JPWO2024252871A1 - - Google Patents
Info
- Publication number
- JPWO2024252871A1 JPWO2024252871A1 JP2025526022A JP2025526022A JPWO2024252871A1 JP WO2024252871 A1 JPWO2024252871 A1 JP WO2024252871A1 JP 2025526022 A JP2025526022 A JP 2025526022A JP 2025526022 A JP2025526022 A JP 2025526022A JP WO2024252871 A1 JPWO2024252871 A1 JP WO2024252871A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/692—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/01—Manufacture or treatment
- H10D1/041—Manufacture or treatment of capacitors having no potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023094200 | 2023-06-07 | ||
| PCT/JP2024/017951 WO2024252871A1 (ja) | 2023-06-07 | 2024-05-15 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024252871A1 true JPWO2024252871A1 (https=) | 2024-12-12 |
| JPWO2024252871A5 JPWO2024252871A5 (https=) | 2026-03-05 |
Family
ID=93795300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025526022A Pending JPWO2024252871A1 (https=) | 2023-06-07 | 2024-05-15 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20260113960A1 (https=) |
| JP (1) | JPWO2024252871A1 (https=) |
| CN (1) | CN121264190A (https=) |
| WO (1) | WO2024252871A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4206293B2 (ja) * | 2003-04-25 | 2009-01-07 | 京セラ株式会社 | 薄膜コンデンサおよびそれを用いたコンデンサ基板 |
| JP2012151220A (ja) * | 2011-01-18 | 2012-08-09 | Asahi Kasei Electronics Co Ltd | 容量素子及びその製造方法並びに半導体集積回路 |
| JP6372640B2 (ja) * | 2016-07-07 | 2018-08-15 | 株式会社村田製作所 | キャパシタ |
| CN117242538A (zh) * | 2021-05-10 | 2023-12-15 | 株式会社村田制作所 | 半导体装置、匹配电路以及滤波电路 |
-
2024
- 2024-05-15 JP JP2025526022A patent/JPWO2024252871A1/ja active Pending
- 2024-05-15 CN CN202480033619.4A patent/CN121264190A/zh active Pending
- 2024-05-15 WO PCT/JP2024/017951 patent/WO2024252871A1/ja not_active Ceased
-
2025
- 2025-11-26 US US19/401,766 patent/US20260113960A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20260113960A1 (en) | 2026-04-23 |
| WO2024252871A1 (ja) | 2024-12-12 |
| CN121264190A (zh) | 2026-01-02 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251203 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251203 |