JPWO2024157863A1 - - Google Patents
Info
- Publication number
- JPWO2024157863A1 JPWO2024157863A1 JP2024573006A JP2024573006A JPWO2024157863A1 JP WO2024157863 A1 JPWO2024157863 A1 JP WO2024157863A1 JP 2024573006 A JP2024573006 A JP 2024573006A JP 2024573006 A JP2024573006 A JP 2024573006A JP WO2024157863 A1 JPWO2024157863 A1 JP WO2024157863A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023008846 | 2023-01-24 | ||
| PCT/JP2024/001205 WO2024157863A1 (ja) | 2023-01-24 | 2024-01-18 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024157863A1 true JPWO2024157863A1 (https=) | 2024-08-02 |
| JPWO2024157863A5 JPWO2024157863A5 (https=) | 2025-10-02 |
Family
ID=91970559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024573006A Pending JPWO2024157863A1 (https=) | 2023-01-24 | 2024-01-18 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024157863A1 (https=) |
| WO (1) | WO2024157863A1 (https=) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6152254B2 (ja) * | 2012-09-12 | 2017-06-21 | 新光電気工業株式会社 | 半導体パッケージ、半導体装置及び半導体パッケージの製造方法 |
| JP7199921B2 (ja) * | 2018-11-07 | 2023-01-06 | ローム株式会社 | 半導体装置 |
-
2024
- 2024-01-18 JP JP2024573006A patent/JPWO2024157863A1/ja active Pending
- 2024-01-18 WO PCT/JP2024/001205 patent/WO2024157863A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024157863A1 (ja) | 2024-08-02 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250716 |