JPWO2024203523A1 - - Google Patents

Info

Publication number
JPWO2024203523A1
JPWO2024203523A1 JP2025510530A JP2025510530A JPWO2024203523A1 JP WO2024203523 A1 JPWO2024203523 A1 JP WO2024203523A1 JP 2025510530 A JP2025510530 A JP 2025510530A JP 2025510530 A JP2025510530 A JP 2025510530A JP WO2024203523 A1 JPWO2024203523 A1 JP WO2024203523A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025510530A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024203523A1 publication Critical patent/JPWO2024203523A1/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16Cyclic ethers having four or more ring atoms
    • C08G65/18Oxetanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03HHOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/02Details of features involved during the holographic process; Replication of holograms without interference recording

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Polymerisation Methods In General (AREA)
JP2025510530A 2023-03-31 2024-03-18 Pending JPWO2024203523A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023059450 2023-03-31
PCT/JP2024/010505 WO2024203523A1 (ja) 2023-03-31 2024-03-18 組成物、積層フィルム、部材、接着方法および封止方法

Publications (1)

Publication Number Publication Date
JPWO2024203523A1 true JPWO2024203523A1 (https=) 2024-10-03

Family

ID=92904798

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025510530A Pending JPWO2024203523A1 (https=) 2023-03-31 2024-03-18

Country Status (2)

Country Link
JP (1) JPWO2024203523A1 (https=)
WO (1) WO2024203523A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62299588A (ja) * 1986-06-16 1987-12-26 東レ株式会社 インクジェット染色用布帛
JP2000154459A (ja) * 1998-11-17 2000-06-06 Toray Ind Inc 繊維構造物の製造方法
JP2013119613A (ja) * 2011-12-08 2013-06-17 Mitsubishi Chemicals Corp 着色樹脂組成物、カラーフィルタ、液晶表示装置及び有機el表示装置
KR20210121019A (ko) * 2019-01-31 2021-10-07 소니그룹주식회사 홀로그램 기록용 조성물, 홀로그램 기록 매체, 홀로그램 광학 소자, 및 이를 사용한 광학 장치, 광학 부품 및 홀로그램 회절 격자의 형성 방법
EP3998289A4 (en) * 2019-07-08 2022-09-14 Sony Group Corporation Photosensitive composition and a hologram storage medium using same, hologram optical element, and hologram diffraction grating forming method

Also Published As

Publication number Publication date
WO2024203523A1 (ja) 2024-10-03

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