JPWO2024241533A1 - - Google Patents
Info
- Publication number
- JPWO2024241533A1 JPWO2024241533A1 JP2025521727A JP2025521727A JPWO2024241533A1 JP WO2024241533 A1 JPWO2024241533 A1 JP WO2024241533A1 JP 2025521727 A JP2025521727 A JP 2025521727A JP 2025521727 A JP2025521727 A JP 2025521727A JP WO2024241533 A1 JPWO2024241533 A1 JP WO2024241533A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/019335 WO2024241533A1 (ja) | 2023-05-24 | 2023-05-24 | 電気回路形成方法、および電気回路形成装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2024241533A1 true JPWO2024241533A1 (https=) | 2024-11-28 |
Family
ID=93589860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025521727A Pending JPWO2024241533A1 (https=) | 2023-05-24 | 2023-05-24 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024241533A1 (https=) |
| WO (1) | WO2024241533A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0738966B2 (ja) * | 1992-02-20 | 1995-05-01 | 株式会社ピーエフユー | 接着剤塗布機構 |
| JP2007142017A (ja) * | 2005-11-16 | 2007-06-07 | Matsushita Electric Ind Co Ltd | 半導体装置およびその製造方法 |
| JP7670731B2 (ja) * | 2020-11-25 | 2025-04-30 | 株式会社Fuji | 電気回路形成方法、および電気回路形成装置 |
| JP7624059B2 (ja) * | 2021-03-18 | 2025-01-29 | 株式会社Fuji | 電子部品装着方法、および電子部品装着装置 |
-
2023
- 2023-05-24 WO PCT/JP2023/019335 patent/WO2024241533A1/ja not_active Ceased
- 2023-05-24 JP JP2025521727A patent/JPWO2024241533A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024241533A1 (ja) | 2024-11-28 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20260325 |