JPWO2024189664A5 - - Google Patents

Info

Publication number
JPWO2024189664A5
JPWO2024189664A5 JP2025506228A JP2025506228A JPWO2024189664A5 JP WO2024189664 A5 JPWO2024189664 A5 JP WO2024189664A5 JP 2025506228 A JP2025506228 A JP 2025506228A JP 2025506228 A JP2025506228 A JP 2025506228A JP WO2024189664 A5 JPWO2024189664 A5 JP WO2024189664A5
Authority
JP
Japan
Prior art keywords
substrate
light
irradiation
optical system
light receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025506228A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024189664A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/009219 external-priority patent/WO2024189664A1/ja
Publication of JPWO2024189664A1 publication Critical patent/JPWO2024189664A1/ja
Publication of JPWO2024189664A5 publication Critical patent/JPWO2024189664A5/ja
Pending legal-status Critical Current

Links

JP2025506228A 2023-03-10 2023-03-10 Pending JPWO2024189664A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/009219 WO2024189664A1 (ja) 2023-03-10 2023-03-10 検査用光学装置、欠陥検査装置、および基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024189664A1 JPWO2024189664A1 (https=) 2024-09-19
JPWO2024189664A5 true JPWO2024189664A5 (https=) 2025-11-21

Family

ID=92754513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025506228A Pending JPWO2024189664A1 (https=) 2023-03-10 2023-03-10

Country Status (2)

Country Link
JP (1) JPWO2024189664A1 (https=)
WO (1) WO2024189664A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006184303A (ja) * 2004-12-24 2006-07-13 Olympus Corp 画像検査装置
JP5281756B2 (ja) * 2007-04-13 2013-09-04 オリンパス株式会社 走査型光学装置および観察方法
US9696264B2 (en) * 2013-04-03 2017-07-04 Kla-Tencor Corporation Apparatus and methods for determining defect depths in vertical stack memory
US10656402B2 (en) * 2017-01-27 2020-05-19 Agilent Technologies, Inc. Three-dimensional infrared imaging of surfaces utilizing laser displacement sensors
US10247910B1 (en) * 2018-03-14 2019-04-02 Nanotronics Imaging, Inc. Systems, devices and methods for automatic microscopic focus
JP7339019B2 (ja) * 2019-05-20 2023-09-05 住友化学株式会社 窒化物半導体基板の製造方法

Similar Documents

Publication Publication Date Title
JP5905060B1 (ja) 積層造形装置および積層造形方法
CN106077956B (zh) 一种去除薄膜或涂层的激光加工方法及设备
KR102194694B1 (ko) 3d 프린팅 공정의 열 화상 및 레이저 초음파 통합 검사 시스템 및 이를 구비한 3d 프린팅 시스템
TWI711886B (zh) 在極紫外光微影中的臨界尺寸變化校正
JP2008087053A5 (https=)
JP2007245235A5 (https=)
CN110116280B (zh) 非破坏检测方法
KR20200097994A (ko) 레이저 용접부 검사를 위한 모니터링 시스템
TW201714696A (zh) 檢查用晶圓及檢查用晶圓的使用方法
CN112839765B (zh) 用于求取加工过程的特征参量的方法和加工机
TW201609296A (zh) 雷射加工裝置
TWI878346B (zh) 雷射加工方法以及雷射加工裝置
KR20160127461A (ko) 레이저 가공 장치 및 그 가공방법
KR20180138533A (ko) 레이저 가공품의 제조 방법 및 레이저 가공품
CN114054985A (zh) 检查装置及检查方法
US8502988B2 (en) Pattern inspection apparatus and pattern inspection method
JP2014233727A (ja) レーザー加工装置
KR101425493B1 (ko) 레이저 가공 방법 및 이를 적용하는 장치
JPWO2024189664A5 (https=)
CN114531857A (zh) 检查装置及检查方法
CN110435141B (zh) 添加式地制造三维物体的装置
KR101283557B1 (ko) 레이저 가공장치
JP7305495B2 (ja) 検査装置及び検査方法
KR102143187B1 (ko) 레이저 가공 장치 및 이를 이용한 레이저 가공 방법
KR20190008644A (ko) 작업 품질 검사 기능을 구비한 레이저 클리닝 장치 및 그 방법