JPWO2024106052A1 - - Google Patents
Info
- Publication number
- JPWO2024106052A1 JPWO2024106052A1 JP2024558685A JP2024558685A JPWO2024106052A1 JP WO2024106052 A1 JPWO2024106052 A1 JP WO2024106052A1 JP 2024558685 A JP2024558685 A JP 2024558685A JP 2024558685 A JP2024558685 A JP 2024558685A JP WO2024106052 A1 JPWO2024106052 A1 JP WO2024106052A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022183962 | 2022-11-17 | ||
| PCT/JP2023/036242 WO2024106052A1 (ja) | 2022-11-17 | 2023-10-04 | 半導体試験装置、半導体試験方法および半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024106052A1 true JPWO2024106052A1 (enrdf_load_stackoverflow) | 2024-05-23 |
| JPWO2024106052A5 JPWO2024106052A5 (enrdf_load_stackoverflow) | 2025-07-18 |
Family
ID=91084140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024558685A Pending JPWO2024106052A1 (enrdf_load_stackoverflow) | 2022-11-17 | 2023-10-04 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2024106052A1 (enrdf_load_stackoverflow) |
| CN (1) | CN120188268A (enrdf_load_stackoverflow) |
| WO (1) | WO2024106052A1 (enrdf_load_stackoverflow) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6765125B2 (ja) * | 2017-09-27 | 2020-10-07 | 日本電産リード株式会社 | 抵抗測定装置、基板検査装置、及び抵抗測定方法 |
| JP7356088B2 (ja) * | 2019-04-12 | 2023-10-04 | 俊彦 水上 | 半導体試験装置および半導体素子の試験方法 |
| CN116325104A (zh) * | 2020-10-05 | 2023-06-23 | 三菱电机株式会社 | 半导体试验装置和半导体试验方法 |
| JP2022143992A (ja) * | 2021-03-18 | 2022-10-03 | 三菱電機株式会社 | 半導体試験装置および半導体試験方法 |
-
2023
- 2023-10-04 CN CN202380077502.1A patent/CN120188268A/zh active Pending
- 2023-10-04 JP JP2024558685A patent/JPWO2024106052A1/ja active Pending
- 2023-10-04 WO PCT/JP2023/036242 patent/WO2024106052A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| CN120188268A (zh) | 2025-06-20 |
| WO2024106052A1 (ja) | 2024-05-23 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250508 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20250508 |