JPWO2024111461A5 - - Google Patents

Info

Publication number
JPWO2024111461A5
JPWO2024111461A5 JP2024560088A JP2024560088A JPWO2024111461A5 JP WO2024111461 A5 JPWO2024111461 A5 JP WO2024111461A5 JP 2024560088 A JP2024560088 A JP 2024560088A JP 2024560088 A JP2024560088 A JP 2024560088A JP WO2024111461 A5 JPWO2024111461 A5 JP WO2024111461A5
Authority
JP
Japan
Prior art keywords
resin composition
molding resin
composition according
polymer particles
porous polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024560088A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024111461A1 (cg-RX-API-DMAC7.html
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/040829 external-priority patent/WO2024111461A1/ja
Publication of JPWO2024111461A1 publication Critical patent/JPWO2024111461A1/ja
Publication of JPWO2024111461A5 publication Critical patent/JPWO2024111461A5/ja
Pending legal-status Critical Current

Links

JP2024560088A 2022-11-25 2023-11-13 Pending JPWO2024111461A1 (cg-RX-API-DMAC7.html)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022188706 2022-11-25
PCT/JP2023/040829 WO2024111461A1 (ja) 2022-11-25 2023-11-13 成形用樹脂組成物及び電子部品装置

Publications (2)

Publication Number Publication Date
JPWO2024111461A1 JPWO2024111461A1 (cg-RX-API-DMAC7.html) 2024-05-30
JPWO2024111461A5 true JPWO2024111461A5 (cg-RX-API-DMAC7.html) 2025-08-01

Family

ID=91195615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024560088A Pending JPWO2024111461A1 (cg-RX-API-DMAC7.html) 2022-11-25 2023-11-13

Country Status (5)

Country Link
US (1) US20260098149A1 (cg-RX-API-DMAC7.html)
JP (1) JPWO2024111461A1 (cg-RX-API-DMAC7.html)
CN (1) CN119183467A (cg-RX-API-DMAC7.html)
TW (1) TW202428687A (cg-RX-API-DMAC7.html)
WO (1) WO2024111461A1 (cg-RX-API-DMAC7.html)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003198248A (ja) * 2001-12-26 2003-07-11 Sharp Corp アンテナ一体型パッケージ
WO2013129250A1 (ja) * 2012-02-29 2013-09-06 富士フイルム株式会社 感光性樹脂組成物、硬化膜の製造方法、硬化膜、液晶表示装置及び有機ｅｌ表示装置
JP7388160B2 (ja) * 2019-12-03 2023-11-29 株式会社レゾナック 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7388235B2 (ja) * 2020-02-20 2023-11-29 味の素株式会社 樹脂組成物
KR102818863B1 (ko) * 2020-12-17 2025-06-10 세키스이가세이힝코교가부시키가이샤 반도체 봉지용 수지 조성물, 언더필, 몰드 수지, 및 반도체 패키지

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