07 | 富士通株式会社 | 化合物半導体装置及びその製造方法 |
| CN202616234U (zh) * | 2012-06-28 | 2012-12-19 | 电子科技大学 | 栅边缘凹槽型源场板结构高电子迁移率晶体管 |
| JP6230456B2 (ja) * | 2014-03-19 | 2017-11-15 | 株式会社東芝 | 半導体装置 |
| JP7472064B2 (ja) * | 2021-03-10 | 2024-04-22 | 株式会社東芝 | 半導体装置 |
| JP7653816B2 (ja) * | 2021-03-19 | 2025-03-31 | 株式会社東芝 | 半導体装置 |
-
2023
- 2023-09-20 JP JP2025547041A patent/JPWO2025062526A1/ja active Pending
- 2023-09-20 WO PCT/JP2023/034091 patent/WO2025062526A1/ja active Pending
- 2023-09-20 CN CN202380095641.7A patent/CN120826998A/zh active Pending
-
2025
- 2025-08-28 US US19/313,718 patent/US20250386538A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN120826998A (zh) | 2025-10-21 |
| WO2025062526A1 (ja) | 2025-03-27 |
| US20250386538A1 (en) | 2025-12-18 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250513 |