JPWO2024127945A1 - - Google Patents
Info
- Publication number
- JPWO2024127945A1 JPWO2024127945A1 JP2024564247A JP2024564247A JPWO2024127945A1 JP WO2024127945 A1 JPWO2024127945 A1 JP WO2024127945A1 JP 2024564247 A JP2024564247 A JP 2024564247A JP 2024564247 A JP2024564247 A JP 2024564247A JP WO2024127945 A1 JPWO2024127945 A1 JP WO2024127945A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022197821 | 2022-12-12 | ||
| PCT/JP2023/042179 WO2024127945A1 (ja) | 2022-12-12 | 2023-11-24 | 半導体装置および半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024127945A1 true JPWO2024127945A1 (https=) | 2024-06-20 |
| JPWO2024127945A5 JPWO2024127945A5 (https=) | 2025-08-20 |
Family
ID=91485643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024564247A Pending JPWO2024127945A1 (https=) | 2022-12-12 | 2023-11-24 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024127945A1 (https=) |
| WO (1) | WO2024127945A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002270715A (ja) * | 2001-03-09 | 2002-09-20 | Sumitomo Bakelite Co Ltd | 半導体装置の製造方法および半導体装置 |
| JP5046481B2 (ja) * | 2004-09-27 | 2012-10-10 | 日立電線株式会社 | 半導体装置及びその製造方法 |
| US20090146280A1 (en) * | 2005-11-28 | 2009-06-11 | Dai Nippon Printing Co., Ltd. | Circuit member, manufacturing method of the circuit member, and semiconductor device including the circuit member |
| JP7421877B2 (ja) * | 2019-06-27 | 2024-01-25 | ローム株式会社 | 半導体装置 |
-
2023
- 2023-11-24 WO PCT/JP2023/042179 patent/WO2024127945A1/ja not_active Ceased
- 2023-11-24 JP JP2024564247A patent/JPWO2024127945A1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024127945A1 (ja) | 2024-06-20 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250604 |