JPWO2024070529A1 - - Google Patents
Info
- Publication number
- JPWO2024070529A1 JPWO2024070529A1 JP2024549947A JP2024549947A JPWO2024070529A1 JP WO2024070529 A1 JPWO2024070529 A1 JP WO2024070529A1 JP 2024549947 A JP2024549947 A JP 2024549947A JP 2024549947 A JP2024549947 A JP 2024549947A JP WO2024070529 A1 JPWO2024070529 A1 JP WO2024070529A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
- H01G9/10—Sealing, e.g. of lead-in wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/022—Electrolytes; Absorbents
- H01G9/025—Solid electrolytes
- H01G9/028—Organic semiconducting electrolytes, e.g. TCNQ
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G9/052—Sintered electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/048—Electrodes or formation of dielectric layers thereon characterised by their structure
- H01G9/055—Etched foil electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/07—Dielectric layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/15—Solid electrolytic capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022152765 | 2022-09-26 | ||
| JP2022152765 | 2022-09-26 | ||
| PCT/JP2023/032358 WO2024070529A1 (ja) | 2022-09-26 | 2023-09-05 | コンデンサ素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2024070529A1 true JPWO2024070529A1 (https=) | 2024-04-04 |
| JPWO2024070529A5 JPWO2024070529A5 (https=) | 2024-12-24 |
| JP7776019B2 JP7776019B2 (ja) | 2025-11-26 |
Family
ID=90477302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024549947A Active JP7776019B2 (ja) | 2022-09-26 | 2023-09-05 | コンデンサ素子 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250104932A1 (https=) |
| JP (1) | JP7776019B2 (https=) |
| CN (1) | CN119487596A (https=) |
| WO (1) | WO2024070529A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2026048937A1 (ja) * | 2024-09-02 | 2026-03-05 | 株式会社村田製作所 | コンデンサ素子 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01262695A (ja) * | 1988-04-13 | 1989-10-19 | Nec Corp | コンデンサ素子内蔵セラミック多層基板 |
| WO2009081853A1 (ja) * | 2007-12-25 | 2009-07-02 | Murata Manufacturing Co., Ltd. | 多層配線基板の製造方法 |
| JP2010171304A (ja) * | 2009-01-26 | 2010-08-05 | Panasonic Corp | 部品内蔵基板の製造方法 |
| JP2020167361A (ja) * | 2019-03-29 | 2020-10-08 | 株式会社村田製作所 | コンデンサアレイ、及び、複合電子部品 |
| JP2021141287A (ja) * | 2020-03-09 | 2021-09-16 | イビデン株式会社 | 配線基板、部品内蔵配線基板、配線基板の製造方法、及び部品内蔵配線基板の製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4417294B2 (ja) * | 2005-06-16 | 2010-02-17 | パナソニック株式会社 | プローブカード用部品内蔵基板とその製造方法 |
-
2023
- 2023-09-05 WO PCT/JP2023/032358 patent/WO2024070529A1/ja not_active Ceased
- 2023-09-05 JP JP2024549947A patent/JP7776019B2/ja active Active
- 2023-09-05 CN CN202380052066.2A patent/CN119487596A/zh active Pending
-
2024
- 2024-12-09 US US18/973,301 patent/US20250104932A1/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01262695A (ja) * | 1988-04-13 | 1989-10-19 | Nec Corp | コンデンサ素子内蔵セラミック多層基板 |
| WO2009081853A1 (ja) * | 2007-12-25 | 2009-07-02 | Murata Manufacturing Co., Ltd. | 多層配線基板の製造方法 |
| JP2010171304A (ja) * | 2009-01-26 | 2010-08-05 | Panasonic Corp | 部品内蔵基板の製造方法 |
| JP2020167361A (ja) * | 2019-03-29 | 2020-10-08 | 株式会社村田製作所 | コンデンサアレイ、及び、複合電子部品 |
| JP2021141287A (ja) * | 2020-03-09 | 2021-09-16 | イビデン株式会社 | 配線基板、部品内蔵配線基板、配線基板の製造方法、及び部品内蔵配線基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN119487596A (zh) | 2025-02-18 |
| WO2024070529A1 (ja) | 2024-04-04 |
| JP7776019B2 (ja) | 2025-11-26 |
| US20250104932A1 (en) | 2025-03-27 |
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