JPWO2024204091A1 - - Google Patents

Info

Publication number
JPWO2024204091A1
JPWO2024204091A1 JP2025510873A JP2025510873A JPWO2024204091A1 JP WO2024204091 A1 JPWO2024204091 A1 JP WO2024204091A1 JP 2025510873 A JP2025510873 A JP 2025510873A JP 2025510873 A JP2025510873 A JP 2025510873A JP WO2024204091 A1 JPWO2024204091 A1 JP WO2024204091A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025510873A
Other languages
Japanese (ja)
Other versions
JPWO2024204091A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024204091A1 publication Critical patent/JPWO2024204091A1/ja
Publication of JPWO2024204091A5 publication Critical patent/JPWO2024204091A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2025510873A 2023-03-30 2024-03-25 Pending JPWO2024204091A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023056703 2023-03-30
PCT/JP2024/011751 WO2024204091A1 (ja) 2023-03-30 2024-03-25 液状エポキシ樹脂組成物及び半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024204091A1 true JPWO2024204091A1 (https=) 2024-10-03
JPWO2024204091A5 JPWO2024204091A5 (https=) 2026-01-06

Family

ID=92905417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025510873A Pending JPWO2024204091A1 (https=) 2023-03-30 2024-03-25

Country Status (3)

Country Link
JP (1) JPWO2024204091A1 (https=)
TW (1) TW202442741A (https=)
WO (1) WO2024204091A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001335619A (ja) * 1999-12-28 2001-12-04 Kanegafuchi Chem Ind Co Ltd エポキシ変性ポリイミドおよび、これを用いた感光性組成物、カバーレイフィルム、ソルダーレジスト、プリント配線板
JP2009126980A (ja) * 2007-11-26 2009-06-11 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物、半導体装置および半導体装置の製造方法
JP2015083634A (ja) * 2013-10-25 2015-04-30 日立化成株式会社 エポキシ樹脂組成物、このエポキシ樹脂組成物を用いた電子部品装置及び電子部品装置の製造方法。
JP2017028050A (ja) * 2015-07-21 2017-02-02 日立化成株式会社 アンダーフィル材及びそれを用いた電子部品装置
JP6938869B2 (ja) * 2016-03-16 2021-09-22 住友ベークライト株式会社 エポキシ樹脂組成物および半導体装置
JP6907773B2 (ja) * 2016-09-05 2021-07-21 住友ベークライト株式会社 エポキシ樹脂組成物および半導体装置
JP7454906B2 (ja) * 2016-10-14 2024-03-25 株式会社レゾナック アンダーフィル材、電子部品装置及び電子部品装置の製造方法
JP7198644B2 (ja) * 2018-11-27 2023-01-04 住友化学株式会社 エポキシ樹脂組成物及びその硬化物
WO2021241286A1 (ja) * 2020-05-27 2021-12-02 住友化学株式会社 エポキシ樹脂組成物及びその硬化物
CN113999636A (zh) * 2021-02-08 2022-02-01 东阳市福雕文化创意有限公司 单组分热固性预涂粘合剂
JP2024051882A (ja) * 2022-09-30 2024-04-11 旭化成株式会社 エポキシ樹脂組成物、硬化物、及び半導体装置

Also Published As

Publication number Publication date
TW202442741A (zh) 2024-11-01
WO2024204091A1 (ja) 2024-10-03

Similar Documents

Publication Publication Date Title
CL2026000430A1 (es) Fuente de energía renovable usando procesos y sistemas de filtración impulsada por presión
CL2025004069A1 (es) Dispositivo de medición de polvo sentado mediante capacitancia
JPWO2024204091A1 (https=)
JPWO2024247416A1 (https=)
BR102023012440A2 (https=)
BR102023010976A2 (https=)
BR102023009641A2 (https=)
BR102023008688A2 (https=)
BR102023007252A2 (https=)
BR102023005164A2 (https=)
BR102023001877A2 (https=)
BR102023000289A2 (https=)
BR102022026909A2 (https=)
CN307044971S (https=)
BY13160U (https=)
BY13156U (https=)
BY23963C1 (https=)
BY13176U (https=)
BY13157U (https=)
CN307045456S (https=)
BY13174U (https=)
BY13172U (https=)
BY13170U (https=)
BY13169U (https=)
BY13168U (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250910