JPWO2024057847A1 - - Google Patents
Info
- Publication number
- JPWO2024057847A1 JPWO2024057847A1 JP2024546805A JP2024546805A JPWO2024057847A1 JP WO2024057847 A1 JPWO2024057847 A1 JP WO2024057847A1 JP 2024546805 A JP2024546805 A JP 2024546805A JP 2024546805 A JP2024546805 A JP 2024546805A JP WO2024057847 A1 JPWO2024057847 A1 JP WO2024057847A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/18—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Inverter Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022146999 | 2022-09-15 | ||
PCT/JP2023/030264 WO2024057847A1 (ja) | 2022-09-15 | 2023-08-23 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2024057847A1 true JPWO2024057847A1 (enrdf_load_stackoverflow) | 2024-03-21 |
JPWO2024057847A5 JPWO2024057847A5 (enrdf_load_stackoverflow) | 2025-05-27 |
Family
ID=90274951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2024546805A Pending JPWO2024057847A1 (enrdf_load_stackoverflow) | 2022-09-15 | 2023-08-23 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPWO2024057847A1 (enrdf_load_stackoverflow) |
WO (1) | WO2024057847A1 (enrdf_load_stackoverflow) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009293986A (ja) * | 2008-06-03 | 2009-12-17 | Denso Corp | 半導体装置 |
US12062634B2 (en) * | 2019-06-20 | 2024-08-13 | Rohm Co., Ltd. | Semiconductor device and production method for semiconductor device |
DE202021004377U1 (de) * | 2020-10-14 | 2024-01-05 | Rohm Co., Ltd. | Halbleitermodul |
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2023
- 2023-08-23 JP JP2024546805A patent/JPWO2024057847A1/ja active Pending
- 2023-08-23 WO PCT/JP2023/030264 patent/WO2024057847A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2024057847A1 (ja) | 2024-03-21 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250220 |