JPWO2025033099A1 - - Google Patents
Info
- Publication number
- JPWO2025033099A1 JPWO2025033099A1 JP2025539229A JP2025539229A JPWO2025033099A1 JP WO2025033099 A1 JPWO2025033099 A1 JP WO2025033099A1 JP 2025539229 A JP2025539229 A JP 2025539229A JP 2025539229 A JP2025539229 A JP 2025539229A JP WO2025033099 A1 JPWO2025033099 A1 JP WO2025033099A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023127473 | 2023-08-04 | ||
| PCT/JP2024/025288 WO2025033099A1 (ja) | 2023-08-04 | 2024-07-12 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2025033099A1 true JPWO2025033099A1 (https=) | 2025-02-13 |
Family
ID=94533992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025539229A Pending JPWO2025033099A1 (https=) | 2023-08-04 | 2024-07-12 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2025033099A1 (https=) |
| WO (1) | WO2025033099A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003273150A (ja) * | 2002-03-15 | 2003-09-26 | Shibaura Mechatronics Corp | ワイヤボンディング方法及び装置 |
| JP4890872B2 (ja) * | 2006-01-30 | 2012-03-07 | ルネサスエレクトロニクス株式会社 | 光半導体封止用透明エポキシ樹脂組成物及びそれを用いた光半導体集積回路装置 |
| JP2010118526A (ja) * | 2008-11-13 | 2010-05-27 | Renesas Technology Corp | 半導体装置の製造方法 |
| JP5467799B2 (ja) * | 2009-05-14 | 2014-04-09 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
-
2024
- 2024-07-12 JP JP2025539229A patent/JPWO2025033099A1/ja active Pending
- 2024-07-12 WO PCT/JP2024/025288 patent/WO2025033099A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025033099A1 (ja) | 2025-02-13 |