JPWO2024202186A1 - - Google Patents

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Publication number
JPWO2024202186A1
JPWO2024202186A1 JP2025509686A JP2025509686A JPWO2024202186A1 JP WO2024202186 A1 JPWO2024202186 A1 JP WO2024202186A1 JP 2025509686 A JP2025509686 A JP 2025509686A JP 2025509686 A JP2025509686 A JP 2025509686A JP WO2024202186 A1 JPWO2024202186 A1 JP WO2024202186A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2025509686A
Other languages
Japanese (ja)
Other versions
JPWO2024202186A5 (https=
JP7825812B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed filed Critical
Publication of JPWO2024202186A1 publication Critical patent/JPWO2024202186A1/ja
Publication of JPWO2024202186A5 publication Critical patent/JPWO2024202186A5/ja
Application granted granted Critical
Publication of JP7825812B2 publication Critical patent/JP7825812B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/19Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of quartz
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02007Details of bulk acoustic wave devices
    • H03H9/02157Dimensional parameters, e.g. ratio between two dimension parameters, length, width or thickness
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/0595Holders or supports the holder support and resonator being formed in one body
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/10Mounting in enclosures
    • H03H9/1007Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders or supports
    • H03H9/10Mounting in enclosures
    • H03H9/1007Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1035Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by two sealing substrates sandwiching the piezoelectric layer of the BAW device
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/125Driving means, e.g. electrodes, coils
    • H03H9/13Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials
    • H03H9/132Driving means, e.g. electrodes, coils for networks consisting of piezoelectric or electrostrictive materials characterized by a particular shape

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP2025509686A 2023-03-31 2023-11-08 水晶振動素子及びそれを備えた水晶振動子 Active JP7825812B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023058608 2023-03-31
JP2023058608 2023-03-31
PCT/JP2023/040261 WO2024202186A1 (ja) 2023-03-31 2023-11-08 水晶振動素子及びそれを備えた水晶振動子

Publications (3)

Publication Number Publication Date
JPWO2024202186A1 true JPWO2024202186A1 (https=) 2024-10-03
JPWO2024202186A5 JPWO2024202186A5 (https=) 2025-10-28
JP7825812B2 JP7825812B2 (ja) 2026-03-09

Family

ID=92903740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025509686A Active JP7825812B2 (ja) 2023-03-31 2023-11-08 水晶振動素子及びそれを備えた水晶振動子

Country Status (4)

Country Link
US (1) US20250357913A1 (https=)
JP (1) JP7825812B2 (https=)
CN (1) CN120858525A (https=)
WO (1) WO2024202186A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013258519A (ja) * 2012-06-12 2013-12-26 Nippon Dempa Kogyo Co Ltd 圧電振動片及び圧電デバイス
JP2016039401A (ja) * 2014-08-05 2016-03-22 日本電波工業株式会社 圧電振動片及び圧電デバイス
WO2020203044A1 (ja) * 2019-03-29 2020-10-08 株式会社村田製作所 振動子及び振動子の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013258519A (ja) * 2012-06-12 2013-12-26 Nippon Dempa Kogyo Co Ltd 圧電振動片及び圧電デバイス
JP2016039401A (ja) * 2014-08-05 2016-03-22 日本電波工業株式会社 圧電振動片及び圧電デバイス
WO2020203044A1 (ja) * 2019-03-29 2020-10-08 株式会社村田製作所 振動子及び振動子の製造方法

Also Published As

Publication number Publication date
US20250357913A1 (en) 2025-11-20
CN120858525A (zh) 2025-10-28
JP7825812B2 (ja) 2026-03-09
WO2024202186A1 (ja) 2024-10-03

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