JPWO2024242165A1 - - Google Patents
Info
- Publication number
- JPWO2024242165A1 JPWO2024242165A1 JP2025522447A JP2025522447A JPWO2024242165A1 JP WO2024242165 A1 JPWO2024242165 A1 JP WO2024242165A1 JP 2025522447 A JP2025522447 A JP 2025522447A JP 2025522447 A JP2025522447 A JP 2025522447A JP WO2024242165 A1 JPWO2024242165 A1 JP WO2024242165A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02218—Material of the housings; Filling of the housings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/17—Containers or parts thereof characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/17—Containers or parts thereof characterised by their materials
- H10W76/18—Insulating materials, e.g. resins, glasses or ceramics
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023084723 | 2023-05-23 | ||
| PCT/JP2024/018964 WO2024242165A1 (ja) | 2023-05-23 | 2024-05-23 | 電子部品収納用パッケージおよびこれを用いた電子モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024242165A1 true JPWO2024242165A1 (https=) | 2024-11-28 |
| JPWO2024242165A5 JPWO2024242165A5 (https=) | 2026-02-18 |
Family
ID=93589957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025522447A Pending JPWO2024242165A1 (https=) | 2023-05-23 | 2024-05-23 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024242165A1 (https=) |
| WO (1) | WO2024242165A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7942549B2 (en) * | 2008-10-16 | 2011-05-17 | Chia-Mao Li | LED lamp having light guiding heat sink |
| KR101277202B1 (ko) * | 2011-04-25 | 2013-06-20 | 주식회사 코스텍시스 | 메탈 베이스 및 그 제조 방법과 이를 이용한 소자 패키지 |
| JP5873174B2 (ja) * | 2012-07-27 | 2016-03-01 | 京セラ株式会社 | 半導体素子収納用パッケージおよび半導体装置 |
-
2024
- 2024-05-23 WO PCT/JP2024/018964 patent/WO2024242165A1/ja not_active Ceased
- 2024-05-23 JP JP2025522447A patent/JPWO2024242165A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024242165A1 (ja) | 2024-11-28 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251118 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251118 |