JPWO2025033315A1 - - Google Patents
Info
- Publication number
- JPWO2025033315A1 JPWO2025033315A1 JP2025539352A JP2025539352A JPWO2025033315A1 JP WO2025033315 A1 JPWO2025033315 A1 JP WO2025033315A1 JP 2025539352 A JP2025539352 A JP 2025539352A JP 2025539352 A JP2025539352 A JP 2025539352A JP WO2025033315 A1 JPWO2025033315 A1 JP WO2025033315A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023128457 | 2023-08-07 | ||
| PCT/JP2024/027519 WO2025033315A1 (ja) | 2023-08-07 | 2024-08-01 | 接合方法、冷却器の製造方法、半導体装置の製造方法、冷却器および半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025033315A1 true JPWO2025033315A1 (https=) | 2025-02-13 |
| JPWO2025033315A5 JPWO2025033315A5 (https=) | 2026-01-08 |
Family
ID=94533845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025539352A Pending JPWO2025033315A1 (https=) | 2023-08-07 | 2024-08-01 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2025033315A1 (https=) |
| WO (1) | WO2025033315A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002184922A (ja) * | 2000-12-12 | 2002-06-28 | Ntt Advanced Technology Corp | 複合型放熱部材 |
| JP2002346737A (ja) * | 2001-05-22 | 2002-12-04 | Denso Corp | 異種金属のろう付け方法 |
| JP4513236B2 (ja) * | 2001-06-11 | 2010-07-28 | 株式会社デンソー | 異種金属接合品の接合方法 |
| JP6432466B2 (ja) * | 2014-08-26 | 2018-12-05 | 三菱マテリアル株式会社 | 接合体、ヒートシンク付パワーモジュール用基板、ヒートシンク、接合体の製造方法、ヒートシンク付パワーモジュール用基板の製造方法、及び、ヒートシンクの製造方法 |
| WO2016052392A1 (ja) * | 2014-09-30 | 2016-04-07 | 三菱マテリアル株式会社 | Ａｇ下地層付パワーモジュール用基板及びパワーモジュール |
| WO2021060475A1 (ja) * | 2019-09-25 | 2021-04-01 | 京セラ株式会社 | 電子部品搭載用基体および電子装置 |
| JP7796503B2 (ja) * | 2021-10-06 | 2026-01-09 | 三菱電機株式会社 | 半導体装置用基板、半導体装置用基板の製造方法および接合材 |
-
2024
- 2024-08-01 WO PCT/JP2024/027519 patent/WO2025033315A1/ja active Pending
- 2024-08-01 JP JP2025539352A patent/JPWO2025033315A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025033315A1 (ja) | 2025-02-13 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250930 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250930 |