JPWO2024116899A1 - - Google Patents
Info
- Publication number
- JPWO2024116899A1 JPWO2024116899A1 JP2024561373A JP2024561373A JPWO2024116899A1 JP WO2024116899 A1 JPWO2024116899 A1 JP WO2024116899A1 JP 2024561373 A JP2024561373 A JP 2024561373A JP 2024561373 A JP2024561373 A JP 2024561373A JP WO2024116899 A1 JPWO2024116899 A1 JP WO2024116899A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022193472 | 2022-12-02 | ||
| PCT/JP2023/041446 WO2024116899A1 (ja) | 2022-12-02 | 2023-11-17 | 半導体装置、および半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024116899A1 true JPWO2024116899A1 (https=) | 2024-06-06 |
| JPWO2024116899A5 JPWO2024116899A5 (https=) | 2025-08-08 |
Family
ID=91323707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024561373A Pending JPWO2024116899A1 (https=) | 2022-12-02 | 2023-11-17 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024116899A1 (https=) |
| WO (1) | WO2024116899A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011216564A (ja) * | 2010-03-31 | 2011-10-27 | Mitsubishi Electric Corp | パワーモジュール及びその製造方法 |
| TWI525767B (zh) * | 2011-04-04 | 2016-03-11 | 羅姆電子股份有限公司 | Semiconductor device and method for manufacturing semiconductor device |
| JP2017055146A (ja) * | 2011-09-08 | 2017-03-16 | ローム株式会社 | 半導体装置、半導体装置の製造方法、半導体装置の実装構造、およびパワー用半導体装置 |
| JP6255118B2 (ja) * | 2011-10-31 | 2017-12-27 | ローム株式会社 | 半導体装置 |
| JP7150461B2 (ja) * | 2018-04-24 | 2022-10-11 | ローム株式会社 | 半導体装置 |
-
2023
- 2023-11-17 JP JP2024561373A patent/JPWO2024116899A1/ja active Pending
- 2023-11-17 WO PCT/JP2023/041446 patent/WO2024116899A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024116899A1 (ja) | 2024-06-06 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250411 |