JPWO2025009349A1 - - Google Patents
Info
- Publication number
- JPWO2025009349A1 JPWO2025009349A1 JP2025531457A JP2025531457A JPWO2025009349A1 JP WO2025009349 A1 JPWO2025009349 A1 JP WO2025009349A1 JP 2025531457 A JP2025531457 A JP 2025531457A JP 2025531457 A JP2025531457 A JP 2025531457A JP WO2025009349 A1 JPWO2025009349 A1 JP WO2025009349A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023110016 | 2023-07-04 | ||
| PCT/JP2024/021456 WO2025009349A1 (ja) | 2023-07-04 | 2024-06-13 | 電子装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2025009349A1 true JPWO2025009349A1 (https=) | 2025-01-09 |
| JPWO2025009349A5 JPWO2025009349A5 (https=) | 2026-04-03 |
Family
ID=94171689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025531457A Pending JPWO2025009349A1 (https=) | 2023-07-04 | 2024-06-13 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2025009349A1 (https=) |
| WO (1) | WO2025009349A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS558923Y2 (https=) * | 1973-09-17 | 1980-02-27 | ||
| JP2924858B2 (ja) * | 1997-06-09 | 1999-07-26 | 日本電気株式会社 | リードフレームとその製造方法 |
| JP3566109B2 (ja) * | 1998-11-04 | 2004-09-15 | 株式会社デンソー | 樹脂封止型半導体装置 |
| JP6591302B2 (ja) * | 2016-01-29 | 2019-10-16 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP2017174885A (ja) * | 2016-03-22 | 2017-09-28 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| WO2023112735A1 (ja) * | 2021-12-17 | 2023-06-22 | ローム株式会社 | 電子装置 |
-
2024
- 2024-06-13 WO PCT/JP2024/021456 patent/WO2025009349A1/ja active Pending
- 2024-06-13 JP JP2025531457A patent/JPWO2025009349A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2025009349A1 (ja) | 2025-01-09 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251225 |