JPWO2025023230A1 - - Google Patents
Info
- Publication number
- JPWO2025023230A1 JPWO2025023230A1 JP2025535827A JP2025535827A JPWO2025023230A1 JP WO2025023230 A1 JPWO2025023230 A1 JP WO2025023230A1 JP 2025535827 A JP2025535827 A JP 2025535827A JP 2025535827 A JP2025535827 A JP 2025535827A JP WO2025023230 A1 JPWO2025023230 A1 JP WO2025023230A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023120368 | 2023-07-25 | ||
| PCT/JP2024/026236 WO2025023230A1 (ja) | 2023-07-25 | 2024-07-23 | 放熱構造及び基板ユニット |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025023230A1 true JPWO2025023230A1 (https=) | 2025-01-30 |
| JPWO2025023230A5 JPWO2025023230A5 (https=) | 2026-04-21 |
Family
ID=94374569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025535827A Pending JPWO2025023230A1 (https=) | 2023-07-25 | 2024-07-23 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2025023230A1 (https=) |
| WO (1) | WO2025023230A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5904006B2 (ja) * | 2012-05-21 | 2016-04-13 | 株式会社デンソー | 半導体装置 |
| JP2014090049A (ja) * | 2012-10-30 | 2014-05-15 | Nippon Steel & Sumikin Electronics Devices Inc | パワーモジュール用基板 |
| JP6139331B2 (ja) * | 2013-08-26 | 2017-05-31 | 三菱電機株式会社 | パワーモジュール |
| JP7025181B2 (ja) * | 2016-11-21 | 2022-02-24 | ローム株式会社 | パワーモジュールおよびその製造方法、グラファイトプレート、および電源装置 |
| JP2021100006A (ja) * | 2018-03-28 | 2021-07-01 | 株式会社カネカ | 半導体パッケージ |
-
2024
- 2024-07-23 WO PCT/JP2024/026236 patent/WO2025023230A1/ja active Pending
- 2024-07-23 JP JP2025535827A patent/JPWO2025023230A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025023230A1 (ja) | 2025-01-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20260121 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260121 |