JPWO2024057847A1 - - Google Patents

Info

Publication number
JPWO2024057847A1
JPWO2024057847A1 JP2024546805A JP2024546805A JPWO2024057847A1 JP WO2024057847 A1 JPWO2024057847 A1 JP WO2024057847A1 JP 2024546805 A JP2024546805 A JP 2024546805A JP 2024546805 A JP2024546805 A JP 2024546805A JP WO2024057847 A1 JPWO2024057847 A1 JP WO2024057847A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024546805A
Other languages
Japanese (ja)
Other versions
JPWO2024057847A5 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024057847A1 publication Critical patent/JPWO2024057847A1/ja
Publication of JPWO2024057847A5 publication Critical patent/JPWO2024057847A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/60Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/18Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of the types provided for in two or more different main groups of the same subclass of H10B, H10D, H10F, H10H, H10K or H10N

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Inverter Devices (AREA)
JP2024546805A 2022-09-15 2023-08-23 Pending JPWO2024057847A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022146999 2022-09-15
PCT/JP2023/030264 WO2024057847A1 (ja) 2022-09-15 2023-08-23 半導体装置

Publications (2)

Publication Number Publication Date
JPWO2024057847A1 true JPWO2024057847A1 (enrdf_load_stackoverflow) 2024-03-21
JPWO2024057847A5 JPWO2024057847A5 (enrdf_load_stackoverflow) 2025-05-27

Family

ID=90274951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024546805A Pending JPWO2024057847A1 (enrdf_load_stackoverflow) 2022-09-15 2023-08-23

Country Status (2)

Country Link
JP (1) JPWO2024057847A1 (enrdf_load_stackoverflow)
WO (1) WO2024057847A1 (enrdf_load_stackoverflow)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009293986A (ja) * 2008-06-03 2009-12-17 Denso Corp 半導体装置
US12062634B2 (en) * 2019-06-20 2024-08-13 Rohm Co., Ltd. Semiconductor device and production method for semiconductor device
DE202021004377U1 (de) * 2020-10-14 2024-01-05 Rohm Co., Ltd. Halbleitermodul

Also Published As

Publication number Publication date
WO2024057847A1 (ja) 2024-03-21

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Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250220