JPWO2025041283A1 - - Google Patents

Info

Publication number
JPWO2025041283A1
JPWO2025041283A1 JP2023576382A JP2023576382A JPWO2025041283A1 JP WO2025041283 A1 JPWO2025041283 A1 JP WO2025041283A1 JP 2023576382 A JP2023576382 A JP 2023576382A JP 2023576382 A JP2023576382 A JP 2023576382A JP WO2025041283 A1 JPWO2025041283 A1 JP WO2025041283A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023576382A
Other versions
JP7458564B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of JP7458564B1 publication Critical patent/JP7458564B1/ja
Publication of JPWO2025041283A1 publication Critical patent/JPWO2025041283A1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/04—Removal of gases or vapours ; Gas or pressure control
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemically Coating (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2023576382A 2023-08-23 2023-08-23 基板処理装置 Active JP7458564B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/030227 WO2025041283A1 (ja) 2023-08-23 2023-08-23 基板処理装置

Publications (2)

Publication Number Publication Date
JP7458564B1 JP7458564B1 (ja) 2024-03-29
JPWO2025041283A1 true JPWO2025041283A1 (ja) 2025-02-27

Family

ID=90417700

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023576382A Active JP7458564B1 (ja) 2023-08-23 2023-08-23 基板処理装置

Country Status (4)

Country Link
JP (1) JP7458564B1 (ja)
KR (1) KR102949275B1 (ja)
CN (1) CN118843721B (ja)
WO (1) WO2025041283A1 (ja)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3830272B2 (ja) * 1998-03-05 2006-10-04 株式会社荏原製作所 基板のめっき装置
JP2001316888A (ja) * 2000-05-02 2001-11-16 Tokyo Electron Ltd 半導体基板のメッキ処理システム
JP3772973B2 (ja) * 2000-12-11 2006-05-10 株式会社荏原製作所 無電解めっき装置
JP4100466B2 (ja) 2000-12-25 2008-06-11 東京エレクトロン株式会社 液処理装置
JP4282574B2 (ja) 2004-09-07 2009-06-24 パナソニック株式会社 ボンディング装置
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
KR102359048B1 (ko) * 2017-09-01 2022-02-08 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 반도체 장치의 제조 방법 및 프로그램
JP7430677B2 (ja) * 2021-09-21 2024-02-13 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法およびプログラム
US20250087513A1 (en) * 2022-12-07 2025-03-13 Ebara Corporation Transfer apparatus and substrate processing apparatus

Also Published As

Publication number Publication date
JP7458564B1 (ja) 2024-03-29
CN118843721A (zh) 2024-10-25
KR20250030432A (ko) 2025-03-05
WO2025041283A1 (ja) 2025-02-27
CN118843721B (zh) 2025-10-31
KR102949275B1 (ko) 2026-04-07

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