JPWO2024111503A1 - - Google Patents
Info
- Publication number
- JPWO2024111503A1 JPWO2024111503A1 JP2024521298A JP2024521298A JPWO2024111503A1 JP WO2024111503 A1 JPWO2024111503 A1 JP WO2024111503A1 JP 2024521298 A JP2024521298 A JP 2024521298A JP 2024521298 A JP2024521298 A JP 2024521298A JP WO2024111503 A1 JPWO2024111503 A1 JP WO2024111503A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022188495 | 2022-11-25 | ||
| JP2022188495 | 2022-11-25 | ||
| PCT/JP2023/041299 WO2024111503A1 (ja) | 2022-11-25 | 2023-11-16 | 接合体及びその製造方法、集合基板、並びにパワーモジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024111503A1 true JPWO2024111503A1 (enrdf_load_stackoverflow) | 2024-05-30 |
| JP7545615B1 JP7545615B1 (ja) | 2024-09-04 |
Family
ID=91195657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024521298A Active JP7545615B1 (ja) | 2022-11-25 | 2023-11-16 | 接合体及びその製造方法、集合基板、並びにパワーモジュール |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7545615B1 (enrdf_load_stackoverflow) |
| WO (1) | WO2024111503A1 (enrdf_load_stackoverflow) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100371974B1 (ko) * | 1997-05-26 | 2003-02-17 | 스미토모덴키고교가부시키가이샤 | 구리회로접합기판 및 그 제조방법 |
| JP2004307307A (ja) * | 2003-04-10 | 2004-11-04 | Hitachi Metals Ltd | セラミックス回路基板とその製造方法 |
| JP2004342635A (ja) * | 2003-05-13 | 2004-12-02 | Hitachi Metals Ltd | セラミックス基板接合用金属板およびセラミックス回路基板 |
| JP4345066B2 (ja) * | 2005-05-24 | 2009-10-14 | 日立金属株式会社 | セラミックス回路基板及びこれを用いたパワー半導体モジュール |
| JP5887907B2 (ja) * | 2011-12-15 | 2016-03-16 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法および製造装置 |
| JP6747897B2 (ja) * | 2016-07-15 | 2020-08-26 | 京セラ株式会社 | 複合基板および電子装置 |
| CN114982388A (zh) * | 2020-01-23 | 2022-08-30 | 电化株式会社 | 陶瓷-铜复合体、及陶瓷-铜复合体的制造方法 |
| JP7574697B2 (ja) * | 2021-03-01 | 2024-10-29 | 三菱マテリアル株式会社 | 絶縁回路基板の製造方法 |
-
2023
- 2023-11-16 WO PCT/JP2023/041299 patent/WO2024111503A1/ja active Application Filing
- 2023-11-16 JP JP2024521298A patent/JP7545615B1/ja active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP7545615B1 (ja) | 2024-09-04 |
| WO2024111503A1 (ja) | 2024-05-30 |
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