JPWO2024142447A5 - - Google Patents

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Publication number
JPWO2024142447A5
JPWO2024142447A5 JP2024567193A JP2024567193A JPWO2024142447A5 JP WO2024142447 A5 JPWO2024142447 A5 JP WO2024142447A5 JP 2024567193 A JP2024567193 A JP 2024567193A JP 2024567193 A JP2024567193 A JP 2024567193A JP WO2024142447 A5 JPWO2024142447 A5 JP WO2024142447A5
Authority
JP
Japan
Prior art keywords
curable resin
resin composition
composition according
cured product
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024567193A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024142447A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/027621 external-priority patent/WO2024142447A1/ja
Publication of JPWO2024142447A1 publication Critical patent/JPWO2024142447A1/ja
Publication of JPWO2024142447A5 publication Critical patent/JPWO2024142447A5/ja
Pending legal-status Critical Current

Links

JP2024567193A 2022-12-27 2023-07-27 Pending JPWO2024142447A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022210520 2022-12-27
PCT/JP2023/027621 WO2024142447A1 (ja) 2022-12-27 2023-07-27 硬化性樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子デバイス

Publications (2)

Publication Number Publication Date
JPWO2024142447A1 JPWO2024142447A1 (https=) 2024-07-04
JPWO2024142447A5 true JPWO2024142447A5 (https=) 2026-03-31

Family

ID=91717082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024567193A Pending JPWO2024142447A1 (https=) 2022-12-27 2023-07-27

Country Status (6)

Country Link
EP (1) EP4644457A4 (https=)
JP (1) JPWO2024142447A1 (https=)
KR (1) KR20250127045A (https=)
CN (1) CN120265677A (https=)
TW (1) TW202426550A (https=)
WO (1) WO2024142447A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025204845A1 (ja) * 2024-03-25 2025-10-02 ナミックス株式会社 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
TW202546135A (zh) * 2024-03-25 2025-12-01 日商納美仕有限公司 樹脂組成物、接著劑、密封材、硬化物、半導體裝置及電子零件

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3267329B2 (ja) * 1991-04-12 2002-03-18 日本曹達株式会社 硬化性組成物
TWI529186B (zh) * 2009-11-05 2016-04-11 日立化成股份有限公司 熱聚合系起始劑系統及黏著劑組成物
CA3037796A1 (en) * 2016-09-28 2018-04-05 Dsm Ip Assets B.V. Thermosetting powder coating compositions having lower chalk-free temperature
DE102020203952A1 (de) * 2020-03-26 2021-09-30 Tesa Se Latent reaktiver Klebefilm
JP7481011B2 (ja) 2021-01-04 2024-05-10 協立化学産業株式会社 熱カチオン重合性樹脂組成物

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