JPWO2024111507A1 - - Google Patents
Info
- Publication number
- JPWO2024111507A1 JPWO2024111507A1 JP2024519885A JP2024519885A JPWO2024111507A1 JP WO2024111507 A1 JPWO2024111507 A1 JP WO2024111507A1 JP 2024519885 A JP2024519885 A JP 2024519885A JP 2024519885 A JP2024519885 A JP 2024519885A JP WO2024111507 A1 JPWO2024111507 A1 JP WO2024111507A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022188502 | 2022-11-25 | ||
| PCT/JP2023/041332 WO2024111507A1 (ja) | 2022-11-25 | 2023-11-16 | 接合体及びその製造方法、集合基板、並びにパワーモジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024111507A1 true JPWO2024111507A1 (enrdf_load_stackoverflow) | 2024-05-30 |
| JPWO2024111507A5 JPWO2024111507A5 (enrdf_load_stackoverflow) | 2024-10-23 |
Family
ID=91195656
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024519885A Pending JPWO2024111507A1 (enrdf_load_stackoverflow) | 2022-11-25 | 2023-11-16 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024111507A1 (enrdf_load_stackoverflow) |
| WO (1) | WO2024111507A1 (enrdf_load_stackoverflow) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001110953A (ja) * | 1999-10-07 | 2001-04-20 | Sumitomo Metal Electronics Devices Inc | 半導体モジュール用基板及びその製造方法 |
| JP2006062930A (ja) * | 2004-08-30 | 2006-03-09 | Sumitomo Metal Electronics Devices Inc | セラミックと金属との接合体及びその製造方法 |
| JP2007053349A (ja) * | 2005-07-20 | 2007-03-01 | Mitsubishi Materials Corp | 絶縁基板および絶縁基板の製造方法並びにパワーモジュール用基板およびパワーモジュール |
| JP5664679B2 (ja) * | 2013-03-07 | 2015-02-04 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3156364B2 (ja) * | 1992-04-03 | 2001-04-16 | イビデン株式会社 | 電子部品搭載用基板及びそれに用いる半田フレーム |
| JP2001332854A (ja) * | 2000-05-24 | 2001-11-30 | Toshiba Corp | セラミックス回路基板 |
| JP6747897B2 (ja) * | 2016-07-15 | 2020-08-26 | 京セラ株式会社 | 複合基板および電子装置 |
| JP7574697B2 (ja) * | 2021-03-01 | 2024-10-29 | 三菱マテリアル株式会社 | 絶縁回路基板の製造方法 |
-
2023
- 2023-11-16 WO PCT/JP2023/041332 patent/WO2024111507A1/ja active Application Filing
- 2023-11-16 JP JP2024519885A patent/JPWO2024111507A1/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001110953A (ja) * | 1999-10-07 | 2001-04-20 | Sumitomo Metal Electronics Devices Inc | 半導体モジュール用基板及びその製造方法 |
| JP2006062930A (ja) * | 2004-08-30 | 2006-03-09 | Sumitomo Metal Electronics Devices Inc | セラミックと金属との接合体及びその製造方法 |
| JP2007053349A (ja) * | 2005-07-20 | 2007-03-01 | Mitsubishi Materials Corp | 絶縁基板および絶縁基板の製造方法並びにパワーモジュール用基板およびパワーモジュール |
| JP5664679B2 (ja) * | 2013-03-07 | 2015-02-04 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024111507A1 (ja) | 2024-05-30 |
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