JPWO2024219184A1 - - Google Patents

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Publication number
JPWO2024219184A1
JPWO2024219184A1 JP2025515123A JP2025515123A JPWO2024219184A1 JP WO2024219184 A1 JPWO2024219184 A1 JP WO2024219184A1 JP 2025515123 A JP2025515123 A JP 2025515123A JP 2025515123 A JP2025515123 A JP 2025515123A JP WO2024219184 A1 JPWO2024219184 A1 JP WO2024219184A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2025515123A
Other languages
Japanese (ja)
Other versions
JP7837469B2 (ja
JPWO2024219184A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024219184A1 publication Critical patent/JPWO2024219184A1/ja
Publication of JPWO2024219184A5 publication Critical patent/JPWO2024219184A5/ja
Application granted granted Critical
Publication of JP7837469B2 publication Critical patent/JP7837469B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/62—Heating or cooling of contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H33/00—High-tension or heavy-current switches with arc-extinguishing or arc-preventing means
    • H01H33/60—Switches wherein the means for extinguishing or preventing the arc do not include separate means for obtaining or increasing flow of arc-extinguishing fluid
    • H01H33/66—Vacuum switches
    • H01H33/662—Housings or protective screens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/52—Cooling of switch parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/259—Ceramics or glasses

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
JP2025515123A 2023-04-17 2024-03-28 放熱部材、放熱部材の製造方法および真空バルブ Active JP7837469B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023015320 2023-04-17
JPPCT/JP2023/015320 2023-04-17
PCT/JP2024/012718 WO2024219184A1 (ja) 2023-04-17 2024-03-28 放熱部材、放熱部材の製造方法および真空バルブ

Publications (3)

Publication Number Publication Date
JPWO2024219184A1 true JPWO2024219184A1 (https=) 2024-10-24
JPWO2024219184A5 JPWO2024219184A5 (https=) 2025-07-23
JP7837469B2 JP7837469B2 (ja) 2026-03-30

Family

ID=93152761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025515123A Active JP7837469B2 (ja) 2023-04-17 2024-03-28 放熱部材、放熱部材の製造方法および真空バルブ

Country Status (4)

Country Link
JP (1) JP7837469B2 (https=)
CN (1) CN121002658A (https=)
DE (1) DE112024001737T5 (https=)
WO (1) WO2024219184A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026074722A1 (ja) * 2024-10-03 2026-04-09 三菱電機株式会社 クッキングヒータ

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH063086A (ja) * 1992-06-18 1994-01-11 Daido Steel Co Ltd 放熱部材およびその製造方法
JP2010074122A (ja) * 2008-08-21 2010-04-02 Sumitomo Electric Ind Ltd Ｌｅｄ用ヒートシンク、ｌｅｄ用ヒートシンク前駆体、ｌｅｄ素子、ｌｅｄ用ヒートシンクの製造方法およびｌｅｄ素子の製造方法
JP2010140969A (ja) * 2008-12-09 2010-06-24 Toyota Motor Corp 積層モジュール構造
JP2016208010A (ja) * 2015-04-16 2016-12-08 三菱マテリアル株式会社 接合体、ヒートシンク付パワーモジュール用基板、ヒートシンク、及び、接合体の製造方法、ヒートシンク付パワーモジュール用基板の製造方法、ヒートシンクの製造方法
WO2021210048A1 (ja) * 2020-04-13 2021-10-21 三菱電機株式会社 放熱構造及びその製造方法、真空バルブ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH063086A (ja) * 1992-06-18 1994-01-11 Daido Steel Co Ltd 放熱部材およびその製造方法
JP2010074122A (ja) * 2008-08-21 2010-04-02 Sumitomo Electric Ind Ltd Ｌｅｄ用ヒートシンク、ｌｅｄ用ヒートシンク前駆体、ｌｅｄ素子、ｌｅｄ用ヒートシンクの製造方法およびｌｅｄ素子の製造方法
JP2010140969A (ja) * 2008-12-09 2010-06-24 Toyota Motor Corp 積層モジュール構造
JP2016208010A (ja) * 2015-04-16 2016-12-08 三菱マテリアル株式会社 接合体、ヒートシンク付パワーモジュール用基板、ヒートシンク、及び、接合体の製造方法、ヒートシンク付パワーモジュール用基板の製造方法、ヒートシンクの製造方法
WO2021210048A1 (ja) * 2020-04-13 2021-10-21 三菱電機株式会社 放熱構造及びその製造方法、真空バルブ

Also Published As

Publication number Publication date
JP7837469B2 (ja) 2026-03-30
WO2024219184A1 (ja) 2024-10-24
CN121002658A (zh) 2025-11-21
DE112024001737T5 (de) 2026-02-19

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