JPWO2024070967A1 - - Google Patents
Info
- Publication number
- JPWO2024070967A1 JPWO2024070967A1 JP2024549331A JP2024549331A JPWO2024070967A1 JP WO2024070967 A1 JPWO2024070967 A1 JP WO2024070967A1 JP 2024549331 A JP2024549331 A JP 2024549331A JP 2024549331 A JP2024549331 A JP 2024549331A JP WO2024070967 A1 JPWO2024070967 A1 JP WO2024070967A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022156996 | 2022-09-29 | ||
| PCT/JP2023/034562 WO2024070967A1 (ja) | 2022-09-29 | 2023-09-22 | 信号伝達装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024070967A1 true JPWO2024070967A1 (https=) | 2024-04-04 |
| JPWO2024070967A5 JPWO2024070967A5 (https=) | 2025-06-12 |
Family
ID=90477758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024549331A Pending JPWO2024070967A1 (https=) | 2022-09-29 | 2023-09-22 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024070967A1 (https=) |
| WO (1) | WO2024070967A1 (https=) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6253531B2 (ja) * | 2014-06-30 | 2017-12-27 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP6522402B2 (ja) * | 2015-04-16 | 2019-05-29 | ローム株式会社 | 半導体装置 |
| JP6768569B2 (ja) * | 2017-03-21 | 2020-10-14 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法および半導体装置 |
| WO2022130906A1 (ja) * | 2020-12-18 | 2022-06-23 | ローム株式会社 | 半導体装置 |
-
2023
- 2023-09-22 JP JP2024549331A patent/JPWO2024070967A1/ja active Pending
- 2023-09-22 WO PCT/JP2023/034562 patent/WO2024070967A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024070967A1 (ja) | 2024-04-04 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250219 |