JPWO2025052698A1 - - Google Patents

Info

Publication number
JPWO2025052698A1
JPWO2025052698A1 JP2024572665A JP2024572665A JPWO2025052698A1 JP WO2025052698 A1 JPWO2025052698 A1 JP WO2025052698A1 JP 2024572665 A JP2024572665 A JP 2024572665A JP 2024572665 A JP2024572665 A JP 2024572665A JP WO2025052698 A1 JPWO2025052698 A1 JP WO2025052698A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024572665A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025052698A1 publication Critical patent/JPWO2025052698A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • C04B35/111—Fine ceramics
    • C04B35/117—Composites
    • C04B35/119—Composites with zirconium oxide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Oxide Ceramics (AREA)
JP2024572665A 2022-09-05 2024-03-06 Pending JPWO2025052698A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022033331 2022-09-05
PCT/JP2023/032291 WO2024053619A1 (ja) 2022-09-05 2023-09-04 セラミック基板、及びこれを備えた半導体装置用基板
PCT/JP2024/008614 WO2025052698A1 (ja) 2022-09-05 2024-03-06 セラミック基板、及びこれを備えた半導体装置用基板

Publications (1)

Publication Number Publication Date
JPWO2025052698A1 true JPWO2025052698A1 (https=) 2025-03-13

Family

ID=90191262

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024572665A Pending JPWO2025052698A1 (https=) 2022-09-05 2024-03-06

Country Status (2)

Country Link
JP (1) JPWO2025052698A1 (https=)
WO (2) WO2024053619A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024053619A1 (ja) * 2022-09-05 2024-03-14 Ｎｇｋエレクトロデバイス株式会社 セラミック基板、及びこれを備えた半導体装置用基板
EP4653406A1 (en) * 2024-05-21 2025-11-26 CeramTec GmbH Ceramic substrate
JP7849573B1 (ja) 2024-08-21 2026-04-21 Ｎｇｋ株式会社 セラミック基板、及びこれを備えた半導体装置用基板

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011241131A (ja) * 2010-05-20 2011-12-01 Sumitomo Metal Electronics Devices Inc セラミック焼結体および光反射体および発光素子収納用パッケージ
WO2013008919A1 (ja) * 2011-07-14 2013-01-17 株式会社東芝 セラミックス回路基板
JP2013230949A (ja) * 2012-04-27 2013-11-14 Kyocera Corp セラミック基板およびこれを用いた発光装置
JP2017224656A (ja) * 2016-06-13 2017-12-21 Ｎｇｋエレクトロデバイス株式会社 金属−セラミックス複合基板および半導体装置
WO2020115868A1 (ja) * 2018-12-06 2020-06-11 日本碍子株式会社 セラミックス焼結体及び半導体装置用基板
JP2022515808A (ja) * 2019-07-23 2022-02-22 南充三環電子有限公司 ジルコニアーアルミナ複合セラミック焼結体、その製造方法及び応用
WO2022118802A1 (ja) * 2020-12-04 2022-06-09 Ｎｇｋエレクトロデバイス株式会社 セラミック焼結体及び半導体装置用基板
WO2024053619A1 (ja) * 2022-09-05 2024-03-14 Ｎｇｋエレクトロデバイス株式会社 セラミック基板、及びこれを備えた半導体装置用基板

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011241131A (ja) * 2010-05-20 2011-12-01 Sumitomo Metal Electronics Devices Inc セラミック焼結体および光反射体および発光素子収納用パッケージ
WO2013008919A1 (ja) * 2011-07-14 2013-01-17 株式会社東芝 セラミックス回路基板
JP2013230949A (ja) * 2012-04-27 2013-11-14 Kyocera Corp セラミック基板およびこれを用いた発光装置
JP2017224656A (ja) * 2016-06-13 2017-12-21 Ｎｇｋエレクトロデバイス株式会社 金属−セラミックス複合基板および半導体装置
WO2020115868A1 (ja) * 2018-12-06 2020-06-11 日本碍子株式会社 セラミックス焼結体及び半導体装置用基板
JP2022515808A (ja) * 2019-07-23 2022-02-22 南充三環電子有限公司 ジルコニアーアルミナ複合セラミック焼結体、その製造方法及び応用
WO2022118802A1 (ja) * 2020-12-04 2022-06-09 Ｎｇｋエレクトロデバイス株式会社 セラミック焼結体及び半導体装置用基板
WO2024053619A1 (ja) * 2022-09-05 2024-03-14 Ｎｇｋエレクトロデバイス株式会社 セラミック基板、及びこれを備えた半導体装置用基板

Also Published As

Publication number Publication date
WO2025052698A1 (ja) 2025-03-13
WO2024053619A1 (ja) 2024-03-14

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